INTERSIL ACS21HMSR-03

ACS21MS
Data Sheet
July 1999
File Number
Radiation Hardened Dual 4-Input AND Gate
Features
The Radiation Hardened ACS21MS is a Dual 4-Input AND
Gate. For each gate, a HIGH level on all inputs results in a
HIGH level on the Y output. A LOW level on any input
results in a LOW level on the Y output. All inputs are
buffered and the outputs are designed for balanced
propagation delay and transition times.
• QML Qualified Per MIL-PRF-38535 Requirements
The ACS21MS is fabricated on a CMOS Silicon on
Sapphire (SOS) process, which provides an immunity to
Single Event Latch-up and the capability of highly reliable
performance in any radiation environment. These devices
offer significant power reduction and faster performance
when compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS21MS are
contained in SMD 5962-98629. A “hot-link” is provided
on our homepage for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
4757
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-Up Free Under Any Conditions
- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si)
- SEU Immunity . . . . . . . . . . . . . <1 x 10-10 Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm2)
• Input Logic Levels. . . . VIL = (0.3)(VCC), VIH = (0.7)(VCC)
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA (Min)
• Quiescent Supply Current . . . . . . . . . . . . . . . 5.0µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 15ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
Ordering Information
INTERNAL MARKETING
NUMBER
ORDERING NUMBER
5962F9862901VCC
ACS21DMSR-03
ACS21D/SAMPLE-03
ACS21D/SAMPLE-03
5962F9862901VXC
ACS21KMSR-03
ACS21K/SAMPLE-03
5962F9862901V9A
TEMP. RANGE (oC)
PACKAGE
DESIGNATOR
-55 to 125
14 Ld SBDIP
CDIP2-T14
25
14 Ld SBDIP
CDIP2-T14
-55 to 125
14 Ld Flatpack
CDFP3-F14
ACS21K/SAMPLE-03
25
14 Ld Flatpack
CDFP3-F14
ACS21HMSR-03
25
Die
NA
Pinouts
ACS21MS
(SBDIP)
TOP VIEW
ACS21MS
(FLATPACK)
TOP VIEW
A1 1
14 VCC
A1
1
14
VCC
B1 2
13 D2
B1
2
13
D2
NC 3
12 C2
NC
3
12
C2
C1
4
11
NC
D1
5
10
B2
Y1
6
9
A2
GND
7
8
Y2
11 NC
C1 4
D1 5
10 B2
Y1 6
9 A2
GND 7
8 Y2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
ACS21MS
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm ±25µm (20.6 mils ±1 mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm ±0.15µm
SPECIAL INSTRUCTIONS
METALLIZATION: AI
Bond VCC First
Metal 1 Thickness: 0.7µm ±0.1µm
Metal 2 Thickness: 1.0µm ±0.1µm
ADDITIONAL INFORMATION:
Worst Case Current Density: <2.0 x 105 A/cm2
Transistor Count: 92
SUBSTRATE POTENTIAL
Unbiased Insulator
Metallization Mask Layout
ACS21MS
B1
(2)
A1
(1)
VCC
(14)
D2
(13)
(12) C2
NC
NC
C1 (4)
NC
NC
(10) B2
D1 (5)
(6)
Y1
(7)
GND
(8)
Y2
(9)
A2
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