CrossLink LIF-MD6000 Master Link Board Evaluation Board User Guide

CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
EB105 Version 1.0
May 2016
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Contents
Acronyms in This Document .................................................................................................................................................3
1. Introduction ..................................................................................................................................................................4
2. Headers and Test Connections .....................................................................................................................................6
3. Programming Circuit .....................................................................................................................................................7
3.1.
Bridging Circuit ....................................................................................................................................................7
2
3.2.
I C Expander ........................................................................................................................................................8
4. Power Supply ................................................................................................................................................................9
5. Status Indicators .........................................................................................................................................................11
References ..........................................................................................................................................................................12
Technical Support Assistance...............................................................................................................................................12
Appendix A. LIF-MD6000-ML-EVN-BRD Schematics ...........................................................................................................13
Appendix B. LIF-MD6000-ML-EVN-BRD Bill of Materials ....................................................................................................21
Appendix C. SMA-IOL-EVN-BRD Schematics .......................................................................................................................27
Appendix D. SMA-IOL-EVN-BRD Bill of Materials................................................................................................................28
Appendix E. B-IOL-EVN-BRD Schematics.............................................................................................................................29
Appendix F. B-IOL-EVN-BRD Bill of Materials .....................................................................................................................30
Revision History ...................................................................................................................................................................31
Figures
Figure 1.1. Top View of Master Link Board and its Key Components ...................................................................................4
Figure 1.2. Bottom View of Master Link Board .....................................................................................................................5
Figure 3.1. Programming Block .............................................................................................................................................7
Figure 3.2. Bridging Block .....................................................................................................................................................8
2
Figure 3.3. I C Expander Block ..............................................................................................................................................8
Figure 4.1. Power Supply Block .............................................................................................................................................9
Tables
Table 2.1. Headers and Test Connectors ..............................................................................................................................6
Table 4.1. Power LEDs ...........................................................................................................................................................9
Table 4.2. Device Power Rail Summary and Test Points .....................................................................................................10
Table 5.1. Status LED I/O Map ............................................................................................................................................11
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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Acronyms in This Document
A list of acronyms used in this document.
Acronym
Definition
CMOS
Complementary Metal-Oxide Semiconductor
CSI-2
Camera Serial Interface
DSI
Display Serial Interface
FTDI
Future Technology Devices International
2
IC
Inter-Integrated Circuit
LVDS
Low-Voltage Differential Signaling
SPI
Serial Peripheral Interface
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
1. Introduction
TM
This document describes the Lattice Semiconductor CrossLink LIF-MD6000 Master Link board that supports a variety
of demos, encompassing different signaling logic standards bridging with MIPI® CSI-2/DSI interface. The board‘s key
component is the CrossLink Family device that features built in MIPI D-PHY hard blocks to support different bridging
solutions.
For the latest information about this board, including optional Tx/Rx Link boards, demo files, further documentation
and more, see the Lattice website at: www.latticesemi.com/masterlink
For details about the CrossLink device refer to DS1055, CrossLink Family Data Sheet.
The content of this user guide includes descriptions of on-board jumper settings, programming circuit, a complete set
of schematics, and bill of materials for LIF-MD6000 Master Link board.
Refer to Appendix A, B, C, D, E, F for the schematics and BOM of the CrossLink LIF-MD6000 Master Link board and the
schematics and BOMs of the Breakout IOLink and SMA IOLink boards that are included in the demo kit.
Circuits on the development kit board:
 Programming Circuit
 Mini USB Type-B connector to FTDI
 FTDI to CrossLink using SPI
 FTDI to XO3LF device using JTAG
 CrossLink
 MIPI CSI-2/DSI hard block
 Bridging of multiple signaling standards
 SPI flash configuration
 General Purpose Input/Output
 LED display
 LCMXO3LF-1300E
2
 I C muxing
Figure 1.1 shows the top view of the LIF-MD6000 Master Link board and its key components. Figure 1.2 on the next
page shows the bottom view of the board.
Tx Connector 1 & 2 (U9, U7)
XO3 Reset (SW3)
Power Switch (SW1)
Power LEDs
External Power Input
LCMXO3L-1300E (U19)
Debug Header (J18)
External Power Jack (J3)
LIF-MD6000-CSFBGA81
Bank 1, 2 Voltage Selection
Headers (J24, J25)
Debug and
Configuration LEDs
USB 2.0 Mini-B (J2)
Reset and wake-up buttons
Switch (SW2)
JTAG Header (J1)
External Clock SMA Inputs
FTDI Chip (U1)
SPI Flash Device (U14)
Rx Connectors (U11, U12)
Clock Source Selection (J26, J27)
Figure 1.1. Top View of Master Link Board and its Key Components
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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Figure 1.2. Bottom View of Master Link Board
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
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2. Headers and Test Connections
Figure 1.1 shows the top view of the Master Link board. The headers and test connections on the board provide access
to LIF-MD6000 Master Link demo board circuits. Table 2.1 lists the headers and test connectors.
Table 2.1. Headers and Test Connectors
Part
Description
Setting
J1
External JTAG interface - For LCMX03 only
—
J8
External 12 V terminal block
Open
J9
External 5 V terminal block
Open
SW1
External adaptor power ON/OFF
—
J22
External reference clock input for MIPI D-PHY reference clock
—
J21
External or internal reference clock selection
J5
Debug I/O
J20
LIF-MD6000 chip select
OPEN-OFF, SHORT-ON
J19
SPI Flash chip select
OPEN-OFF, SHORT-ON
J4
External clock input for MIPI D-PHY reference clock
J6
External or internal clock selection
1–2 (External), 2–3 (Internal)
—
2
—
1–2 (External), 2–3 (Internal)
J18
External SP/I C access
—
SW2
Configuration reset for LIF-MD6000
—
J29
Reset signal voltage selector
J28
Reveal analyzer signal connector
J26
Internal/External clock and I2C SDA Mux
J27
Internal/External reference clock and I2C SCL Mux
J24
VCCIO1 Bank voltage selector
1-2 (2.5 V), 2-3 (3.3 V), 2-4 (1.2 V)
J25
VCCIO1 Bank voltage selector
1-2 (2.5 V), 2-3 (3.3 V), 2-4 (1.2 V)
J3
External power jack
—
1-2 (VCCIO2), 2-3 (VCCIO0)
—
1-2 (CLK_INT), 2-3 (CLK_EXT), 2-4 (SDA)
1-2 (CLK_INT_REF), 2-3 (CLK_EXT_REF), 2-4 (SCL)
U7, U9
Tx Connectors for external interface
—
U11, U12
Rx Connectors for external interface
—
SW4
External reset for LIF-MD6000 device
—
SW3
External reset for LCMXO3L device
—
SW5
PMU WAKEUP Switch
—
J23
Debug Header for LCMXO3L device
—
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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3. Programming Circuit
The Mini-B USB connector is used for programming the board by using Lattice Diamond® programmer software.
Figure 3.1 shows the programming block of LIF-MD6000 Master Link board.
The Mini-B USB connector interfaces to the FTDI FT2232H IC. The FTDI IC works with Diamond programmer software to
provide interfaces for:
 JTAG – to program MachXO2-1300E
 SPI – to program both CrossLink, and SPI Flash Memory
SPI Flash (U14)
SPI
USB Mini-B
(J2)
LIF-MD6000
CSFBGA81 (U8)
FTDI Chip (U1)
JTAG
LCMXO3LF-1300E
MG121 (U19)
Figure 3.1. Programming Block
3.1. Bridging Circuit
Figure 3.2 shows the block diagram of bridging of different standard interfaces. The CrossLink device is used as a
bridging device that supports a variety of I/O standards. This demo board supports development of the following
interface bridges:
 1:1 MIPI DSI Display Interface Bridge
 1:2 MIPI DSI Display Interface Bridge
 2:1 MIPI CSI-2 Image Sensor Aggregator Bridge
 CMOS to MIPI CSI-2 Image Sensor Interface Bridge
 MIPI CSI-2 to CMOS Image Sensor Interface Bridge
 MIPI DSI to CMOS Display Interface Bridge
 OpenLDI LVDS to MIPI DSI Display Interface Bridge
 CMOS to MIPI DSI Display Interface Bridge
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Tx Connector 1
D-PHY I/F
D-PHY Rx/
LVDS/CMOS
Rx Connector 1
LIF-MD6000
CSFBGA81 (U8)
Tx Connector 2
D-PHY Rx/
LVDS/CMOS
D-PHY I/F
Rx Connector 2
Figure 3.2. Bridging Block
3.2. I2C Expander
2
2
Figure 3.3 shows the block diagram of the I C expander. The LCMXO3LF-1200E device is used as an I C expander and it
2
supports a single master and multiple slave devices connected to the board. The master I C interface is connected to
2
the Tx header and the slave device I C interface is connected to the Rx connectors supporting any slave device access
from the master based on the slave address.
2 X I2C
Rx Connector 1
Tx
H
e
a
d
e
r
I2C
LCMXO3LF-1200EMG121 (U19)
2 X I2C
Rx Connector 2
LIF-MD6000
CSFBGA81 (U8)
2
Figure 3.3. I C Expander Block
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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4. Power Supply
The power supply to the development kit is provided by the Mini-B USB connector or from an external adaptor.
Figure 4.1 shows the power supply block of the CrossLink LIF-MD6000 Master Link board. The Mini-B USB connector is
used only for programming and the onboard power regulator for the successful programming. The external adaptor
provides 12 V power source through voltage regulators on the board to CrossLink and LCMXO3LF-1300E, as well as to
the external boards connected to Tx and Rx Headers. Each I/O and core voltage rail on the board is accessible by a test
point on the board. The current flowing to each rail can be measured using a 1 Ω resistor placed in the path of each
voltage rail.
U18
J3
12 V
12 V to 5 V
converter
5V
Power adaptor
J2
U15
LDO
1.2 V
U5
5V
LDO
3.3 V
Mini-B USB
U6
LDO
2.5 V
U17
LDO
1.8 V
Figure 4.1. Power Supply Block
Table 4.1 lists the device power rails. There are five voltage regulators on the board used to supply the 5 V, 3.3 V, 2.5V
1.8 V, and 1.2 V rails. The input to these regulators is either from the Mini-B USB connector or the external 12 V
adaptor that is connected to the board. Switch SW2 is used to connect or disconnect the external adaptor power to the
board.
Table 4.1. Power LEDs
Voltage Rail
LEDs
Colour
12
D26
Green
5
D3
Green
3.3
D25
Green
2.5
D29
Green
1.8
D28
Green
1.2
D27
Green
Table 4.2 on the next page lists the board voltage rails, including the rail source voltage, test point number, and current
sense resistor number.
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
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Table 4.2. Device Power Rail Summary and Test Points
Voltage Rail
Source Rail
Current Sense Resistor
Test Points
12 V
12_Ext
—
12V
5V
12 V
—
5V
+3.3 V
5V
—
3V3
+2.5 V
5V
—
2V5
+1.8 V
5V
—
1V8
+1.2 V
5V
—
1V2
VCCCORE
+1.2 V
R19
VCC_CORE
VCCIO0
+3.3 V
R20
VCCIO0
VCCIO1
+3.3 V
R21
VCCIO1
VCCIO2
+3.3 V
R28
VCCIO2
VCC_DPHY
+1.2 V
R417
VCC_DPHY
1K_VCC_CORE
1.2 V
R190
1K_VCC_CORE
1K_VCCIO0
+3.3 V
R410
1K_VCCIO0
1K_VCCIO1
+3.3 V
R184
1K_VCCIO1
1K_VCCIO2
+3.3 V
R186
1K_VCCIO2
1K_VCCIO3
+3.3 V
R188
1K_VCCIO3
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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5. Status Indicators
The LED status indicators on the board show power, configuration, and application status. Table 5.1 lists the status LED
I/O map.
Table 5.1. Status LED I/O Map
Device
LED
Net Name
Colour
CrossLink
D6
CMOS_IO_1
Blue
CrossLink
D7
CMOS_IO_2
Blue
CrossLink
D8
CMOS_IO_3
Blue
CrossLink
D9
CMOS_IO_4
Blue
CrossLink
D10
CDONE
Green
LCMX03LF-1300E
D23
DONE
Red
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
References
For more information, refer to:
DS1055, CrossLink Family Data Sheet
Technical Support Assistance
Submit a technical support case through www.latticesemi.com/techsupport.
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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Appendix A. LIF-MD6000-ML-EVN-BRD Schematics
LIF-MD6000 Master Link Board Block Diagram
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
FTDI Interface
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Power Regulator Interface
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
MIPI Block – MIPI Tx
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Bank 1, 2 – LVDS Rx
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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
BANK0, Flash Interface
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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Evaluation Board User Guide
2
I C Expander
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
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CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Layout Guidelines
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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Appendix B. LIF-MD6000-ML-EVN-BRD Bill of Materials
LIF-MD6000 Master Link Board Bill of Materials
Item
1
2
3
Reference
C1, C3
C2, C4, C5, C6, C8,
C9, C12, C13, C14,
C15, C16, C22, C25,
C68, C112, C180,
C181
C7, C20, C23, C107,
C114, C141, C145,
C150, C153
PCB
PART_
NUMBER
Manufacturer Description
—
ECJ1VB0J475K
Panasonic
C0402
—
C0402C104K4
Kemet
RACTU
10 uF
C0603
—
LMK107BJ106
CAP CECAP CER 10 uF
Taiyo Yuden
MALTD
10 V X5R 20% 0603
Quantity
Part
2
4u7
C0603
17
0.1 uF
9
Footprint
Comments
4
C10, C11
2
18 pF
C0402
—
5
C21, C24, C113
3
22 uF
C0805
—
6
C29, C95, C97
3
0.1 uF
C0402
—
7
C41, C43, C53, C60,
C67, C71
6
1 uF
C0306
8
C42, C44
2
0.01 uF
C0201
9
C42, C44, C51, C176
4
0.001 uF
C0201
10
C45
1
1 uF
C0402
11
C46, C66, C171,
C172, C177
5
470 pF
C0201
12
C46, C66, C171, C172
4
0.1 uF
C0201
13
C49, C98, C179
3
100 nF
C0402
14
C51, C58, C70, C176
4
100 nF
C0201
15
C52
1
6800 pF
C0201
16
C59, C75, C78, C175
4
1.5 nF
C0201
17
C75, C78, C59, C175
4
1.5 nF
C0201
18
C72
1
4700 pF
C0306
19
C73, C74, C76
3
330 pF
C0201
20
C77
1
5600 pF
C0201
C0402C180K3
Kemet
GACTU
LMK212BJ226
Taiyo Yuden
MG-T
CL05A104MP
Samsung
5NNNC
LLR185C70G1
05ME05L
GRM033R61C
—
103KA12D
Piggyback GRM033R71C
Configuration 102KA01D
GRM155R61C
—
105KA12D
GRM033R71C
—
471KA01D
Piggyback GRM033R61C
Configuration 104KE84D
GRM155R61A
—
104KA01D
C0603X5R1C1
—
04K030BC
GRM033R71A
—
682KA01D
GRM033R71A
—
152KA01D
Piggyback GRM033R71A
Configuration 152KA01D
LLL185R71H4
—
72MA01L
GRM033R71H
—
331KA12D
GRM033R71A
—
562KA01D
—
Murata
Murata
Murata
Murata
Murata
Murata
Murata
TDK
Murata
Murata
Murata
Murata
Murata
Murata
Cap Cer
4.7 uF
6.3 V 10% X5R 0603
CAP CERAMIC
0.1 uF
16 V X7R 0402
CAP CER 18 pF 25 V
C0G 0402
CAP CERAMIC
22 uF 10 V X5R 0805
Cap Ceramic 0.1 uF
10 V X5R 20% SMD
0402 85C Paper T/R
CAP CER 1uF 4 V X7S
0306
CAP CER 10000 pF
16 V X5R 0201
CAP CER 1000 pF 16 V
X7R 0201
CAP CER
1 uF 16 V X5R 0402
CAP CER
470 pF 16 V X7R 0201
CAP CER 0.1 uF
16 V X5R 0201
CAP CER 100 nF
10 V 10% X5R 0402
CAP CER
0.1 uF 16 V X5R 0201
CAP CER 6800 pF 10 V
X7R 0201
CAP CER 1500 pF 10 V
X7R 0201
CAP CER 1500 pF 10 V
X7R 0201
CAP CER 4700 pF 50 V
X7R 0306
CAP CER
330 pF 50 V X7R 0201
CAP CER 5600 pF 10 V
X7R 0201
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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LIF-MD6000 Master Link Board Bill of Materials (Continued)
PCB
PART_
NUMBER
Manufacturer
Description
—
CL10X106MP
8NRNC
Samsung
CAP CER
10 uF 10 V 20% X6S
0603
C0201
-—
C0603X5R1C1
TDK
04K030BC
0.01 uF
C0201
—
Item
Reference
Quantity
21
C94, C96
2
10 uF
C0603
11
0.1 uF
5
22
23
C102, C104, C105,
C139, C142, C143,
C144, C147, C148,
C151, C152
C103, C140, C146,
C149, C154
Part
Footprint
Comments
CC0201KRX7R
Yageo
7BB103
C0402C105K9
Kemet
PACTU
24
C106
1
1 uF
C0402
—
25
C115, C130
2
10 uF
C0603
—
CL10A106MA
8NRNC
26
C123
1
0.1 uF
C0603
—
GRM188R71E
Murata
104KA01D
27
C127
1
680 pF
C0603
—
C0603C681J3
GACTU
28
C128
1
0.47 uF
C0402
—
CL05A474KA5
Samsung
NNNC
29
C129
1
47 uF
C0805
—
C2012X5R1A4
TDK
76M125AC
30
C155, C156, C157,
C158, C159, C160,
C161, C162, C163,
C164, C165, C166,
C167, C168, C169,
C170
16
0.1 uF
C0402
—
04023C104KA
AVX
T2A
31
C173
1
2200 pF
C0201
—
32
C174
1
1000 pF
C0201
—
33
C178
1
0.1 uF
C0201
—
34
D1, D14
2
SL44-E3/
57T
SL44E357T
—
6
Green
led_0603
—
8
blue
led_0603
—
LTSTC193TBKT-5A
35
36
D3, D25, D26, D27,
D28, D29
D6, D7, D8, D9,
D30, D31, D32,
D33
Samsung
Kemet
GRM033R71E
Murata
222KA12D
GRM033R61E
Murata
102KA01D
GRM033R61C
Murata
104KE84D
Vishay
SL44-E3/57T semiconducto
r
LTSTLITE-On INC
C190KGKT
LITE-On INC
37
D10
1
Green
led_0603
—
LG L29K-G2J1OSRAM
24-Z
38
D12
1
0.3 VF
MBRA340T
3G
—
MBRA340T3G ON Semi
39
D23
1
Red
led_0603
—
LTSTLITE-On INC
C193KRKT-5A
CAP CER
0.1 uF 16 V 10% X5R
0201
CAP CER 10000 pF
16 V 10% X7R 0201
CAP CERAMIC
1 uF 6.3 V X5R 0402
CAP CER
10 uF 25 V 20% X5R
0603
CAP CER
0.1 uF 25 V 10% X7R
0603
CAP CER
680 pF 25 V 5% NP0
0603
CAP CER 0.47 uF 25 V
10% X5R 0402
CAP CER
47 uF 10 V 20% X5R
0805
CAP CER
0.1 uF 25 V 10% X7R
0402
CAP CER 2200 pF 25 V
X7R 0201
CAP CER 1000 pF 25 V
X5R 0201
CAP CER
0.1 uF 16 V X5R 0201
Schottky Diodes &
Rectifiers 4.0 A 40 V
LED SUPER GREEN
CLEAR 0603 SMD
Standard LEDs - SMD
Blue 470 nm 28mcd
5 mA
LED SUPER GREEN
CLEAR 0603 SMD
DIODE SCHOTTKY 40 V
3 A SMA
Standard LEDs - SMD
Red 631 nm 14mcd
5 mA
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
22
EB105-1.0
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
Reference
Quantity
Part
40
VCC_DPHY1,
VCC_CORE1,
VCCIO1, GND1,
VCCIO2, GND2,
GND3, GND4,
GND5, 1K_VCCIO0,
1K_VCC_CORE1,
1K_VCCIO1, 1V2,
1K_VCCIO2,
1K_VCCIO3, TP18,
TP23, TP24, TP25,
2V5, 3V3, 5V0,
12V0, VCCIO0
24
TP_S_40_
63
41
J1
1
42
J2
43
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer Description
DNI
—
—
Square test point,
40 mil inner
diameter,
63 mil outer
diameter
hdr_amp_
header_1x
87220_8_
8
1x8_100
—
22-28-4081
Molex
CONN HEADER
8POS .100 VERT TIN
1
SKT_MINI skt_miniu
USB_B_RA sb_b_ra
—
5075BMR-05Neltron
SM-CR
J3
1
PJ-032A
PJ-032A
—
PJ-032A
CUI Inc.
44
J4, J22
2
733910060
733910060
—
73391-0060
Molex
45
J7, J19, J20
3
CON2
CON2
REGULAR
100 MIL
HEADER
—
—
General 100 mils
2 Position header
46
J8, J9
2
2 Position
Terminal
Block_0
TERM_BL
OCK_2POS
_10A
1727010
Phoenix
Contact
TERM BLOCK 2POS
3.81 mm PCB GRN
47
J18
1
HEADER
5X2
HEADER
2X5
—
—
General 100 Mils
2*5 header
48
J23
1
4 HEADER
CON4
—
—
General 100 Mils
4 Position Header
49
J24, J25, J26, J27
4
Tri-Con
TriCon
—
—
General 100 Mils
Header
50
J28
1
CON6
HDR1X6
—
—
—
51
J29
1
CON3
HDR1X3
—
—
—
52
L1, L2, L3, L4, L5, L6,
L7
7
600 Ω
500 mA
FB0603
—
BLM18AG601
Murata
SN1D
53
L8
1
4.7 uH
MPLC0730
L4R7
—
MPLC0730L4R
Kemet
7
Ferrite Bead 600 Ω
@100 MHz 500 mA
0603
INDUCTOR POWER
4.7 uH 20% SMD
54
MH1, MH2, MH3,
MH4, MH5, MH6,
MH7, MH8, MH9,
MH10
10
Thru Hole
MTG125
—
—
tp_s_
40_63
—
REGULAR
100 MIL
HEADER
REGULAR
100 MIL
HEADER
REGULAR
100 MIL
HEADER
REGULAR
100 MIL
HEADER
REGULAR
100 MIL
HEADER
DNL
—
CONN MINI USB
RCPT RA TYPE B SMD
CON PWR JCK
2.0 X 6.5 M VERT
CONN SMA JACK STR
50 OHM PCB
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
23
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item
55
56
57
Reference
Q9, Q10, Q11
R1, R2, R3, R56,
R131, R175, R176,
R177, R178, R403,
R404, R405, R440,
R445, R477, R478,
R479, R480, R483,
R484
R4, R5, R6, R7, R15,
R16, R26, R37, R39,
R51, R52, R53, R90,
R159, R165, R167,
R180, R181, R183,
R192, R431, R433,
R447
Quantity
Part
PCB
Footprint
Comments
PART_
NUMBER
Manufacturer
3
MMBT222 SM_SOT2
2A
3-3
—
MMBT2222A NXP
TRANS NPN 40 V 0.6
,215
Semiconductor A SOT23
20
4.7K
R0603
—
CRCW06034
Vishay
K70FKEA
RES SMD
4.7 kΩ HM 1% 1/10
W 0603
23
0
R0603
—
RC0603JR070RL
Res 1/10 W 0.0 Ω 5%
0603
Yageo
58
R9, R10
2
2K2
R0603
—
CRCW06032
Vishay
K20FKEA
59
R11, R17
2
12K
R0603
—
RC0603FR0712KL
60
R12, R13, R14,
R123, R124, R125
6
10K
R0603
—
RMCF0603JT Stackpole
10K0
Electronics Inc
5
0
R0603
DNI
16
1
R0603
—
61
62
R18, R418, R419,
R422, R423
R19, R20, R21, R25,
R28, R33, R184,
R186, R188, R190,
R410, R417, R434,
R435, R448, R449
Description
63
R22, R144
2
100E
R0603
DNI
64
R23
1
0
R0603
DNI
65
R24, R185, R187,
R189, R411
5
1
R0603
DNI
66
R36, R233
2
1K
R0603
—
67
R54, R55, R57, R59
4
680R
R0402
DNI
68
R60, R61, R446,
R457, R458, R459,
R460, R461, R462,
R463, R464, R467,
R468, R469, R470,
R471, R472, R473,
R474, R475, R476
21
0
R0402
—
RC0603JR070RL
Yageo
Yageo
RES SMD
2.2 kΩ 1% 1/10 W
0603
RES SMD
12 kΩ 1% 1/10 W
0603
RES SMD
10 kΩ 5%
1/10 W 0603
Res 1/10 W 0.0 Ω 5%
0603
CRCW06031
Vishay/Dale
R00JNEAHP
RES SMD
1 Ω 5% 1/4W 0603
CRCW06031
Vishay / Dale
00RFKEAHP
RC0603JRYageo
070RL
CRCW06031
Vishay/Dale
R00JNEAHP
RES SMD 100 Ω 1%
1/4W 0603
Res 1/10 W 0.0 Ω 5%
0603
RES SMD
1 Ω 5% 1/4W 0603
RES SMD
1 kΩ 1% 1/10 W
0603
RES 680 Ω 1/16 W
5% 0402
RC0603FR071KL
Yageo
RMCF0402JT Stackpole
680R
Electronics Inc
RC0402JR070RL
Yageo
RES SMD 0.0O HM
JUMPER 1/16 W
0402
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
24
EB105-1.0
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Quantity Part
PCB
Reference
69
R76, R77
2
2K
R0402
—
ERJ2RKF2001X
70
R78
1
10K
R0402
—
RMCF0402JT1
0K0
71
R80, R436, R437,
R438, R439
5
680R
R0402
—
RMCF0402JT6
80R
72
R83
1
30E
R0603
—
RC0603FR0730RL
Yageo
RES SMD
30 Ω 1% 1/10 W
0603
73
R106, R107, R108,
R110, R111, R113,
R114, R117, R119,
R121
10
100
R0402
DNI
RC0402FR07100RL
Yageo
RES SMD 100 Ω
1% 1/16 W 0402
74
R160, R432
2
100K
R0402
—
RMCF0402JT1
00K
75
R166, R441, R442,
R443, R444
5
1K
R0402
—
RMCF0402JT1
K00
76
R179
1
650
R0603
—
77
R229
1
15K
R0402
—
78
R230
1
34K
R0402
—
79
R231
1
536K
R0402
—
ERJ2RKF5363X
80
R232
1
100K
R0402
—
ERJ2RKF1003X
81
R395, R399, R400
3
10K
R0603
—
ERJ3EKF1002V
Panasonic
RES SMD
10 kΩ 1% 1/10 W
0603
82
R412, R413, R414,
R415, R416, R420,
R421, R424, R425,
R451, R452, R453,
R454, R455, R456,
R465, R466
17
0
R0603
—
RC0603JR070RL
Yageo
Res 1/10 W 0.0 Ω 5%
0603
83
R450
1
0
R0402
DNI
RC0402JR070RL
Yageo
84
R481, R482
2
0
R0603
DNL
RC0603JR070RL
Yageo
85
SW1
1
PWR
TS01CQE_
switch
TS01CQE
C&K
Components
Footprint
Comments
PART_
NUMBER
Item
—
RC0603FR07649RL
ERJ2RKF1502X
ERJ2RKF3402X
Manufacturer
Panasonic
Stackpole
Electronics
Inc
Stackpole
Electronics
Inc
Stackpole
Electronics
Inc
Stackpole
Electronics
Inc
Yageo
Panasonic
Panasonic
Panasonic
Electronic
Components
Panasonic
Electronic
Components
Description
RES SMD
2 kΩ 1% 1/10 W
0402
RES 10 kΩ 1/16 W
5% 0402
RES 680 Ω 1/16 W
5% 0402
RES 100 kΩ 1/16 W
5% 0402
RES 1 kΩ 1/16 W 5%
0402
RES SMD 649 Ω 1%
1/10 W 0603
RES 15 kΩ 1/10 W
1% 0402 SMD
RES 34 kΩ 1/10 W
1% 0402 SMD
RES 536 kΩ 1/10 W
1% 0402 SMD
RES 100 kΩ 1/10 W
1% 0402 SMD
RES SMD 0.0O HM
JUMPER 1/16 W
0402
Res 1/10 W 0.0 Ω 5%
0603
SWITCH SLIDE SPDT
3 A 120 V
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
25
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
LIF-MD6000 Master Link Board Bill of Materials (Continued)
Item Reference
Quantity Part
86
SW2, SW3, SW4
3
87
SW5
1
88
U1
1
89
U2
1
90
U3
1
91
U5
1
92
U6
1
93
U7, U9, U11,
U12
4
94
U8
1
95
U14
1
96
U15
1
97
U17
1
98
U18
99
PCB
Footprint
SYS_
RST
WAKE_
UP
2psmd_es
witch
2psmd_es
witch
tqfp64_0p
FT2232HL
5_12p2x1
2p2_h1p6
so8_50_24
93LC56-SO8
4
PART_
NUMBER
Manufacturer
—
TL1015AF160QG
E-Switch
—
TL1015AF160QG
E-Switch
—
FT2232HL
FTDI
USB to UART / FIFO
—
93LC56C-I/SN
Microchip
IC 93LC56 EEPROM
Comments
Description
SWITCH TACTILE SPSTNO 0.05 A 12 V
SWITCH TACTILE SPSTNO 0.05 A 12 V
Surface Mount Fuses
Fuseblock with fuse 4A
OMNI BLOK 154T
NCP1117ST
IC Reg LDO 3.3 V SOTsot223_4p
—
NCP1117ST33T3G On Semi
33T3G
223
NCP1117ST
IC Reg LDO 2.5 V SOTsot223_4p
—
NCP1117ST25T3G On Semi
25T3G
223
Conn Board to Board PL
Hirose HiroseHirose Electric 40 POS
FX12 - 40
—
FX12B-40P-0.4SV
FX12
Co Ltd
0.4 mm Solder ST SMD
Pos
T/R
LIFLIFLattice Semiconductor
Customer LIF-MD6000Lattice
MD6000MD60006K CrossLink FPGA
supplied csfBGA81
Semiconductor
csfBGA81
csfBGA81
Family
IC FLASH
M25PX16M25PX16Micron
SOIC8
—
16 Mbit
VMW6TG
VMW6TG
Technology Inc
75 MHz 8SO
LDO Voltage Regulators
AP7313SOT23
—
AP7313-12SAG-7 Diodes Inc
LDO SOT-23R
12SAG-7
1.2 V/ 150 mA
NCP1117ST
IC Reg LDO 1.8 V SOTsot223_4p
—
NCP1117ST18T3G On Semi
18T3G
223
FUSE
0154004D
RT
—
0154004.DRT
Littlefuse
1
LT3680
LT3680_10
QFN
—
LT3680EDD#PBF
Linear
U19
1
LCMXO3LF- LCMXO3LF
CPLD MachXO3 Family
Customer LCMXO3LF-1200E- Lattice
1200E-1200E121-Pin CSFBGAsupplied MG121
Semiconductor
MG121
MG121
0.5 mm Pitch
100
X1
1
12MHZ
crystal_4p
_3p2x2p5
—
7M-12.000MAAJTXC
T
12 MHz Crystal
101
X3, X4
2
KC3225A27.
27MHZ_O
0000C30E0
SC
A
—
KC3225A27.0000C AVX
30E0A
Corporation
Standard Clock
Oscillators 27.000 MHz
102
LIF-MD6000
MASTER LINK
BOARD PCB
1
—
—
305-PD-16-0154
—
—
PACTRON
5 V Step down
converter
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
26
EB105-1.0
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Appendix C. SMA-IOL-EVN-BRD Schematics
SMA Debug Board
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications
and information herein are subject to change without notice.
EB105-1.0
27
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Appendix D. SMA-IOL-EVN-BRD Bill of Materials
SMA IOLink Board Bill of Materials
Item
Reference
Quantity
Part
PCB
Footprint
tp_s_4
0_63
DNI
Comments
PART_NUMBER
Manufacturer
Description
—
—
Square test point,
40 mil inner
diameter, 63 mil
outer diameter
1
GND1, +5 V, +1.8 V,
+3.3 V, SN, SDA, SCLK,
SCL, RESETN, MOSI,
MISO, GND
12
TP_S_
40_63
2
C1, C4
2
1 uF
C0402
—
C0402C105K
9PACTU
Kemet
CAP CERAMIC
1 uF 6.3 V X5R
0402
3
C2, C5
2
0.1 uF
C0402
—
C0402C104K
4RACTU
Kemet
CAP CERAMIC 0.
1 uF 16 V X7R 0402
4
C3, C6
2
0.01
uF
C0402
—
C0402C103J
4RACTU
Kemet
CAP CERAMIC
10 nF 16 V 5% X7R
0402
5
J1, J2, J3, J4, J5, J6, J7,
J8, J9, J10, J11, J12,
J13, J14
14
73391
-0060
733910060
—
73391-0060
Molex
Molex Straight 50O
Through Hole SMA
Connector, jack,
Solder Termination
6
MH1, MH2
2
Thru
Hole
MTG1
25
—
—
—
—
HiroseFX12S
—
FX12B-40S0.4SV
Hirose
Electric Co
Ltd
Conn Board to
Board PL 40 POS
0.4 mm Solder ST
SMD T/R
—
—
305-PD-150589
PACTRON
—
7
U1
1
Hirose
- FX12
- 40
Pos
8
SMA IOLINK BOARD
PCB
1
—
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
28
EB105-1.0
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Appendix E. B-IOL-EVN-BRD Schematics
100MILS_DEBUG Header
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications
and information herein are subject to change without notice.
EB105-1.0
29
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Appendix F. B-IOL-EVN-BRD Bill of Materials
Breakout IOLink Board Bill of Materials
Item
Part
PCB
Footprint
Manufacturer
Description
—
—
Square test point, 40 mil
inner diameter,
63 mil outer diameter
Quantity
1
GND1, +5 V,
+1.8 V, +3.3 V,
SN, SCLK, MOSI,
MISO, GND
9
2
C1, C5
2
0.1uF
C0402
—
C0402C104
Kemet
K4RACTU
CAP CERAMIC 0.1 uF 16
V X7R 0402
3
C2, C6
2
0.01uF
C0402
—
C0402C103
Kemet
J4RACTU
CAP CERAMIC
10 nF 16 V 5% X7R 0402
4
C3, C4
2
1uF
C0402
—
C0402C105
Kemet
K9PACTU
CAP CERAMIC
1 uF 6.3 V X5R 0402
5
J2
1
HEADER
13X2
13X2_HDR
6
MH1, MH2
2
ThruHole
MTG125
DNL
7
U1
1
Hirose FX12 - 40
Pos
HiroseFX12S
—
Conn Board to Board PL
FX12B-40S- Hirose Electric
40 POS 0.4 mm Solder ST
0.4SV
Co Ltd
SMD T/R
8
BREAKOUT
IOLINK BOARD
PCB
1
—
—
—
305-PD-15PACTRON
0595
TP_S_40_
tp_s_40_63
63
Comments
PART_NUM
BER
Reference
DNL
REGULAR 100
—
MIL HEADER
—
—
—
—
—
—
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
30
EB105-1.0
CrossLink LIF-MD6000 Master Link Board
Evaluation Board User Guide
Revision History
Date
Version
May 2016
1.0
Change Summary
Initial release.
© 2016 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are
trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
EB105-1.0
31
th
th
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