Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TJA1040
High speed CAN transceiver
Product specification
Supersedes data of 2003 Feb 19
2003 Oct 14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
FEATURES
GENERAL DESCRIPTION
• Fully compatible with the ISO 11898 standard
The TJA1040 is the interface between the Controller Area
Network (CAN) protocol controller and the physical bus.
It is primarily intended for high speed applications, up to
1 MBaud, in passenger cars. The device provides
differential transmit capability to the bus and differential
receive capability to the CAN controller.
• High speed (up to 1 MBaud)
• Very low-current standby mode with remote wake-up
capability via the bus
• Very low ElectroMagnetic Emission (EME)
• Differential receiver with high common-mode range for
ElectroMagnetic Immunity (EMI)
• Transceiver in unpowered state disengages from the
bus (zero load)
The TJA1040 is the next step up from the TJA1050 high
speed CAN transceiver. Being pin compatible and offering
the same excellent EMC performance, the TJA1040 also
features:
• Input levels compatible with 3.3 V and 5 V devices
• An ideal passive behaviour when supply voltage is off
• Voltage source for stabilizing the recessive bus level if
split termination is used (further improvement of EME)
• A very low-current standby mode with remote wake-up
capability via the bus.
• At least 110 nodes can be connected
This makes the TJA1040 an excellent choice in nodes
which can be in power-down or standby mode in partially
powered networks.
• Transmit Data (TXD) dominant time-out function
• Bus pins protected against transients in automotive
environments
• Bus pins and pin SPLIT short-circuit proof to battery and
ground
• Thermally protected.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCC
supply voltage
ICC
supply current
standby mode
5
15
µA
VCANH
DC voltage on pin CANH
0 < VCC < 5.25 V; no time limit
−27
+40
V
VCANL
DC voltage on pin CANL
0 < VCC < 5.25 V; no time limit
−27
+40
V
VSPLIT
DC voltage on pin SPLIT
0 < VCC < 5.25 V; no time limit
−27
+40
V
Vesd
electrostatic discharge voltage
Human Body Model (HBM)
−6
+6
kV
operating range
pins CANH, CANL and SPLIT
all other pins
tPD(TXD-RXD)
propagation delay TXD to RXD
Tvj
virtual junction temperature
VSTB = 0 V
4.75
5.25
V
−4
+4
kV
40
255
ns
−40
+150
°C
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
TJA1040T
SO8
TJA1040U
−
2003 Oct 14
DESCRIPTION
plastic small outline package; 8 leads; body width 3.9 mm
bare die; die dimensions 1840 × 1440 × 380 µm
2
VERSION
SOT96-1
−
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BLOCK DIAGRAM
VCC
handbook, full pagewidth
3
TXD
TIME-OUT &
SLOPE
1
TEMPERATURE
PROTECTION
V SPLIT
VCC
5
7
6
STB
RXD
GND
8
WAKE-UP
MODE CONTROL
4
SPLIT
CANH
CANL
DRIVER
WAKE-UP
FILTER
MUX
TJA1040
2
MGU161
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
TXD
1
transmit data input
GND
2
ground supply
TXD 1
VCC
3
supply voltage
GND 2
RXD
4
receive data output; reads out data
from the bus lines
SPLIT
5
common-mode stabilization output
CANL
6
LOW-level CAN bus line
CANH
7
HIGH-level CAN bus line
STB
8
standby mode control input
2003 Oct 14
handbook, halfpage
8
STB
7
CANH
VCC 3
6
CANL
RXD 4
5
SPLIT
TJA1040T
MGU160
Fig.2 Pin configuration.
3
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
to the centre tap of the split termination (see Fig.4). In case
of a recessive bus voltage <0.5VCC due to the presence of
an unsupplied transceiver in the network with a significant
leakage current from the bus lines to ground, the split
circuit will stabilize this recessive voltage to 0.5VCC. So a
start of transmission does not cause a step in the
common-mode signal which would lead to poor
ElectroMagnetic Emission (EME) behaviour.
FUNCTIONAL DESCRIPTION
Operating modes
The TJA1040 provides two modes of operation which are
selectable via pin STB. See Table 1 for a description of the
modes of operation.
Table 1
Operating modes
MODE
PIN
STB
PIN RXD
LOW
Wake-up
HIGH
normal
LOW
bus dominant
standby
HIGH
wake-up request no wake-up
detected
request detected
In the standby mode the bus lines are monitored via a
low-power differential comparator. Once the low-power
differential comparator has detected a dominant bus level
for more than tBUS, pin RXD will become LOW.
bus recessive
NORMAL MODE
Over-temperature detection
In this mode the transceiver is able to transmit and receive
data via the bus lines CANH and CANL. See Fig.1 for the
block diagram. The differential receiver converts the
analog data on the bus lines into digital data which is
output to pin RXD via the multiplexer (MUX). The slope of
the output signals on the bus lines is fixed and optimized
in a way that lowest ElectroMagnetic Emission (EME) is
guaranteed.
The output drivers are protected against over-temperature
conditions. If the virtual junction temperature exceeds the
shutdown junction temperature Tj(sd), the output drivers will
be disabled until the virtual junction temperature becomes
lower than Tj(sd) and TXD becomes recessive again.
By including the TXD condition, the occurrence of output
driver oscillation due to temperature drifts is avoided.
STANDBY MODE
A ‘TXD dominant time-out’ timer circuit prevents the bus
lines from being driven to a permanent dominant state
(blocking all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD.
TXD dominant time-out function
In this mode the transmitter and receiver are switched off,
and the low-power differential receiver will monitor the bus
lines. A HIGH level on pin STB activates this low-power
receiver and the wake-up filter, and after tBUS the state of
the CAN bus is reflected on pin RXD.
If the duration of the LOW level on pin TXD exceeds the
internal timer value (tdom), the transmitter is disabled,
driving the bus lines into a recessive state. The timer is
reset by a positive edge on pin TXD. The TXD dominant
time-out time tdom defines the minimum possible bit rate of
40 kBaud.
The supply current on VCC is reduced to a minimum in
such a way that ElectroMagnetic Immunity (EMI) is
guaranteed and a wake-up event on the bus lines will be
recognized.
In this mode the bus lines are terminated to ground to
reduce the supply current (ICC) to a minimum. A diode is
added in series with the high-side driver of RXD to prevent
a reverse current from RXD to VCC in the unpowered state.
In normal mode this diode is bypassed. This diode is not
bypassed in standby mode to reduce current consumption.
Fail-safe features
Pin TXD provides a pull-up towards VCC in order to force a
recessive level in case pin TXD is unsupplied.
Pin STB provides a pull-up towards VCC in order to force
the transceiver into standby mode in case pin STB is
unsupplied.
Split circuit
Pin SPLIT provides a DC stabilized voltage of 0.5VCC. It is
turned on only in normal mode. In standby mode pin SPLIT
is floating. The VSPLIT circuit can be used to stabilize the
recessive common-mode voltage by connecting pin SPLIT
2003 Oct 14
In the event that the VCC is lost, pins TXD, STB and RXD
will become floating to prevent reverse supplying
conditions via these pins.
4
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
UNIT
no time limit
−0.3
+6
V
operating range
4.75
5.25
V
VTXD
DC voltage on pin TXD
−0.3
VCC + 0.3 V
VRXD
DC voltage on pin RXD
−0.3
VCC + 0.3 V
VSTB
DC voltage on pins STB
−0.3
VCC + 0.3 V
VCANH
DC voltage on pin CANH
0 < VCC < 5.25 V; no time limit
−27
+40
V
VCANL
DC voltage on pin CANL
0 < VCC < 5.25 V; no time limit
−27
+40
V
VSPLIT
DC voltage on pin SPLIT
0 < VCC < 5.25 V; no time limit
−27
+40
V
Vtrt
transient voltages on pins CANH,
CANL and SPLIT
according to ISO 7637; see Fig.5
−200
+200
V
Vesd
electrostatic discharge voltage
Human Body Model (HBM); note 1
pins CANH and CANL
and SPLIT
−6
+6
kV
all other pins
−4
+4
kV
Tvj
virtual junction temperature
Tstg
storage temperature
Machine Model (MM); note 2
−200
+200
V
note 3
−40
+150
°C
−55
+150
°C
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition of Tvj is: Tvj = Tamb + P × Rth(vj-amb),
where Rth(vj-amb) is a fixed value to be used for the calculating of Tvj. The rating for Tvj limits the allowable
combinations of power dissipation (P) and ambient temperature (Tamb).
THERMAL CHARACTERISTICS
In accordance with IEC 60747-1.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(vj-a)
thermal resistance from virtual junction
to ambient in SO8 package
in free air
145
K/W
Rth(vj-s)
thermal resistance from virtual junction
to substrate of bare die
in free air
50
K/W
QUALITY SPECIFICATION
Quality specification in accordance with “AEC-Q100”.
2003 Oct 14
5
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
CHARACTERISTICS
VCC = 4.75 to 5.25 V, Tvj = −40 to +150 °C and RL = 60 Ω unless specified otherwise; all voltages are defined with
respect to ground; positive currents flow into the IC; note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin VCC)
ICC
supply current
5
10
15
µA
recessive; VTXD = VCC
2.5
5
10
mA
dominant; VTXD = 0 V
30
50
70
mA
standby mode
normal mode
Transmit data input (pin TXD)
VIH
HIGH-level input voltage
2
−
VCC + 0.3 V
VIL
LOW-level input voltage
−0.3
−
+0.8
V
IIH
HIGH-level input current
VTXD = VCC
−5
0
+5
µA
IIL
LOW-level input current
normal mode; VTXD = 0 V
−100
−200
−300
µA
Ci
input capacitance
not tested
−
5
10
pF
Standby mode control input (pin STB)
VIH
HIGH-level input voltage
2
−
VCC + 0.3 V
VIL
LOW-level input voltage
−0.3
−
+0.8
V
IIH
HIGH-level input current
VSTB = VCC
−
0
−
µA
IIL
LOW-level input current
VSTB = 0 V
−1
−4
−10
µA
Receive data output (pin RXD)
VOH
HIGH-level output voltage
standby mode;
IRXD = −100 µA
VCC − 1.1 VCC − 0.7 VCC − 0.4 V
IOH
HIGH-level output current
normal mode;
VRXD = VCC − 0.4 V
−0.1
−0.4
−1
mA
IOL
LOW-level output current
VRXD = 0.4 V
2
6
12
mA
Common-mode stabilization output (pin SPLIT)
VO
output voltage
normal mode;
−500 µA < IO < +500 µA
0.3VCC
0.5VCC
0.7VCC
V
IL
leakage current
standby mode;
−22 V < VSPLIT < +35 V
−
0
5
µA
pin CANH
3
3.6
4.25
V
pin CANL
0.5
1.4
1.75
V
−100
0
+150
mV
VTXD = 0 V; dominant;
45 Ω < RL < 65 Ω
1.5
−
3.0
V
VTXD = VCC; recessive;
no load
−50
−
+50
mV
Bus lines (pins CANH and CANL)
VO(dom)
dominant output voltage
VO(dom)(m)
matching of dominant output
voltage (VCC - VCANH - VCANL)
VO(dif)(bus)
differential bus output voltage
(VCANH − VCANL)
2003 Oct 14
VTXD = 0 V
6
Philips Semiconductors
Product specification
High speed CAN transceiver
SYMBOL
PARAMETER
VO(reces)
recessive output voltage
IO(sc)
short-circuit output current
TJA1040
CONDITIONS
MIN.
normal mode; VTXD = VCC; 2
no load
standby mode; no load
TYP.
MAX.
UNIT
0.5VCC
3
V
−0.1
0
+0.1
V
−40
−70
−95
mA
VTXD = 0 V
pin CANH; VCANH = 0 V
pin CANL; VCANL = 40 V 40
70
100
mA
−
+2.5
mA
normal mode (see Fig.6) 0.5
0.7
0.9
V
standby mode
0.4
0.7
1.15
V
IO(reces)
recessive output current
−27 V < VCAN < +32 V
Vdif(th)
differential receiver threshold
voltage
−12 V < VCANL < +12 V;
−12 V < VCANH < +12 V
−2.5
Vhys(dif)
differential receiver hysteresis
voltage
normal mode;
−12 V < VCANL < +12 V;
−12 V < VCANH < +12 V
50
70
100
mV
ILI
input leakage current
VCC = 0 V;
VCANH = VCANL = 5 V
−5
0
+5
µA
Ri(cm)
common-mode input
resistance
standby or normal mode
15
25
35
kΩ
Ri(cm)(m)
common-mode input
resistance matching
VCANH = VCANL
−3
0
+3
%
Ri(dif)
differential input resistance
standby or normal mode
25
50
75
kΩ
Ci(cm)
common-mode input
capacitance
VTXD = VCC; not tested
−
−
20
pF
Ci(dif)
differential input capacitance
VTXD = VCC; not tested
−
−
10
pF
normal mode
25
70
110
ns
Timing characteristics; see Fig.8
td(TXD-BUSon)
delay TXD to bus active
td(TXD-BUSoff)
delay TXD to bus inactive
10
50
95
ns
td(BUSon-RXD)
delay bus active to RXD
15
65
115
ns
td(BUSoff-RXD)
delay bus inactive to RXD
35
100
160
ns
tPD(TXD-RXD)
propagation delay TXD to RXD VSTB = 0 V
40
−
255
ns
tdom(TXD)
TXD dominant time-out
VTXD = 0 V
300
600
1000
µs
tBUS
dominant time for wake-up via
bus
standby mode
0.75
1.75
5
µs
td(stb-norm)
delay standby mode to normal
mode
normal mode
5
7.5
10
µs
155
165
180
°C
Thermal shutdown
Tj(sd)
shutdown junction temperature
Note
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 °C
ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for
cased products; unless specified otherwise. For bare dies, all parameters are only guaranteed with the backside of
the die connected to ground.
2003 Oct 14
7
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
APPLICATION AND TEST INFORMATION
handbook, full pagewidth
5V
BAT
VCC
CANH
3
7
8
STB
Port x
VCC
TJA1040
SPLIT
MICROCONTROLLER
5
4
CANL
6
2
1
RXD
TXD
RXD
TXD
MGU164
More application information is available in a separate application note.
Fig.3 Typical application for 5 V microcontroller.
VCC
handbook, full pagewidth
TJA1040
CANH
60 Ω
R
VSPLIT = 0.5VCC
SPLIT
in normal mode;
otherwise floating
60 Ω
R
CANL
MGU162
GND
Fig.4 Stabilization circuitry and application.
2003 Oct 14
8
Philips Semiconductors
Product specification
High speed CAN transceiver
handbook, full pagewidth
TJA1040
+5 V
47 µF
100 nF
VCC
TXD
3
1
7
TJA1040
500 kHz
RXD
CANL
1 nF
1 nF
TRANSIENT
GENERATOR
SPLIT
5
4
2
15 pF
6
CANH
8
GND
STB
MGW336
The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.
Fig.5 Test circuit for automotive transients.
handbook, full pagewidth
MGS378
VRXD
HIGH
LOW
hysteresis
0.5
0.9
Fig.6 Hysteresis of the receiver.
2003 Oct 14
9
Vi(dif)(bus) (V)
Philips Semiconductors
Product specification
High speed CAN transceiver
handbook, full pagewidth
TJA1040
+5 V
47 µF
100 nF
VCC
TXD
3
1
7
SPLIT
RXD
CANH
RL
60 Ω
TJA1040
5
6
CANL
CL
100 pF
4
2
15 pF
8
GND
STB
MGW335
Fig.7 Test circuit for timing characteristics.
handbook, full pagewidth
HIGH
TXD
LOW
CANH
CANL
dominant
(BUS on)
0.9 V
Vi(dif)(bus)
(1)
0.5 V
recessive
(BUS off)
HIGH
RXD
0.7VCC
0.3VCC
LOW
t d(TXD-BUSon)
t d(TXD-BUSoff)
t d(BUSon-RXD)
t d(BUSoff-RXD)
t PD(TXD-RXD)
t PD(TXD-RXD)
(1) Vi(dif)(bus) = VCANH − VCANL.
Fig.8 Timing diagram.
2003 Oct 14
10
MGS377
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BONDING PAD LOCATIONS
COORDINATES(1)
SYMBOL
PAD
x
y
119.5
114.5
TXD
1
GND
2
648.5
85
VCC
3
1214.25
114.5
RXD
4
1635.25
114.5
SPLIT
5
1516.5
1275
CANL
6
990.5
1273.75
CANH
7
530.25
1273.75
STB
8
113.75
1246
7
6
5
test pad 1
TJA1040U
test pad 2
x
0
1
0
2
3
4
y
Note
MBL584
The backside of the bare die must be connected to ground.
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
2003 Oct 14
8
handbook, halfpage
Fig.9 Bonding pad locations.
11
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
inches
0.010 0.057
0.069
0.004 0.049
0.05
0.244
0.039 0.028
0.041
0.228
0.016 0.024
0.01
0.01
0.028
0.004
0.012
θ
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
2003 Oct 14
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
12
o
8
0o
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
To overcome these problems the double-wave soldering
method was specifically developed.
SOLDERING
Introduction to soldering surface mount packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
Manual soldering
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2003 Oct 14
13
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
not suitable
suitable(4)
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not
PLCC(5), SO, SOJ
suitable
REFLOW(2)
suitable
suitable
suitable
not
recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended(7)
suitable
PMFP(8)
not suitable
LQFP, QFP, TQFP
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
REVISION HISTORY
REV
6
DATE
20031014
CPCN
200307014
DESCRIPTION
Product specification (9397 750 11837)
Modification:
• Change ‘Vth(dif) = 0.5 V’ in standby mode into ‘Vdif(th) = 0.4 V’
• Add Chapter REVISION HISTORY
5
20030219
2003 Oct 14
−
Product specification (9397 750 10887)
14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 14
15
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Bare die  All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
2003 Oct 14
16
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R16/06/pp17
Date of release: 2003
Oct 14
Document order number:
9397 750 11837
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