Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MC33889
Rev. 15.0, 6/2015
System Basis Chip (SBC) with
Low Speed Fault Tolerant CAN
Interface
33889
The 33889 is an SBC having a fully protected, fixed 5.0 V low dropout regulator, with current limit, overtemperature prewarning and reset.
An SBC device is a monolithic IC combining many functions repeatedly
found in standard microcontroller-based systems, e.g., protection,
diagnostics, communication, power, etc.
An output drive with sense input is also provided to implement a
second 5.0 V regulator using an external PNP. The 33889 has Normal,
Standby, Stop and Sleep modes; an internally switched high-side
power supply output with two wake-up inputs; programmable timeout
or window watchdog, Interrupt, Reset, serial peripheral interface (SPI)
input control, and a low-speed fault tolerant CAN transceiver,
compatible with CAN 2.0 A and B protocols for module-to-module
communications. The combination is an economical solution for power
management, high-speed communication, and control in MCU-based
systems. This device is powered by SMARTMOS technology.
SYSTEM BASIS CHIP
EG SUFFIX (PB-FREE)
PLASTIC PACKAGE
98ASB42345B
28-PIN SOICW
Features
• VDD1: 5.0 V low drop voltage regulator, current limitation,
overtemperature detection, monitoring and reset function with total
current capability 200 mA
• V2: tracking function of VDD1 regulator; control circuitry for external
bipolar ballast transistor for high flexibility in choice of peripheral
voltage and current supply
• Four operational modes
• Low standby current consumption in Stop and Sleep modes
• Built-in low speed 125 kbps fault tolerant CAN physical interface.
• External high voltage wake-up input, associated with HS1 VBAT
switch
• 150 mA output current capability for HS1 VBAT switch allowing drive
of external switches pull-up resistors or relays
Device
(Add R2 Suffix for
Tape and Reel)
MC33889BPEG
*MC33889DPEG
Temperature
Range (TA)
Package
-40 to 125 °C
28 SOICW
*Recommended for new designs
VPWR
33889
VSUP
VDD1
5.0 V
ORDERING INFORMATION
V2
GND
CS
SCLK
MOSI
MISO
CS
SCLK
MOSI
MISO
V2CTRL
V2
HS1
L0
L1
WDOG
RTH
TXD
RXD
CANH
CANL
RST
INT
MCU
SPI
Local Module Supply
Wake-Up Inputs
Safe Circuits
Twisted
Pair
RTL
Figure 1. 33889 Simplified Application Diagram
© Freescale Semiconductor, Inc., 2007-2015. All rights reserved.
CAN Bus
DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations Between the 33889D and 33889B Versions (1)
Parameters
Symbol
Differential Receiver, Recessive To Dominant Threshold
(By Definition, VDIFF = VCANH-VCANL)
VDIFF1
Differential Receiver, Dominant To Recessive Threshold
(Bus Failures 1, 2, 5)
MC33889D(2)
Min
3.2 V
3.5 V
Typ
2.6 V
3.0 V
Max
2.1 V
2.5 V
Min
3.2 V
3.5 V
Typ
2.6 V
3.0 V
Max
2.1 V
2.5 V
Min
50 mA
50 mA
Typ
75 mA
100 mA
Max
110 mA
130 mA
Min
50 mA
50 mA
Typ
90 mA
140 mA
Max
135 mA
170 mA
Vcanh
max
Vsup/2 + 5V
Vsup/2 + 4.55V
tLOOPRD
max
N/A
1.5us
tLOOPRD-F
max
N/A
1.9us
N/A
3.6us
min
N/A
8
typ
30
16
max
N/A
30
min
not specified, 25us
spec applied
25us
after 4 non
consecutive pulses
after 4 consecutive
pulses
VDIFF2
ICANH
CANL Output Current (VCANL = 14 V; TX = 0.0)
ICANL
loop time Tx to Rx, no bus failure, ISO configuration
loop time Tx to Rx, with bus failure, ISO configuration
loop time Tx to Rx, with bus failure and +-1.5V gnd shift, tLOOPRD/DR-F+GS
5 node network, ISO configuration
Minimum Dominant time for Wake up on CANL or CANH
(Tem Vbat mode)
T2SPI timing
Device Part Number
MC33889B(2)
CANH Output Current (VCANH = 0; TX = 0.0)
Detection threshold for Short circuit to Battery voltage
Trait
tWAKE
T2spi
DEVICE BEHAVIOR
CANH or CANL open wire recovery principle
Rx behavior in TermVbat mode
Reference MC33889B: on page
35
Reference MC333889D: on page Rx recessive, no pulse Rx recessive, dominant
pulse to signal bus
35
traffic
Notes
1. This datasheet uses the term 33889 in the inclusive sense, referring to both the D version (33889D) and the B version (33689B).
2. The 33889D and 33889B versions are nearly identical. However, where variations in characteristic occur, these items will be separated
onto individual lines.
33889
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VSUP
V2
VDD1
Oscillator
HS1 Control
INT
HS1
L0
V2CTRL
Dual Voltage Regulator
VSUP Voltage Monitor
VDD1 Voltage Monitor
Interrupt
Watchdog
Reset
Programmable
Wake-Up Inputs
WDOG
RST
L1
Mode Control
TX
CS
SCLK
RX
SPI
Interface
MOSI
MISO
VSUP
Fault Tolerant
CAN
Transceiver
V2
GND
RTH
CAN H
CAN L
RTL
Figure 2. 33889 Internal Block Diagram
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
PIN CONNECTIONS
RX
TX
VDD1
RST
INT
GND
GND
GND
GND
V2CTRL
VSUP
HS1
L0
L1
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
WDOG
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
RTL
RTH
V2
Figure 3. 33889 Pin Connections
A functional description of each pin can be found in the Functional pin description section page 24.
Table 2. Pin Definitions
Pin
Pin Name
Pin Function
Formal Name
1
RX
Output
Receiver Data
2
TX
Input
Transmitter Data
3
VDD1
Power
Voltage Regulator One
5.0 V pin is a 2% low drop voltage regulator for to the microcontroller
supply.
This is the device reset output pin whose main function is to reset the
MCU.
Output
Definition
CAN bus receive data output pin
CAN bus receive data input pin
4
RST
Output
Reset
5
INT
Output
Interrupt
This output is asserted LOW when an enabled interrupt condition occurs.
6 -9,
20 - 23
GND
Ground
Ground
These device ground pins are internally connected to the package lead
frame to provide a 33889-to-PCB thermal path.
10
V2CTRL
Output
11
VSUP
Power
Voltage Source 2 Control Output drive source for the V2 regulator connected to the external series
pass transistor.
Voltage Supply
Supply input pin.
Input
12
HS1
Output
High-Side Output
Output of the internal high-side switch.
13 - 14
L0, L1
Input
Level 0 - 1 Inputs
Inputs from external switches or from logic circuitry.
15
V2
Input
Voltage Regulator Two
16
RTH
Output
RTH
Pin for connection of the bus termination resistor to CANH.
17
RTL
Output
RTL
Pin for connection of the bus termination resistor to CANL.
18
CANH
Output
CAN High
CAN high output pin.
19
CANL
Output
CAN Low
CAN low output pin.
24
SCLK
Input
System Clock
25
MISO
Output
Master In/Slave Out
SPI data sent to the MCU by the 33889. When CSLOW is HIGH, the pin is
in the high impedance state.
26
MOSI
Input
Master Out/Slave In
SPI data received by the 33889.
5.0 V pin is a low drop voltage regulator dedicated to the peripherals
supply.
Clock input pin for the Serial Peripheral Interface (SPI).
33889
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Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
Table 2. Pin Definitions
Pin
Pin Name
Pin Function
Formal Name
Definition
27
CS
Input
Chip Select
The CSLOW input pin is used with the SPI bus to select the 33889. When
the CSLOW is asserted LOW, the 33889 is the selected device of the SPI
bus.
28
WDOG
Output
Watchdog
The WDOG output pin is asserted LOW if the software watchdog is not
correctly triggered.
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Max
Unit
ELECTRICAL RATINGS
Supply Voltage at VSUP
Continuous voltage
Transient voltage (Load dump)
Logic Signals (RX, TX, MOSI, MISO, CS, SCLK, RST, WDOG, INT)
Output current VDD1
V
VSUP
-0.3 to 27
40
VLOG
-0.3 to VDD1 +0.3
V
I
Internally Limited
mA
V
-0.2 to VSUP +0.3
Internally Limited
V
HS1
Voltage
Output Current
I
A
L0, L1
DC Input voltage
DC Input current
Transient input voltage (according to ISO7637 specification) and with external
component per Figure 4.
VWU
-0.3 to 40
V
IWU
-2.0 to 2.0
mA
VTRWU
+-100
V
DC voltage at V2 (V2INT)
V2INT
0 to 5.25
V
DC Voltage On Pins CANH, CANL
VBUS
-20 to +27
V
VCANH/VCANL
-40 to +40
V
VTR
-150 to +100
V
DC Voltage On Pins RTH, RTL
VRTL, VRTH
-0.3 to +27
V
Transient Voltage At Pins RTH, RTL
0.0 < V2-INT < 5.5 V; VSUP = 0.0; T < 500 ms
VRTH/VRTL
-0.3 to +40
V
Transient Voltage At Pins CANH, CANL
0.0 < V2-INT < 5.5 V; VSUP = 0.0; T < 500 ms
Transient Voltage On Pins CANH, CANL
(Coupled Through 1.0 nF Capacitor)
33889
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
ESD voltage (HBM 100 pF, 1.5 k) (3)
Max
VESDH
Unit
kV
CANL, CANH, HS1, L0, L1
RTH, RTL
All other pins
±4.0
±3.0
±2.0
ESD voltage (Machine Model) All pins, MC33889B (3) (4)
VESD-MM
ESD voltage (CDM) All pins, MC33889D (4)
VESD-CDM
±200
V
V
Pins 1,14,15, & 28
All other pins
750
500
RT
500 to 16000

Junction Temperature
TJ
-40 to 150
°C
Storage Temperature
TS
-55 to 165
°C
TA
-40 to 125
°C
RTHJ/P
20
°C/W
RTH, RTL Termination Resistance
THERMAL RATINGS
Ambient Temperature (for info only)
Thermal resistance junction to gnd pin
(5)
Notes:
3. Testing done in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), Machine Model (CZAP = 200 pF, RZAP = 0 ).
4. ESD machine model (MM) is for MC33889B only. MM is now replaced by CDM (Charged Discharged model).
5. Gnd pins 6,7,8,9,20, 21, 22, 23.
1.0 nF
LX
10 k
Gnd
Transient Pulse
Generator
(note)
Gnd
Note: Waveform in accordance to ISO7637 part1, test pulses 1, 2, 3a and 3b.
Figure 4. Transient test pulse for L0 and L1 inputs
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Symbol
Min
Typ
Max
Unit
VSUP
5.5
-
18
V
4.5
-
5.5
18
-
27
-
-
40
INPUT PIN (VSUP)
Nominal DC Voltage range
Extended DC Voltage range 1
VSUP-EX1
Reduced functionality (6)
Extended DC Voltage range 2 (8)
VSUP-EX2
Input Voltage during Load Dump
VSUPLD
Load dump situation
Input Voltage during jump start
V
V
VSUPJS
Jump start situation
Supply Current in Sleep Mode (7)
V
-
-
27
-
95
130
-
55
90
-
170
270
-
42
45
-
42.5
45
-
120
150
A
ISUP
VDD1 & V2 off, VSUP  12 V, oscillator running (10)
Supply Current in Sleep Mode (7)
VDD1 & V2 off, VSUP  12 V, oscillator not running
Supply current in sleep mode (7)
(SLEEP1)
A
ISUP
(SLEEP2)
A
ISUP
VDD1 & V2 off, VSUP = 18 V, oscillator running (10)
Supply Current in Stand-by Mode (7),(9)
(SLEEP3)
ISUP(STDBY)
IOUT at VDD1 = 40 mA, CAN recessive state or disabled
Supply Current in Normal Mode (7)
mA
ISUP(NORM)
IOUT at VDD1 = 40 mA, CAN recessive state or disabled
Supply Current in Stop mode (7),(9)
mA
A
ISUP
IOUT VDD1 < 2.0 mA, VDD1 on (11), VSUP  12 V, oscillator
(STOP1)
V
running (10)
Supply Current in Stop mode (7),(9)
(11)
VSUP  12 V, oscillator
(STOP2)
Iout VDD1 < 2.0 mA, VDD1 on (11), VSUP = 18 V, oscillator
(STOP3)
IOUT VDD1 < 2.0 mA, VDD1 on
A
ISUP
-
80
110
-
200
285
not running (10)
Supply Current in Stop mode (7),(9)
A
ISUP
running (10)
Notes
6. VDD1 > 4.0 V, reset high, if RSTTH-2 selected and IOUT VDD1 reduced, logic pin high level reduced, device is functional.
7.
Current measured at VSUP pin.
8.
Device is fully functional. All modes available and operating, Watchdog, HS1 turn ON turn OFF, CAN cell operating, L0 and L1 inputs
operating, SPI read write operation. Over temperature may occur.
Measured in worst case condition with 5.0 V at V2 pin (V2 pin tied to VDD1).
Oscillator running means “Forced Wake-up” or “Cyclic Sense” or “Software Watchdog” timer activated. Software Watchdog is available
in stop mode only.
VDD1 is ON with 2.0 mA typical output current capability.
9.
10.
11.
33889
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Supply Fail Flag internal threshold
Supply Fail Flag hysteresis
(12)
Battery fall early warning threshold
Symbol
Min
Typ
Max
Unit
VTHRESH
1.5
3.0
4.0
V
VDETHYST
-
1.0
-
V
5.8
6.1
6.4
0.1
0.2
0.3
BFEW
In normal & standby mode
Battery fall early warning hysteresis
V
BFEWH
In normal & standby mode (12)
V
OUTPUT PIN (VDD1) (13)
VDD1 Output Voltage
VDD1OUT
V
IDD1 from 2.0 to 200 mA
5.5 V < VSUP < 27 V
4.5 V < VSUP < 5.5 V
Drop Voltage VSUP > VDDOUT
5.0
-
5.1
-
-
0.2
0.5
-
0.1
0.25
200
270
350
VDD1DROP
IDD1 = 200 mA
Drop Voltage VSUP > VDDOUT, limited output current
4.9
4.0
V
VDD1DP2
IDD1 = 50 mA
V
4.5 V < VSUP < 27 V
IDD1 Output Current
IDD1
Internally limited
VDD1 Output Voltage in stop mode
VDDSTOP
IOUT < 2.0 mA
IDD1 stop output current to wake-up SBC
IDD1 stop output current to wake-up SBC (14)
IDD1S-WU2
IDD1 overcurrent wake deglitcher
IDD1-DGIT11
IDD1 overcurrent wake deglitcher
(with IDD1S-WU2 selected) (12)
Thermal Shutdown
5.00
5.25
2.0
3.5
6.0
10
14
18
40
55
75
mA
s
-
150
-
160
-
190
130
-
160
20
-
40
°C
TPW
TSD-TPW
mA
s
TSD
VDDTEMP bit set
Temperature Threshold difference
4.75
IDD1-DGIT2
Normal or standby mode
Overtemperature prewarning
V
IDD1S-WU1
Default value after reset. (14)
(with IDD1S-WU1 selected) (12)
mA
°C
°C
Notes
12. Guaranteed by design
13. IDD1 is the total regulator output current. VDD specification with external capacitor C  22 F and ESR < 10 .
14.
Selectable by SPI
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Symbol
Reset threshold 1
Min
Typ
Max
4.5
4.6
4.7
VRST-TH2
4.1
4.2
4.3
V
RESET-DUR
0.85
1.0
2.0
ms
VDD
1.0
-
-
V
VRST-TH1
Default value after reset. (15)
Reset threshold 2 (15)
Reset duration
VDD1 range for Reset Active
Reset Delay Time
Measured at 50% of reset signal.
V
s
tD
(16)
Line Regulation
Line Regulation
20
-
5.0
25
mV
mV
-
10
25
-
25
75
-
5.0
-
0.99
1.0
1.01
200
-
-
LD
1.0 mA < IIDD < 200 mA
Thermal stability
-
LR2
5.5 V < VSUP < 27 V, IDD = 10 mA
Load Regulation
5.0
LR1
9.0 V < VSUP < 18 V, IDD = 10 mA
mV
THERMS
VSUP = 13.5 V, I = 100 mA
Unit
mV
V2 REGULATOR (V2) (17)
V2 Output Voltage
V2
I2 from 2.0 to 200 mA, 5.5 V < VSUP < 27 V (18)
I2 output current (for information only)
VDD1
I2
Depending on the external ballast transistor
mA
V2 CTRL sink current capability
I2CTRL
10
-
-
mA
V2LOW flag threshold
V2LTH
3.75
4.0
4.25
V
Internal V2 Supply Current (CAN and SBC in Normal Mode).
TX = 5.0 V, CAN in Recessive State
IV2RS
3.8
5.6
6.8
mA
Internal V2 Supply Current (CAN and SBC in Normal Mode).
TX = 0.0 V, No Load, CAN in Dominant State
IV2DS
4.0
5.8
7.0
mA
Internal V2 Supply Current (CAN in Receive Only Mode, SBC
in Normal mode). VSUP = 12 V
IV2R
80
120
A
Internal V2 Supply Current (CAN in Bus TermVbat mode, SBC
in normal mode), VSUP = 12 V
IV2BT
35
60
A
Notes
15. Selectable by SPI
16. Guaranteed by design
17. V2 TRACKING VOLTAGE REGULATOR - V2 specification with external capacitor
- option 1: C  22 F and ESR < 10 . Using a resistor of 2 k or less between the base and emitter of the external PNP is
recommended.
- option2: 1.0 F < C < 22 F and ESR < 10 . In this case depending on the ballast transistor gain an additional resistor and capacitor
network between emitter and base of PNP ballast transistor might be required. Refer to Freescale application information or contact
your local technical support.
- option 3: 10 uF < C < 22 F ESR > 0.2 : a resistor of 2 k or less is required between the base and emitter of the external PNP.
18. For IVDD1 > 10 mA
33889
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Symbol
Min
Typ
Max
-
-
1.0
Unit
LOGIC OUTPUT PINS (MISO)
Low Level Output Voltage
VOL
IOUT = 1.5 mA
High Level Output Voltage
IOUT = -250 A
Tri-state MISO Leakage Current
V
VOH
V
VDD1-0.9
-
-
-2.0
-
+2.0
A
IHZ
0.0 V < VMISO < VDD
LOGIC INPUT PINS (MOSI, SCLK, CS)
High Level Input Voltage
VIH
0.7VDD1
-
VDD1+0.3V
Low Level Input Voltage
VIL
-0.3
-
0.3 VDD1
Input Current on CS
VI = 4.0 V
VI = 1.0 V
V
A
IIH
IIL
-100
-
-20
-100
-
-20
-10
-
10
-350
-250
-150
5.5 V < VSUP < 27 V
0.0
-
0.9
1.0 V < VDD1
0.0
-
0.9
2.3
-
5.0
0.0
-
0.9
VOH
VDD1 -0.9
-
VDD1
V
Low Level Output Voltage (I0 = 1.5 mA)
VOL
0.0
-
0.9
V
High Level Output Voltage (I0 = -250 A)
VOH
VDD1 -0.9
-
VDD1
V
-
-
2.5
-
-
5.0
Low Level Input Current CS
MOSI, SCLK Input Current
A
IIL
VI = 1.0 V
A
IIN
0.0 < VIN < VDD
RESET PIN (RST)
High Level Output current
Low Level Output Voltage (I0 = 1.5 mA)
Reset pull-down current
A
IOH
0.0 < VOUT < 0.7 VDD
VOL
IPDW
V
mA
WATCHDOG PIN (WDOG)
Low Level Output Voltage (I0 = 1.5 mA)
VOL
5.5 V < VSUP < 27 V
High Level Output Voltage (I0 = -250 A)
V
INTERRUPT PIN (INT)
HIGH-SIDE OUTPUT PIN (HS1)
RDSON at Tj = 25 °C, and IOUT -150 mA
RDSON at TJ = 125 °C, and IOUT -150 mA

RDON125-2
5.5 V < VSUP < 9.0 V
Output current limitation

RDSON125
VSUP > 9.0 V
RDSON at TJ = 125 °C, and IOUT -120 mA

RDSON25
VSUP > 9.0 V
ILIM
-
4.0
5.5
160
-
500
mA
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Symbol
Min
Typ
Max
Unit
OVT
155
-
190
°C
ILEAK
-
-
10
A
VCL
-1.5
-
-0.3
V
5.5 V < VSUP < 6.0 V
1.7
2.0
3.0
6.0 V < VSUP < 18 V
2.0
2.4
3.0
18 V < VSUP < 27 V
2.0
2.5
3.1
5.5 V < VSUP < 6.0 V
2.2
2.75
4.0
6.0 V < VSUP < 18 V
2.5
3.4
4.0
18 V < VSUP < 27 V
2.5
3.5
4.1
5.5 V < VSUP < 6.0 V
2.0
2.5
3.0
6.0 V < VSUP < 18 V
2.5
3.0
3.7
18 V < VSUP < 27 V
2.7
3.2
3.8
Overtemperature Shutdown
Leakage current
Output Clamp Voltage at IOUT = -1.0 mA
(19)
no inductive load drive capability
INPUT PINS (L0 AND L1)
L0 Negative Switching Threshold
L0 Positive Switching Threshold
L1 Negative Switching Threshold
L1 Positive Switching Threshold
VTH0N
V
VTH0P
V
VTH1N
V
VTH1P
V
5.5 V < VSUP < 6.0 V
2.7
3.3
3.8
6.0 V < VSUP < 18V
3.0
4.0
4.7
18 V < VSUP < 27 V
3.5
4.2
4.8
0.6
1.0
1.3
Hysteresis
VHYST
5.5 V < VSUP < 27 V
Input current
V
A
IIN
-0.2 V < VIN < 40 V
-10
-
10
CAN MODULE SPECIFICATION (TX, RX, CANH, CANL, RTH, AND RTL)
DC Voltage On Pins TX, RX
VLOGIC
-0.3
VDD1 + 0.3
V
DC voltage at V2 (V2INT)
V2INT
0.0
5.25
V
DC Voltage On Pins CANH, CANL
VBUS
-20
+27
V
Notes
19. Refer to HS1 negative maximum rating voltage limitation of -0.2 V.
Transient Voltage At Pins CANH, CANL
0.0 < V2-INT < 5.5 V; VSUP  0.0; T < 500 ms
VCANH/VCANL
V
-40
-
40
Transient Voltage On Pins CANH, CANL (Coupled Through 1.0
nF Capacitor)
VTR
-150
-
100
V
Detection Threshold For Short-circuit To Battery Voltage (Term
VBAT Mode) MC33889B
VCANH
VSUP/2+3
-
VSUP/2+5
V
Detection Threshold For Short-circuit To Battery Voltage (Term
VBAT Mode) MC33889D
VCANH
VSUP/2+3
-
VSUP/2+4.55
V
VRTL, VRTH
-0.3
-
+27
V
DC Voltage On Pins RTH, RTL
33889
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Transient Voltage At Pins RTH, RTL
0.0 < V2-INT < 5.5 V; VSUP 0.0; T < 500 ms
Symbol
Min
Typ
Max
-0.3
-
40
VRTH/VRTL
Unit
V
TRANSMITTER DATA PIN (TX)
High Level Input Voltage
VIH
0.7*V2
-
V2+0.3V
V
Low Level Input Voltage
VIL
-0.3
-
0.3 * V2
V
TX High Level Input Current (VI = 4.0 V)
ITXH
-100
-50
-25
A
TX Low Level Input Current (VI = 1.0 V)
ITXL
-100
-50
-25
A
High Level Output Voltage RX (I0 = -250 A)
VOH
V2-INT - 0.9
-
V2-INT
V
Low Level Output Voltage (I0 = 1.5 mA)
VOL
0.0
-
0.9
V
RECEIVE DATA PIN (RX)
CAN HIGH AND CAN LOW PINS (CANH, CANL)
Differential Receiver, Recessive To Dominant Threshold
VDIFF1
V
(By Definition, VDIFF = VCANH-VCANL)
For 33889D
For 33889B
Differential Receiver, Dominant To Recessive Threshold (Bus
Failures 1, 2, 5)
TX = 5.0 V; R(RTL) < 4.0 k
-2.5
-3.2
-2.6
-2.1
V
-3.5
-3.0
-2.5
-3.2
-2.6
-2.1
VCANH
TX = 5.0 V; R(RTH) < 4.0 k
CANL Recessive Output Voltage
-3.0
VDIFF2
For 33889D
For 33889B
CANH Recessive Output Voltage
-3.5
V
-
-
0.2
V2-INT - 0.2
-
-
VCANL
V
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
CANH Output Voltage, Dominant
TX = 0.0 V; ICANH = -40 mA; Normal Operating Mode (20)
CANL Output Voltage, Dominant
TX = 0.0 V; ICANL = 40 mA; Normal Operating Mode (20)
CANH Output Current (VCANH = 0; TX = 0.0)
Symbol
Min
Typ
Max
Unit
VCANH
V2 - 1.4
-
-
V
VCANL
-
-
1.4
V
50
100
130
50
75
110
ICANH
For 33889D
For 33889B
CANL Output Current (VCANL = 14 V; TX = 0.0)
mA
ICANL
For 33889D
For 33889B
mA
50
140
170
50
90
135
VCANH, VCANL
7.3
7.9
8.9
V
Detection Threshold For Short-circuit To Battery Voltage (Term
VBAT Mode), MC33889B
VcanH
Vsup/2+3
-
Vsup/2+5
V
Detection Threshold For Short-circuit To Battery Voltage (Term
VBAT Mode), MC33889D
VcanH
Vsup/2+3
-
Vsup/2+4.55
V
CANH Output Current (Term VBAT Mode; VCANH = 12 V,
Failure3)
ICANH
-
5.0
10
A
CANL Output Current (Term VBAT Mode; VCANL = 0.0 V;
ICANL
-
0.0
2.0
A
CANL Wake-up Voltage Threshold
VWAKE,L
2.5
3.0
3.9
V
CANH Wake-up Voltage Threshold
VWAKE,H
1.2
2.0
2.7
V
VWAKEL-VWAKEH
0.2
-
-
V
CANH Single Ended Receiver Threshold (Failures 4, 6, 7)
VSE, CANH
1.5
1.85
2.15
V
CANL Single Ended Receiver Threshold (Failures 3, 8)
VSE, CANL
2.8
3.05
3.4
V
CANL Pull-up Current (Normal Mode)
ICANL,PU
45
75
90
A
CANH Pull-down Current (Normal Mode)
ICANH,PD
45
75
90
A
RDIFF
100
-
300
k
VCOM
-10
-
10
V
CANH To Ground Capacitance
CCANH
-
-
50
pF
CANL To Ground Capacitance
CCANL
-
-
50
pF
CCANL to CCANH Capacitor Difference
DCCAN
-
-
10
pF
tCSD
150
160
-
°C
Detection Threshold For Short-circuit To Battery Voltage
(Normal Mode)
VBAT = 12 V, Failure 4)
Wake-up Threshold Difference (Hysteresis)
Receiver Differential Input Impedance CANH / CANL
Differential Receiver Common Mode Voltage Range
(21)
CAN Driver Thermal Shutdown
Notes
20. For MC33889B, after 128 pulses on TX and no bus failure.
21. Guaranteed by design
33889
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions - VSUP From 5.5 V to 18 V and TJ from -40 to 125 °C, unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25 °C under nominal conditions unless otherwise noted.
Description
Symbol
Min
Typ
Max
10
30
90
Unit
BUS TERMINATION PINS (RTH, RTL)
RTL to V2 Switch On Resistance

RRTL
(IOUT < -10 mA; Normal Operating Mode)
RTL to BAT Switch Series Resistance (term VBAT Mode)
RRTL
8.0
12.5
20
k
RTH To Ground Switch On Resistance (IOUT < 10 mA; Normal
Operating Mode)
RRTH
10
30
90

33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
VSUP From 5.5 V to 18 V, V2INT from 4.75 to 5.25 V and TJ from -40 to 150 °C, unless otherwise noted. Typical values noted
reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Conditions
Symbol
Min
Typ
Max
Unit
SPI operation frequency
FREQ
-
-
4.0
MHz
SCLK Clock Period
DIGITAL INTERFACE TIMING (SCLK, CS, MOSI, MISO)
tPCLK
250
-
-
ns
SCLK Clock High Time
tWSCLKH
125
-
-
ns
SCLK Clock Low Time
tWSCLKL
125
-
-
ns
Falling Edge of CS to Rising Edge of SCLK
tlLEAD
100
50
-
ns
Falling Edge of SCLK to Rising Edge of CS
tLAG
100
50
-
ns
MOSI to Falling Edge of SCLK
tSISU
40
25
-
ns
Falling Edge of SCLK to MOSI
tSIH
40
25
-
ns
MISO Rise Time (CL = 220 pF)
tRSO
-
25
50
ns
MISO Fall Time (CL = 220 pF)
tfSO
-
25
50
ns
tSOEN
-
-
50
tSODIS
-
-
50
-
-
50
Time from Falling or Rising Edges of CS to:
- MISO Low-impedance
- MISO High-impedance
Time from Rising Edge of SCLK to MISO Data Valid
0.2 V1 SO  0.8 V1, CL = 200 pF
Delay between CS low to high transition (at end of SPI stop
command) and Stop or sleep mode activation (22) detected by
V2 off
Interrupt low level duration
ns
tVALID
All modes except Sleep and Stop (22)
s
TCS-STOP
18
-
34
s
TINT
SBC in stop mode
Internal oscillator frequency
ns
7.0
10
13
-
100
-
OSC-F1
kHz
Notes
22. Guaranteed by design
33889
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
VSUP From 5.5 V to 18 V, V2INT from 4.75 to 5.25 V and TJ from -40 to 150 °C, unless otherwise noted. Typical values noted
reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Conditions
Internal low power oscillator frequency
Symbol
Watchdog period 1 - stop
Sleep and Stop modes
50.4
88
100
112
308
350
392
ms
ms
ms
%
-12
-
12
308
350
392
6.82
9.75
12.7
31.5
45
58.5
ms
ms
ms
ms
70
100
130
245
350
455
-30
-
30
3.22
4.6
5.98
ms
%
CSFWU1
Sleep and Stop modes
Cyclic sense/FWU timing 2
45
F2ACC
Stop mode
Cyclic sense/FWU timing 1
39.6
WD4STOP
Stop mode
Stop mode watchdog period accuracy
10.92
WD3STOP
Stop mode
Watchdog period 4 - stop
9.75
WD2STOP
Stop mode
Watchdog period 3 - stop
8.58
WD1STOP
Stop mode
Watchdog period 2- stop
ms
NRTOUT
Normal request mode
Unit
kHz
F1ACC
Normal and standby modes
Normal request mode timeout
-
WD4
Normal and standby modes
Watchdog period accuracy
100
WD3
Normal and standby modes
Watchdog period 4
-
WD2
Normal and standby modes
Watchdog period 3
Max
WD1
Normal and standby modes
Watchdog period 2
Typ
OSC-F2
Sleep and Stop modes (23)
Watchdog period 1
Min
ms
CSFWU2
ms
6.47
9.25
12
Notes
23. Guaranteed by design
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
VSUP From 5.5 V to 18 V, V2INT from 4.75 to 5.25 V and TJ from -40 to 150 °C, unless otherwise noted. Typical values noted
reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Conditions
Cyclic sense/FWU timing 3
Symbol
Normal request mode
74
96.2
66.8
95.5
124
134
191
248
271
388
504
ms
ms
ms
s
200
300
400
-30
-
+30
-
-
22
-
-
22
9.0
-
25
9.0
-
25
15
35
70
%
s
s
s
s
tS-V2OFF
Normal modes
Delay between Normal Request and Normal mode, after 
W/D trigger command
51.8
tS-V2ON
Standby mode
Delay between SPI and V2 turn off (24)
ms
tS-HSOFF
Normal or Standby mode, VSUP > 9.0 V
Delay between SPI and V2 turn on (24)
ms
tS-HSON
Normal or Standby mode, VSUP > 9.0 V
Delay between SPI command and HS1 turn off (24)
48.1
tACC
Sleep and Stop mode
Delay between SPI command and HS1 turn on (24)
37
tON
Sleep and Stop modes
Cyclic sense/FWU timing accuracy
25.9
Unit
ms
CSFWU8
Sleep and Stop modes
Cyclic sense On time
24
CSFWU7
Sleep and Stop modes
Cyclic sense/FWU timing 8
18.5
CSFWU6
Sleep and Stop modes
Cyclic sense/FWU timing 7
12.9
CSFWU5
Sleep and Stop modes
Cyclic sense/FWU timing 6
Max
CSFWU4
Sleep and Stop modes
Cyclic sense/FWU timing 5
Typ
CSFWU3
Sleep and Stop modes
Cyclic sense/FWU timing 4
Min
s
tS-NR2N
Notes
24. State Machine Timing - Delay starts at rising edge of CS (end of SPI command) and start of Turn on or Turn off of HS1 or V2.
33889
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
VSUP From 5.5 V to 18 V, V2INT from 4.75 to 5.25 V and TJ from -40 to 150 °C, unless otherwise noted. Typical values noted
reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Conditions
Delay between SPI and “CAN normal mode”
Symbol
SBC Normal mode
10
s
-
-
10
15
40
90
s
s
90
-
-
20
-
-
s
s
t2SPI
For 33889D only
Unit
s
tS-1STSPI
In Stop mode after wake-up
Delay between two SPI messages addressing the same
register
-
tW-SPI
SBC in Stop mode
Delay between INT pulse and 1st SPI command accepted
-
tW-CS
SBC in Stop mode
Delay between CS wake-up (CS low to high) and first accepted
SPI command
Max
tS-CANS
(25)
Delay between CS wake-up (CS low to high) and SBC normal
request mode (VDD1 on & reset high)
Typ
tS-CANN
SBC Normal mode (25)
Delay between SPI and “CAN sleep mode”
Min
25
-
-
8.0
20
38
2.0
2.0
-
8.0
9.0
-
1.2
1.6
-
1.1
1.8
-
1.8
2.2
INPUT PINS (L0 AND L1)
Wake-up Filter Time (enable/disable option on L0 input)
tWUF
s
(If filter enabled)
PIN AC CHARACTERISTICS (CANH, CANL, RX, TX)
CANL and CANH Slew Rates (25% to 75% CAN signal). (26)
tSLDR
Recessive to Dominant state
Dominant to Recessive state
Propagation Delay
s
tONRX
TX to RX Low. -40 < T  25°C. (27)
TX to RX Low. 25 < T < 125°C. (27)
Propagation Delay TX to RX High. (27)
V/s
tOFFRX
s
Notes
25. Guaranteed by design
26. Dominant to recessive slew rate is dependant upon the bus load characteristics.
27. AC Characteristics measured according to schematic Figure 5
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
VSUP From 5.5 V to 18 V, V2INT from 4.75 to 5.25 V and TJ from -40 to 150 °C, unless otherwise noted. Typical values noted
reflect the approximate parameter means at TA = 25°C under nominal conditions, unless otherwise noted.
Conditions
Loop time Tx to Rx, no bus failure, MC33889D only ((28),
Figure 6) (ISO ICT test series 10)
Symbol
Min. Dominant Time For Wake-up On CANL or CANH
Max
Unit
s
-
1.15
1.5
-
1.45
1.5
s
tLOOPRD-F
Tx high to low transition (dominant edge)
Tx low to high transition (recessive edge)
Loop time Tx to Rx, with bus failure and 1.5 V gnd shift, 5
nodes network, MC33889D,((29), Figure 8, ISO ICT tests
series 11)
Typ
tLOOPRD
Tx high to low transition (dominant edge)
Tx low to high transition (recessive edge)
Loop time Tx to Rx, with bus failure, MC33889D only ((28),
Figure 7) (ISO ICT test series 10)
Min
-
-
1.9
-
-
1.9
tLOOPRD/DR-F+GS
3.6
s
s
tWAKE
(Term VBAT; VSUP = 12 V) Guaranteed by design.
MC33889B
MC33889D
-
30
-
8.0
16
30
Failure 3 Detection Time (Normal Mode)
tDF3
10
30
80
s
Failure 3 Recovery Time (Normal Mode)
tDR3
-
160
-
s
Failure 6 Detection Time (Normal Mode)
tDF6
50
200
500
s
Failure 6 Recovery Time (Normal Mode)
tDR6
150
200
1000
s
Failure 4, 7 Detection Time (Normal Mode)
tDF47
0.75
1.5
4.0
ms
Failure 4, 7 Recovery Time (Normal Mode)
tDR47
10
30
60
s
Failure 3a, 8 Detection Time (Normal Mode)
tDF8
0.75
1.7
4.0
ms
Failure 3a, 8 Recovery Time (Normal Mode)
tTDR8
0.75
1.5
4.0
ms
Failure 4, 7 Detection Time, (Term VBAT; VSUP = 12 V)
tDR47
0.8
1.2
8.0
ms
Failure 4, 7 Recovery Time (Term VBAT; VSUP = 12 V)
tDR47
-
1.92
-
ms
Failure 3 Detection Time (Term VBAT; VSUP = 12 V)
tDR3
-
3.84
-
ms
Failure 3 Recovery Time (Term VBAT; VSUP = 12 V)
tDR3
-
1.92
-
ms
Failure 3a, 8Detection Time (Term VBAT; VSUP = 12 V)
tDR8
-
2.3
-
ms
Failure 3a, 8 Recovery Time (Term VBAT; VSUP = 12 V)
tDR8
-
1.2
-
ms
Edge Count Difference Between CANH and CANL for Failures 1,
2, 5 Detection (Failure bit set, Normal Mode)
ECDF
-
3
-
Edge Count Difference Between CANH And CANL For Failures
1, 2, 5 Recovery (Normal Mode)
ECDR
-
3
-
TX Permanent Dominant Timer Disable Time
(Normal Mode And Failure Mode)
tTX,D
0.75
-
4.0
ms
TX Permanent Dominant Timer Enable Time
(Normal Mode And Failure Mode)
tTX,E
10
-
60
s
Notes
28. AC characteristic according to ISO11898-3, tested per figure 5 and 6. Guaranteed by design, room temperature only.
29. AC characteristic according to ISO11898-3, tested per figure 7. Max reported is the typical measurement under the worst condition (gnd
shift, dominant/recessive edge, at source or destination node. ref to ISO test specification). Guaranteed by design, room temperature
only.
33889
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
5V
VDD
R
RtL
C
Tx
CANL
C
1nF
500 RcanH
1nF
CANL
MC33889D
R = 100
C = 1nF
Rx
CANH
R
RcanL
500
CANH
RtH
C
RcanL = RcanH = 125 
Figure 5. Test Circuit for AC Characteristics
Figure 6. ISO loop time without bus failure
Vbat
RtL
Tx
500
CANL
RcanH
1nF
Failure
Generator (*)
CANH
RtH
1nF
Bus
MC33889D
Rx
RcanL
500
RcanL = RcanH = 125 
except for failure CANH short to CANL
(Rcanl = 1M )
(*) List of failure
CANL short to gnd, Vdd, Vbat
CANHshort to gnd, Vdd, Vbat
CANL short to CANH
CANL and CANH open
Figure 7. ISO Loop Time with Bus Failure
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Figure 8. Test Set Up for Propagation Delay with GND Shift in a 5 Node Configuration
33889
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
VTX
TX HIgh: RECESSIVE Bit
TX High: RECESSIVE Bit
TX Low: DOMINANT Bit
5.0V
CANL
3.6V
1.4V
0.0V
CANH
2.2V
VTH(DR)
VDIFF
VTH(RD)
tOFFTX
-5.0V
VRX
0.7VCC
0.3VCC
tONRX
tOFFRX
RECESSIVE Bit
DOMINANT Bit
t
RECESSIVE Bit
Figure 9. Device Signal Waveforms
TPCLK
CS
TWCLKH
TLEAD
TLAG
SCLK
TWCLKL
TSISU
MOSI
Undefined
D0
TSIH
Don’t Care
D7
Don’t Care
TVALID
TSODIS
TSOEN
MISO
D0
Don’t Care
D7
Figure 10. Timing Characteristic
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
•
•
•
•
•
•
The MC33889 is an integrated circuit dedicated to automotive applications. It includes the following functions:
One full protected voltage regulator with 200 mA total output current capability.
Driver for external path transistor for V2 regulator function.
Reset, programmable watchdog function
Four operational modes
Wake-up capabilities: Forced wake-up, cyclic sense and wake-up inputs, CAN and the SPI
Can low speed fault tolerant physical interface.
FUNCTIONAL PIN DESCRIPTION
RECEIVE AND TRANSMIT DATA (RX AND TX)
The RX and TX pins (receive data and transmit data pins, respectively) are connected to a microcontroller’s CAN protocol
handler. TX is an input and controls the CANH and CANL line state (dominant when TX is LOW, recessive when TX is HIGH).
RX is an output and reports the bus state (RX LOW when CAN bus is dominant, HIGH when CAN bus is recessive).
VOLTAGE REGULATOR ONE (VDD1)
The VDD1 pin is the output pin of the 5.0 V internal regulator. It can deliver up to 200 mA. This output is protected against
overcurrent and overtemperature. It includes an overtemperature prewarning flag, which is set when the internal regulator
temperature exceeds 130 °C typical. When the temperature exceeds the overtemperature shutdown (170 °C typical), the
regulator is turned off. VDD1 includes an undervoltage reset circuitry, which sets the RST pin LOW when VDD is below the
undervoltage reset threshold.
RESET (RST)
The Reset pin RST is an output that is set LOW when the device is in reset mode. The RST pin is set HIGH when the device
is not in reset mode. RST includes an internal pull-up current source. When RST is LOW, the sink current capability is limited,
allowing RST to be shorted to 5.0 V for software debug or software download purposes.
INTERRUPT (INT)
The Interrupt pin INT is an output that is set LOW when an interrupt occurs. INT is enabled using the Interrupt Register (INTR).
When an interrupt occurs, INT stays LOW until the interrupt source is cleared. INT output also reports a wake-up event by a 10
sec. typical pulse when the device is in Stop mode.
GROUND (GND)
This pin is the ground of the integrated circuit.
V2CTRL (V2CTRL)
The V2CTRL pin is the output drive pin for the V2 regulator connected to the external series pass transistor.
VOLTAGE SUPPLY (VSUP)
The VSUP pin is the battery supply input of the device.
HIGH-SIDE OUTPUT 1 (HS1)
The HS pin is the internal high-side driver output. It is internally protected against overcurrent and overtemperature.
LEVEL 0-1 INPUTS (L0: L1)
The L0: L1 pins can be connected to contact switches or the output of other ICs for external inputs. The input states can be
read by the SPI. These inputs can be used as wake-up events for the SBC when operating in the Sleep or Stop mode.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
VOLTAGE REGULATOR TWO (V2)
The V2 pin is the input sense for the V2 regulator. It is connected to the external series pass transistor. V2 is also the 5.0 V
supply of the internal CAN interface. It is possible to connect V2 to an external 5.0 V regulator or to the VDD output when no
external series pass transistor is used. In this case, the V2CTRL pin must be left open.
RTH (RTH)
Pin for the connection of the bus termination resistor to CANH
RTL (RTL)
Pin for the connection of the bus termination resistor to CANL
CAN HIGH AND CAN LOW OUTPUTS
(CANH AND CANL)
The CAN High and CAN Low pins are the interfaces to the CAN bus lines. They are controlled by TXD input level, and the
state of CANH and CANL is reported through RXD output.
SYSTEM CLOCK (SCLK)
SCLK is the Serial Data Clock input pin of the serial peripheral interface.
MASTER IN/SLAVE OUT (MISO
MISO is the Master In Slave Out pin of the serial peripheral interface. Data is sent from the SBC to the microcontroller through
the MISO pin.
MASTER OUT/SLAVE IN (MOSI)
MOSI is the Master Out Slave In pin of the serial peripheral interface. Control data from a microcontroller is received through
this pin.
CHIP SELECT (CS)
CS is the Chip Select pin of the serial peripheral interface. When this pin is LOW, the SPI port of the device is selected.
WATCH DOG (WDOG)
The Watchdog output pin is asserted LOW to flag that the software watchdog has not been properly triggered.
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
DEVICE SUPPLY
The device is supplied from the battery line through the VSUP pin. An external diode is required to protect against negative
transients and reverse battery. It can operate from 4.5 V and under the jump start condition at 27 V DC. This pin sustains standard
automotive voltage conditions such as load dump at 40 V. When VSUP falls below 3.0 V typical, the MC33889 detects it and
stores the information in the SPI register, in a bit called “BATFAIL”. This detection is available in all operation modes.
VDD1 VOLTAGE REGULATOR
VDD1 Regulator is a 5.0 V output voltage with total current capability of 200 mA. It includes a voltage monitoring circuitry
associated with a reset function. The VDD1 regulator is fully protected against overcurrent, short-circuit and has overtemperature
detection warning flags and shutdown with hysteresis.
V2 REGULATOR
V2 Regulator circuitry is designed to drive an external path transistor in order to increase output current flexibility. Two pins
are used: V2 and V2CTRL. Output voltage is 5.0 V and is realized by a tracking function of the VDD1 regulator. A recommended
ballast transistor is the MJD32C. Other transistors might be used, however depending upon the PNP gain, an external resistor
capacitor network might be connected between the emitter and base of the PNP. The use of external ballast is optional (refer to
simplified typical application). The state of V2 is reported into the IOR register (if V2 is below 4.5 V typical, or in cases of overload
or short-circuit).
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Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
HS1 VBAT SWITCH OUTPUT
HS1 output is a 2.0  typical switch from the VSUP pin. It allows the supply of external switches and their associated pull-up
or pull-down circuitry, for example, in conjunction with the wake-up input pins. Output current is limited to 200 mA and HS1 is
protected against short-circuit and has an over temperature shutdown (reported into the IOR register). The HS1 output is
controlled from the internal register and the SPI. It can be activated at regular intervals in sleep mode thanks to an internal timer.
It can also be permanently turned on in normal or stand-by modes to drive external loads, such as relays or supply peripheral
components. In case of inductive load drive, external clamp circuitry must be added.
SPI
The complete device control as well as the status report is done through an 8 bit SPI interface. Refer to the SPI paragraph.
CAN
The device incorporates a low speed fault tolerant CAN physical interface. The speed rate is up to 125 kBaud.
The state of the CAN interface is programmable through the SPI. Reference the CAN transceiver description on page 31.
PACKAGE AND THERMAL CONSIDERATION
The device is proposed in a standard surface mount SO28 package. In order to improve the thermal performances of the SO28
package, 8 pins are internally connected to the lead frame and are used for heat transfer to the printed circuit board.
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Analog Integrated Circuit Device Data
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FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
INTRODUCTION
The device has four modes of operation, normal, stand-by, sleep and stop modes. All modes are controlled by the SPI. An
additional temporary mode called “normal request mode” is automatically accessed by the device (refer to state machine) after
wake-up events. Special mode and configurations are possible for software application debug and flash memory programming.
NORMAL MODE
In this mode both regulators are ON, and this corresponds to the normal application operation. All functions are available in
this mode (watchdog, wake-up input reading through the SPI, HS1 activation, and CAN communication). The software watchdog
is running and must be periodically cleared through the SPI.
STANDBY MODE
Only the Regulator 1 is ON. Regulator 2 is turned OFF by disabling the V2CTRL pin. The CAN cell is not available, as powered
from V2. Other functions are available: wake-up input reading through the SPI and HS1 activation. The watchdog is running.
SLEEP MODE
Regulators 1 and 2 are OFF. In this mode, the MCU is not powered. The device can be awakened internally by cyclic sense
via the wake-up input pins and HS1 output, from the forced wake function, the CAN physical interface, and the SPI (CS pin).
STOP MODE
Regulator 2 is turned OFF by disabling the V2CTRL pin. Regulator 1 is activated in a special low power mode which allows it
to deliver 2.0 mA. The objective is to supply the MCU of the application while it is turned into a power saving condition (i.e stop
or wait mode).
Stop mode is entered through the SPI. Stop mode is dedicated to powering the Microcontroller when it is in low power mode
(stop, pseudo stop, wait etc.). In these modes, the MCU supply current is less than 1.0 mA. The MCU can restart its software
application very quickly without the complete power up and reset sequence.
When the application is in stop mode (both MCU and SBC), the application can wake-up from the SBC side (ex cyclic sense,
forced wake-up, CAN message, wake-up inputs) or the MCU side (key wake-up etc.).
When Stop mode is selected by the SPI, stop mode becomes active 20 s after end of the SPI message. The “go to stop”
instruction must be the last instruction executed by the MCU before going to low power mode.
In Stop mode, the Software watchdog can be “running” or “not running” depending on the selection by the SPI. Refer to the
SPI description, RCR register bit WDSTOP. If the W/D is enabled, the SBC must wake-up before the W/D time has expired,
otherwise a reset is generated. In stop mode, the SBC wake-up capability is identical as in sleep mode.
STOP MODE: WAKE-UP FROM SBC SIDE, INT PIN ACTIVATION
When an application is in stop mode, it can wake-up from the SBC side. When a wake-up is detected by the SBC (CAN, Wakeup input, forced wake-up, etc.), the SBC turns itself into Normal request mode and activates the VDD1 main regulator. When the
main regulator is fully active, then the wake-up is signalled to the MCU through the INT pin. The INT pin is pulled low for 10 s
and then returns high. Wake-up events can be read through the SPI registers.
STOP MODE: WAKE-UP FROM MCU SIDE
When the application is in stop mode, the wake-up event may come to the MCU. In this case, the MCU has to signal to the
SBC that it has to go into Normal mode in order for the VDD1 regulator to be able to deliver full current capability. This is done
by a low to high transition of the CS pin. The CS pin low to high activation has to be done as soon as possible after the MCU.
The SBC generates a pulse at the INT pin. Alternatively the L0 and L1 inputs can also be used as wake-up from the Stop mode.
STOP MODE CURRENT MONITORING
If the current in Stop mode exceeds the IDD1S-WU threshold, the SBC jumps into Normal request mode, activates the VDD1
main regulator, and generates an interrupt to the MCU. This interrupt is not maskable and a not bit are set into the INT register.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
27
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
SOFTWARE WATCHDOG IN STOP MODE
If the watchdog is enabled (register MCR, bit WDSTOP set), the MCU has to wake-up independently of the SBC before the
end of the SBC watchdog time. In order to do this, the MCU has to signal the wake-up to the SBC through the SPI wake-up (CS
pin low to high transition to activated the SPI wake-up). Then the SBC wakes up and jumps into the normal request mode. The
MCU has to configure the SBC to go to either into normal or standby mode. The MCU can then choose to go back into stop mode.
If no MCU wake-up occurs within the watchdog timing, the SBC will activate the reset pin and jump into the normal request
mode. The MCU can then be initialized.
NORMAL REQUEST MODE
This is a temporary mode automatically accessed by the device after a wake-up event from sleep or stop mode, or after device
power up. In this mode, the VDD1 regulator is ON, V2 is off, and the reset pin is high. As soon as the device enters the normal
request mode, an internal 350 ms timer is started. During these 350 ms, the microcontroller of the application must address the
SBC via the SPI and configure the watchdog register (TIM1 register). This is the condition for the SBC to leave the Normal request
Mode and enter the Normal mode, and to set the watchdog timer according to the configuration done during the Normal Request
mode.
The “BATFAIL flag” is a bit which is triggered when VSUP falls below 3.0 V. This bit is set into the MCR register. It is reset by
the MCR register read.
INTERNAL CLOCK
This device has an internal clock used to generate all timings (reset, watchdog, cyclic wake-up, filtering time etc...).
RESET PIN
A reset output is available in order to reset the microcontroller. Reset causes are:
• VDD1 falling out of range: if VDD1 falls below the reset threshold (parameter RST-TH), the reset pin is pulled low until VDD1 returns
to the nominal voltage.
• Power on reset: at device power on or at device wake-up from sleep mode, the reset is maintained low until VDD1 is within its
operation range.
• Watchdog timeout: if the watchdog is not cleared, the SBC will pull the reset pin low for the duration of the reset duration time
(parameter: RESET-DUR).
For debug purposes at 25 °C, the reset pin can be shorted to 5.0 V.
SOFTWARE WATCHDOG (SELECTABLE WINDOW OR TIMEOUT WATCHDOG)
The software watchdog is used in the SBC normal and stand-by modes for monitoring the MCU. The watchdog can be either
a window or timeout. This is selectable by the SPI (register TIM, bit WDW). Default is the window watchdog. The period of the
watchdog is selectable by the SPI from 5.0 to 350 ms (register TIM, bits WDT0 and WDT1). When the window watchdog is
selected, the closed window is the first half of the selected period, and the open window is the second half of the period. The
watchdog can only be cleared within the open window time. An attempt to clear the watchdog in the closed window will generate
a reset. The Watchdog is cleared through the SPI by addressing the TIM register.
Refer to “table for reset pin operations” operation in mode 2.
WAKE-UP CAPABILITIES
Several wake-up capabilities are available for the device when it is in sleep or stop mode. When a wake-up has occurred, the
wake-up event is stored into the WUR or CAN registers. The MCU can then access the wake-up source. The wake-up options
are selectable through the SPI while the device is in normal or standby mode, and prior to entering low power mode (Sleep or
Stop mode).
WAKE-UP FROM WAKE-UP INPUTS (L0, L1) WITHOUT CYCLIC SENSE
The wake-up lines are dedicated to sense external switch states, and when changes occur to wake-up the MCU (In sleep or
stop modes). The wake-up pins are able to handle 40 V DC. The internal threshold is 3.0 V typical, and these inputs can be used
as an input port expander. The wake-up inputs state can be read through the SPI (register WUR). L0 has a lower threshold than
L1 in order to allow a connection and wake-up from a digital output such as a CAN physical interface.
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
CYCLIC SENSE WAKE-UP (CYCLIC SENSE TIMER AND WAKE-UP INPUTS L0, L1)
The SBC can wake-up from a state change of one of the wake-up input lines (L0, L1), while the external pull-up or pull-down
resistor of the switches associated to the wake-up input lines are biased with HS1 VSUP switch. The HS1 switch is activated in
sleep or stop mode from an internal timer. Cyclic sense and forced wake-up are exclusive. If Cyclic sense is enabled, the forced
wake-up can not be enabled.
INFO FOR CYCLIC SENSE + DUAL EDGE SELECTION
In case the Cyclic sense and Lx both level sensitive conditions are use together, the initial value for Lx inputs are sampled in
two cases:
1) When the register LPC[D3 and D0] are set and
2) At cyclic sense event, that is when device is in sleep or stop mode and HS1 is active.
The consequence is that when the device wake up by Lx transition, the new value is sampled as default, then when the device
is set back into low power again, it will automatically wake up.
The user should reset the LPC bits [D3 and D0] to 0 and set them again to the desired value prior to enter sleep or stop
mode.
FORCED WAKE-UP
The SBC can wake-up automatically after a predetermined time spent in sleep or stop mode. Forced wake-up is enabled by
setting bit FWU in the LPC register. Cyclic sense and forced wake-up are exclusive. If forced wake-up is enabled, the Cyclic
sense can not be enabled.
CAN WAKE-UP
The device can wake-up from a CAN message. A CAN wake-up cannot be disabled.
SPI WAKE-UP
The device can wake-up by the CS pin in sleep or stop mode. Wake-up is detected by the CS pin transition from a low to high
level. In stop mode this correspond to the condition where the MCU and SBC are both in Stop mode, and when the application
wake-up events come through the MCU.
SYSTEM POWER UP
At power up the device automatically wakes up.
DEVICE POWER UP, SBC WAKE UP
After device or system power up or a wake-up from sleep mode, the SBC enters into “reset mode” then into “normal request
mode”.
BATTERY FALL EARLY WARNING
This function provides an interrupt when the VSUP voltage is below the 6.1 V typical. This interrupt is maskable. A hysteresis
is included. Operation is only in Normal and Stand-by modes. VBAT low state reports in the IOR register.
RESET AND WDOG OPERATION
The following figure shows the reset and watchdog output operations. Reset is active at device power up and wake-up. Reset
is activated in case the VDD1 falls or the watchdog is not triggered. The WDOG output is active low as soon as the reset goes
low and stays low for as long as the watchdog is not properly re-activated by the SPI.
The WDOG output pin is a push pull structure than can drive external components of the application, for instance to signal the
MCU is in a wrong operation. Even if it is internally turned on (low-state), the reset pin can be forced to 5.0 V at 25 °C only, thanks
to its internally limited current drive capability. The WDOG stays low until the Watchdog register is properly addressed through
the SPI.
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29
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
Watchdog timeout
VDD1
RESET
WDOG
Watchdog
period
SPI
W/D clear
SPI CS
Watchdog register addressed
Figure 11. Reset and WDOG Function Diagram
DEBUG MODE APPLICATION HARDWARE AND SOFTWARE DEBUG WITH THE SBC.
When the SBC is mounted on the same printed circuit board as the micro controller, it supplies both application software and
the SBC with a dedicated routine that must be debugged. The following features allow the user to debug the software by disabling
the SBC internal software watchdog timer.
DEVICE POWER UP, RESET PIN CONNECTED TO VDD1
At SBC power up, the VDD1 voltage is provided, but if no SPI communication occurs to configure the device, a reset occurs
every 350 ms. In order to allow software debugging and avoid an MCU reset, the Reset pin can be connected directly to VDD1
by a jumper.
DEBUG MODES WITH SOFTWARE WATCHDOG DISABLED THOUGH SPI (NORMAL DEBUG, STANDBY DEBUG AND
STOP DEBUG)
The software watchdog can be disabled through the SPI. In order to avoid unwanted watchdog disables, and to limit the risk
of disabling the watchdog during an SBC normal operation, the watchdog disable has to be performed with the following
sequence:
Step 1) Power down the SBC
Step 2) Power up the SBC (The BATFAIL bit is set, and the SBC enters normal request mode)
Step 3) Write to the TIM1 register to allow the SBC to enter Normal mode
Step 4) Write to the MCR register with data 0000 (this enables the debug mode). (Complete SPI byte: 000 1 0000)
Step 5) Write to the MCR register normal debug (0001 x101), stand-by debug (0001 x110), or Stop debug (0001 x111)
While in debug mode, the SBC can be used without having to clear the W/D on a regular basis to facilitate software and
hardware debugging.
Step 6) To leave the debug mode, write 0000 to the MCR register.
To avoid entering the debug mode after a power up, first read the BATFAIL bit (MCR read) and write 0000 into the MCR.
Figure 12 illustrates entering the debug mode.
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FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
VSUP
VDD1
BATFAIL
TIM1(step 3)
MCR (step5)
MCR (step6)
SPI
SPI: read batfail
MCR(step4)
debug mode
SBC not in debug Mode and W/D on
SBC in debug Mode, no W/D
Figure 12. Debug Mode Enter
MCU FLASH PROGRAMMING CONFIGURATION
To facilitate the possibility of down loading software into the application memory (MCU EEPROM or Flash), the SBC allows
the following capabilities: The VDD1 can be forced by an external power supply to 5.0 V and the reset and WDOG output by
external signal sources to zero or 5.0 V without damage. This supplies the complete application board with external power supply
and applies the correct signal to the reset pin.
CAN TRANSCEIVER DESCRIPTION
Vsup
V2
VSE-H (1.85V)
IcanHpd
SH
CANH
Driver
CANL
SL
Stvbat
VSE-L (3.05V)
RXD
Rx multiplexer
CANH
SRL
RTL
Vdiff
RTH
SRH
V2
RtH
Failure detection
Tx driver
SPI
CAN
mode control
Driver
Hwake
CANL
Lwake
CANL
IcanLpu
TXD
RtL
V2
Vwake-H (2V)
CANH
GND
Vwake-L (3V)
Figure 13. Simplified Block Diagram of the CAN Transceiver of the MC33889
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FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
General description
CAN driver:
The CANH driver is a “high-side” switch to the V2 voltage (5.0 V). The CANL driver is a “low-side” switch to gnd.The turn on
and turn off time is controlled in order to control the slew rate, and the CANH and CANL driver have a current limitation as well
as an over temperature shutdown.
The CAN H or CANL driver can be disabled in case a failure is detected on the CAN bus (ex: CANH driver is disabled in case
CANH is shorted to VDD). The disabling of one of the drivers is controlled by the CAN logic and the communication continues via
the other drivers. When the failure is removed the logic detects a failure recovery and automatically reenables the associated
driver.
The CAN drivers are also disabled in case of a Tx failure detection.
Bus termination:
The bus is terminated by pull-up and pull-down resistors, which are connected to GND, VDD, or VBAT through dedicated RTL
and RTH pins and internal switches Srh, Srl, Stvbat. Each node must have a resistor connected between CANH and RTH and
between CANL and RTL. The resistor value should be between 500 and 16000 .
Transmitter Function
CAN bus levels are called Dominant and Recessive, and correspond respectively to Low and High states of the TX input pin.
Dominant state:
The CANH and CANL drivers are on. The voltage at CANL is <1.4 V, the voltage at CANH is >3.6 V, and the differential voltage
between CANH and CANL line is >2.2 V (3.6 -1.4 V).
Recessive state:
This is a weak state, where the CANH and CANL drivers are off. The CANL line is pulled up to 5 V via the RTL pin and RTL
resistor, and the CANH line is pull down via the RTH and RTH resistor. The resultant voltage at CANL is 5.0 V and 0V at CANH.
The differential voltage is -5.0 V (0V - 5.0 V). The recessive state can be over written by any other node forcing a Dominant state.
Receiver Function
In normal operation (no bus failures), RX is the image of the differential bus voltage. The differential receiver inputs are
connected to CANH and CANL.
The device incorporates single ended comparators connected to CANH and CANL in order to monitor the bus state as well as
detect bus failures. Failures are reported via the SPI.
In normal operation when no failure is present, the differential comparator is active. Under a fault condition, one of the two
CANH or CANL pins can be become non-operational. The single ended comparator of either CANH or CANL is activated and
continues to report a bus state to Rx pin. The device permanently monitors the bus failure and recovery, and as soon as fault
disappears, it automatically switches back to differential operation.
CAN interface operation Mode
The CAN has 3 operation modes: TxRx (Transmit-Receive), Receive Only, and Term-VBAT (Terminated to VBAT). The mode
is selected by the SPI. As soon as the MC33889 mode is sleep or stop (selected via MCR register), the CAN interface
automatically enters Tem-Vbat mode.
Tx Rx mode:
In this mode, the CAN drivers and receivers are enabled, and the device is able to send and receive messages. Bus failures
are detected and managed, this means that in case of a bus failure, one of the CAN drivers can be disabled, but communication
continues via the remaining drivers.
Receive Only mode:
In this mode, the transmitter path is disabled, so the device does not drive the bus. It maintains CANL and CANH in the
recessive state. The receiver function operates normally.
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FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
TermVbat mode:
In this mode, the transmitter and receiver functions are disabled. The CANL pin is connected to VSUP through the RTL resistor
and internal pull up resistor of 12.5 k. In this mode, the device monitors the bus activity and if a wake up conditions is
encountered on the CAN bus, it will wakes up the MC33889.
The device will enter into a normal request mode if low power mode was in sleep, or generates an INT. It enters into Normal
request mode if low power mode was in stop mode. If the device was in normal or stand by mode, the Rx pin will report a wake
up (feature not available on the MC33889B). See Rx pin behavior.
Bus Failure Detection
General description:
The device permanently monitors the bus lines and detects faults in normal and receive only modes. When a fault is detected,
the device automatically takes appropriate actions to minimize the system current consumption and to allow communication on
the network. Depending on the type of fault, the mode of operation, and the fault detected, the device automatically switches off
one or more of the following functions: CANL or CANH line driver, RTL or RTH termination resistors, or internal switches. These
actions are detailed in the following table.
The device permanently monitors the faults and in case of fault recovery, it automatically switches back to normal operation
and reconnects the open functions. Fault detection and recovery circuitry have internal filters and delays timing, detailed in the
AC characteristics parameters.
The failure list identification and the consequence on the device operation are described in following table. The failure
detection, and recovery principle, the transceiver state after a failure detected, timing for failure detection and recovery can be
found in the ISO11898-3 standard.
The following table is a summary of the failure identifications and of the consequences on the CAN driver and receiver when
the CAN is in Tx Rx mode.
Bus failure
identification
Description
Consequence on CAN driver
Consequence on Rx pin
no failure
default operation: CAN H and CANL driver active,
RTH and RTL termination switched ON
default operation: Report differential
receiver output
1
CANH open wire
default operation
default operation
5
CANH shorted to GND
default operation
default operation
8, 3a
CANH shorted to VDD
(5.0 V)
CANH driver turn OFF. RTH termination switched
OFF
Rx report CANL single ended receiver
3
CANH shorted to VBAT
CANH driver turn OFF. RTH termination switched
OFF
Rx report CANL single ended receiver
2
CANL open wire
default operation
default operation
4, 7
CANL shorted to GND or
CANL shorted to CANH
CANL driver is OFF. RTL termination switched OFF
Rx report CANH single ended receiver
9
CANL shorted to VDD
(5.0 V)
CANL driver is ON. RTL termination active
default operation
6
CANL shorted to VBAT
CANL driver is OFF. RTL termination switched OFF
Rx report CANH single ended receiver
Open wire detection operation:
Description:
The CANH and CANL open wire failures are not described in the ISO document. Open wire is only diagnostic information, as
no CAN driver or receiver state will change in case of an open wire condition.
In case one of the CAN wires are open, the communication will continue through the remaining wire. In this situation the 33889
will receive information on one wire only and the consequences are as follows:
when the bus is set in dominant:
- The differential receiver will toggle
- Only one of the single ended receivers CANH or of CANL will toggle
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FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
The following figure illustrates the CAN signal during normal communication and in the example of a CANH open wire. The
single ended receiver is sampled at the differential receiver switching event, in a window of 1.0 s.
(No open wire, or open wire recovery)
Rec
CANL
Dom
Rec
(CAN H open wire)
Rec
CANL
CANH
Dom
Rec
CANH
Sampling point
-3.2V
Diff
S-L
S-L
S-H
S-H
1us
Sampling dominant level
= > no failure or “recovery pulse”
Sampling point
-3.2V
Diff
Sampling recessive level
= > open wire “detection pulse”
Figure 14. CAN Normal Signal Communication and CAN Open Wire
S-H
1us
Sampling
CANH
Diff
Dom Rec
CANL
S-L
1us
Sampling
CANH counter
L-counter +/(count = 4)
(count = 0)
L-open
recover
Figure 15. Open Wire Detection Principle
Open wire detection, MC33889B and D:
Failure detection:
The device will detect a difference in toggling counts between the differential receiver and one of the single ended receivers.
Every time a difference in count is detected a counter is incremented. When the counter reaches 4, the device detects and reports
an open wire condition. The open wire detection is performed only when the device receives a message and not when it send
message.
Open wire recovery:
When the open wire failure has recovered, the difference in count is reduced and the device detects the open wire recovery.
33889
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
MC33889B:
When detection is complete, the counter is no longer incremented. It can only be decremented by sampling of the dominant
level on the S-H (S-L) (recovery pulse). When it reaches zero, the failure has recovered.
In application, with CAN communication, a recovery condition is detected after 4 acknowledge bits are sent by the MC33889B.
MC333889D:
When detection is complete, the counter is decremented by sampling the dominant pulse (recovery pulse) on S-H (S-L), and
incremented (up to 4) by sampling the recessive pulse (detection pulses) on S-H (S-L). It is necessary to get 4 consecutive
dominant samples (recovery pulse) to get to zero. When reaching zero, the failure is recovered.
In application with real CAN communication, a recovery condition will not be detected by a single acknowledge bit send by
MC33889D, but requires a complete CAN message (at least 4 dominant bits) send in dual wire mode, without reception of any
bit in single wire mode.
Tx permanent dominant detection:
In addition to the previous list, the 33889 detects a permanent low state at the TX input which results in a permanent dominant
bus state. If TX is low for more than 0.75-4.0 ms, the bus output driver is disabled. This avoids blocking communication between
other nodes of the network. TXD is reported via the SPI (RCR register bit D1: TXFAILURE). Tx permanent dominant recovery is
done with TX recessive for more than typ 32 s.
Rx pin behavior while CAN interface is in TermVBAT.
The MC33889D is able to signal bus activity on Rx while the CAN interface is in TermVBAT and the SBC in normal or standby
mode. When the bus is driven into a dominant state by another sending node, each dominant state is reported at Rx by a low
level, after a delay of tWAKE.
The bus state report is done through the CAN interface wake-up comparator on CANL and CANH, and thus operates also in
case of bus failure. This is illustrated in Figure 16.
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
Other CAN node send
CANL terminated to VBAT
Recessive
state
CANL
Dominant
state
Dominant
state
Recessive
state
CANH
Rx
tWAKE
tWAKE
CAN in TermVBAT
CAN in TxRx
MC33889D in Normal mode MC33889D in Normal mode, Standby mode or in stop mode
CAN in TxRx
MC33889D in Normal mode
tWAKE: duration of the CAN wake up filter, typ 16 s. The MC33889D Rx dominant low level duration is the difference
between the duration of the bus minus the tWAKE, as illustrated below (tRX_DOM = tBUS_DOM - tWAKE)
Tx sender node
Example: A dominant duration at the bus level of 5
bits of 8us each results in a 40 s bus dominant.
This results in a 24 s (40 s -16 s) dominant level
at Rx of MC33889D (while the CAN of the
Tx MC33889D
MC33889D is in TermVBAT).
Dominant state
Rx MC33889D
tWAKE
tRX_DOM
tBUS_DOM
Figure 16. Bus State Report of the CAN Interface Wake-up Comparator on CANL and CANH
The following table summarizes the device behavior when a CAN Wake-up event occurs.
Table 6. Summary of RX Pin Operations for Wake-up Signaling
SBC mode
CAN state
MC33889B
MC33889D
Normal
TermVBAT
no event on RX, no bit set
RX pulse (1), bit CANWU is not set
Standby
TermVBAT
no event on RX, no bit set
RX pulse (1), bit CANWU is not set
Sleep
TermVBAT
Stop
TermVBAT
SBC mode transition to Normal request, bit CANWU set SBC mode transition to Normal request, bit CANWU set
INT pulse, bit CANWU set
Int pulse, bit CANWU set
Notes
30. pulse duration is bus dominant duration minus tWAKE.
33889
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
GND SHIFT DETECTION
GENERAL
When normally working in two-wire operating mode, the CAN transmission can afford some ground shift between different
nodes without trouble. Should a bus failure occur, the transceiver switches to single-wire operation, therefore working with less
noise margin. The affordable ground shift is decreased.
The SBC provides a ground shift detection for diagnosis purpose. The four ground shift levels are selectable and the detection
is stored in the IOR register which is accessible via the SPI.
DETECTION PRINCIPLE
The GND shift to detect is selected via the SPI from 4 different values (-0.3 V, -0.7 V, -1.2 V, -1.7 V). At each TX falling edge
(end of recessive state), the CANH voltage is sensed. If it is detected to be below the selected gnd shift threshold, the bit SHIFT
is set at 1 in the IOR register. No filter is implemented. Required filtering for reliable detection should be done by software (e.g.
several trials).
DEVICE STATE DESCRIPTION
Table 7. 33889 Table of Operations
The table below describes the SBC operation modes.
Mode
Voltage
Regulator
HS1 switch
Normal Request
VDD1: ON
Wake-up capabilities
(if enabled)
Reset Pin
INT
Software
Watchdog
Low for 1.0 ms,
then high
V2: OFF
CAN cell
term VBAT
HS1: OFF
Normal
VDD1: ON
V2: ON
HS1 controllable
Standby
VDD1: ON
V2: OFF
HS1 controllable
Stop
VDD1: ON
CAN (always enable)
(limited current
capability)
SPI and L0,L1
Cyclic sense or
V2: OFF
Forced Wake-up
Normally high.
Active low if W/D
or VDD1 under
voltage occur
If enabled,
signal failure
(VDD
prewarning
temp, CAN,
HS1)
Running
Normally high.
Active low if W/D
or VDD1 under
voltage occur
If enabled,
signal failure
(VDD temp,
HS1)
Running
Term VBAT
Tx/Rx
Rec only
Term VBAT
Tx/Rx
Rec only
Normally high.
Signal SBC
- Running if
Active low if W/D
wake-up
enabled
or VDD1 under (not maskable) - Not Running
voltage occur
if disabled
Term VBAT
HS1: OFF or cyclic
Sleep
VDD1: OFF
CAN (always enable
V2: OFF
SPI and L0,L1
HS1 OFF or cyclic
Low
Not active
No Running
Term VBAT
Cyclic sense
Forced Wake-up
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
State Machine (not valid in debug modes)
W/D: timeout OR VDD1 low
W/D: timeout & Nostop & !BATFAIL
Reset
Normal Request
to
4
O
R
VD
D1
lo
w
ot
e2
)
r
ge
(n
SPI: normal
ut
SPI: standby
lo
w
eo
Standby
rig
:T
Power
Down
im
S
hi PI:
gh S
tra top
ns &
iti CS
on
:t
Wake-up
/D
1
/D
W
SBC power up
W
1
VDD1 low OR W/D: time
out 350 ms & !Nostop
SPI: standby &
W/D
trigger
(note1)
3
2
1
Stop
W/D: timeout OR VDD1 low
SPI: Stop & CS
low
to
high
transition
Nostop & SPI: sleep & CS
low to high transition
2
Normal
1
Nostop & SPI:
sleep & CS low to
high transition
Reset counter
(1 ms) expired
Wake-up
(VDD1 high temperature OR (VDDd1 low > 100 ms & VSUP >BFew)) & Nostop & !BATFAIL
1
2
3
4
Sleep
denotes priority
State machine description:
“Nostop” means Nostop bit = 1
“! Nostop” means Nostop bit = 0
“BATFAIL” means Batfail bit = 1
“! BATFAIL” means Batfail bit = 0
“VDD1 over temperature” means VDD1 thermal shutdown occurs
“VDD1 low” means VDD1 below reset threshold
“VDD1 low > 100 ms” means VDD1 below reset threshold for more than
100 ms
“W/D: Trigger” means TIM1 register write operation.
VSUP > BFew means VSUP > Battery Fall Early Warning (6.1 V typical)
“W/D: timeout” means TIM1 register not written before W/D timeout period
expired, or W/D written in incorrect time window if window W/D selected
(except stop mode). In normal request mode timeout is 355 ms p2.2
(350 ms p3)ms.
“SPI: Sleep” means SPI write command to MCR register, data sleep
“SPI: Stop” means SPI write command to MCR register, data stop
“SPI: Normal” means SPI write command to MCR register, data normal
“SPI: Standby” means SPI write command to MCR register, data standby
Note 1: these 2 SPI commands must be send in this sequence and
consecutively.
Note 2: if W/D activated
Figure 17. Simplified State Machine
33889
38
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
Behavior at SBC power up
Figure 18. Behavior at SBC Power Up
Transitions to enter debug modes
W/D: timeout 350 ms
Reset counter
(1.0 ms) expired
Power
Down
Reset
W/D: Trigger
Normal Request
Normal
SPI: MCR (0000) & Normal Debug
SPI: MCR (0000) & Standby Debug
Normal Debug
Standby Debug
Figure 19. Transitions to Enter Debug Modes
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
Simplified State machine in debug modes
W/D: timeout 350 ms
R
D
eb
ma
Normal
ld
y
or
eb
db
SP
I: n
ug
R
& !BATFAILNOSTOP
& SPI: Sleep
R
Trig
ger
Sleep
ug
E
E
SPI: Normal Debug
SPI: standby debug
SPI: Stop
Standby
W/
D:
R
Wake-up
Reset
I:
St
an
R
Reset counter
(1.0 ms) expired
Normal Request
SP
Wake-up
SPI: standby &
W/D: Trigger
Stop (1)
SPI: Standby debug
Standby Debug
Normal Debug
SPI: Normal debug
R
R
(1) If stop mode entered, it is entered without watchdog, no matter the WDSTOP bit.
(E) debug mode entry point (step 5 of the debug mode entering sequence).
(R) represents transitions to reset mode due to Vdd1 low.
Figure 20. Simplified State Machine in Debug Mode
33889
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
LOGIC COMMANDS AND REGISTERS
SPI INTERFACE
MISO
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
A2
A1
A0
R/W
D3
D2
D1
D0
MOSI
Read operation: R/W bit = 0
Write operation: R/W bit = 1
address
data
Figure 21. Data Format Description
The SPI is a 8 bit SPI. First 3 bits are used to identify the internal SBC register address, bit 4 is a read/write bit. The last 4 bits
are data send from MCU to SBC or read back from SBC to MCU.
During write operation state of MISO has no signification.
During read operation only the last 4 bits at MISO have a meaning (content of the accessed register)
Following tables describe the SPI register list, and register bit meaning.
Registers “reset value” is also described, as well as the “reset condition”. reset condition is the condition which cause the bit
to be set at the “reset value”.
Possible reset condition are:
Power On Reset: POR
SBC mode transition:
NR2R - Normal Request to Reset mode
NR2N - Normal Request to Normal mode
N2R - Normal to Reset mode
STB2R - Standby to Reset mode
STO2R - Stop to Reset mode
SBC mode:RESET - SBC in Reset mode
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Table 8. List of Registers
Name
Address
Description
Comment and usage
MCR
$0 0 0
Mode control register
Write: Control of normal, standby, sleep, and stop modes
Read: BATFAIL flag and other status bits and flags
RCR
$0 0 1
Reset control register
Write: Configuration of reset voltage level, WD in stop mode, low power
mode selection
Read: CAN wake-up event, Tx permanent dominant
CAN
$0 1 0
CAN control register
Write: CAN module control: TX/RX, Rec only, term VBAT, Normal and
extended modes, filter at L0 input.
Read: CAN failure status bits
Write: HS1 (high-side switch) control in normal and standby mode.
Gnd shift register level selection
Read: HS1 over temp bit, SHIFT bit (gnd shift above selection), VSUP
below 6.1V, V2 below 4.0 V
IOR
$0 1 1
I/O control register
WUR
$1 0 0
Wake-up input register
TIM
$1 0 1
Timing register
LPC
$1 1 0
Low power mode
control register
Write: HS1 periodic activation in sleep and stop modes
Force wake-up control
INTR
$1 1 1
Interrupt register
Write: Interrupt source configuration
Read: INT source
Write: Control of wake-up input polarity
Read: Wake-up input, and real time LX input state
Write: TIM1, Watchdog timing control, window or Timeout mode.
Write: TIM2, Cyclic sense and force wake-up timing selection
NOTE: For SPI Operation
In case a low pulse is asserted by the device on the RST output pin during a SPI message,
the SPI message can be corrupted. An RST low pulse is asserted in 2 cases:
Case 1: W/D refresh issue: The MCU does not perform the SPI watchdog refresh command
before the expiration of the timeout (in Normal mode or Normal Request mode and if the
“Timeout watchdog” option is selected), or the SPI watchdog refresh command is performed
in the closed window (in Normal mode and if “Window watchdog” option is selected).
Case 2: VDD undervoltage condition: VDD falls below the VDD undervoltage threshold.
Message corruption means that the targeted register address can be changed, and another
register is written. Table 9 shows the various cases and impacts on SPI register address:
Table 9. Possible Corrupted Registers In Case of RST Pulse During SPI Communication
Resulting Written register
Target
written
register
Register
MCR
RCR
CAN
IOR
Address
$000
$001
$010
$011
Register
Address
CAN
$010
IOR
$011
WUR
$100
TIM1/2
$101
LPC
$110
INTR
$111
X
X
X
X
X
X
X
X
33889
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Four registers can be corrupted: MCR, RCR, CAN, and IOR registers. As examples:
•
write to CAN register can end up as write to MCR register, or
•
write to TIM1 register can end up as write to RCR register
To avoid the previously described behavior, it is recommended to write into the MCR, RCR,
CAN, and IOR registers with the expected configuration, after each RST assertion.
In the application, a RST low pulse leads to an MCU reset and a software restart. By
applying this recommendation, all registers will be written with the expected configuration.
Register Description
Table 10. MCR Register
MCR
D3
$000b
D2
D1
D0
MCTR2
MCTR1
MCTR0
BATFAIL
VDDTEMP
GFAIL
WDRST
0
0
0
0
POR, RESET
POR, RESET
POR, RESET
W
R
Reset
Reset condition
Table 11. Control Bits
MCTR2
MCTR1
MCTR0
SBC mode
Description
0
0
0
Enter/leave debug mode
To enter debug mode, SBC must be in Normal or Standby
mode and BATFAIL (31) must be still at 1. To leave debug
mode, BATFAIL must be at 0.
0
0
1
Normal
0
1
0
Standby
0
1
1
Stop, watchdog off (32)
0
1
1
Stop, watchdog on (32)
1
0
0
Sleep (33)
1
0
1
Normal
1
1
0
Standby
1
1
1
Stop (34)
No watchdog running, debug mode
Notes
31. Bit BATFAIL cannot be set by SPI. BATFAIL is set when VSUP falls below 3V.
32.
33.
34.
Watchdog ON or OFF depends on the RCR register bit D3.
Before entering sleep mode, bit NOSTOP in RCR register must be previously set to 1.
Stop command should be replaced by Stop Watchdog OFF. MCTR2=0, MCTR1= MCTR0=1
Table 12. Status Bits
Status bit
GFAIL
BATFAIL
VDDTEMP
WDRST
Description
Logic OR of CAN failure, HS1 failure, V2LOW
Battery fail flag (VSUP < 3.0 V)
Temperature prewarning on VDD (latched)
Watchdog reset occurred
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
RCR Register
RCR
$001b
W
D3
D2
D1
WDSTOP
NOSTOP
R
D0
RSTTH
TXFAILURE
CANWU
Reset
1
0
0
Reset condition
POR, RESET
POR, NR2N
POR
Table 13. Control Bits
Status bit
Bit value
Description
0
No watchdog in stop mode
1
Watchdog runs in stop mode
0
Stop mode is default low power mode
1
Sleep mode is default low power mode
0
Reset threshold 1 selected (typ. 4.6 V)
1
Reset threshold 2 selected (typ. 4.2 V)
CANWU
1
Wake-rom CAN
TXFAILURE
1
Tx permanent dominant (CAN)
WDSTOP
NOSTOP
RSTTH
Table 14. CAN Register
CAN
D3
D2
D1
D0
W
FDIS
CEXT
CCTR1
CCTR0
R
CS3
CS2
CS1
CS0
Reset
0
0
0
0
Reset condition
POR, CAN
POR, CAN
POR, CAN
POR, CAN
$010b
Fault Tolerant CAN Transceiver Standard Modes
The CAN transceiver standard mode can be programmed by setting CEXT to 0. The transceiver cell will then be behave as
known from the 33889.
Table 15. CAN Transceiver Modes
CEXT
CCTR1
CCTR0
Mode
0
0
0
TermVBAT
0
0
1
0
1
0
RxOnly
0
1
1
RxTx
Table 16. CAN Transceiver Extended Modes (CAN with CEXT bit =1 is not recommended)
CEXT (35)
CCTR1
CCTR0
Mode
1
0
0
TermVBAT
1
0
1
TermVDD
1
1
0
RxOnly
1
1
1
RxTx
33889
44
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Table 16. CAN Transceiver Extended Modes (CAN with CEXT bit =1 is not recommended)
CEXT (35)
CCTR1
CCTR0
Mode
Notes
35. CEXT Bit should be set at 0. The CAN operation in extended mode is not recommended.
Fault tolerant CAN transceiver extended modes
By setting CEXT to 1 the transceiver cell supports sub bus communication
FDIS
L0 Wake Input Filter (20 s Typical)
0
Enable (LO wake threshold selectable by WUR register)
1
Disable (L0 wake-up threshold is low level only, no matter D0 and D1 bits set in WUR register).
Note: if DFIS bit is set to 1, WUR register must be read before going into sleep or stop mode in order to clear the wake-up flag.
During read out L0 must be at high level and should stay high when entering sleep or stop.
Table 17. Status Bits
CS3
CS2
CS1
CS0
Bus failure #
Description
0
0
0
0
0
0
0
1
1
0
1
0
1
5
0
1
1
0
8, 3a
0
1
1
1
3
1
0
0
1
2
1
1
0
1
4, 7
1
1
1
0
9
VDD
1
1
1
1
6
VBAT
no failure
CANH open wire
ground
CANH short circuit to
VDD
VBAT
CANL open wire
CANL short circuit to
ground / CANH
Comments:
CS2 bit at 0 = open failure. CS2 bit at 1 = short failure.
(CS3 bit at 0 and (CS1 = 1 or CS2 =1)) = CANH failure. CS3 bit at 1 = CANL failure.
CS1 and CS0 bits: short type failure coding (GND, VDD or VBAT).
In case of multiple failures, the last failure is reported.
.
Table 18. IOR Register
IOR
D3
D2
D1
D0
HS1ON
GSLR1
GSLR0
HS1OT
V2LOW
VSUPLOW
Reset
0
0
0
Reset condition
POR, RESET
POR, RESET
POR, RESET
$011b
W
R
SHIFT
Table 19. Control Bits
HS1ON
HS1
0
HS1 switch turn OFF
1
HS1 switch turn ON
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Table 20. Gnd Shift Selection
GSLR1
GSLR0
Typical gnd shift comparator level
0
0
-0.3 V
0
1
-0.7 V
1
0
-1.2 V
1
1
-1.7 V
Shift
State
0
Gnd shift value is lower than the level selected by the GSLR1 and GSLR2 bit
1
Gnd shift value is higher than the level selected by the GSLR1 and GSLR2 bit
Table 21. Status Bits
Status bit
HS1OT
Description
(36)
High-side 1 overtemperature
SHIFT
gnd shift level selected by GSLR1 and GSLR2 bits is reached
V2LOW
V2 below 4.0 V typical
VSUPLOW
VSUP below 6.1 V typical
Notes
36. Once the HS1 switch has been turned off because of overtemperature, it can be turned on again by setting the appropriate control bit
to “1”.
WUR REGISTER
The local wake-up inputs L0 and L1 can be used in both normal and standby mode as port expander and for waking up the
SBC in sleep or stop mode.
Table 22. WUR Register
WUR
$100b
D3
D2
D1
D0
W
LCTR3
LCTR2
LCTR1
LCTR0
R
L1WUb
L1WUa
L0WUb
L0WUa
1
1
1
1
Reset
Reset condition
POR, NR2R, N2R, STB2R, STO2R
Control Bits
LCTR3
LCTR2
LCTR1
LCTR0
L0 Configuration
X
X
0
0
inputs disabled
X
X
0
1
high level sensitive
X
X
1
0
low level sensitive
X
X
1
1
both level sensitive
L1 Configuration
33889
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Control Bits
LCTR3
LCTR2
LCTR1
LCTR0
L0 Configuration
L1 Configuration
0
0
X
X
inputs disabled
0
1
X
X
high level sensitive
1
0
X
X
low level sensitive
1
1
X
X
both level sensitive
Table 23. Status Bits
L0WUb
L0WUa
FDIS bit in
CAN register
0
0
0
No wake-up occurred at L0 (sleep or stop mode). Low level state on L0 (standby or normal mode)
1
1
0
Wake-up occurred at L0 (sleep or stop mode). High level state on L0 (standby or normal mode)
0
1
1
Wake-up occurred at L0 (sleep or stop mode with L0 filter disable). WUR must be set to xx00 before
sleep or stop mode.
L1WUb
L1WUa
0
0
No wake-up occurred at L1 (sleep or stop mode). Low level state on L1 (standby or normal mode)
1
1
Wake-up occurred at L1 (sleep or stop mode). High level state on L1 (standby or normal mode)
Description
Description
TIM REGISTERS
Description: This register is split into 2 sub registers, TIM1 and TIM2.
TIM1 controls the watchdog timing selection as well as the window or timeout option. TIM1 is selected when bit D3 is 0.
TIM2 is used to define the timing for the cyclic sense and forced wake-up function. TIM2 is selected when bit D3 is 1.
No read operation is allowed for registers TIM1 and TIM2
TIM Register
Table 24. TIM Register
TIM1
D3
D2
D1
D0
0
WDW
WDT1
WDT0
Reset
0
0
0
Reset condition
POR, RESET
POR, RESET
POR, RESET
W
$101b
R
Watchdog
WDW
WDT1
WDT0
Watchdog Timing [ms]
0
0
0
10
0
0
1
50
0
1
0
100
0
1
1
350
1
0
0
10
1
0
1
50
1
1
0
100
1
1
1
350
no window watchdog
window watchdog enabled (window lenght is
half the watchdog timing)
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
j
window closed
no watchdog clear
window open
for watchdog clear
WD timing * 50%
window open
for watchdog clear
WD timing * 50%
Watchdog period
(WD timing selected by TIM 1 bit WDW=1)
Watchdog period
(WD timing selected by TIM 1, bit WDW=0)
Window watchdog
Timeout watchdog
Figure 22. Watchdog Operation (window and timeout)
TIM2 register
The purpose of TIM2 register is to select an appropriate timing for sensing the wake-up circuitry or cyclically supplying devices
by switching on or off HS1
Table 25. TIM2 Register
TIM2
D3
D2
D1
D0
1
CSP2
CSP1
CSP0
Reset
0
0
0
Reset condition
POR, RESET
POR, RESET
POR, RESET
$101b
W
R
Table 26. Cyclic Sense Timing
CSP2
CSP1
CSP0
Cyclic Sense Timing [ms]
0
0
0
5
0
0
1
10
0
1
0
20
0
1
1
40
1
0
0
75
1
0
1
100
1
1
0
200
1
1
1
400
33889
48
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Cyclic sense on time
Cyclic sense timing
10 s to 20 s
HS1
Sample
t
LPC REGISTER
Description: This register controls:
• The state of HS1 in Stop and Sleep mode (HS1 permanently off or HS1 cyclic)
• Enable or disable the forced wake-up function (SBC automatic wake-up after time spend in Sleep or Stop mode, time
defined by the TIM2 register)
• Enable or disable the sense of the wake-up inputs (LX) at sampling point of the cyclic sense period (LX2HS1 bit).
Table 27. LPC Register
LPC
W
$110b
D3
D2
D1
D0
LX2HS1
FWU
IDDS
HS1AUTO
0
0
0
0
R
Reset
Reset condition
POR, NR2R, N2R, STB2R, POR, NR2R, N2R, STB2R, POR, NR2R, N2R, STB2R, POR, NR2R, N2R, STB2R,
STO2R
STO2R
STO2R
STO2R
LX2HS1
HS1AUTO
Wake-up Inputs Supplied by HS1
Autotiming HS1
X
0
off
X
1
On, HS1 cyclic, period defined in TIM2 register
0
X
no
1
X
Yes, LX inputs sensed at sampling point
Bit
Description
FWU
If this bit is set, and the SBC is turned into sleep or stop mode, the SBC wakes up after the time selected in the TIM2 register
IDDS
Bit = 0: IDDS-WU1 selected (lowest value, typ 3.5 mA)
Bit = 1: IDDS-WU2 selected (highest value, typ 14 mA)
Table 28. INTR register
INTR
D3
D2
D1
D0
W
VSUPLOW
HS1OT-V2LOW
VDDTEMP
CANF
R
VSUPLOW
HS1OT
VDDTEMP
CANF
Reset
0
0
0
0
Reset condition
POR, RESET
POR, RESET
POR, RESET
POR, RESET
$111b
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Table 29. Control bits
Control bit
Description
Mask bit for CAN failures (OR of any CAN failure)
CANF
Mask bit for VDD medium temperature
VDDTEMP
HS1OT-V2LOW
VSUPLOW
Mask bit for HS1 over temperature OR V2 below 4.0 V
Mask bit for SUP below 6.1 V
When the mask bit has been set, INT pin goes low if the appropriate condition occurs.
Table 30. Status bits
Status bit
CANF
VDDTEMP
HS1OT
VSUPLOW
Description
CAN failure
VDD medium temperature
HS1 overtemperature
VSUP below 6.1 V, typical
Notes:
If HS1OT-V2LOW interrupt is only selected (only bit D2 set in INTR register), reading INTR register bit D2 leads to two
possibilities:
Bit D2 = 1: INT source is HS1OT
Bit D2 = 0: INT source is V2LOW.
Upon a wake-up condition from Stop mode due to overcurrent detection (IDD1S-WU1 or IDD1S-WU2), an INT pulse is generated.
However, the INTR register content remains at 0000 (not bit set into the INTR register).
33889
50
Analog Integrated Circuit Device Data
Freescale Semiconductor
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
5V
Q1
RB
VBAT
V2CTRL
VSUP
V2
VSUP monitor
CAN
supply
Dual Voltage Regulator
5V/200mA
VDD1 Monitor
VDD1
Mode control
HS1 control
Oscillator
HS1
INT
Interrupt
Watchdog
Reset
Programmable
wake-up input
L0
L1
WDOG
RESET
MOSI
SCLK
MISO
CS
SPI Interface
RRTH
RTH
V2
Low Speed
CANH
TXD
Fault Tolerant CAN
CANL
RRTL
5V/200mA
RXD
GND
Physical Interface
RTL
Figure 23. 33889D/33889B Simplified Typical Application With Ballast Transistor
5V/100mA
VBAT
V2
V2CTRL (open)
VSUP
VSUP Monitor
Dual Voltage Regulator
VDD1 Monitor
HS1 Control
L1
VDD1
5V/200mA
Mode Control
Programmable
wake-up input
INT
Interrupt
Watchdog
Reset
WDOG
RESET
MOSI
SCLK
MISO
CS
SPI Interface
RRTH
RTH
CANH
Low Speed
Fault Tolerant CAN
CANL
RRTL
RTL
5V/100mA
Oscillator
HS1
L0
CAN
supply
Physical Interface
V2
TX
RX
GND
Figure 24. 33889D/33889B Simplified Typical Application Without Ballast Transistor
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
51
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important For the most current revision of the package, visit www.freescale.com and do a keyword search on the
98ASB42345B number listed below. Dimensions shown are provided for reference ONLY.
33889
52
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
53
PACKAGING
PACKAGE DIMENSIONS
33889
54
Analog Integrated Circuit Device Data
Freescale Semiconductor
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
33889EG
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33889 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
28-PIN
SOICW
Packaging and Thermal Considerations
The MC33889 is offered in a 28 pin SOICW, single die package. There is a
single heat source (P), a single junction temperature (TJ), and thermal resistance
(RJA).
TJ
=
RJA
.
EG SUFFIX (PB-FREE)
98ASB42345
28-PIN SOICW
P
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an applicationspecific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
NOTE FOR PACKAGE DIMENSIONS,
REFER TO THE 33889 DEVICE DATASHEET.
Standards
Table 31. Thermal Performance Comparison
Thermal Resistance
[C/W]
JA (1) (2)
42
JB
(2) (3)
11
JA
(1) (4)
69
(5)
23
Notes
1. Per JEDEC JESD51-2 at natural convection, still air
condition.
2. 2s2p thermal test board per JEDEC JESD51-7.
3. Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4. Single layer thermal test board per JEDEC JESD51-3.
5. Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
20 Terminal SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
Figure 25. Surface Mount for SOIC Wide Body
Non-Exposed Pad
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
RX
TX
VDD1
RST
INT
GND
GND
GND
GND
V2CTRL
VSUP
HS1
L0
L1
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
A
WDOG
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
RTL
RTH
V2
33889 Pin Connections
28-Pin SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
Figure 26. Thermal Test Board
Device on Thermal Test Board
Material:
Outline:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Table 32. Thermal Resistance Performance
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Thermal
Resistance
Area A (mm2)
(C/W)
RJA
0
69
300
53
600
48
RJA is the thermal resistance between die junction and ambient air.
33889
56
Analog Integrated Circuit Device Data
Freescale Semiconductor
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Thermal Resistance [ºC/W]
80
70
60
50
40
30
x RJA
20
10
0
0
300
Heat spreading area A [mm²]
600
Figure 27. Device on Thermal Test Board RJA
Thermal Resistance [ºC/W]
100
10
x RJA
1
0.1
1.00E-03
1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Figure 28. Transient Pin ResistanceRJA
Device on Thermal Test Board Area A = 600 (mm2)
33889
Analog Integrated Circuit Device Data
Freescale Semiconductor
57
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
7.0
5/2006
•
•
•
•
•
•
•
•
Implemented Revision History page
Added “EG” PB-Free package type
Removed MC33889DW version, and added MC33889B and MC33889D versions
Converted to the Freescale format, and updated to the prevailing form and style
Modified Device Variations Between the 33889D and 33889B Versions (1) on page 2
Added Thermal Addendum (rev 2.0) on page 55
Changed the Maximum Ratings on page 6 to the standard format
Added CAN transceiver description section
8.0
6/2002
•
Corrected two instances where pin LO had an overline, and one instance where pin WDOG did not.
9.0
8/2006
•
Removed MC33889BEG/R2 and MC33889DEG/R2 and replaced them with MCZ33889BEG/R2
and MCZ33889DEG/R2 in the ordering Information table
10.0
9/2006
•
Replaced the label Logic Inputs with Logic Signals (RX, TX, MOSI, MISO, CS, SCLK, RST, WDOG,
INT) on page 6
Changed CS to CS at various places in the document
11.0
12/2006
•
Made changes to Supply Current in Stand-by Mode (7),(9) on page 8 and Supply Current in Normal
Mode (7) on page 8
12.0
3/2007
•
Added the EG suffix to the included thermal addendum
13.0
12/2012
•
•
•
•
Updated orderable part number from MCZ33889BEG to MC33889BPEG
Updated orderable part number from MCZ33889DEG to MC33889DPEG
Removed all DW part ordering information and documentation
Updated format
14.0
6/2013
•
•
Added a For SPI Operation on page 42
Updated document properties
15.0
6/2015
•
Added note (18)
•
33889
58
Analog Integrated Circuit Device Data
Freescale Semiconductor
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Home Page:
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There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based
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Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be
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may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by
customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others.
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© 2015 Freescale Semiconductor, Inc.
Document Number: MC33889
Rev. 15.0
6/2015
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