MICRF114 Low-Power Integrated Sub-GHz Wireless RF Transmitter General Features • Fully Integrated Low-Power Sub-GHz RF Transmitter • Single-Pin Crystal Oscillator with Integrated Programmable Load Capacitor • Wide Operating Voltage Range: 1.8V to 3.6V • Industrial Temperature Range: -40°C to +85°C • Low-Current Consumption: 0.2 µA in Sleep mode, 11.7 mA in +10 dBm Transmit mode • Fast Turn-On and Turn-Off Times • Small Footprint 6-pin SOT-23 Package RF/Analog Features • Fully Integrated VCO and PLL Loop Filter • Single-Ended RF Output with Easy Antenna Matching • Wide Operating Frequency Range: 285 MHz to 445 MHz • Transmit Power Programmable in 1 dB steps from -2 dBm to +13 dBm • Data Rate: Up to 115.2 kbps NRZ, 57.6 kbps Manchester Encoded • On-Off Keying (OOK) Modulation with Power Ramp-Up Control • Complies with US (FCC) and Canada (IC) Standards Pin Diagram 6-pin SOT-23 SCK 1 6 OSC SDI 2 5 VSS VDD 3 4 RFO Digital Features • Simple and Flexible 2-pin Proprietary Microcontroller (MCU) Interface • Supports Proprietary Remote Control Protocols Applications • • • • • • • Remote Keyless Entry (RKE) Garage Door Opener (GDO) Alarm and Security Systems Command and Control Wireless Sensors Industrial Sensing and Control Smart Energy 2015 Microchip Technology Inc. Preliminary DS50002416A-page 1 MICRF114 Table of Contents 1.0 Hardware Description................................................................................................................................................................... 3 2.0 Functional Description.................................................................................................................................................................. 7 3.0 Typical Performance Curves .......................................................................................................................................................11 4.0 Application Circuit....................................................................................................................................................................... 19 5.0 Electrical Characteristics ............................................................................................................................................................ 23 6.0 Packaging Information................................................................................................................................................................ 27 Appendix A:Revision History................................................................................................................................................................ 30 The Microchip Web Site ....................................................................................................................................................................... 31 Customer Change Notification Service ................................................................................................................................................ 31 Customer Support ................................................................................................................................................................................ 31 Product Identification System............................................................................................................................................................... 32 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS50002416A-page 2 Preliminary 2015 Microchip Technology Inc. MICRF114 1.0 HARDWARE DESCRIPTION 1.1 Overview The MICRF114 is optimized for battery-powered applications. It features low-current consumption and can operate over a wide supply voltage range. Internal circuits sensitive to supply voltage variations run from the on-chip Low Dropout (LDO) regulator. To reduce pin count and system Bill of Materials (BOM), the LDO regulator does not need an external capacitor for stability, and the single-pin reference oscillator has a integrated programmable crystal load capacitor. The single-ended RF output enables easy matching to monopole antennas with a minimal number of external components. The MICRF114 is a simple, low-cost OOK transmitter with programmable output power. It is primarily intended for command and control applications such as RKE and GDO. The transmitter is synthesizer based for high-frequency accuracy. It operates on a single frequency that is determined by the frequency of the crystal connected to the built-in reference oscillator. This frequency can be selected from a wide range. The more popular transmit frequencies require readily available crystal frequencies. For example, a 433.92 MHz transmit frequency requires a 13.56 MHz crystal. The RF performance of the transmitter is compliant with FCC and IC regulations and with some Japanese standards. European Telecommunications Standards Institute (ETSI) requirements can be met at low-radiated power. 1.2 A 2-wire proprietary MCU interface is used to program the parameters of the MICRF114 to select its operating mode and to input the transmit data packet. A built-in self-calibration circuit ensures consistent performance over the operating frequency range and against temperature variations. Initial calibration is automatically performed during Power-on Reset (POR). Recalibration can be initiated by the MCU that controls the application when required. Block Diagram Figure 1-1 shows the MICRF114 block diagram. FIGURE 1-1: MICRF114 ARCHITECTURE BLOCK DIAGRAM POWER MANAGEMENT VDD VSS LDO BIAS REFERENCE POR Regulated Supply SYNTHESIZER OSC PFD VCO CP To Digital Block PA RFO 1/32 TX Data DIGITAL BLOCK SDI SCK 2015 Microchip Technology Inc. MCU Interface Operating mode control Configuration register Self-Calibration Preliminary DS50002416A-page 3 MICRF114 1.3 Pin Descriptions Table 1-1 describes the MICRF114 pins. TABLE 1-1: 1.4 MICRF114 PIN DESCRIPTIONS Pin Name Type Description 1 SCK Digital Input MCU interface serial clock input 2 SDI Digital Input MCU interface serial configuration or TX data input 3 VDD Power Positive supply voltage 4 RFO Analog Output RF TX output 5 VSS Power Ground reference 6 OSC Analog Input Reference crystal connection Power Management 1.6 The MICRF114 has a single power pin and a single ground pin. The sensitive analog blocks run from an internal LDO, which does not need an external capacitor. A bias and reference circuit provides reference voltage to the LDO and bias currents to all analog blocks. The digital block runs from the unregulated supply. This enables communication with the MCU even when most of the blocks (including the LDO) are turned off to save power. Additionally, the MICRF114 retains its selfcalibration result and user-programmable parameters in this low-power state. To get the highest possible efficiency, the RF Power Amplifier (PA) block runs directly from the unregulated supply. A POR circuit keeps the MICRF114 in a Reset state until the supply voltage is sufficient for proper operation of the digital block. The POR event resets the device control state machine and the Configuration register to their default state. A Reset is also triggered by sufficiently large supply voltage glitches and brown-out. 1.5 MCU Interface A proprietary 2-wire serial interface consisting of a clock line and a data line is utilized to control the operation of the MICRF114 and to input the transmit data packet. Special start and stop conditions on these two lines indicate the beginning and end of communication with the MCU. Except during these Start and Stop bits, the MCU must change the data only when the clock is at logic low. Control and Configuration bits are sent synchronously, and the MICRF114 samples the data on the rising edge of the clock. Transmit data is sent asynchronously with the clock held low. During transmission, the serial data line is connected directly to the RF modulator. The assembly and timing of the data packet are the responsibilities of the MCU. DS50002416A-page 4 Device Control Data transmission start and stop are always initiated by the MCU. Programmable transmit parameters are stored in a single 16-bit register. The value in this register is kept as long as the supply voltage is present. The MCU can rewrite the register at the beginning of each transmission. Immediately after POR or at the beginning of a transmission, an internal state machine turns on the various blocks of the MICRF114 with the required sequence and timing and then performs an automatic calibration of the device when required. The MCU must wait for these operations to be completed before sending the transmit data packet. An initial calibration is done after POR. The calibration result is kept as long as the supply voltage is present. Recalibration can be requested by the MCU when required. 1.7 Crystal Oscillator The reference frequency source is a single-pin crystal oscillator. The transmit frequency is 32 times the reference. Thus, the relative accuracy of the crystal oscillator directly determines the accuracy of the transmit frequency. The most popular transmit frequencies require standard and off-the-shelf low-cost crystals. The oscillator operates at parallel resonance. The load capacitor that the crystal requires is integrated to minimize the BOM. To accommodate various crystal types and compensate for PCB parasitic capacitances, the value of this load capacitor is programmable by the MCU. The other function of the crystal oscillator is to provide a relatively accurate clock frequency for the automatic calibration circuit. As the crystal frequency is determined by the transmit frequency and can vary over a wide range, the clock is generated by dividing the crystal frequency by a programmable number that must be properly set to achieve the expected performance. Preliminary 2015 Microchip Technology Inc. MICRF114 1.8 Frequency Synthesizer The frequency synthesizer is a fully integrated PLL with a fixed feedback division ratio. It operates on a single frequency that is determined by the reference crystal. The VCO within the PLL operates directly at the transmit frequency to save power. The VCO also has a wide tuning range to cover most of the popular frequencies below 500 MHz. 1.9 Transmit Path The main element of the transmit path is the RF Power Amplifier (PA). Since typical applications use monopole antennas, the output is single-ended. It must be biased to VDD using an inductor. This configuration enables high-voltage swing, thereby reducing the required supply current for the specified output power. The output power is programmable by the MCU in 1 dB steps. This enables the current consumption and transmit range to be optimized according to the product requirements of the customers. Additionally, compliance with the relevant regulations can be ensured with different antenna gains. To ease design-in and keep the BOM as low as possible, the output capacitance of the PA is programmable by the MCU. As a result, the impedance matching circuit between the RF output and the antenna requires fewer elements and is easier to optimize. A modulator circuit is used to control the slope of the output power ramping on and off. This is to prevent steep supply current transients which may result in a spectrum splatter. 2015 Microchip Technology Inc. Preliminary DS50002416A-page 5 MICRF114 NOTES: DS50002416A-page 6 Preliminary 2015 Microchip Technology Inc. MICRF114 2.0 FUNCTIONAL DESCRIPTION 2.1 Initialization FIGURE 2-1: RESET After applying the supply voltage, the MICRF114 is initialized by its built-in POR circuit. The POR is level sensitive. It starts to generate a Reset pulse for the internal logic when the rising supply voltage (VDD) crosses a given threshold. The threshold level is chosen so that the operation of the digital circuits is already guaranteed at the beginning of the Reset pulse. Initialization first involves resetting all internal state machines, setting the Configuration register to its default value, and executing a calibration sequence to guarantee proper operation of the frequency synthesizer. Blocks needed for calibration are turned on with the required sequence and timing. The result is stored after calibration, and all blocks are turned off to bring the MICRF114 into Sleep mode where it waits for the MCU to initiate transmission. The calibration result is kept as long as the supply voltage is present. Figure 2-1 illustrates the simplified initialization flowchart where the Reset due to VDD drops or brownout is not shown. Additionally, it is not shown that a Reset condition in any state or during any sequence immediately brings the MICRF114 into its Reset state. One of the advantages of the level-sensitive Reset is that the generation and length of the Reset pulse are mostly independent of the slope of the rising VDD. Another advantage is that it triggers a Brown-out Reset (BOR) when VDD goes below the VTP threshold voltage. Refer to Figure 2-2. Abrupt drops of the VDD can disturb the operation of digital circuits even if the VDD always stays above the threshold level during such a transient. The POR block also generates a Reset pulse after this kind of event if the voltage drop exceeds the VTG threshold value. FIGURE 2-2: INITIALIZATION FLOWCHART N VDD>VTP? Y wake-up sequence A calibration SLEEP 2.2 Operating Modes The MICRF114 has two main operating modes: • Sleep mode • Transmit mode In Sleep mode, all the blocks (except the POR and the digital block) are powered down and wait to be woken up by the MCU. The current consumption is minimal because there is no activity within the digital block. After the wake-up sequence and the associated delay, MICRF114 enters Transmit mode. In Transmit mode, all blocks become active and an RF signal, modulated by the data stream sent by the MCU, is transmitted. Transmission can be terminated by the MCU without any time-out delay when required and the MICRF114 immediately goes back to Sleep mode. Section 2.3 “Communication with the MCU” shows the main operating mode flowchart and the associated activity on the MCU interface. POR OPERATION VDD VTG VTP t 0 PORn tDP tDP VHI VLO t Note: VHI follows VDD 2015 Microchip Technology Inc. Preliminary DS50002416A-page 7 MICRF114 2.3 Communication with the MCU The communication between the MCU and the MICRF114 is one-directional and it is always initiated by the MCU. It uses a proprietary protocol that supports switching between the two operating modes, optional request for recalibration, reprogramming of the operating parameters (as needed), and transmit data input. The logic is active-high. The communications protocol requires both the lines of Serial Clock (SCK) and Serial Data Input (SDI) to idle high. However, this is not the state with the lowest current consumption because the SCK input of the MICRF114 has an internal pull-down resistor to avoid unwanted clock transitions during the power-on process. In Sleep mode, the clock line can be pulled low to minimize the overall supply current. FIGURE 2-3: Control and Configuration bits are sent synchronously after the Start bit. The two control bits, CAL and CFG, must always be present. If CAL is high, recalibration is performed before transmission. In this case, the wakeup time from Sleep mode to Transmit mode is longer. If CFG is high, the MCU must send 17 additional Configuration bits. The first 16 bits updates the 16-bit Transmit Parameter register within the MICRF114. The Most Significant bit (MSb) is sent first. The last bit must always be ‘0’. Figure 2-3 shows the two methods of starting transmission. The wake-up sequence from Sleep mode to Transmit mode starts at the rising edge of the last clock pulse. This is the second or 19th clock, depending on the CFG bit setting. COMMUNICATION PROTOCOL Transmit with quick-start using the default or previously loaded configuration settings. Recalibration (CAL=1) is not normally needed. Wake-up Sleep Sleep Transmit tWK + cal * tCL Start CAL CFG Asynchronous TX Data Stop (MCU Waits) SDI SCK Transmit start with configuration settings update. Recalibration is always needed in case of frequency setting change. Wake-up Sleep Start CAL CFG 16 Configuration (Config) bits 0 SDI SCK DS50002416A-page 8 Preliminary 2015 Microchip Technology Inc. MICRF114 2.4 After the wake-up delay, the MICRF114 starts to automatically transmit. Since the exact timing of this is unknown by the MCU, keep the transmit data input low until the maximum specified wake-up time passes. Although the MICRF114 wakes up earlier, it transmits ‘0’, that is, no carrier. Transmit data is asynchronous and directly modulates the RF carrier. The MCU takes care of all timing and coding of the data in software. This is feasible due to the typical low-data rates and is necessary due to the great variety of proprietary protocols. The flowchart in Figure 2-4 shows the MICRF114 states during a normal operation cycle. FIGURE 2-4: Parameter Selection All transmit parameters of the MICRF114 are stored in a single 16-bit register. This is loaded with default values at POR. The MCU can modify these values before sending the transmit data. There are four distinct parameter fields in the register as shown in Table 2-1. To keep the MCU interface simple, only the complete register as a whole can be updated. Fields that need to remain unchanged must be reloaded with the same value. For example, the new register value is retained in Sleep mode until the next POR event. TOP FLOWCHART SLEEP N N Start? CAL = 1? Y N Y Read Control Bits Calibration CFG = 1? Wake-up Sequence B Y Read Config Bits TRANSMIT N Wake-up Sequence A TABLE 2-1: Bit Range Stop? Y TRANSMIT PARAMETERS OF MICRF114 Parameter Field Symbol Default Setting Value 425-445 MHz <15:13> Transmit Frequency F<2:0> fTX 0x7 <12:8> Crystal Load Capacitor X<4:0> CXT 0x16 18 pF <7:4> RF Transmit Power P<3:0> PTX 0xC +10 dBm <3:0> RF Output Tuning Capacitor R<3:0> CTX 0x0 0 pF 2015 Microchip Technology Inc. Preliminary DS50002416A-page 9 MICRF114 Select the transmit frequency parameter to ensure that the actual operating frequency, which is determined by the selected crystal, falls into the frequency range defined by the parameter. Refer to Table 2-2. TABLE 2-2: FREQUENCY RANGE fTX range (MHz) F<2:0> Min Max 285 305 0 305 325 1 325 345 2 345 365 3 365 385 4 385 405 5 405 425 6 425 445 7 Equation 2-1 through Equation 2-1 show that the rest of the programmable parameters can be calculated from the Control bit fields. EQUATION 2-1: 2.5 Transmitting The MICRF114 is normally in Sleep mode. The MCU always initiates entry into Transmit mode by sending a Start bit, the compulsory Control bits, and the optional Configuration bits to the MICRF114, which starts its wake-up sequence. After the wake-up delay, it transmits the data present on its SDI pin. The MCU holds the SDI pin low for the maximum specified wakeup time. If calibration is requested, the maximum specified calibration time must be added to the wakeup time. Transmit parameters are not usually changed on the fly, and recalibration is not necessary. Therefore, the MCU can use the quick-start transmit sequence as described in Section 2.3 “Communication with the MCU”. However, except in the rare case that all default parameter settings are acceptable for the application, the first transmission after a POR event must include sending the required Configuration bits. Recalibration is always needed when the transmit frequency is in a band that is different from the default value. The MICRF114 stays in Transmit mode until the MCU sends a Stop bit and then reverts to Sleep mode without any time-out delay. CRYSTAL LOAD CAPACITOR Crystal Load Capacitor: CXT = 7 pF + X <4:0> * 0.5 pF EQUATION 2-2: RF TRANSMIT POWER RF Transmit Power: PTX = -2 dBm + P <3:0> dBm EQUATION 2-3: RF OUTPUT TUNING CAPACITOR RF Output Tuning Capacitor: CTX = 0 pF + R <3:0> * 0.2 pF The operating frequency, the crystal load capacitor, and the RF output tuning capacitor settings depend on the selection of external components and, to a lesser extent, PCB layout. If these parameters are different from the default values, it must be set only once during the first transmission after a POR event. DS50002416A-page 10 Preliminary 2015 Microchip Technology Inc. MICRF114 3.0 TYPICAL PERFORMANCE CURVES 3.1 Characterization Setup Harmonic filtering is omitted. The measured power levels are calculated back to the RFO pin of the MICRF114, taking into account the losses of the characterization setup. Component values that are valid for the two frequencies are listed in Table 3-1. The MICRF114 is characterized at the two most popular frequencies, 315 MHz and 433.92 MHz, over the whole operating temperature and supply voltage range. The results shown in Section 3.2 “315 MHz Results” and Section 3.3 “433 MHz results” are the average values taken from three devices, each coming from a typical wafer lot. The RF output of the MICRF114 is matched to 50 ohms to facilitate connection to a spectrum analyzer. Refer to Figure 3-1. FIGURE 3-1: MATCHING CIRCUIT SCHEMATIC RFO L2 C2 C1 2015 Microchip Technology Inc. 50 ohm MICRF114 L1 SMA Connector VDD TABLE 3-1: Component COMPONENT VALUES Frequency 315 MHz 433 MHz L1 360 nH 330 nH L2 39 nH 22 nH C1 6.8 pF 5.6 pF C2 9.1 pF 5.6 pF Current consumption is measured with a 50% dutycycle OOK modulation at 115.2 kbps data rate. Output power is measured in unmodulated, Continuous Wave (CW) mode. The reference spur level and the phase noise are also measured in CW mode at +10 dBm (nominal) output power setting. The phase noise is measured at 1 MHz offset from the carrier. Preliminary DS50002416A-page 11 MICRF114 3.2 315 MHz Results Figure 3-2 through Figure 3-7 show the average values measured at 315 MHz. FIGURE 3-2: CURRENT CONSUMPTION, 0 dBm POWER SETTING FIGURE 3-3: OUTPUT POWER, 0 dBm POWER SETTING DS50002416A-page 12 Preliminary 2015 Microchip Technology Inc. MICRF114 FIGURE 3-4: CURRENT CONSUMPTION, +10 dBm POWER SETTING FIGURE 3-5: OUTPUT POWER, +10 dBm POWER SETTING 2015 Microchip Technology Inc. Preliminary DS50002416A-page 13 MICRF114 FIGURE 3-6: REFERENCE SPUR LEVEL FIGURE 3-7: PHASE NOISE DS50002416A-page 14 Preliminary 2015 Microchip Technology Inc. MICRF114 3.3 433 MHz results Figure 3-8 through Figure 3-13 show the average values measured at 433 MHz. FIGURE 3-8: CURRENT CONSUMPTION, 0 dBm POWER SETTING FIGURE 3-9: OUTPUT POWER, 0 dBm POWER SETTING 2015 Microchip Technology Inc. Preliminary DS50002416A-page 15 MICRF114 FIGURE 3-10: CURRENT CONSUMPTION, +10 dBm POWER SETTING FIGURE 3-11: OUTPUT POWER, +10 dBm POWER SETTING DS50002416A-page 16 Preliminary 2015 Microchip Technology Inc. MICRF114 FIGURE 3-12: REFERENCE SPUR LEVEL FIGURE 3-13: PHASE NOISE 2015 Microchip Technology Inc. Preliminary DS50002416A-page 17 MICRF114 NOTES: DS50002416A-page 18 Preliminary 2015 Microchip Technology Inc. MICRF114 4.0 APPLICATION CIRCUIT 4.1 50-ohm Matching Example Table 4-1 shows the values of the frequencydependent components for the two most popular frequencies. Except for L1, it is recommended to use 0402 SMD components in the matching and filter network. Figure 4-1 shows the RF section of the MICRF114 application circuit. The VSS pin potential is the ground reference for the whole circuit. The supply voltage (1.8V to 3.6V) is connected to the VDD pin. Capacitors C5 and C6 provide supply bypass (filtering). In every application, the MICRF114 has to be controlled by an MCU via the proprietary serial interface (SDI and SCK pins). The quartz crystal (X1) connected to the OSC pin determines the operating frequency which is 32 times the crystal resonance frequency. TABLE 4-1: SDI SCK C5 C6 4.7 nF 470 pF MICRF114 VDD Note: 315 MHz 433 MHz X1 9.84375 MHz 13.56 MHz L2 39 nH 22 nH C1 9.1 pF 6.8 pF C2 9.1 pF 5.6 pF C3 12 pF 8.2 pF L3 27 nH 18 nH C4 12 pF 8.2 pF SCHEMATIC DIAGRAM Supply From MCU Frequency Component The matching network (L1, L2, C1, and C2) provides optimum power transfer from the MICRF114 to the antenna. The filter stage (L3, C3, and C4) removes the unwanted harmonics. The required harmonic suppression depends on the operating frequency, antenna characteristics, and regional regulations. This means the order of the filter (the number of components) may be different in an actual application with an integrated antenna. FIGURE 4-1: COMPONENT VALUES L1 220 nH L2 RFO Filtering C2 C1 VSS OSC Matching L3 C3 C4 50 ohm RF Output X1 This is a suggested schematic diagram only. Component values for C1 to C4 and L2 to L3 vary according to operating frequency, antenna characteristics, and regional regulations. Certain components can be removed. 2015 Microchip Technology Inc. Preliminary DS50002416A-page 19 MICRF114 4.2 Measurement Results The important parameters for regulatory standard compliance are measured on PICtail™ boards for the two most popular operating frequencies using the frequency-dependent components listed in Table 4-1. The MICRF114 operates in CW mode. Harmonics and spurs are measured at +10 dBm output power setting. Matching network, cable, and connector losses are not compensated to ensure that the actual power readings on the spectrum analyzer are slightly less. FIGURE 4-2: HARMONIC LEVELS AT 315 MHZ FIGURE 4-3: SPURIOUS LEVELS AT 315 MHZ DS50002416A-page 20 Measurement results are shown in Figure 4-2 through Figure 4-7. Note that the regulations limit the radiated field strength at a given distance. The maximum usable power setting at a given frequency and geographic region can be determined only if the antenna gain is known. The level of the fundamental carrier signal and all possible out-of-band signals – harmonics, spurs, and integrated phase noise – must be taken into account. The filter network can be simplified at lowradiated power. Preliminary 2015 Microchip Technology Inc. MICRF114 FIGURE 4-4: PHASE NOISE AT 315 MHZ FIGURE 4-5: HARMONIC LEVELS AT 433 MHZ 2015 Microchip Technology Inc. Preliminary DS50002416A-page 21 MICRF114 FIGURE 4-6: SPURIOUS LEVELS AT 433 MHZ FIGURE 4-7: PHASE NOISE AT 433 MHZ DS50002416A-page 22 Preliminary 2015 Microchip Technology Inc. MICRF114 5.0 ELECTRICAL CHARACTERISTICS In Table 5-1 and Table 5-2, all voltages are referenced to the potential on the VSS pin. TABLE 5-1: Symbol ABSOLUTE MAXIMUM RATINGS Parameter Min Typ Max Unit Conditions/Notes VDD Supply Voltage -0.3 — 4.0 V On VDD pin VIN Voltage on any pin -0.3 — VDD+0.3 V Except VDD and RFO pins VRF Voltage on RFO pin -0.3 — 9 V RF peak values VESD Any pin combinations, HBM Electrostatic Discharge — — 2000 V IIN Current into any pin -25 — 25 mA — TST Storage Temperature -55 — +125 °C — TLD Lead Temperature — — +260 °C Soldering, for max 10s TABLE 5-2: Symbol RECOMMENDED OPERATING CONDITIONS Parameter Min Typ Max Unit Conditions/Notes VDD Supply Voltage 1.8 2.7 3.6 V On VDD pin Except VDD and RFO pins VIN Voltage on any pin 0.0 — VDD V VRF Voltage on RFO pin 0.2 — 7.2 V RF peak values TOP Operating Temperature -40 +27 +85 °C Ambient Typical parameter values in Table 5-3 through Table 5-6 are valid at typical VDD and TOP except where indicated otherwise. TABLE 5-3: Symbol DC CHARACTERISTICS Parameter IDD Supply Current Min Typ Max Unit — 0.2 — µA Sleep mode Conditions/Notes — 11.7 — mA Transmit mode(1) VTP POR Level Threshold — 1.2 — V VDD < VTP needed for POR VTG POR Glitch Threshold — 0.8 — V Larger glitch generates POR VIL Digital in Low Level — — 0.35 x VDD V — VIH Digital in High Level 0.65 x VDD — — V — RPD Input Pull Down — 134 — k Note 1: On SCK pin OOK transmission with +10 dBm power and 50% duty cycle. 2015 Microchip Technology Inc. Preliminary DS50002416A-page 23 MICRF114 TABLE 5-4: Symbol AC CHARACTERISTICS Parameter fTX Transmit Frequency CTX Output Capacitance PTX PSP LOUT ZOUT DR hMOD SRVDD CXT RXT Note 1: 2: Output Power Spurious Emission Phase Noise RF Output Impedance(2) Modulation Data Rate Typ Max Unit 285 — 445 MHz Conditions/Notes 32 times the crystal frequency 0 — 3 pF — +13 — dBm Maximum setting(1) Selectable with 0.2 pF steps Typical control range -2 — +13 dBm — 1 — dB Power control step — — -45 dBc Excluding harmonics — — -76 dBc/Hz 100 kHz from carrier — — -92 dBc/Hz — 7.5-j50.9 — — 6.0-j32.2 — 0 — 115.2 kbps 0 — 57.6 kbps Modulation Depth — 60 — dB VDD Slew Rate 1 MHz from carrier At 315 MHz At 433 MHz NRZ Manchester encoded — 0.1 — — V/ms Crystal Load Capacitor 7 — 22.5 pF Selectable with 0.5 pF steps For proper POR operation Crystal Loss Resistance — — 80 — Valid with optimum matching circuit at TOP = 27°C and VDD = 2.7V to 3.3V The RF output impedance varies with the operating frequency, the output power setting PTX (which is not necessarily equal to the actual output power) and the output tuning capacitance setting CTX. The values given: PTX = +10 dBm and CTX = 0 pF. TABLE 5-5: Symbol Min TIMING CHARACTERISTICS Parameter Min Typ Max Unit — — 20 ms Conditions/Notes tDP POR Delay Time tWK Wake-up Time — — 3 ms Without calibration tCL Calibration Time — — 2 ms — DS50002416A-page 24 Preliminary — 2015 Microchip Technology Inc. MICRF114 TABLE 5-6: MCU INTERFACE TIMING Symbol Parameter Min Typ Max Unit Conditions/Notes tCHI Clock High Time 30 — — ns VSCK > VIH(1) tCLO Clock Low Time 30 — — ns VSCK < VIL(1) tCS Clock Setup Time 15 — — ns tCH Clock Hold Time 15 — — ns tDHI Data High Time 100 — — ns Before and after start or stop edge Between stop and start edges tDS Data Setup Time 15 — — ns — tDH Data Hold Time 15 — — ns — tFI Input Signal Fall Time — — 500 ns tRI Input Signal Rise Time — — 500 ns Note 1: Between VIL and VIH For the definition of VIL and VIH see Table 5-3. FIGURE 5-1: MCU INTERFACE TIMING SDI tDHI SCK tDS tDH 2015 Microchip Technology Inc. tCHI tCLO Preliminary tCS tCH tCS tCH DS50002416A-page 25 MICRF114 NOTES: DS50002416A-page 26 Preliminary 2015 Microchip Technology Inc. MICRF114 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example 6-Lead SOT-23 F1145 03XYZ Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2015 Microchip Technology Inc. Preliminary DS50002416A-page 27 MICRF114 6.2 Package Details /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H %6& 2XWVLGH/HDG3LWFK H %6& 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± )RRW/HQJWK / ± )RRWSULQW / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS50002416A-page 28 Preliminary 2015 Microchip Technology Inc. MICRF114 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2015 Microchip Technology Inc. Preliminary DS50002416A-page 29 MICRF114 APPENDIX A: REVISION HISTORY Revision A (September 2015) This is the initial released version of the document. DS50002416A-page 30 Preliminary 2015 Microchip Technology Inc. MICRF114 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2015 Microchip Technology Inc. Preliminary DS50002416A-page 31 MICRF114 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) Device Tape and Reel Option - X /XX Temperature Package Range Device: MICRF114: Low-Power Integrated Sub-GHz Wireless RF Transmitter Tape and Reel Option: T = Tape and Reel Temperature Range: I = -40C to +85C(Industrial) Package: OT = 6-Lead Plastic Small Outline Transistor Package (SOT-23) Example: MICRF114T-I/OT: Note 1: DS50002416A-page 32 Preliminary Tape and Reel, Industrial temperature, 6LD SOT-23 package Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-792-8 QUALITYMANAGEMENTSYSTEM CERTIFIEDBYDNV == ISO/TS16949== 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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