S E M I C O N D U C T O R HC-5509B3999-003 SLIC Subscriber Line Interface Circuit March 1996 Features Description • DI Monolithic High Voltage Process • Compatible with Worldwide PBX and CO Performance Requirements • Controlled Supply of Battery Feed Current with Programmable Current Limit • Operates with 5V Positive Supply (VB+) • Internal Ring Relay Driver and a Utility Relay Driver • High Impedance Mode for Subscriber Loop • High Temperature Alarm Output • Low Power Consumption During Standby Functions • Switch Hook, Ground Key, and Ring Trip Detection • Selective Power Denial to Subscriber • Voice Path Active During Power Denial • On-Chip Op Amp for 2-Wire Impedance Matching The HC-5509B3999-003 telephone Subscriber Line Interface Circuit integrates most of the BORSCHT functions on a monolithic IC. The device is manufactured in a Dielectric Isolation (DI) process and is designed for use as a high voltage interface between the traditional telephone subscriber pair (Tip and Ring) and the low voltage filtering and coding/decoding functions of the line card. Together with a secondary protection diode bridge and “feed” resistors, the device will withstand 1000V lightning induced surges, in plastic packages. The SLIC also maintains specified transmission performance in the presence of externally induced longitudinal currents. The BORSCHT functions that the SLIC provides are: • Battery Feed with Subscriber Loop Current Limiting • Overvoltage Protection • Ring Relay Driver • Supervisory Signaling Functions • Hybrid Functions (with External Op-Amp) • Test (or Battery Reversal) Relay Driver Applications • Solid State Line Interface Circuit for PBX or Central Office Systems, Digital Loop Carrier Systems • Hotel/Motel Switching Systems • Direct Inward Dialing (DID) Trunks • Voice Messaging PBXs • High Voltage 2-Wire/4-Wire, 4-Wire/2-Wire Hybrid In addition, the SLIC provides selective denial of power to subscriber loops, a programmable subscriber loop current limit from 20mA to 60mA, a thermal shutdown with an alarm output and line fault protection. Switch hook detection, ring trip detection and ground key detection functions are also incorporated in the SLIC device. Ordering Information PART NUMBER TEMP. RANGE (oC) HC9P5509B3999-003 0 to +75 PACKAGE 28 Ld SOIC PKG. NO. The HC-5509B3999-003 SLIC is ideally suited for line card designs in PBX and CO systems, replacing traditional transformer solutions. M28.3 Pinout HC-5509B3999-003 (SOIC) TOP VIEW TRUTH TABLE F1 F0 0 0 Normal Loop Feed 0 1 RD Active 25 TF 1 0 Power Down Latch RESET AG 1 28 BG VB+ 2 27 VB- C1 3 26 RF F1 4 ACTION F0 5 24 VFB 1 0 Power on RESET RS 6 23 RD 1 1 SHD 7 22 DG Loop Power Denial Active GKD 8 21 PR TST 9 20 PRI ALM 10 19 VTX ILMT 11 18 C2 OUT 1 12 17 VRX -IN 1 13 16 RFS TIP 14 15 RING CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation 1996 1 File Number 4126 Specifications HC-5509B3999-003 Absolute Maximum Ratings (Note 1) Operating Conditions Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V Maximum Supply Voltages (VB+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V (VB+)-(VB-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75V Junction Temperature Ceramic. . . . . . . . . . . . . . . . . . . . . . . +175oC Junction Temperature Plastic . . . . . . . . . . . . . . . . . . . . . . . . +150oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC (For SOIC - Lead Tips Only) Operating Temperature Range HC-5509B3999-003. . . . . . . . . . . . . . . . . . . . . . . . . 0oC to +75oC Storage Temperature Range . . . . . . . . . . . . . . . . . .-65oC to +150oC Relay Drivers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V Positive Power Supply (VB+) . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5% Negative Power Supply (VB-) . . . . . . . . . . . . . . . . . . . . -42V to -58V Loop Resistance (RL) . . . . . . . . . . . . . . . . . 200Ω to 1750Ω (Note 2) Thermal Information θJA (oC/W) 75 Thermal Resistance (Typical) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = +25oC, Min-Max Parameters are Over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = DG = BG = 0V. All AC Parameters are specified at 600Ω 2-Wire Terminating Impedance. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS AC TRANSMISSION PARAMETERS RX Input Impedance 300Hz to 3.4kHz (Note 3) - 100 - kΩ TX Output Impedance 300Hz to 3.4kHz (Note 3) - - 20 Ω 4-Wire Input Overload Level 300Hz to 3.4kHz RL = 1200Ω, 600Ω Reference +1.5 - - VPEAK 2-Wire Return Loss Matched for 600Ω (Note 3) SRL LO 26 35 - dB ERL 30 40 - dB SRL HI 30 40 - dB 2-Wire Longitudinal to Metallic Balance Off Hook Per ANSI/IEEE STD 455-1976 (Note 3) 300Hz to 3400Hz 58 63 - dB 4-Wire Longitudinal Balance Off Hook 300Hz to 3400Hz (Note 3) 50 55 - dB Low Frequency Longitudinal Balance R.E.A. Test Circuit - - -67 dBmp ILINE = 40mA TA = +25oC (Note 3) - - 23 dBrnC Longitudinal Current Capability ILINE = 40mA TA = +25oC (Note 3) - - 30 mARMS Insertion Loss 0dBm at 1kHz, Referenced 600Ω 2-Wire/4-Wire - ±0.05 ±0.2 dB 4-Wire/2-Wire - ±0.05 ±0.2 dB 4-Wire/4-Wire - - ±0.2 dB - ±0.02 ±0.05 dB +3 to -40dBm - - ±0.05 dB -40 to -50dBm - - ±0.1 dB -50 to -55dBm - - ±0.3 dB Frequency Response 300Hz to 3400Hz (Note 3) Referenced to Absolute Level at 1kHz, 0dBm Referenced 600Ω7 Level Linearity Referenced to -10dBm (Note 3) 2-Wire to 4-Wire and 4-Wire to 2-Wire 2 Specifications HC-5509B3999-003 Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = +25oC, Min-Max Parameters are Over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = DG = BG = 0V. All AC Parameters are specified at 600Ω 2-Wire Terminating Impedance. (Continued) PARAMETER Absolute Delay TEST CONDITIONS MIN TYP MAX UNITS (Note 3) 2-Wire/4-Wire 300Hz to 3400Hz - - 1 µs 4-Wire/2-Wire 300Hz to 3400Hz - - 1 µs 4-Wire/4-Wire 300Hz to 3400Hz - - 1.5 µs 32 40 - dB - - -52 dB C-Message - - 5 dBrnC Psophometric - - -85 dBmp 3kHz Flat - - 15 dBrn 20 29 - dB VB+ to 4-Wire 20 29 - dB VB- to 2-Wire 20 29 - dB VB- to 4-Wire 20 29 - dB 30 - - dB 30 - - dB VB- to 4-Wire 20 25 - dB VB- to 4-Wire 20 25 - dB 50 - 500 µs Limit Range 20 40 60 mA Accuracy 10 - - % - ±3 ±5 mA TIP to Ground - 30 - mA RING to Ground - 60 - mA TIP and RING to Ground - 90 - mA Switch Hook Detection Threshold 9.0 12 15 mA Ground Key Detection Threshold 14.5 10 25.5 mA 140 - 160 oC Transhybrid Loss, THL (Note 3) See Figure 1, VIN = 1VP-P at 1kHz Total Harmonic Distortion 2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire Reference Level 0dBm at 600Ω 300Hz to 3400Hz (Note 3) Idle Channel Noise (Note 3) 2-Wire and 4-Wire Power Supply Rejection Ratio VB+ to 2-Wire VB+ to 4-Wire VB- to 2-Wire (Note 3) 30Hz to 200Hz, RL = 600Ω (Note 3) 200Hz to 16kHz, RL = 600Ω Ring Sync Pulse Width DC PARAMETERS Loop Current Programming Loop Current During Power Denial RL = 200Ω Fault Currents Thermal ALARM Output Safe Operating Die Temperature Exceeded 3 Specifications HC-5509B3999-003 Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = +25oC, Min-Max Parameters are Over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = DG = BG = 0V. All AC Parameters are specified at 600Ω 2-Wire Terminating Impedance. (Continued) PARAMETER MIN TYP MAX UNITS - 10 - mA Ring Trip Detection Period - 100 150 ms Dial Pulse Distortion - 0.1 0.5 ms Ring Trip Detection Threshold TEST CONDITIONS VRING = 105VRMS, fRING = 20Hz Relay Driver Outputs On Voltage VOL IOL (PR) = 60mA, IOL (RD) = 30mA - 0.2 0.5 V Off Leakage Current VOH = 13.2V - ±10 ±100 µA Logic ‘0’ VIL - - 0.8 V Logic ‘1’ VIH 2.0 - 5.5 V 0V ≤ VIN ≤ 5V - - ±100 µA Logic ‘0’ VOL ILOAD = 800µA - 0.1 0.5 V Logic ‘1’ VOH ILOAD = 40µA 2.7 - - V - 200 - mW TTL/CMOS Logic Inputs (F0, F1, RS, TEST, PRI) Input Current (F0, F1, RS, TEST, PRI) Logic Outputs Power Dissipation On Hook Relay Drivers Off IB+ VB+ = +5.25V, VB- = -58V, RLOOP = ∞ - - 6 mA IB- VB+ = +5.25V, VB- = -58V, RLOOP = ∞ -6 - - mA Input Offset Voltage - ±5 - mV Input Offset Current - ±10 - nA UNCOMMITED OP AMP PARAMETERS Differential Input Resistance (Note 3) - 1 - MΩ Output Voltage Swing RL = 10kΩ - ±3 - VP-P Small Signal GBW (Note 3) - 1 - MHz NOTES: 1. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. 2. May Be Extended to 1900Ω With Application Circuit. 3. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification compliance. 4 HC-5509B3999-003 Pin Descriptions SOIC SYMBOL DESCRIPTION 1 AG Analog Ground - To be connected to zero potential. Serves as a reference for the transmit output and receive input terminals. 2 VB+ Positive Voltage Source - most positive supply. 3 C1 Capacitor #C1 - An external capacitor to be connected between this terminal and analog ground. Required for proper operation of the loop current limiting function. 4 F1 Function Address #1 - A TTL and CMOS compatible input used with F0 function address line to externally select logic functions. The three selectable functions are mutually exclusive. See Truth Table on page1. F1 should be toggled high after power is applied. 5 F0 Function Address #0 - A TTL and CMOS compatible input used with F1 function address line to externally select logic functions. The three selectable functions are mutually exclusive. See Truth Table on page 1. 6 RS Ring Synchronization Input - A TTL - compatible clock input. The clock is arranged such that a positive pulse (50 - 500µs) occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal. For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring injected systems, on the positive going zero crossing. This ensures that the ring delay activates and deactivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should be tied to +5. 7 SHD Switch Hook Detection - An active low LS TTL compatible logic output. A line supervisory output. 8 GKD Ground Key Detection - An active low LS TTL compatible logic output. A line supervisory output. 9 TST A TTL logic input. A low on this pin will set a latch and keep the SLIC in a power down mode until the proper F1, F0 state is set and will keep ALM low. See Truth Table on page 1. 10 ALM A LS TTL compatible active low output which responds to the thermal detector circuit when a safe operating die temperature has been exceeded. When TST is forced low by an external control signal, ALM is latched low until the proper F1, F0 state and TST input is brought high. The ALM can be tied directly to the TST pin to power down the part when a thermal fault is detected and then reset with F0, F1. See Truth Table on page 1. It is possible to ignore transient thermal overload conditions in the SLIC by delaying the response to the TST pin from the ALM. Care must be exercised in attempting this as continued thermal overstress may reduced component life. 11 ILMT Loop Current Limit - Voltage on this pin sets the short loop current limiting conditions using a resistive voltage divider. 12 OUT1 The analog output of the spare operational amplifier. 13 -IN1 The inverting analog input of the spare operational amplifier. 14 TIP An analog input connected to the TIP (more positive) side of the subscriber loop through a feed resistor and ring relay contact. Functions with the RING terminal to receive voice signals from the telephone and for loop monitoring purpose. 15 RING An analog input connected to the RING (more negative) side of the subscriber loop through a feed resistor. Functions with the TIP terminal to receive voice signals from the telephone and for loop monitoring purposes. 16 RFS Ring Feed Sense - Senses RING side of the loop for Ground Key Detection. During Ring injected ringing the ring signal at this node is isolated from RF via the ring relay. For Tip injected ringing, the RF and RFS pins must be shorted. 17 VRX Receive Input, 4-Wire Side - A high impedance analog input. AC signals appearing at this input drive the Tip Feed and Ring Feed amplifiers differentially. 18 C2 Capacitor #C2 - An external capacitor to be connected between this terminal and ground. It prevents false ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from power lines and other noise sources. This capacitor should be nonpolarized. 19 VTX Transmit Output, 4-Wire Side - A low impedance analog output which represents the differential voltage across TIP and RING. Transhybrid balancing must be performed beyond this output to completely implement 2-Wire to 4-Wire conversion. This output is referenced to analog ground. Since the DC level of this output varies with loop current, capacitive coupling to the next stage is necessary. 5 HC-5509B3999-003 Pin Descriptions (Continued) SOIC SYMBOL DESCRIPTION 20 PRI A TTL compatible input used to control PR. PRI active High = PR active low. 21 PR An active low open collector output. Can be used to drive a Polarity Reversal Relay. 22 DG Digital Ground - To be connected to zero potential. Serves as a reference for all digital inputs and outputs on the SLIC. 23 RD Ring Relay Driver - An active low open collector output. Used to drive a relay that switches ringing signals onto the 2-Wire line. 24 VFB Feedback input to the tip feed amplifier; may be used in conjunction with transmit output signal and the spare op amp to accommodate 2-Wire line impedance matching. 25 TF2 Tip Feed - A low impedance analog output connected to the TIP terminal through a feed resistor. Functions with the RF terminal to provide loop current, and to feed voice signals to the telephone set and to sink longitudinal currents. Must be tied to TF1. NA TF1 Tie directly to TF2 in the PLCC application. 26 RF1 Ring Feed - A low impedance analog output connected to the RING terminal through a feed resistor. Functions with the TF terminal to provide loop current, feed voice signals to the telephone set, and to sink longitudinal currents. Tie directly to RF2. NA RF2 Tie directly to RF1 in the PLCC application. 27 VB- The battery voltage source. The most negative supply. 28 BG Battery Ground - To be connected to zero potential. All loop current and some quiescent current flows into this ground terminal. NC No internal connection. NOTE: 1. All grounds (AG, BG, DG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first. 6 HC-5509B3999-003 Functional Diagram SOIC R TF 25 VRX R - TF + -IN 1 OUT 1 17 12 24 VTX DG VB+ 19 2 AG 1 22 28 - 2R BIAS NETWORK OP AMP + R/2 27 RF1 2R R VFB 13 4 2R R R SHD TA + 2R R SW THERM LTD 4.5k 25k 100k RING 15 100k - RFS 100k RTD GKD 90k LA + 100k 16 TSD GK 25k 6 IIL LOGIC INTERFACE TIP 14 5 - FAULT DET 4.5k RF 26 RF 90k R = 108kΩ - VB/2 REF 18 3 C1 GM + C2 RS PRI PR 23 RD 10 - F0 21 8 + F1 TST 20 RFC 90k VB- 9 7 90k BG SHD GKD ALM RF2 11 ILMT Die Characteristics Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .174 x 120 Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI TABLE 1. TEST CONDITION PERFORMANCE (MAX) UNITS Longitudinal Surge 10µs Rise/ 1000µs Fall ±1000 (Plastic) VPEAK Metallic Surge 10µs Rise/ 1000µs Fall ±1000 (Plastic) VPEAK T/GND R/GND 10µs Rise/ 1000µs Fall ±1000 (Plastic) VPEAK 50/60Hz Current T/GND R/GND 11 Cycles Limited to 10ARMS 700 (Plastic) VRMS PARAMETER Overvoltage Protection and Longitudinal Current Protection The SLIC device, in conjunction with an external protection bridge, will withstand high voltage lightning surges and power line crosses. High voltage surge conditions are as specified in Table 1. The SLIC will withstand longitudinal currents up to a maximum or 30mARMS, 15mARMS per leg, without any performance degradation. 7 HC-5509B3999-003 Logic Diagram RS TTL TO I2L RELAY DRIVER RD TTL TO I2L F0 I2L TO TTL GKD GK I2L TO TTL SHD THERMAL SHUT DOWN TTL TO I2L I2L TO TTL ALM F1 PD SH TTL TO I2L THERMAL SHUT DOWN LATCH TO BIAS NETWORK TEST INJ A B C KEY 8 A B C HC-5509B3999-003 Applications Diagram +5V SYSTEM CONTROLLER +5V K1 RS1 K2 CS1 K1A TIP RB1 SECONDARY PROTECTION (NOTE 3) C5 PRIMARY PROTECTION SHD GKD PRI RS TEST F1 ALARM F0 RD RB2 RL2 PR ILIMIT TIP VRX+ VFB VB- SLIC HC-5509B3999-003 RL1 FROM PCM FILTER/CODER CAC VTX KRF KIB -IN1 RS2 KZ0 CS2 RFS RB3 RING Z1 RB4 VRING 150VPEAK (MAX) OUT1 TO HYBRID BALANCE NETWORK RING VB- BG C2 DG AG VB+ C1 PTC C3 C4 +5V FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC RL1 + RL2 > 90kΩ → offset ILIMIT = (0.6) (RL1 + RL2)/(200 x RL2), RL1 typically 100kΩ KRF = 20kΩ, RF = 2(RB2 + RB4), K = Scaling Factor = 100) RB1 = RB2 = RB3 = RB4 = 50Ω (1% absolute, matching requirements covered in a Tech Brief) RS1 = RS2 = 1kΩ typically CS1 = CS2 = 0.1µF, 200V typically, depending on VRing and line length. Z1 = 150V to 200V transient protector. PTC used as ring generator ballast. TYPICAL COMPONENT VALUES C1 = 0.5µF, 30V C2 = 0.5µF-1.0µF ±10%, 20V (Should be nonpolarized) C3 = 0.01µF, 100V, ±20% C4 = 0.01µF, 100V, ±20% C5 = 0.01µF, 100V, ±20% CAC = 0.5µF, 20V KZ0 = 60kΩ, (Z0 = 600Ω, K = Scaling Factor = 100) RL1, RL2; Current Limit Setting Resistors: NOTES: 1. All grounds (AG, BG, & DG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first. 2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used. 3. Secondary protection diode bridge recommended is 3A, 200V type. Additional information is contained in Application Note 549, “The HC-550X Telephone SLICs” By Geoff Phillips 9 HC-5509B3999-003 Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e 0.25(0.010) M C 0.10(0.004) C A M B S MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 8o 0o N α NOTES: MILLIMETERS MAX A1 e α A1 B MIN 28 0o 28 7 8o Rev. 0 12/93 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. 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