MCP2221 Breakout Module User's Guide

MCP2221
Breakout Module
User’s Guide
 2014 Microchip Technology Inc.
DS50002282A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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Information contained in this publication regarding device
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and may be superseded by updates. It is your responsibility to
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LANCheck, MediaLB, MOST, MOST logo, MPLAB,
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The Embedded Control Solutions Company and mTouch are
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Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
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All other trademarks mentioned herein are property of their
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© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-387-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS50002282A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2014 Microchip Technology Inc.
Object of Declaration: MCP2221 Breakout Module
 2014 Microchip Technology Inc.
DS50002282A-page 3
MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 4
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Recommended Reading........................................................................................ 9
The Microchip Web Site ........................................................................................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 MCP2221 Breakout Module General Description ........................................ 11
1.3 What the MCP2221 Breakout Module Kit Contains ..................................... 11
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 13
2.2 Board Setup ................................................................................................. 13
2.3 Board Operation ........................................................................................... 14
2.4 MCP2221 Typical Usage Scenarios ............................................................. 15
Chapter 3. Software Description
3.1 Introduction ................................................................................................... 17
3.2 I2C™/SMBus Terminal and the MCP2221 .................................................... 17
3.3 Configuring Parameters ............................................................................... 18
3.4 Example for Interfacing with the MCP23008 (8-Bit I/O Expander) ............... 22
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 25
A.2 Board – Schematic ....................................................................................... 26
A.3 Board – Top Silk .......................................................................................... 27
A.4 Board – Top Copper and Silk ....................................................................... 27
A.5 Board – Top Copper .................................................................................... 28
A.6 Board – Bottom Silk ..................................................................................... 28
A.7 Board – Bottom Copper and Silk ................................................................. 29
A.8 Board – Bottom Copper ............................................................................... 29
Appendix B. Bill of Materials
Worldwide Sales and Service .................................................................................... 32
 2014 Microchip Technology Inc.
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MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 6
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP2221 Breakout Module. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP2221 Breakout Module as a development
tool to emulate and debug firmware on a target board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Contains important information about the
MCP2221 Breakout Module
• Chapter 2. “Installation and Operation” – Covers the initial setup of this board,
board operation and typical usage scenarios
• Chapter 3. “Software Description” – Covers the Graphical User Interface (GUI)
• Appendix A. “Schematic and Layouts” – Shows the schematic and board
layouts for the MCP2221 Breakout Module
• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2221
Breakout Module
 2014 Microchip Technology Inc.
DS50002282A-page 7
MCP2221 Breakout Module User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS50002282A-page 8
Examples
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
 2014 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user's guide describes how to use the MCP2221 Breakout Module. Another useful
document is listed below. The following Microchip document is available and
recommended as a supplemental reference resource.
• MCP2221 Data Sheet – “USB 2.0 to I2C/UART Protocol Converter with GPIO”
(DS20005292)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (July 2014)
• Initial Release of this Document.
 2014 Microchip Technology Inc.
DS50002282A-page 9
MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 10
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP2221 Breakout Module and covers the
following topics:
• MCP2221 Breakout Module General Description
• What the MCP2221 Breakout Module Kit Contains
1.2
MCP2221 BREAKOUT MODULE GENERAL DESCRIPTION
The MCP2221 Breakout Module is a development and evaluation platform for the
MCP2221 device. The module is comprised of a single DIP form factor board.
The MCP2221 Breakout Module has the following features:
•
•
•
•
•
•
UART Tx and Rx signals
I2C™/SMBus clock and data lines (SCL and SDA)
Four GP lines, configurable for GPIO, dedicated or alternate function operation
User-selectable (by using a jumper) power supply of 3.3V or 5V (up to 500 mA)
DIP form factor (600 mil spacing between two 7-pin headers)
PICkit™ Serial Analyzer header — used for UART and I2C/SMBus
communication only
The accompanying PC software is used to evaluate/demonstrate the MCP2221 device
as a USB-to-UART/I2C/SMBus protocol converter. It allows I/O control and custom
device configuration.
A DLL package is included to allow development of custom PC applications using the
MCP2221.
1.3
WHAT THE MCP2221 BREAKOUT MODULE KIT CONTAINS
The MCP2221 Breakout Module kit includes:
• MCP2221 Breakout Module (ADM00559)
• USB-to-mini-USB Cable
• Important Information Sheet
 2014 Microchip Technology Inc.
DS50002282A-page 11
MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 12
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
The MCP2221 Breakout Module is designed to demonstrate the device as a
USB-to-UART/I2C/SMBus protocol converter solution.
The package is comprised of a single board and has the following features:
• Small plug-in board with DIP form factor (two 7-pin headers spaced at 600 mil)
• Mini-USB connector
• Access to the UART signals (Tx, Rx), I2C/SMBus (SCL, SDA) and all the GP
signals (GP0 – GP3)
• PICkit Serial Analyzer compatible header
• 3.3 or 5V jumper-selectable VDD; the breakout board can be used to supply up to
500 mA to the rest of the system.
• Jumper-selectable I2C/SMBus on-board pull-up resistors. The user can select
whether or not the on-board pull-up resistors will be connected to the SCL and
SDA lines.
2.2
BOARD SETUP
Follow these steps to install the software and set up the MCP2221 Breakout Module:
1. Download the support material (MCP2221 DLL, MCP2221 Utility, MCP2221
I2C/SMBus Terminal) that can be found on the board’s web page, on the
Microchip web site.
2. Unzip and install the driver package for the MCP2221 device.
3. Plug the board (using a DIP adapter or the PICkit Serial Analyzer header) into
the target system needing UART-to-USB and/or USB-to-I2C/SMBus conversion.
4. Connect the MCP2221 Breakout Module to a USB port on a Windows®-based
PC.
5. Windows will automatically install the driver for this board. Wait for the installation
to complete.
The board is now set up for operation. Optional steps for using the dedicated
application include the following:
1. Unzip and install the PC software.
2. Start a Hyperterminal-like application (or any serial port application) in order to
get access to the COM port.
3. Start the provided I2C/SMBus Terminal tool in order to exercise the I2C/SMBus.
 2014 Microchip Technology Inc.
DS50002282A-page 13
MCP2221 Breakout Module User’s Guide
FIGURE 2-1:
2.3
BREAKOUT MODULE LAYOUT
BOARD OPERATION
The MCP2221 will be detected by a Windows-based PC host as a composite device.
The accompanying software can be used to exercise the board’s features and also
provides a reference point for users who want to design their own applications based
on the MCP2221 device.
2.3.1
MCP2221 Breakout Module Operation
The MCP2221 Breakout Module can be used together with UART-based and/or
I2C/SMBus systems. The breakout board eases the USB support addition.
The board has the following features:
• UART signals (Tx, Rx)
• Four GP signals that can be configured for:
- GPIO functionality (digital input or output pins; please see the MCP2221 Data
Sheet for the exact GP pin options)
- Dedicated function pins (signal important system states, such as USB
Configured, USB Suspend)
- Alternate function pins (clock output, analog inputs or outputs)
DS50002282A-page 14
 2014 Microchip Technology Inc.
Installation and Operation
• Jumper-selectable power supply: 3.3 or 5V (up to 500 mA)
• PICkit Serial Analyzer header – the board can be directly plugged into systems
that have this type of header. The MCP2221 Breakout Module provides
UART-to-USB and USB-to-I2C/SMBus access.
• DIP form factor (two 7-pin headers spaced at 600 millimeters)
By using the provided software and libraries, the user can create personalized PC
applications, using the breakout board as a USB-to-UART and/or USB-to-I2C/SMBus
protocol converter.
2.4
MCP2221 TYPICAL USAGE SCENARIOS
The MCP2221 can be used in systems where a UART bus is available. The MCP2221
enables the USB connection to a UART-based system.
FIGURE 2-2:
MCP2221 TYPICAL USAGE DIAGRAM – UART-BASED SYSTEM
MCP2221 Breakout Board
MCP2221
Tx
VDD
Rx
GND
GND
Rx
FIGURE 2-3:
UART-Based System
Tx
MCP2221 TYPICAL USAGE DIAGRAM – I2C/SMBUS-BASED SYSTEM
MCP2221 Breakout Board
I22C™/SMBus-Based System
VDD
MCP2221
 2014 Microchip Technology Inc.
I C/SMBus-Based System
GND
GND
SDA
SCL
SDA
SCL
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MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 16
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Chapter 3. Software Description
3.1
INTRODUCTION
The I2C/SMBus functionality of the MCP2221 Breakout Module requires a Microsoft®
Windows® XP/7/8 operating system and a USB port. To run the software, follow the
steps described in this section.
1. Connect the MCP2221 Breakout Module to the PC using the provided USB
cable.
2. To start the I2C®/SMBus Terminal application, select Start > All Programs >
Microchip > MCP2221 I2C/SMBus Terminal. The interface detects the MCP2221
device automatically and is ready for use (see Figure 3-1).
3.2
I2C™/SMBUS TERMINAL AND THE MCP2221
The I2C/SMBus Terminal application is provided as a support tool for the MCP2221. It
allows the user easy I2C/SMBus command manipulation using any MCP2221-based
system.
FIGURE 3-1:
THE I2C/SMBUS TERMINAL USER INTERFACE
Commands Panel
Settings Panel
Operating Status Box
 2014 Microchip Technology Inc.
DS50002282A-page 17
MCP2221 Breakout Module User’s Guide
3.3
CONFIGURING PARAMETERS
As depicted in Figure 3-1, the MCP2221 Breakout Module user interface is divided into
three parts:
• Commands Panel
• Settings Panel
• Operating Status Box
3.3.1
Commands Panel
Figure 3-2 shows a detailed view of the Commands panel.
FIGURE 3-2:
3.3.1.1
COMMANDS PANEL
“ON” CHECK BOX
This check box is used when pressing the Send All button. Data lines that have the
check box enabled will be sent to the slave.
3.3.1.2
“PROTOCOL” FIELD
This field allows selecting between I2C and SMBus.
3.3.1.3
“ADDRESS LENGTH” FIELD
This field allows setting the address length for the slave address to 7 bit or 8 bit.
3.3.1.4
“R/W” FIELD
This field specifies whether the command sent to the slave is a read or a write
operation.
3.3.1.5
“REGISTER INDEX” FIELD
This field is used only for SMBus communication and specifies the register address on
which the operation will take place.
3.3.1.6
“DATA” FIELD
The content of this field varies depending on the Read/Write selection.
For a “Read” operation, the data field will contain a single value, specifying the number
of bytes that will be read from the slave.
For a “Write” operation, the data field will contain the data bytes that will be sent to the
slave. Values should be separated by commas. The following formats are accepted for
hexadecimal representation: 0xFF and FF.
The data field can be left empty for write commands. This can be used to scan the bus
and verify that the slave responds correctly.
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 2014 Microchip Technology Inc.
Software Description
3.3.1.7
“PEC” (PACKET ERROR CHECK) FIELD
This field is used for SMBus only and will enable/disable the error checking for SMBus
packets.
3.3.1.8
“DELAY” FIELD
This field is used to insert the delay period after the message has been sent. To enable
the delay, press the Send All button.
3.3.1.9
“SEND” FIELD
When pressing the Send button on the selected field, the command will be transmitted
from the corresponding line to the slave.
3.3.1.10
BUTTONS
The buttons in the Commands panel and their descriptions are listed in Table 3-1.
TABLE 3-1:
COMMANDS PANEL BUTTONS
Button
Description
Save
This button allows saving all the commands present in the Commands list. The
default file format is .csv but .txt files are also supported.
Import
This button allows importing a previously saved command list. The imported
commands will be added after any existing commands.
Save Log
This button allows saving the contents of the Received/Sent Data field to a .txt file.
Clear Output Window
This button allows erasing the contents of the Received/Sent Data field. This window
can also be cleared by right clicking in the “Received/Sent Data” area and selecting
Clear Output Window.
Send All
This button allows sending all the enabled (“on” checkbox enabled) commands to the
slave. If configured, delays will be inserted between consecutive commands.
3.3.1.11
ADDING AND DELETING COMMAND ROWS
New lines are added automatically at the end of the list when the last line is being
edited.
To manually insert an empty row in a specific location, right click on a command row
and select “Insert Row Above” or “Insert Row Below” from the context menu.
The right click context menu also allows deleting a specific line or the entire commands
table.
FIGURE 3-3:
ADDING AND DELETING COMMAND ROWS
Deleting can also be done by selecting the line and pressing the <Delete> key on the
keyboard.
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DS50002282A-page 19
MCP2221 Breakout Module User’s Guide
FIGURE 3-4:
COMMAND SELECTION
Select all lines
Select one line
Command lines can be rearranged by left clicking on a line, then dragging and dropping
it into the desired location.
3.3.2
Settings Panel
Figure 3-5 shows a detailed view of the Settings panel.
FIGURE 3-5:
SETTINGS PANEL
Settings
Advanced Settings
3.3.2.1
SELECT DEVICE
This drop-down menu contains a list of the connected MCP2221 devices. The selected
device will be used when the Send/Send All buttons are pressed, as well as for the
Bus Scan option. The device list is automatically refreshed.
3.3.2.2
SPEED OPTION
This option is used to set the communication speed to values ranging from 100 kbps to
400 kbps. Custom speeds can be used by typing in the desired value.
3.3.2.3
DATA FORMAT OPTIONS
These options allow selecting between using hexadecimal or decimal formatting for the
input fields. This selection applies to the “Address”, “Register Index” and “Data” fields
in the Commands panel and to the “Start Address” and “End Address” fields under the
Bus Scan option. When switching between the two radixes, the values from the
affected fields will be automatically converted.
DS50002282A-page 20
 2014 Microchip Technology Inc.
Software Description
To display the Advanced Settings panel, press the Advanced Settings button. The
options in the Advanced Settings panel are described below.
3.3.2.4
CUSTOM DEVICE OPTIONS
The terminal can be used with MCP2221 devices which have been configured with
different VID and PID values. To connect to a custom device, provide the VID and PID
values and press the Apply button so the new settings take effect. The status message
in the bottom left corner of the screen should update with a message on the number of
devices which were found.
3.3.2.5
BUS SCAN OPTION
The scan options can be used to detect what slaves are connected to the system. After
pressing the Start Scan button, the MCP2221 will go through the address range
provided in the “Start Address” and “End Address” fields and report the addresses
which have sent back acknowledgments. The format of the address used for the scan
is selectable between 7 and 8 bits in length.
3.3.3
Operating Status Box
This box provides the user with the results of the communication and the operating
status. Examples of status messages are shown in Figure 3-6.
FIGURE 3-6:
OPERATING STATUS BOX
The “Received/Sent Data” field in the operating status box contains the communication
results. The application status message is shown in the bottom left corner of the
operating status box.
 2014 Microchip Technology Inc.
DS50002282A-page 21
MCP2221 Breakout Module User’s Guide
3.4
EXAMPLE FOR INTERFACING WITH THE MCP23008 (8-BIT I/O EXPANDER)
1. If multiple MCP2221 devices are connected, choose the one to be used from the
Select Device drop-down menu. Also, select the desired communication speed
from the Speed list, as shown in Figure 3-7.
FIGURE 3-7:
DEVICE SETTINGS
2. With A0, A1, A2 pins on the board tied to a 0 logic level, select the protocol,
address length, slave address and whether the operation is a read or a write
(Figure 3-8). Set the slave address to 40. These settings need to be made for
every new command.
FIGURE 3-8:
COMMAND SETTINGS
3. For the Write sequence, first configure the pins as outputs. The IODIR register
has a 0h address, so writing 0h to this register will set all the port pins as outputs.
To set all the pins high, write FF(hex) to the OLAT register (address 0A(hex)), as
shown in Figure 3-9. The first data byte represents the register address, while the
second data byte represents the value that will be written.
The commands can be sent individually, by pressing the Send button, or
consecutively, by pressing the Send All button.
Verify whether the settings have been applied by reading back the port value
from the GPIO register (address 09(hex)). Send a write command to specify the
register address. Then, send a read command specifying the number of bytes
that will be read.
FIGURE 3-9:
DS50002282A-page 22
WRITE SEQUENCE
 2014 Microchip Technology Inc.
Software Description
4. The command sequence in Figure 3-10 sets the address for the GPIO register
and reads one byte of data from the slave, obtaining the value from the register.
FIGURE 3-10:
READ SEQUENCE
5. The results of the four commands sent in steps 3 and 4 are shown in Figure 3-11.
FIGURE 3-11:
 2014 Microchip Technology Inc.
WRITE AND READ COMMAND OUTPUT
DS50002282A-page 23
MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 24
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2221
Breakout Module:
•
•
•
•
•
•
•
Board – Schematic
Board – Top Silk
Board – Top Copper and Silk
Board – Top Copper
Board – Bottom Silk
Board – Bottom Copper and Silk
Board – Bottom Copper
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DS50002282A-page 25
MCP2221 Breakout Module User’s Guide
A.2
BOARD – SCHEMATIC
U2
5V
C2
4.7uF
10V
0805
0.1uF
16V
0603
GND
VOUT
GND
3
2
C1
VIN
3.3V
5V
1 2 3
C3
J4
4.7uF
10V
0805
GND
VBUS
DD+
ID
GND
0
GND
HDR-2.54 Male 1x3
USB MINI-B Female
JP1
GND
J5
1
2
3
4
5
USB_N
USB_P
MCP1825S/3.3V
1
GND
5V
VDD
VUSB
Shunt 2.54mm 1x2 Handle
VDD
C5
5
DNP
GP0
GP1
RESET
RX
TX
GP2
4
1
2
3
4
5
6
7
HDR-2.54 Male 1x7
VDD
GP0
GP1
RST
UART RX
UART TX
GP2
3
VSS
D+
DVUSB
SCL
SDA
GP3
14
13
12
11
10
9
8
GND
USB_P
USB_N
VUSB
SCL
SDA
GP3
C4
0.47uF
6.3V
0603
5V
SCL
SDA
GP3
DNP
HDR-2.54 Male 1x7
MCP2221
GND
JP3
J3
PK Serial
RX
SCL
SDA
GND
VDD
TX
GND
2
J2
U1
VDD
GP0
GP1
RESET
RX
TX
GP2
1
VDD
6
6
1
J1
GND
5
10k
0603
5%
7
3
2
4
VDD
R1
7
0.1uF
16V
0603
6
5
4
3
2
1
2
RX
SCL
SDA
J6
2
GND
TX
VDD
J7
JP2
1
1
R3
2.2k
R2
2.2k
0603
5%
0603
5%
VDD
HDR-2.54 Female 1x6
DS50002282A-page 26
 2014 Microchip Technology Inc.
Schematic and Layouts
A.3
BOARD – TOP SILK
A.4
BOARD – TOP COPPER AND SILK
 2014 Microchip Technology Inc.
DS50002282A-page 27
MCP2221 Breakout Module User’s Guide
A.5
BOARD – TOP COPPER
A.6
BOARD – BOTTOM SILK
DS50002282A-page 28
 2014 Microchip Technology Inc.
Schematic and Layouts
A.7
BOARD – BOTTOM COPPER AND SILK
A.8
BOARD – BOTTOM COPPER
 2014 Microchip Technology Inc.
DS50002282A-page 29
MCP2221 Breakout Module User’s Guide
NOTES:
DS50002282A-page 30
 2014 Microchip Technology Inc.
MCP2221 BREAKOUT MODULE
USER’S GUIDE
Appendix B. Bill of Materials
TABLE B-1:
BILL OF MATERIALS
Qty Reference
Description
Manufacturer
Part Number
2
C1, C3
Cap. cer. 4.7 µF 10V 10% X5R SMD 0805
Taiyo Yuden Co.,
Ltd.
LMK212BJ475KD-T
2
C2, C5
Cap. cer. 0.1 µF 16V 10% X7R SMD 0603
NIC Components
Corp.
NMC0603X7R104K16TRPF
1
C4
Cap. cer. 0.47 µF 6.3V 10% X5R SMD 0603
Murata Electronics®
GRM188R60J474KA01D
1
J3
Conn. hdr - 2.54 female 1x6 Gold TH R/A
Sullins Connector
Solutions
PPPC061LGBN-RC
1
J4
Conn. hdr - 2.54 male 1x3 Gold 5.84MH TH
vert.
FCI
68000-103HLF
1
J5
Conn. USB Mini-B female SMD R/A
Hirose Electric Co.,
Ltd.
UX60SC-MB-5ST(80)
2
J6, J7
Conn. hdr - 2.54 male 1x2 gold 5.84MH TH
vert.
FCI
68001-202HLF
3
JP1 – JP3 Mech. HW Jumper 2.54 mm 1x2 handle gold
TE Connectivity, Ltd. 881545-2
PCB
Printed Circuit Board – MCP2221 Breakout
Module
—
104-00559
1
R1
Resistor TKF 10 k 5% 1/10W SMD 0603
Panasonic® - ECG
ERJ-3GEYJ103V
2
R2, R3
Resistor TKF 2.2 k 5% 1/10W SMD 0603
NIC Components
Corp.
NRO6J222TRF
1
U1
USB-to-I2C and UART Bridge TSSOP-14
Microchip
Technology Inc,
MCP2221-I/ST
1
U2
Analog LDO 3.3V MCP1825ST-3302E/DB
SOT-223-3
Note 1:
MicrochipTechnology MCP1825S-3302E/DB
Inc.
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
 2014 Microchip Technology Inc.
DS50002282A-page 31
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS50002282A-page 32
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
 2014 Microchip Technology Inc.