Data Sheet

Freescale Semiconductor
Technical Data
MC33910G5AC/MC3433910G5AC
Document Number: MC33911
Rev. 10.0, 9/2015
LIN System Basis Chip with DC
Motor Pre-driver
33911
The 33911G5/BAC is a SMARTMOS Serial Peripheral Interface (SPI) controlled
System Basis Chip (SBC), combining many frequently used functions in an MCU
based system, plus a Local Interconnect Network (LIN) transceiver. The 33911
has a 5.0 V, 50 mA/60 mA low dropout regulator with full protection and reporting
features. The device provides full SPI readable diagnostics and a selectable
timing watchdog for detecting errant operation. The LIN Protocol Specification
2.0 and 2.1 compliant LIN transceiver has waveshaping circuitry which can be
disabled for higher data rates.
One 50 mA/60 mA high-side switch and two 150 mA/160 mA low-side switches
with output protection are available. All outputs can be pulse-width modulated
(PWM). Two high-voltage inputs are available for use in contact monitoring, or
as external wake-up inputs. These inputs can be used as high-voltage Analog
Inputs. The voltage on these pins is divided by a selectable ratio and available
via an analog multiplexer.
The 33911 has three main operating modes: Normal (all functions available),
Sleep (VDD off, wake-up via LIN, wake-up inputs (L1, L2), cyclic sense, and
forced wake-up), and Stop (VDD on with limited current capability, wake-up via
CS, LIN bus, wake-up inputs, cyclic sense, forced wake-up, and external reset).
The 33911 is compatible with LIN Protocol Specification 2.0, 2.1, and
SAEJ2602-2.
Features
• Full-duplex SPI interface at frequencies up to 4.0 MHz
• LIN transceiver capable of up to 100 kbps with wave shaping
• One 50 mA/60 mA high-side and two 150 mA/60 mA low-side protected
switches
• Two high-voltage analog/logic Inputs
• Configurable window watchdog
• 5.0 V low drop regulator with fault detection and low-voltage reset (LVR)
circuitry
SYSTEM BASIS CHIP WITH LIN
AC SUFFIX (Pb-FREE)
98ASH70029A
32-PIN LQFP
Applications
• Window lift
• Mirror switch
• Door lock
• Sunroof
• Light control
33911
VBAT
VSENSE
HS1
VS1
VS2
LIN INTERFACE
L1
L2
LIN
VDD
PWMIN
ADOUT0
LS1
M
MOSI
MISO
SCLK
CS
RXD
TXD
IRQ
RST
LS2
WDCONF
LGND
PGND
AGND
MCU
Figure 1. 33911 Simplified Application Diagram
© Freescale Semiconductor, Inc., 2009 - 2015. All rights reserved.
1
Orderable Parts
The 33911G5 data sheet is within MC33911G5 Product Specifications - page 3 to page 52.
The 33911BAC data sheet is within MC33911BAC Product Specifications - page 53 to page 100.
Table 1. Orderable Part Variations
Device
Temperature
MC33911G5AC/R2
- 40 to 125°C
MC34911G5AC/R2
- 40 to 85°C
MC33911BAC/R2
- 40 to 125°C
MC34911BAC/R2
- 40 to 85°C
Package
Generation
2.5
32-LQFP
2.0
• Increase ESD GUN IEC61000-4-2 (gun test contact with 150 pF, 330 Ω
test conditions) performance to achieve ±6.0 kV min on the LIN pin.
• Immunity against ISO7637 pulse 3b
• Reduce EMC emission level on LIN
• Improve EMC immunity against RF – target new specification including 3
x 68 pF
• Comply with J2602 conformance test
Initial release
33911
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Analog Integrated Circuit Device Data
Freescale Semiconductor
2
MC33911G5 Product Specifications - page 3 to page 52
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
3
Internal Block Diagram
VS2
INTERRUPT CONTROL
MODULE
LVI, HVI,
ALL OT (VDD,HS,LS,LIN,SD)
RESET CONTROL
MODULE
LVR, WD, EXT ΜC
VS1
INTERNAL BUS
RST IRQ
VDD
AGND
VOLTAGE REGULATOR
LS1
LOW-SIDE
CONTROL
MODULE
WINDOW
WATCHDOG
MODULE
LS2
PWMIN
PGND
VS2
MISO
SCLK
HS1
SPI
&
CONTROL
ANALOG MULTIPLEXER
MOSI
HIGH-SIDE
CONTROL
MODULE
CS
ADOUT0
WAKE-UP MODULE
VBAT
SENSE MODULE
CHIP TEMPERATURE
SENSE MODULE
ANALOG INPUT
MODULE
DIGITAL INPUT MODULE
RXD
TXD
VSENSE
L1
L2
LIN PHYSICAL
LAYER
LIN
LGND
WDCONF
Figure 2. 33911G5 Simplified Internal Block Diagram
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Analog Integrated Circuit Device Data
Freescale Semiconductor
VDD
NC*
VSENSE
NC*
VS1
VS2
HS1
30
29
28
27
26
25
Pinout Diagram
31
4.1
AGND
Pin Connections
32
4
RXD
1
24
NC*
TXD
2
23
L1
MISO
3
22
L2
MOSI
4
21
NC*
SCLK
5
20
NC*
CS
6
19
LS1
ADOUT0
7
18
PGND
PWMIN
8
17
LS2
11
12
13
14
15
16
NC*
WDCONF
LIN
LGND
NC*
NC*
RST
10
9
IRQ
* See Recommendation in Table below
Figure 3. 33911 Pin Connections
4.2
Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 23.
Table 2. 33911 Pin Definitions
Pin
Pin Name
Formal Name
1
RXD
Receiver Output
This pin is the receiver output of the LIN interface which reports the state of the bus
voltage to the MCU interface.
2
TXD
Transmitter Input
This pin is the transmitter input of the LIN interface which controls the state of the bus
output.
3
MISO
SPI Output
4
MOSI
SPI Input
SPI (Serial Peripheral Interface) data input.
5
SCLK
SPI Clock
SPI (Serial Peripheral Interface) clock Input.
6
CS
SPI Chip Select
7
ADOUT0
Analog Output Pin 0
8
PWMIN
PWM Input
Definition
SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the highimpedance state.
SPI (Serial Peripheral Interface) chip select input pin. CS is active low.
Analog multiplexer output.
High-side and low-side pulse width modulation input.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
Table 2. 33911 Pin Definitions
Pin
Pin Name
Formal Name
Definition
9
RST
Internal Reset I/O
Bidirectional Reset I/O pin - driven low when any internal reset source is asserted. RST
is active low.
10
IRQ
Internal Interrupt
Output
Interrupt output pin, indicating wake-up events from Stop mode or events from Normal
and Normal request modes. IRQ is active low.
11 & 30
NC
Not Connected
12
WDCONF
Watchdog
Configuration Pin
This pin must not be connected.
This input pin is for configuration of the watchdog period and allows the disabling of the
watchdog.
13
LIN
LIN Bus
14
LGND
LIN Ground Pin
This pin represents the single-wire bus transmitter and receiver.
This pin is the device LIN ground connection. It is internally connected to the PGND pin.
15,16, 20, and
21
NC
Not Connected
This pin must not be connected or connected to ground.
17
19
LS2
LS1
Low-side Outputs
Relay drivers low-side outputs.
18
PGND
Power Ground Pin
This pin is the device low-side ground connection. It is internally connected to the LGND
pin.
22
23
L2
L1
Wake-up Inputs
These pins are the wake-up capable digital inputs (1). In addition, all Lx inputs can be
sensed analog via the analog multiplexer.
24
NC
Not Connected
This pin must not be connected or connected to VS2.
25
HS1
High-side Output
High-side switch output.
26
27
VS2
VS1
Power Supply Pin
These pins are device battery level power supply pins. VS2 is supplying the HS1 driver
while VS1 supplies the remaining blocks.(2)
28
NC
Not Connected
29
VSENSE
Voltage Sense Pin
Battery voltage sense input. (3)
31
VDD
Voltage Regulator
Output
+5.0 V main voltage regulator output pin. (4)
32
AGND
Analog Ground Pin
This pin is the device analog ground connection.
This pin can be left opening or connected to any potential ground or power supply
Notes
1. When used as digital input, a series 33 kΩ resistor must be used to protect against automotive transients.
2. Reverse battery protection series diodes must be used externally to protect the internal circuitry.
3. This pin can be connected directly to the battery line for voltage measurements. The pin is self protected against reverse battery connections. It
is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
4. External capacitor (2.0 µF < C < 100 µF; 0.1 Ω < ESR < 10 Ω) required.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
Electrical Characteristics
5.1
Maximum Ratings
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
Ratings
Value
Unit
Supply Voltage at VS1 and VS2
• Normal Operation (DC)
• Transient Conditions (load dump)
-0.3 to 27
-0.3 to 40
V
VDD
Supply Voltage at VDD
-0.3 to 5.5
V
VIN
Input / Output Pins Voltage
• CS, RST, SCLK, PWMIN, ADOUT0, MOSI, MISO, TXD, RXD
• Interrupt Pin (IRQ)
-0.3 to VDD +0.3
-0.3 to 11
V
VHS
HS1 Pin Voltage (DC)
- 0.3 to VSUP +0.3
V
VLS
LS1 and LS2 Pin Voltage (DC)
-0.3 to 45
V
L1 and L2 Pin Voltage
• Normal Operation with a series 33 kΩ resistor (DC)
• Transient input voltage with external component (according to ISO7637-2)
(See Figure 5, page 19)
-18 to 40
±100
V
VVSENSE
VSENSE Pin Voltage (DC)
-27 to 40
V
VBUSDC
VBUSTR
LIN Pin Voltage
• Normal Operation (DC)
• Transient input voltage with external component (according to ISO7637-2)
(See Figure 5, page 19)
-18 to 40
-150 to 100
V
Internally Limited
A
Notes
Electrical Ratings
VSUP(SS)
VSUP(PK)
VIN(IRQ)
VLxDC
VLxTR
IVDD
VDD Output Current
(5)
(6)
Notes
5. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device.
6. Extended voltage range for programming purpose only.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
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Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
VESD1-1
VESD1-2
VESD1-3
VESD2-1
Ratings
ESD Capability
• AECQ100
• Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω)
• LIN Pin
• L1 and L2
• all other Pins
• Charge Device Model - JESD22/C101 (CZAP = 4.0 pF)
VESD2-2
• Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
• All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
• According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (CZAP = 150 pF, RZAP = 330 Ω)
VESD3-1
• Contact Discharge, Unpowered
• LIN pin with 220 pF
• LIN pin without capacitor
• VS1/VS2 (100 nF to ground)
• Lx inputs (33 kΩ serial resistor)
VESD3-2
VESD3-3
VESD3-4
Value
Unit
Notes
± 8.0k
± 6.0k
±2000
± 750
± 500
± 20 k
± 11 k
>± 12 k
±6000
V
• According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω)
VESD4-1
VESD4-2
VESD4-3
• Unpowered
• LIN pin with 220 pF and without capacitor
• VS1/VS2 (100 nF to ground)
• Lx inputs (33 kΩ serial resistor)
± 8000
± 8000
± 8000
Thermal Ratings
TA
Operating Ambient Temperature
• 33911
• 34911
-40 to 125
-40 to 85
°C
TJ
Operating Junction Temperature
-40 to 150
°C
TSTG
Storage Temperature
-55 to 150
°C
RθJA
Thermal Resistance, Junction to Ambient
Natural Convection, Single Layer board (1s)
Natural Convection, Four Layer board (2s2p)
85
56
°C/W
Thermal Resistance, Junction to Case
23
°C/W
(10)
Note 12
°C
(11), (12)
RθJC
TPPRT
Peak Package Reflow Temperature During Reflow
(7)
(7), (8)
(7), (9)
Notes
7.
8.
9.
10.
11.
12.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to
view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33911
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5.2
Static Electrical Characteristics
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
5.5
–
18
V
Notes
Supply Voltage Range (VS1, VS2)
VSUP
Nominal Operating Voltage
VSUPOP
Functional Operating Voltage
–
–
27
V
VSUPLD
Load Dump
–
–
40
V
–
4.5
10
mA
(14)
–
–
–
47
62
180
80
90
400
µA
(14), (15),
(16), (17)
–
–
–
27
33
160
35
48
300
µA
(14), (16)
–
10
–
µA
(18)
1.5
–
3.0
0.9
3.9
–
V
(18), (19)
VSUP Undervoltage Detection (VSUV Flag) (Normal and Normal
Request Modes, Interrupt Generated)
• Threshold (measured on VS1)
• Hysteresis (measured on VS1)
5.55
–
6.0
0.2
6.6
–
VSUP Overvoltage Detection (VSOV Flag) (Normal and Normal
Request Modes, Interrupt Generated)
• Threshold (measured on VS1)
• Hysteresis (measured on VS1)
18
–
19.25
1.0
20.5
–
(13)
Supply Current Range (VSUP = 13.5 V)
IRUN
ISTOP
Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State
Stop Mode, VDD ON with IOUT = 100 µA, LIN Recessive State
• 5.5 V < VSUP < 12 V
• VSUP = 13.5 V
• 13.5 V < VSUP < 18 V
ISLEEP
ICYCLIC
Sleep Mode, VDD OFF, LIN Recessive State
• 5.5 V < VSUP < 12 V
• VSUP = 13.5 V
• 13.5 V ≤ VSUP < 18 V
Cyclic Sense Supply Current Adder
Supply Under/overvoltage Detections
Power-On Reset (BATFAIL)
VBATFAIL
• Threshold (measured on VS1)
VBATFAIL_HYS
• Hysteresis (measured on VS1)
VSUV
VSUV_HYS
VSOV
VSOV_HYS
V
V
Notes
13. Device is fully functional. All features are operating.
14. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled.
15.
16.
Total IDD current (including loads) below 100 µA.
Stop and Sleep modes current increases if VSUP exceeds 13.5 V.
17.
18.
19.
This parameter is guaranteed after 90 ms.
This parameter is guaranteed by process monitoring but not production tested.
The Flag is set during power up sequence. To clear the flag, a SPI read must be performed.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
(20)
Voltage Regulator
Min.
Typ.
Max.
Unit
4.75
5.00
5.25
V
Notes
(VDD)
VDDRUN
Normal Mode Output Voltage
• 1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V
IVDDRUN
Normal Mode Output Current Limitation
60
110
200
mA
VDDDROP
Dropout Voltage
• IVDD = 50 mA
–
0.1
0.25
V
VDDSTOP
Stop Mode Output Voltage
• IVDD < 5.0 mA
4.75
5.0
5.25
V
IVDDSTOP
Stop Mode Output Current Limitation
6.0
13
36
mA
–
–
–
–
25
25
mV
mV
LRRUN
Line Regulation
• Normal Mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA
LRSTOP
• Stop Mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA
LDRUN
Load Regulation
• Normal Mode, 1.0 mA < IVDD < 50 mA
LDSTOP
• Stop Mode, 0.1 mA < IVDD < 5.0 mA
–
–
–
–
80
50
TPRE
Overtemperature Prewarning (Junction)
• Interrupt generated, VDDOT Bit Set
90
115
140
TPRE_HYS
Overtemperature Prewarning Hysteresis
–
13
150
(21)
°C
(22)
–
°C
(22)
170
190
°C
(22)
–
13
–
°C
(22)
VDD Low-voltage Reset Threshold
4.3
4.5
4.7
V
VOL
Low-state Output Voltage
• IOUT = 1.5 mA; 3.5 V ≤ VSUP ≤ 27 V
0.0
–
0.9
V
IOH
High-state Output Current (0 V < VOUT < 3.5 V)
-150
-250
-350
µA
IPD_MAX
Pull-down Current Limitation (internally limited)
VOUT = VDD
1.5
–
8.0
mA
VIL
Low-state Input Voltage
-0.3
–
0.3 x VDD
V
VIH
High-state Input Voltage
0.7 x VDD
–
VDD +0.3
V
TSD
TSD_HYS
Overtemperature Shutdown Temperature (Junction)
Overtemperature Shutdown Hysteresis
RST Input/output Pin (RST)
VRSTTH
Notes
20. Specification with external capacitor 2.0 µF < C < 100 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
21. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V).
22. This parameter is guaranteed by process monitoring but not production tested.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
MISO SPI Output Pin (MISO)
VOL
Low-state Output Voltage
• IOUT = 1.5 mA
0.0
–
1.0
V
VOH
High-state Output Voltage
• IOUT = -250 µA
VDD -0.9
–
VDD
V
ITRIMISO
Tri-state Leakage Current
• 0 V ≤ VMISO ≤ VDD
-10
–
10
µA
SPI Input Pins (MOSI, SCLK, CS)
VIL
Low-state Input Voltage
-0.3
–
0.3 x VDD
V
VIH
High-state Input Voltage
0.7 x VDD
–
VDD +0.3
V
IIN
MOSI, SCLK Input Current
• 0 V ≤ VIN ≤ VDD
-10
–
10
µA
CS Pull-up Current
• 0 V < VIN < 3.5 V
10
20
30
µA
IPUCS
Interrupt Output Pin (IRQ)
VOL
Low-state Output Voltage
• IOUT = 1.5 mA
0.0
–
0.8
V
VOH
High-state Output Voltage
• IOUT = -250 µA
VDD -0.8
–
VDD
V
IOUT
Leakage Current
• VDD ≤ VOUT ≤ 10 V
–
–
2.0
mA
Pulse Width Modulation Input Pin (PWMIN)
VIL
Low-state Input Voltage
-0.3
–
0.3 x VDD
V
VIH
High-state Input Voltage
0.7 x VDD
–
VDD +0.3
V
10
20
30
µA
IPUPWMIN
Pull-up current
• 0 V < VIN < 3.5 V
33911
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Freescale Semiconductor
11
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
–
–
–
–
–
–
7.0
10
14
Unit
Notes
Ω
(23)
High-side Output HS1 Pin (HS1)
RDS(on)
Output Drain-to-Source On Resistance
• TJ = 25 °C, ILOAD = 50 mA; VSUP > 9.0 V
• TJ = 150 °C, ILOAD = 50 mA; VSUP > 9.0 V
• TJ = 150 °C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V
(23)
ILIMHS1
Output Current Limitation
• 0 V < VOUT < VSUP - 2.0 V
60
90
250
mA
(24)
IOLHS1
Open Load Current Detection
–
5.0
7.5
mA
(25)
ILEAK
Leakage Current
• -0.2 V < VHS1 < VS2 + 0.2 V
–
–
10
µA
VTHSC
Short-circuit Detection Threshold
• 5.5 V < VSUP < 27 V
VSUP -2.0
–
–
V
(26)
THSSD
Overtemperature Shutdown
140
160
180
°C
(27), (31)
–
10
–
°C
(31)
–
–
–
–
–
–
2.5
4.5
10
160
275
350
mA
(28)
(29)
THSSD_HYS
Overtemperature Shutdown Hysteresis
Low-side Outputs LS1 and LS2 Pins (LS1, LS2)
RDS(on)
Output Drain-to-Source On Resistance
• TJ = 25 °C, ILOAD = 150 mA, VSUP > 9.0 V
• TJ = 125 °C, ILOAD = 150 mA, VSUP > 9.0 V
• TJ = 125 °C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
Ω
ILIMLSX
Output Current Limitation
• 2.0 V < VOUT < VSUP
IOLLSX
Open Load Current Detection
–
7.5
12
mA
ILEAK
Leakage Current
• -0.2 V < VOUT < VS1
–
–
10
µA
VSUP +2.0
–
VSUP +5.0
V
VCLAMP
Active Output Energy Clamp
• IOUT = 150 mA
VTHSC
Short-circuit Detection Threshold
• 5.5 V < VSUP < 27 V
2.0
–
–
V
(26)
TLSSD
Overtemperature Shutdown
140
160
180
°C
(30), (31)
–
10
–
°C
(31)
TLSSD_HYS
Overtemperature Shutdown Hysteresis
Notes
23. This parameter is production tested up to TA = 125 °C, and guaranteed by process monitoring up to TJ = 150 °C.
24.
25.
26.
27.
28.
29.
30.
31.
When overcurrent occurs, the corresponding high-side stays ON with limited current capability and the HS1CL flag is set in the HSSR.
When open load occurs, the flag (HS1OP) is set in the HSSR.
HS and LS automatically shutdown if HSOT or LSOT occurs or if the HVSE flag is enabled and an overvoltage occurs.
When overtemperature shutdown occurs, the high-side is turned off. All flags in HSSR are set.
When overcurrent occurs, the corresponding low-side stays ON with limited current capability and the LSxCL flag is set in the LSSR.
When open load occurs, the flag (LSxOP) is set in the LSSR.
When overtemperature shutdown occurs, both low-sides are turned off. All flags in LSSR are set.
Guaranteed by characterization but not production tested
33911
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
L1 and L2 Input Pins (L1 and L2)
VTHL
Low Detection Threshold
• 5.5 V < VSUP < 27 V
2.0
2.5
3.0
V
(32)
VTHH
High Detection Threshold
• 5.5 V < VSUP < 27 V
3.0
3.5
4.0
V
(32)
VHYS
Hysteresis
• 5.5 V < VSUP < 27 V
0.4
0.8
1.4
V
(32)
Input Current
• -0.2 V < VIN < VS1
-10
–
10
µA
(33)
Analog Input Impedance
800
1300
2000
kΩ
(34)
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
• LXDS (Lx Divider Select) = 0
• LXDS (Lx Divider Select) = 1
0.95
3.42
1.0
3.6
1.05
3.78
VRATIOLx-OFFSET
Analog Output offset Ratio
• LXDS (Lx Divider Select) = 0
• LXDS (Lx Divider Select) = 1
-80
-22
6.0
2.0
80
22
mV
LXMATCHING
Analog Inputs Matching
• LXDS (Lx Divider Select) = 0
• LXDS (Lx Divider Select) = 1
96
96
100
100
104
104
%
External Resistor Range
20
–
200
kΩ
Watchdog Period Accuracy with External Resistor (Excluding Resistor
Accuracy)
-15
–
15
%
Temperature Sense Analog Output Voltage
• TA = -40 °C
• TA = 25 °C
• TA = 125 °C
2.0
2.8
3.6
–
3.0
–
2.8
3.6
4.6
Temperature Sense Analog Output Voltage per characterization
• TA = 25 °C
3.1
3.15
3.2
Internal Chip Temperature Sense Gain
9.0
10.5
12
mV/K
Internal Chip Temperature Sense Gain per characterization at 3
temperatures. See Figure 16, Temperature Sense Gain
9.9
10.2
10.5
mV/K
5.0
5.25
5.5
IIN
RLXIN
RATIOLX
Window Watchdog Configuration Pin (WDCONF) (35)
REXT
WDACC
(36)
Analog Multiplexer
VADOUT0_TEMP
VADOUT0_25
STTOV
STTOV_3T
RATIOVSENSE
Notes
32.
33.
34.
35.
36.
37.
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0)
• 5.5 V < VSUP < 27 V
V
V
(37)
(37)
The unused Lx pins must be connected to ground.
Analog multiplexer input disconnected from Lx input pin.
Analog multiplexer input connected to Lx input pin.
For VSUP 4.7 V to 18 V
Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in kΩ)
These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tightened limits could not be guaranteed by
production test.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
RATIOVSENSECZ
VSENSE Input Divider Ratio (RATIOVSENSE=Vsense/Vadout0) per
characterization
• 5.5 <VSUP< 27 V
5.15
5.25
5.35
OFFSETVSENSE
VSENSE Output Related Offset
-30
-10
30
mV
OFFSETVSENSE_CZ VSENSE Output Related Offset per characterization
-30
-12.6
0
mV
Notes
Analog Multiplexer (Continued)
(38)
(38)
Analog Output (ADOUT0)
VOUT_MAX
Maximum Output Voltage
• -5.0 mA < IO < 5.0 mA
VDD -0.35
–
VDD
V
VOUT_MIN
Minimum Output Voltage
• -5.0 mA < IO < 5.0 mA
0.0
–
0.35
V
RxD Output Pin (LIN Physical Layer) (RxD)
VOL
Low-state Output Voltage
• IOUT = 1.5 mA
0.0
–
0.8
V
VOH
High-state Output Voltage
• IOUT = -250 µA
VDD -0.8
–
VDD
V
TXD Input Pin (LIN Physical Layer) (TXD)
VIL
Low-state Input Voltage
-0.3
–
0.3 x VDD
V
VIH
High-state Input Voltage
0.7 x VDD
–
VDD +0.3
V
10
20
30
µA
6.0
V
IPUIN
Pin Pull-up Current, 0 V < VIN < 3.5 V
LIN PHYSICAL LAYER WITH J2602 FEATURE Enabled (bit DIS_J2602 = 0)
VTH_UNDER_
VOLTAGE
LIN Undervoltage threshold
• Positive and Negative threshold (VTHP, VTHN)
VJ2602_DEG
Hysteresis (VTHP - VTHN)
5.0
400
mV
Notes
38. These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighter limits cannot be guaranteed by production
test.
33911
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
LIN PHYSICAL LAYER, TRANSCEIVER
Min.
Typ.
Max.
Unit
Notes
(LIN)(39)
VBAT
Operating Voltage Range
8.0
–
18
V
VSUP
Supply Voltage Range
7.0
–
18
V
Voltage Range within which the device is not destroyed
-0.3
–
40
V
40
90
200
mA
-1.0
–
–
mA
–
–
20
µA
-1.0
–
1.0
mA
(40)
VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V
–
–
100
µA
(41)
VBUSDOM
Receiver Dominant State
–
–
0.4
VSUP
VBUSREC
Receiver Recessive State
0.6
–
–
VSUP
VBUS_CNT
Receiver Threshold Center
• (VTH_DOM + VTH_REC)/2
0.475
0.5
0.525
VSUP
–
–
0.175
VSUP
0.4
1.0
V
VSUP_NON_OP
IBUS_LIM
Current Limitation for Driver Dominant State
• Driver ON, VBUS = 18 V
IBUS_PAS_DOM
Input Leakage Current at the receiver
• Driver off; VBUS = 0 V; VBAT = 12 V
IBUS_PAS_REC
Leakage Output Current to GND
• Driver Off; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS ≥ VBAT
IBUS_NO_GND
Control Unit Disconnected from Ground
• GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V
IBUSNO_BAT
VHYS
Receiver Threshold Hysteresis
• (VTH_REC - VTH_DOM)
VSERDIODE
Voltage Drop at the Serial Diode in pull-up path
VSHIFT_BAT
VBAT_SHIFT
0
11.5%
VBAT
VSHIFT_GND
GND_SHIFT
0
11.5%
VBAT
5.3
5.8
V
VBUSWU
LIN Wake-up Threshold from Stop or Sleep Mode
RSLAVE
LIN Pull-up Resistor to VSUP
20
30
60
kΩ
TLINSD
Overtemperature Shutdown
140
160
180
°C
–
10
–
°C
TLINSD_HYS
Overtemperature Shutdown Hysteresis
(42)
(43)
Notes
39.
40.
41.
42.
43.
Parameters guaranteed for 7.0 V ≤ VSUP ≤ 18 V.
Loss of local ground must not affect communication in the residual network.
Node has to sustain the current which can flow under this condition. Bus must remain operational under this condition.
This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale does not
guarantee this parameter during the product's life time.
When overtemperature shutdown occurs, the LIN bus goes in recessive state and the flag LINOT in LINSR is set.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
5.3
Dynamic Electrical Characteristics
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
–
–
4.0
MHz
Notes
SPI INTERFACE TIMING (see Figure 13, page 22)
f SPIOP
SPI Operating Frequency
tPSCLK
SCLK Clock Period
250
–
N/A
ns
tWSCLKH
SCLK Clock High Time
110
–
N/A
ns
(44)
tWSCLKL
SCLK Clock Low Time
110
–
N/A
ns
(44)
Falling Edge of CS to Rising Edge of SCLK
100
–
N/A
ns
(44)
tLAG
Falling Edge of SCLK to CS Rising Edge
100
–
N/A
ns
(44)
tSISU
MOSI to Falling Edge of SCLK
40
–
N/A
ns
(44)
tSIH
Falling Edge of SCLK to MOSI
40
–
N/A
ns
(44)
tRSO
MISO Rise Time
• CL = 220 pF
–
40
–
ns
(44)
tFSO
MISO Fall Time
• CL = 220 pF
–
40
–
ns
(44)
Time from Falling or Rising Edges of CS to:
- MISO Low-impedance
- MISO High-impedance
0.0
0.0
–
–
50
50
ns
(44)
Time from Rising Edge of SCLK to MISO Data Valid
• 0.2 x VDD ≤ MISO ≥ 0.8 x VDD, CL = 100 pF
0.0
–
75
ns
(44)
Reset Low-level Duration After VDD High (see Figure 12, page 22)
0.65
1.0
1.35
ms
Reset Deglitch Filter Time
350
480
900
ns
8.5
79
110
10
94
150
11.5
108
205
tLEAD
tSOEN
tSODIS
tVALID
RST OUTPUT PIN
t RST
t RSTDF
Window Watchdog Configuration Pin (WDCONF)
t PWD
Watchdog Time Period
• External Resistor REXT = 20 kΩ (1%)
• External Resistor REXT = 200 kΩ (1%)
• Without External Resistor REXT (WDCONF Pin Open)
ms
(45)
Notes
44. This parameter is guaranteed by process monitoring but not production tested.
45. Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in kΩ)
33911
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
8.0
20
38
μs
(46)
–
–
5.0
μs
(46)
Normal Request Mode Timeout (see Figure 12, page 22)
110
150
205
ms
Cyclic Sense ON Time from Stop and Sleep Mode
130
200
270
µs
(47)
Cyclic Sense Accuracy
-35
+35
%
(46)
L1 and L2 Inputs
t WUF
Lx Filter Time Deglitcher
State Machine Timing
t STOP
t NR TOUT
TON
Delay Between CS LOW-to-HIGH Transition (at End of the SPI Stop Command)
and Stop Mode Activation
t S-ON
Delay Between the SPI Command and HS /LS Turn On
• 9.0 V < VSUP < 27 V
–
–
10
μs
(48)
t S-OFF
Delay Between the SPI Command and HS /LS Turn Off
• 9.0 V < VSUP < 27 V
–
–
10
μs
(48)
t SNR2N
Delay Between Normal Request and Normal Mode After a Watchdog Trigger
Command (Normal Request Mode)
–
–
10
μs
(46)
t WUCS
t WUSPI
Delay Between CS Wake-up (CS LOW to HIGH) in Stop Mode and:
• Normal Request Mode, VDD ON and RST HIGH
• First Accepted the SPI Command
9.0
90
15
—
80
N/A
μs
Minimum Time Between Rising and Falling Edge on the CS
4.0
—
—
μs
VSUP Deglitcher
• (DIS_J2602 = 0)
35
50
70
μs
t 2CS
J2602 Deglitcher
tJ2602_DEG
(49)
LIN Physical Layer: Driver Characteristics for Normal Slew Rate - 20.0kBit/sec According TO LIN Physical Layer Specification(50), (51)
D1
Duty Cycle 1:
• THREC(MAX) = 0.744 * VSUP
• THDOM(MAX) = 0.581 * VSUP
0.396
—
—
—
—
0.581
• D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs, 7.0 V ≤ VSUP ≤ 18 V
D2
Duty Cycle 2:
• THREC(MIN) = 0.422 * VSUP
• THDOM(MIN) = 0.284 * VSUP
• D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs, 7.6 V ≤ VSUP ≤ 18 V
Notes
46. This parameter is guaranteed by process monitoring but not production tested.
47. This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale does not
guarantee this parameter during the product's life time.
48. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to external load.
49. This parameter has not been monitoring during operating life test.
50. See Figure 7, page 20.
51. See Figure 8, page 20.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min.
Typ.
Max.
Unit
Notes
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4kBit/sec ACCORDING TO LIN PHYSICAL LAYER
SPECIFICATION(52), (53)
D3
Duty Cycle 3:
• THREC(MAX) = 0.778 * VSUP
• THDOM(MAX) = 0.616 * VSUP
• D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs, 7.0 V ≤ VSUP ≤ 18 V
D4
0.417
—
—
—
—
0.590
—
20
—
V / μs
—
- 2.0
4.2
—
6.0
2.0
μs
(55)
Duty Cycle 4:
• THREC(MIN) = 0.389 * VSUP
• THDOM(MIN) = 0.251 * VSUP
• D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs, 7.6 V ≤ VSUP ≤ 18 V
LIN Physical Layer: Driver Characteristics for Fast Slew Rate
SRFAST
LIN Fast Slew Rate (Programming Mode)
LIN Physical Layer: Characteristics and Wake-up Timings(54)
t REC_SYM
Propagation Delay and Symmetry
• Propagation Delay of Receiver, tREC_PD=MAX (tREC_PDR, tREC_PDF)
• Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR
t PROPWL
Bus Wake-up Deglitcher (Sleep and Stop Modes)
42
70
95
μs
(56),(60),
(57)
Bus Wake-up Event Reported
• From Sleep Mode
• From Stop Mode
—
9.0
—
27
1500
35
μs
(58)
TXD Permanent Dominant State Delay
0.65
1.0
1.35
s
—
10
—
kHz
t REC_PD
t WAKE_SLEEP
t WAKE_STOP
t TXDDOM
(59)
Pulse Width Modulation Input Pin (PWMIN)
fPWMIN
PWMIN pin
• Max. frequency to drive HS and LS output pins
(60)
Notes
52. Bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to LIN signal threshold
defined at each parameter. See Figure 6, page 20.
53. See Figure 8, page 20.
54. VSUP from 7.0 to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to
LIN signal threshold defined at each parameter. See Figure 6, page 20.
55. See Figure 9, page 21
56. See Figure 10, page 21 for Sleep and Figure 11, page 21 for Stop mode.
57. This parameter is tested on automatic tester but has not been monitoring during operating life test.
58. The measurement is done with 1.0 µF capacitor and 0 mA current load on VDD. The value takes into account the delay to charge the capacitor.
The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0 V. See Figure 10,
page 21. The delay depends of the load and capacitor on VDD.
59. In Stop mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 11, page 21.
60. This parameter is guaranteed by process monitoring but not production tested.
33911
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
5.4
Timing Diagrams
33911
1.0 nF
LIN
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
PGND LGND
AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 4. Test Circuit for Transient Test Pulses (LIN)
33911
Transient Pulse
Generator
(Note)
1.0 nF
L1, L2
10 kΩ
GND
PGND LGND AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,.
Figure 5. Test Circuit for Transient Test Pulses (Lx)
VSUP
TXD
LIN
R0
RXD
C0
R0 AND C0 COMBINATIONS:
• 1.0 KΩ and 1.0 nF
• 660 Ω and 6.8 nF
• 500 Ω and 10 nF
Figure 6. Test Circuit for LIN Timing Measurements
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
TXD
tBIT
tBIT
tBUS_DOM(MAX)
VLIN_REC
THREC(MAX)
74.4% VSUP
THDOM(MAX)
58.1% VSUP
tBUS_REC(MIN)
Thresholds of
receiving node 1
LIN
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 2
42.2% VSUP
28.4% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDF(2)
tREC_PDR(2)
Figure 7. LIN Timing Measurements for Normal Slew Rate
TXD
tBIT
tBIT
tBUS_DOM(MAX)
VLIN_REC
THREC(MAX)
77.8% VSUP
THDOM(MAX)
61.6% VSUP
tBUS_REC(MIN)
Thresholds of
receiving node 1
LIN
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 2
38.9% VSUP
25.1% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDR(2)
tREC_PDF(2)
Figure 8. LIN Timing Measurements for Slow Slew Rate
33911
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
VLIN_REC
VBUSREC
0.6% VSUP
VBUSDOM
0.4% VSUP
VSUP
LIN BUS SIGNAL
RXD
tREC_PDF
tREC_PDR
Figure 9. LIN Receiver Timing
VLIN_REC
LIN
5.0 V
VBUSWU
DOMINANT LEVEL
3.0 V
VDD
tPROPWL
tWAKE_SLEEP
Figure 10. LIN Wake-up Sleep Mode Timing
VLIN_REC
LIN
5.0 V
VBUSWU
DOMINANT LEVEL
IRQ
tPROPWL
tWAKE_STOP
Figure 11. LIN Wake-up Stop Mode Timing
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
VSUP
VDD
RST
tNRTOUT
tRST
Figure 12. Power On Reset and Normal Request Timeout Timing
tPSCLK
CS
tWSCLKH
tLEAD
tLAG
SCLK
tWSCLKL
tSISU
MOSI
UNDEFINED
D0
tSIH
DON’T CARE
D7
DON’T CARE
tVALID
tSODIS
tSOEN
MISO
D0
DON’T CARE
D7
Figure 13. SPI Timing Characteristics
33911
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
6
Functional Description
6.1
INTRODUCTION
The 33911 was designed and developed as a highly integrated and cost-effective solution for automotive and industrial applications. The
33911 is well suited to perform relay control in applications such as a window lift, sunroof, etc. via the LIN bus, for automotive body
electronics
Power switches are provided on the device configured as high-side and low-side outputs. Other ports are also provided, which include a
current and voltage sense port and two wake-up capable pins. An internal voltage regulator provides power to a MCU device. Also
included in this device is a LIN physical layer, which communicates using a single wire. This enables this device to be compatible with 3wire bus systems, where one wire is used for communication, one for battery, and one for ground.
6.2
Functional Pin Description
See Figure 1, 33911 Simplified Application Diagram, page 1, for a graphic representation of the various pins referred to in the following
paragraphs. See the 33911 Pin Connections on page 5 for a description of the pin locations in the package.
6.2.1
Receiver Output Pin (RXD)
The RXD pin is a digital output. It is the receiver output of the LIN interface and reports the state of the bus voltage: RXD Low when LIN
bus is dominant, RXD High when LIN bus is recessive.
6.2.2
Transmitter Input Pin (TXD)
The TXD pin is a digital input. It is the transmitter input of the LIN interface and controls the state of the bus output (dominant when TXD
is Low, recessive when TXD is High). This pin has an internal pull-up to force recessive state in case the input is left floating.
6.2.3
Lin Bus Pin (LIN)
The LIN pin represents the single-wire bus transmitter and receiver. It is suited for automotive bus systems and is compliant to the LIN
bus specification 2.0, 2.1, and SAE J2602-2. The LIN interface is only active during Normal mode. See Operating Modes Overview on
page 28.
6.2.4
Serial Data Clock Pin (SCLK)
The SCLK pin is the SPI clock input. MISO data changes on the positive transition of the SCLK. MOSI is sampled on the negative edge
of the SCLK.
6.2.5
Master Out Slave In Pin (MOSI)
The MOSI digital pin receives the SPI data from the MCU. This data input is sampled on the negative edge of SCLK.
6.2.6
Master In Slave Out Pin (MISO)
The MISO pin sends data to an SPI-enabled MCU. It is a digital tri-state output used to shift serial data to the microcontroller. Data on this
output pin changes on the positive edge of the SCLK. When CS is High, this pin remains in the high-impedance state.
6.2.7
Chip Select Pin (CS)
CS is an active low digital input. It must remain low during a valid SPI communication and allow for several devices to be connected in the
same SPI bus without contention. A rising edge on CS signals the end of the transmission and the moment the data shifted in is latched.
A valid transmission must consist of 8 bits only. While in STOP mode, a low-to-high level transition on this pin generates a wake-up
condition for the 33911.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
6.2.8
Analog Multiplexer Pin (ADOUT0)
The ADOUT0 pin can be configured via the SPI to allow the MCU A/D converter to read the several inputs of the Analog Multiplexer,
including the VSENSE, L1, L2 input voltages, and the internal junction temperature.
6.2.9
PWM Input Control Pin (PWMIN)
This digital input can control the high-side and low-sides drivers in Normal Request and Normal mode. To enable PWM control, the MCU
must perform a write operation to the High-side Control Register (HSCR) or the Low-side Control Register (LSCR). This pin has an internal
20 μA current pull-up.
6.2.10 Reset pin (RST)
This bidirectional pin is used to reset the MCU in case the 33911 detects a reset condition, or to inform the 33911 the MCU has just been
reset. After release of the RST pin, Normal Request mode is entered. The RST pin is an active low filtered input and output formed by a
weak pull-up and a switchable pull-down structure, which allows this pin to be shorted either to VDD or to GND during software
development, without the risk of destroying the driver.
6.2.11 Interrupt Pin (IRQ)
The IRQ pin is a digital output used to signal events or faults to the MCU while in Normal and Normal Request mode or to signal a wakeup from Stop mode. This active low output transitions to high only after the interrupt is acknowledged by a SPI read of the respective status
bits.
6.2.12 Watchdog Configuration Pin (WDCONF)
The WDCONF pin is the configuration pin for the internal watchdog. A resistor can be connected to this pin to configure the window
watchdog period. When connected directly to ground, the watchdog is disabled. When this pin is left open, the watchdog period is fixed to
its lower precision internal default value (150 ms typical).
6.2.13 Ground Connection Pins (AGND, PGND, LGND)
The AGND, PGND and LGND pins are the Analog and Power ground pins. The AGND pin is the ground reference of the voltage regulator.
The PGND and LGND pins are used for high current load return as in the relay-drivers and LIN interface pin. Note: PGND, AGND, and
LGND pins must be connected together.
6.2.14 Low-side Pins (LS1 and LS2)
LS1 and LS2 are the low-side driver outputs. Those outputs are short-circuit protected and include active clamp circuitry to drive inductive
loads. Due to the energy clamp voltage on this pin, it can raise above the battery level when switched off. The switches are controlled
through the SPI and can be configured to respond to a signal applied to the PWMIN input pin.
Both low-side switches are protected against overheating. In case of VS1 disconnection and the low-sides are still supplied by VBAT
through a load, both low-sides have a VDS voltage equal to the clamping value, as stated in the specification.
6.2.15 Digital/Analog Pins (L1 and L2)
The Lx pins are multi purpose inputs. They can be used as digital inputs, which can be sampled by reading the SPI and used for wake-up
when 33911 is in low-power mode or used as analog inputs for the analog multiplexer. When used to sense voltage outside the module,
a 33 kΩ series resistor must be used on each input. When used as wake-up inputs, L1 and L2 can be configured to operate in cyclic-sense
mode. In this mode, the high-side switch is configured to be periodically turned on and sample the wake-up inputs. If a state change is
detected between two cycles a wake-up is initiated. The 33911 can also wake-up from Stop or Sleep by a simple state change on L1 and
L2. When used as analog inputs, the voltage present on the Lx pins is scaled down by an selectable internal voltage divider and can be
routed to the ADOUT0 output through the analog multiplexer.
Note: If an Lx input is selected in the analog multiplexer, it is disabled as a digital input and remains disabled in low-power mode. No wakeup feature is available in this condition.
When an Lx input is not selected in the analog multiplexer, the voltage divider is disconnected from this input.
33911
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
6.2.16 High-side Output Pin (HS1)
This high-side switch is able to drive loads such as relays or lamps. Its structure is connected to the VS2 supply pin. The pin is short-circuit
protected and also protected against overheating. HS1 is controlled by the SPI and can respond to a signal applied to the PWMIN input
pin. The HS1 output can also be used during Low-power mode for the cyclic-sense of the wake inputs.
6.3
Power Supply Pins (VS1 and VS2)
These are the battery level voltage supply pins. In an application, VS1 and VS2 pins must be protected against reverse battery connection
and negative transient voltages with external components. These pins sustain standard automotive voltage conditions such as a load
dump at 40 V. The high-side switch (HS1) is supplied by the VS2 pin. All other internal blocks are supplied by the VS1 pin.
6.3.1
Voltage Sense Pin (VSense)
This input can be connected directly to the battery line. It is protected against battery reverse connection. The voltage present in this input
is scaled down by an internal voltage divider, and can be routed to the ADOUT0 output pin and used by the MCU to read the battery
voltage. The ESD structure on this pin allows for excursion up to +40 V and down to -27 V, allowing this pin to be connected directly to
the battery line. It is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
6.3.2
+5.0 V Main Regulator Output Pin (VDD)
An external capacitor has to be placed on the VDD pin to stabilize the regulated output voltage. The VDD pin is intended to supply a
microcontroller. The pin is current limited against shorts to GND and overtemperature protected. During Stop mode, the voltage regulator
does not operate with its full drive capabilities and the output current is limited. During Sleep mode, the regulator output is completely
shutdown.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
7
Functional Device Operations
7.1
Operational Modes
7.1.1
Introduction
The 33911 offers three main operating modes: Normal (Run), Stop, and Sleep (Low-power). In Normal mode, the device is active and is
operating under normal application conditions. The Stop and Sleep modes are Low-power modes with wake-up capabilities. In Stop mode,
the voltage regulator still supplies the MCU with VDD (limited current capability), while in Sleep mode the voltage regulator is turned off
(VDD = 0 V). Wake-up from Stop mode is initiated by a wake-up interrupt. Wake-up from Sleep mode is done by a reset and the voltage
regulator is turned back on. The selection of the different modes is controlled by the MOD1:2 bits in the Mode Control Register (MCR).
Figure 14 describes how transitions are done between the different operating modes. Table 6, gives an overview of the operating modes.
7.1.2
Reset Mode
The 33911 enters the Reset mode after a power up. In this mode, the RST pin is low for 1.0 ms (typical value). After this delay, it enters
the Normal Request mode and the RST pin is driven high. The Reset mode is entered if a reset condition occurs (VDD low, watchdog
trigger fail, after wake-up from Sleep mode, Normal Request mode timeout occurs).
7.1.3
Normal Request Mode
This is a temporary mode automatically accessed by the device after the Reset mode, or after a wake-up from Stop mode. In Normal
Request mode, the VDD regulator is ON, the RESET pin is High, and the LIN is operating in RX Only mode. As soon as the device enters
in the Normal Request mode an internal timer is started for 150 ms (typical value). During these 150 ms, the MCU must configure the
Timing Control Register (TIMCR) and the Mode Control Register (MCR) with MOD2 and MOD1 bits set = 0, to enter the Normal mode. If
within the 150 ms timeout, the MCU does not command the 33911 to Normal mode, it enters in Reset mode. If the WDCONF pin is
grounded to disable the watchdog function, it goes directly in Normal mode after the Reset mode.
7.1.4
Normal Mode
In Normal mode, all 33911 functions are active and can be controlled by the SPI interface and the PWMIN pin. The VDD regulator is ON
and delivers its full current capability. If an external resistor is connected between the WDCONF pin and the Ground, the window watchdog
function is enabled. The wake-up inputs (L1 and L2) can be read as digital inputs or have its voltage routed through the analog-multiplexer.
The LIN interface has slew rate and timing compatible with the LIN protocol specification 2.0, 2.1, and SAEJ2602. The LIN bus can transmit
and receive information. The high-side and low-side switches are active and have PWM capability according to the SPI configuration. The
interrupts are generated to report failures for VSUP over/undervoltage, thermal shutdown, or thermal shutdown prewarning on the main
regulator.
7.1.5
Sleep Mode
The Sleep mode is a Low-power mode. From Normal mode, the device enters into Sleep mode by sending one SPI command through the
Mode Control Register (MCR), or (VDD low > 150 ms) with VSUV = 0. When in Reset mode, a VDD undervoltage condition with no VSUP
undervoltage (VSUV = 0) sends the device to Sleep mode. All blocks are in their lowest power consumption condition. Only some wakeup sources (wake-up inputs with or without cyclic sense, forced wake-up and LIN receiver) are active. The 5.0 V regulator is OFF. The
internal low-power oscillator may be active if the IC is configured for cyclic-sense. In this condition, the high-side switch is turned on
periodically and the wake-up inputs are sampled. Wake-up from Sleep mode is similar to a power-up. The device goes in Reset mode
except the SPI reports the wake-up source and the BATFAIL flag is not set.
7.1.6
Stop Mode
The Stop mode is the second low-power mode, but in this case the 5.0 V regulator is ON with limited current drive capability. The
application MCU is always supplied while the 33911 is operating in Stop mode. The device can enter into Stop mode only by sending the
SPI command. When the application is in this mode, it can wake-up from the 33911 side (for example: cyclic sense, force wake-up, LIN
bus, wake inputs) or the MCU side (CS, RST pins). Wake-up from Stop mode transitions the 33911 to Normal Request mode and
generates an interrupt except if the wake-up event is a low to high transition on the CS pin or comes from the RST pin.
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26
Analog Integrated Circuit Device Data
Freescale Semiconductor
Normal Request
Timeout
Expired
(t NRTOUT
)
Normal Request
timeout
expired (NR
TOUT)
VVDD
Low
DD Low
VDD High and
Normal
Request
VVDDLow
Low
DD
VVDD
LOW (>t NRTOUT
) expired) Expired
DD Low (>NRTOUT
andand
VSUV
=0
VSUV
=0
Wake-up
Wake-Up (Reset)
(Reset)
Sleep
Command
SLEEP
Command
Sleep
Stop
STOPCommand
Command
Normal
WD
Failed
WD
failed
Wake-up
(Interrupt)
Wake-Up Interrupt
Reset
Reset
Delay
(t Delay
VDD
High and
Reset
RST) expired
RST) (tExpired
WD
Disabled
WD disabled
Power Up
WDtrigger
Trigger
WD
Power
Down
Stop
VDD
VDD Low
Low
Legend
WD: Watchdog
Notes:
WD Disabled:
Watchdog disabled (WDCONF pin connected to GND)
WD
- meansisWatchdog
WD Trigger:
Watchdog
triggered by SPI command
means or
Watchdog
disabled
(WDCONF
terminal connected to GND)
WD Failed:WD
No disabled
watchdog- trigger
trigger occurs
in closed
window
WD trigger
means Watchdog
is triggered by SPI command
Stop Command:
Stop –command
sent via SPI
WD failed
– means
no Watchdog
trigger or trigger occurs in closed window
Sleep Command:
Sleep
command
sent via SPI
STOP
Command
means
STOP
command
via SPI Periodic wake-up, CS rising edge wake-up or RST wake-up.
Wake-up from
Stop
mode: L1- or
L2 state
change,
LIN sent
bus wake-up,
SLEEP
Command
SLEEP
command
via SPI
Wake-up from
Sleep
mode: L1 -ormeans
L2 state
change,
LIN bussend
wake-up,
Periodic wake-up.
Wake-Up - means L1 or L2 state change or LIN bus wake up or SS rising edge
Figure 14. Operating Modes and Transitions
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Freescale Semiconductor
27
Table 6. Operating Modes Overview
Function
Reset Mode
Normal Request Mode
Normal Mode
Stop Mode
Sleep Mode
VDD
Full
Full
Full
Stop
-
LSx
-
SPI/PWM(61)
SPI/PWM
-
-
HS1
-
SPI/PWM(61)
SPI/PWM
Note(62)
Note(63)
Analog Mux
-
SPI
SPI
-
-
Lx
-
Inputs
Inputs
Wake-up
Wake-up
LIN
-
Rx-Only
Full/Rx-Only
Rx-Only/Wake-up
Wake-up
Watchdog
-
150 ms (typ.) timeout
On(64)/Off
-
-
Voltage Monitoring
VSUP/VDD
VSUP/VDD
VSUP/VDD
VDD
-
Notes
61.
62.
63.
64.
Operation can be controlled by the PWMIN input.
HS1 switch can be configured for cyclic sense operation in Stop mode.
HS1 switch can be configured for cyclic sense operation in Sleep mode.
Windowing operation when enabled by an external resistor.
7.1.7
Interrupts
Interrupts are used to signal a microcontroller a peripheral needs to be serviced. The interrupts which can be generated, change according
to the operating mode. While in Normal and Normal Request modes, the 33911 signals through interrupts special conditions which may
require a MCU software action. Interrupts are not generated until all pending wake-up sources are read in the Interrupt Source Register
(ISR).
While in Stop mode, interrupts are used to signal wake-up events. Sleep mode does not use interrupts. Wake-up is performed by
powering-up the MCU. In Normal and Normal Request mode the wake-up source can be read by SPI. The interrupts are signaled to the
MCU by a low logic level of the IRQ pin, which remains low until the interrupt is acknowledged by a SPI read command of the ISR register.
The IRQ pin is then driven high. Interrupts are only asserted while in Normal, Normal Request, and Stop mode. Interrupts are not
generated while the RST pin is low. The following is a list of the interrupt sources in Normal and Normal Request modes. Some of these
can be masked by writing to the SPI - Interrupt Mask Register (IMR).
7.1.7.1
Low-voltage Interrupt
Signals when the supply line (VS1) voltage drops below the VSUV threshold (VSUV).
7.1.7.2
High-voltage Interrupt
Signals when the supply line (VS1) voltage increases above the VSOV threshold (VSOV).
7.1.7.3
Overtemperature Prewarning
This signal is when the 33911 temperature has reached the pre-shutdown warning threshold. It is used to warn the MCU an
overtemperature shutdown in the main 5.0 V regulator is imminent.
7.1.7.4
LIN Overtemperature Shutdown/TXD Stuck At Dominant/RXD Short-circuit
These signal fault conditions within the LIN interface cause the LIN driver to be disabled. To restart the operation, the fault must be
removed and TXD must go recessive.
7.1.7.5
High-side Overtemperature Shutdown
Signals a shutdown in the high-side output.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
7.1.7.6
Low-side Overtemperature Shutdown
This signals a shutdown in the low-side outputs.
7.1.8
Reset
To reset a MCU the 33911 drives the RST pin low for the time the reset condition lasts. After the reset source is removed, the state
machine drives the RST output low for at least 1.0 ms (typical value) before driving it high. In the 33911, four main reset sources exist.
7.1.8.1
5.0 V Regulator Low-voltage-Reset (VRSTTH)
The 5.0 V regulator output VDD is continuously monitored against brown outs. If the supply monitor detects the voltage at the VDD pin has
dropped below the reset threshold VRSTTH and the 33911 issues a reset. In case of an overtemperature, the voltage regulator is disabled
and the voltage monitoring issues a VDDOT Flag independently of the VDD voltage.
7.1.8.2
Window Watchdog Overflow
If the watchdog counter is not properly serviced while its window is open, the 33911 detects an MCU software run-away and resets the
microcontroller.
7.1.8.3
Wake-up From Sleep Mode
During Sleep mode, the 5.0 V regulator is not active, hence all wake-up requests from Sleep mode require a power-up/reset sequence.
7.1.8.4
External Reset
The 33911 has a bidirectional reset pin which drives the device to a safe state (same as Reset mode) for as long as this pin is held low.
The RST pin must be held low long enough to pass the internal glitch filter and get recognized by the internal reset circuit. This functionality
is also active in Stop mode. After the RST pin is released, there is no extra t RST to be considered.
7.1.9
Wake-up Capabilities
Once entered into one of the Low-power modes (Sleep or Stop), only wake-up sources can bring the device into Normal mode operation.
In Stop mode, a wake-up is signaled to the MCU as an interrupt, while in Sleep mode the wake-up is performed by activating the 5.0 V
regulator and resetting the MCU. In both cases the MCU can detect the wake-up source by accessing the SPI registers and reading the
Interrupt Source Register. There is no specific SPI register bit to signal a CS wake-up or external reset. If necessary this condition is
detected by excluding all other possible wake-up sources.
7.1.9.1
Wake-up from Wake-up Inputs (L1 and L2) with Cyclic Sense Disabled
The wake-up lines are dedicated to sense state changes of external switches and wake-up the MCU (in Sleep or Stop mode). To select
and activate direct wake-up from Lx inputs, the Wake-up Control Register (WUCR) must be configured with appropriate LxWE inputs
enabled or disabled. The wake-up input’s state is read through the Wake-up Status Register (WUSR). Lx inputs are also used to perform
cyclic-sense wake-up.
Note: Selecting an Lx input in the analog multiplexer before entering Low-power mode disables the wake-up capability of the Lx input
7.1.9.2
Wake-up from Wake-up Inputs (L1 and L2) with Cyclic Sense Timer Enabled
The SBCLIN can wake-up at the end of a cyclic sense period if on one of the two wake-up input lines (L1-L2) a state change occurs. The
HS1 switch can be activated in Sleep or Stop modes from an internal timer. Cyclic sense and force wake-up are exclusive. If cyclic sense
is enabled, the force wake-up can not be enabled.
To select and activate the cyclic sense wake-up from Lx inputs, before entering in Low-power modes (Stop or Sleep modes), the following
SPI set-up has to be performed:
In WUCR: select the Lx input to WU-enable.
In HSCR: enable the desired HS1.
• In TIMCR: select the CS/WD bit and determine the cyclic sense period with CYSTx bits.
• Perform Go to Sleep/Stop command.
33911
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Freescale Semiconductor
29
7.1.9.3
Forced Wake-up
The 33911 can wake-up automatically after a predetermined time spent in Sleep or Stop mode. Cyclic sense and Forced wake-up are
exclusive. If Forced wake-up is enabled, the Cyclic Sense can not be enabled.
To determine the wake-up period, the following SPI set-up has to be sent before entering in low-power modes:
• In TIMCR: select the CS/WD bit and determine the Low-power mode period with CYSTx bits.
• In HSCR: The HS1 bit must be disabled.
7.1.9.4
CS Wake-up
While in Stop mode, a rising edge on the CS causes a wake-up. The CS wake-up does not generate an interrupt, and is not reported on
SPI.
7.1.9.5
LIN Wake-up
While in the Low-power mode, the 33911 monitors the activity on the LIN bus. A dominant pulse larger than t PROPWL followed by a
dominant to recessive transition causes a LIN wake-up. This behavior protects the system from a short to ground bus condition. The bit
RXONLY = 1 from LINCR Register disables the LIN wake-up from Stop mode.
7.1.9.6
RST Wake-up
While in Stop mode, the 33911 can wake-up when the RST pin is held low long enough to pass the internal glitch filter. Then, the 33911
changes to Normal Request or Normal modes depending on the WDCONF pin configuration. The RST wake-up does not generate an
interrupt and is not reported via SPI.
From Stop mode, the following wake-up events can be configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• CS wake-up
• LIN wake-up
• RST wake-up
From Sleep mode, the following wake-up events can be configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• LIN wake-up
7.1.9.7
Window Watchdog
The 33911 includes a configurable window watchdog which is active in Normal mode. The watchdog can be configured by an external
resistor connected to the WDCONF pin. The resistor is used to achieve higher precision in the timebase used for the watchdog.
SPI clears are performed by writing through the SPI in the MOD bits of the Mode Control Register (MCR).
During the first half of the SPI timeout, watchdog clears are not allowed, but after the first half of the SPI timeout window, the clear operation
opens. If a clear operation is performed outside the window, the 33911 resets the MCU, in the same way as when the watchdog overflows.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
WINDOW CLOSED
NO WATCHDOG CLEAR
ALLOWED
WD TIMING X 50%
WINDOW OPEN
FOR WATCHDOG
CLEAR
WD TIMING X 50%
WD PERIOD (tPWD)
WD TIMING SELECTED BY RESISTOR
ON WDCONF PIN
Figure 15. Window Watchdog Operation
To disable the watchdog function in Normal mode the user must connect the WDCONF pin to ground. This measure effectively disables
Normal Request mode. The WDOFF bit in the Watchdog Status Register (WDSR) is set. This condition is only detected during Reset
mode. If neither a resistor nor a connection to ground is detected, the watchdog falls back to the internal lower precision timebase of
150 ms (typ.) and signals the faulty condition through the Watchdog Status Register (WDSR).
The watchdog timebase can be further divided by a prescaler which can be configured by the Timing Control Register (TIMCR). During
Normal Request mode, the window watchdog is not active but there is a 150 ms (typ.) timeout for leaving the Normal Request mode. In
case of a timeout, the 33911 enters into Reset mode, resetting the microcontroller before entering again into Normal Request mode.
7.1.10 Faults Detection Management
The 33911 has the capability to detect faults like an over or undervoltage on VS1, TxD in permanent Dominant State, Overtemperature
on HS, LIN. It is able to take corrective actions accordingly. Most of faults are monitoring through the SPI and the Interrupt pin. The
microcontroller can also take actions. The following table summarizes all fault sources the device is able to detect with associated
conditions. The status for a device recovery and the SPI or pins monitoring are also described.
Table 7. Fault Detection Management Conditions
Block
FAULT
MODE
CONDITION
FALLOUT
RECOVERY
Battery Fail
All modes
VSUP<3.0 V (typ)
then power-up
-
Condition gone
VSUP Overvoltage
Power Supply
Normal, Normal
Request
VSUP
Undervoltage
VDD Undervoltage
VDD Overtemp
Prewarning
VDD
Overtemperature
All except Sleep
All except Lowpower modes
Rxd Pin Short
Circuit
LIN
Txd Pin
Permanent
Dominant
Normal, Normal
Request
Lin Driver
Overtemperature
VSUP > 19.25 V
(typ)
In Normal mode,
Condition gone, to
HS and LS
re-enable HS or
shutdown if bit
LS write to HSCR
HVSE=1 (reg
or LSCR registers
MCR)
VSUP < 6.0 V (typ)
-
VDD < 4.5 V (typ)
Reset (65)
Condition gone
MONITORING(66)
REG (Flag, Bit)
INTERRUPT
VSR (BATFAIL,
0)
-
VSR (VSOV,3)
IRQ low +
ISR (0101)(67)
VSR (VSUV,2)
IRQ low + ISR
(0101)
-
-
VSR (VDDOT,1)
IRQ low + ISR
(0101)
-
Temperature >
115 °C (typ)
-
Temperature >
170 °C (typ)
VDD shutdown,
Reset then Sleep
-
RXD pin shorted
to GND or 5.0 V
LIN trans
shutdown
LINSR,
(RXSHORT,3)
TXD pin low for
more than 1.0s
(typ)
Temperature >
160 °C (typ)
LIN transmitter
shutdown
LIN transmitter reenabled once the
condition is gone
and TXD is high
LINSR
(TXDOM,2)
IRQ low + ISR
(0100)(67)
LINSR (LINOT,1)
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Freescale Semiconductor
31
Table 7. Fault Detection Management Conditions
Block
FAULT
MODE
CONDITION
FALLOUT
Temperature >
160 °C (typ)
HS1 thermal
shutdown
Current through
HS1 < 5.0 mA
(typ)
-
Hs1 Overcurrent
Current through
HS1 tends to rise
above the current
limit 60 mA (min)
HS1 on with
limited current
capability 60 mA
(min)
Low-side Drivers
Overtemperature
Temperature >
160 °C (typ)
High-side Driver
Overtemperature
High-side
Hs1 Open Load
Detection
Normal, Normal
Request
Ls1 Open Load
Low-side
Ls2 Open Load
Normal, Normal
Request
Ls2 Overcurrent
Watchdog
Normal Request
Reset
Normal
Watchdog Error
Normal
WDCONF pin is
floating
INTERRUPT
IRQ low + ISR
(0010) (67)
HSSR
(HS1OP,1)
Condition gone
HSSR (HS1CL,0)
IRQ low + ISR
(0011) (67)
LSSR (LS1OP,1)
Reset
WD timeout or
WD clear within
the window
closed
REG (Flag, Bit)
Condition gone, to
All flags in HSSR
re-enable HS1
are set
write to HSCR reg
-
The MCU did not
command the
device to Normal
mode within the
150 ms timeout
after reset
Watchdog
Timeout
MONITORING(66)
Condition gone, to
Both LS thermal
All flags in LSSR
re-enable LS write
shutdown
are set
to LSCR reg
LSx on with
Current through
limited current
LSx tends to rise
above the current capability 160 mA
(min)
limit 160 mA (min)
Ls1 Overcurrent
Normal Request
Time-out Expired
Current through
LSx < 7.5 mA
(typ)
RECOVERY
LSSR (LS2OP,3)
-
LSSR (LS1CL,0)
-
LSSR (LS2CL,2)
WDSR (WDTO,
3)
-
WD internal lower
Connect
precision
WDSR (WDERR,
WDCONF to a
timebase 150 ms
2)
resistor or to GND
(typ)
Notes
65. When in Reset mode a VDD undervoltage condition combined with no VSUP undervoltage (VSUV=0) sends the device to Sleep mode.
66. Registers to be read when back in Normal Request or Normal mode depending on the fault. Interrupts only generated in Normal, Normal Request
and Stop modes
67. Unless masked, If masked IRQ remains high and the ISR flags are not set.
7.1.11 Temperature Sense Gain
The analog multiplexer can be configured via the SPI to allow the ADOUT0 pin to deliver the internal junction temperature of the device.
Table 16 illustrates the internal chip temp sense obtained per characterization at 3 temperatures with 3 different lots and 30 samples.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
Temperature Sense Analog Output Voltage
5
4.5
Vadout0 (V)
4
3.5
3
2.5
2
-50
0
50
100
150
Temperature (°C)
Figure 16. Temperature Sense Gain
7.1.12 High-side Output Pins HS1
This output is one high-side driver intended to drive small resistive loads or LEDs incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Overtemperature shutdown (with maskable interrupt)
• High-voltage shutdown (software maskable)
• Cyclic sense
The high-side switch is controlled by the bit HS1 in the High-side Control Register (HSCR).
7.1.12.1
PWM Capability (direct access)
The high-side driver offers additional (to the SPI control) direct control via the PWMIN pin. If the bit HS1 and PWMHS1 are set in the Highside Control Register (HSCR), then the HS1 driver is turned on if the PWMIN pin is high and turned of if the PWMIN pin is low.
33911
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Freescale Semiconductor
33
Interrupt
Control
Module
MOD1:2
HS1
HS1OP
VDD
VDD
PWMIN
High-side Interrupt
High-voltage Shutdown
HVSE
PWMHS1
VS2
on/off
Control
Status
HS1CL
HIgh-side Driver
charge pump
open load detection
current limitation
overtemperture shutdown (interrupt maskable)
High-voltage shutdown (maskable)
Cyclic Sense
HS1
Wake up
Module
Figure 17. High-side Drivers HS1
7.1.12.2
Open Load Detection
The high-side driver signals an open load condition if the current through the high-side is below the open load current threshold. The open
load condition is indicated with the bit HS1OP in the High-side Status Register (HSSR).
7.1.12.3
Current Limitation
The high-side driver has an output current limitation. In combination with the overtemperature shutdown the high-side driver is protected
against overcurrent and short-circuit failures. When the driver operates in the current limitation area, it is indicated with the HS1CL bit in
the HSSR.
Note: If the driver is operating in current limitation mode, excessive power might be dissipated.
7.1.12.4
Overtemperature Protection (HS Interrupt)
The high-side driver is protected against overtemperature. During an overtemperature condition, the high-side driver is shutdown and the
event is latched in the Interrupt Control Module. The shutdown is indicated as HS Interrupt in the Interrupt Source Register (ISR). A thermal
shutdown of the high-side driver is indicated by setting the HS1OP and HS1CL bits simultaneously. If the bit HSM is set in the Interrupt
Mask Register (IMR), then an interrupt (IRQ) is generated. A write to the High-Side Control Register (HSCR), when the overtemperature
condition is gone, re-enables the high-side driver.
7.1.12.5
High-voltage Shutdown
If a high-voltage condition occurs and if the high-voltage shutdown is enabled (bit HVSE in the Mode Control Register (MCR) is set the
high-side driver is shutdown. A write to the High-side Control Register (HSCR), when the high-voltage condition is gone, re-enables the
high-side driver.
7.1.12.6
Sleep And Stop Mode
The high-side driver can be enabled to operate in Sleep and Stop mode for cyclic sensing. See Table 6, Operating Modes Overview.
33911
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
7.1.13 Low-side Output Pins LS1 and LS2
These outputs are two low-side drivers intended to drive relays incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Overtemperature shutdown (with maskable interrupt)
• Active clamp (for driving relays)
• High-voltage shutdown (software maskable)
The low-side switches are controlled by the LS1:2 bit in the Low-side Control Register (LSCR). To protect the device against overvoltage
when an inductive load (relay) is turned off. An active clamp re-enables the low-side FET if the voltage on the LS1 or LS2 pin exceeds a
certain level.
7.1.13.1
PWM Capability (direct access)
Each low-side driver offers additional (to the SPI control) direct control via the PWMIN pin. If both the bits LS1 and PWMLS1 are set in
the Low-side Control Register (LSCR), then the LS1 driver is turned on if the PWMIN pin is high and turned off if the PWMIN pin is low.
The same applies to the LS2 and PWMLS2 bits for the LS2 driver.
HVSE
VDD
Interrupt
Control
Module
VDD
MOD1:2
LSx
LSxOP
PWMLSx
Low Side Interrupt
High-voltage Shutdown
PWMIN
active
clamp
LSx
on/off
Control
Status
LSxCL
Low-side Driver
(active clamp)
Open load Detection
Current Limitation
Overtemperture Shutdown (interrupt maskable)
High-voltage shutdown (maskable)
PGND
Figure 18. Low-side Drivers LS1 and LS2
7.1.13.2
Open Load Detection
Each low-side driver signals an open load condition if the current through the low-side is below the open load current threshold. The open
load condition is indicated with the bit LS1OP and LS2OP in the Low-side Status Register (LSSR).
7.1.13.3
Current Limitation
Each low-side driver has a current limitation. In combination with the overtemperature shutdown the low-side drivers are protected against
overcurrent and short-circuit failures. When the drivers operate in current limitation, this is indicated with the bits LS1CL and LS2CL in the
LSSR.
Note: If the drivers are operating in current limitation mode excessive power might be dissipated.
7.1.13.4
Overtemperature Protection (LS Interrupt)
Both low-side drivers are protected against overtemperature. During an overtemperature condition, both low-side drivers are shutdown
and the event is latched in the Interrupt Control Module. The shutdown is indicated as an LS Interrupt in the Interrupt Source Register
(ISR). If the bit LSM is set in the Interrupt Mask Register (IMR) then an Interrupt (IRQ) is generated. A write to the Low-side Control
Register (LSCR), when the overtemperature condition is gone, re-enables the low-side drivers.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
7.1.13.5
High-voltage Shutdown
In case of a high-voltage condition and if the high-voltage shutdown is enabed (bit HVSE in the Mode Control Register (MCR) is set), both
low-side drivers are shutdown. A write to the Low-side Control Register (LSCR), when the high-voltage condition is gone, re-enables the
low-side drivers.
7.1.13.6
Sleep And Stop Mode
The low-side drivers are disabled in Sleep and Stop mode. See Table 6, Operating Modes Overview.
7.1.14 Lin Physical Layer
The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to
meet the LIN physical layer specification and has the following features:
• LIN physical layer 2.0, 2.1 and SAEJ2602 compliant
• Slew rate selection
• Overtemperature shutdown
• Advanced diagnostics
The LIN driver is a low-side MOSFET with thermal shutdown. An internal pull-up resistor with a serial diode structure is integrated, so no
external pull-up components are required for the application in a slave node. The fall time from dominant to recessive and the rise time
from recessive to dominant is controlled. The symmetry between both slopes is guaranteed.
7.1.14.1
LIN Pin
The LIN pin offers a high susceptibility immunity level from external disturbance, guaranteeing communication during external disturbance.
WAKE-UP
MODULE
LIN
Wake-up
MOD1:2
LSR0:1
J2602
VS1
LIN DRIVER
RXONLY
Slope and Slew Rate Control
RXSHORT
Overtemperature Shutdown (interrupt maskable)
TXDOM
LINOT
30 K
LIN
TXD
SLOPE
CONTROL
WAKE-UP
FILTER
LGND
RXD
RECEIVER
Figure 19. LIN Interface
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Analog Integrated Circuit Device Data
Freescale Semiconductor
7.1.14.2
Slew Rate Selection
The slew rate can be selected for optimized operation at 10.4 and 20 kBit/s as well as a fast baud rate for test and programming. The slew
rate can be adapted with the bits LSR1:0 in the LIN Control Register (LINCR). The initial slew rate is optimized for 20 kBit/s.
7.1.14.3
J2602 Conformance
To be compliant with the SAE J2602-2 specification, the J2602 feature has to be enabled in the LINCR Register (bit DIS_J2602 sets to
0). The LIN transmitter is disabled if a VSUP undervoltage condition occurs and TXD is in the Recessive State: the LIN bus goes in
Recessive State and RXD goes high. The LIN transmitter is not disabled if TXD is in Dominant State. A deglitcher on VSUP (tJ2602_DEG)
is implemented to avoid false switching.
If the (DIS_J2602) bit is set to 1, the J2602 feature is disabled and the communication TXD-LIN-RXD works for VSUP down to 4.6 V (typical
value) and then the communication is interrupted. The (DIS_J2602) bit is set per default to 0.
7.1.14.4
Overtemperature Shutdown (LIN Interrupt)
The output low-side FET is protected against overtemperature conditions. In case of an overtemperature condition, the transmitter is
shutdown and the LINOT bit in the LIN Status Register (LINSR) is set. If the LINM bit is set in the Interrupt Mask Register (IMR), an
Interrupt IRQ is generated. The transmitter is automatically re-enabled once the condition is gone and TXD is high.
7.1.14.5
RXD Short-circuit Detection (LIN Interrupt)
The LIN transceiver has a short-circuit detection for the RXD output pin. If the device transmits and in case of a short-circuit condition, on
either 5.0 V or Ground, the RXSHORT bit in the LIN Status Register (LINSR) is set and the transmitter is shutdown. If the LINM bit is set
in the Interrupt Mask Register (IMR), an Interrupt IRQ is generated. The transmitter is automatically re-enabled once the condition is gone
(transition on RXD) and TXD is high. A read of the LIN Status Register (LINSR) without the RXD pin short-circuit condition clears the bit
RXSHORT.
7.1.14.6
TXD Dominant Detection (LIN Interrupt)
The LIN transceiver monitors the TXD input pin to detect a stuck in dominant (0 V) condition. During a stuck condition (TXD pin 0 V for
more than 1 second (typ.)), the transmitter is shutdown and the TXDOM bit in the LIN Status Register (LINSR) is set. If the LINM bit is set
in the IMR, an Interrupt IRQ is generated. The transmitter is automatically re-enabled once TXD is high. A read of the LIN Status Register
(LINSR) with the TXD pin at 5.0 V clears the bit TXDOM.
7.1.14.7
LIN Receiver Operation Only
While in Normal mode, the activation of the RXONLY bit disables the LIN TXD driver. In case of a LIN error condition, this bit is
automatically set. If Stop mode is selected with this bit set, the LIN wake-up functionality is disabled and the RXD pin reflects the state of
the LIN bus.
7.1.14.8
STOP Mode And Wake-up Feature
During Stop mode operation, the transmitter of the physical layer is disabled. The receiver is still active and able to detect wake-up events
on the LIN bus line. A dominant level longer than tPROPWL followed by a rising edge generates a wake-up interrupt, and is reported in the
Interrupt Source Register (ISR). See Figure 11.
7.1.14.9
SLEEP Mode And Wake-up Feature
During Sleep mode operation, the transmitter of the physical layer is disabled. The receiver must be active to detect wake-up events on
the LIN bus line. A dominant level longer than tPROPWL followed by a rising edge generates a system wake-up (Reset), and is reported in
the Interrupt Source Register (ISR). See Figure 10.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
7.2
Logic Commands and Registers
7.2.1
33911 SPI Interface and Configuration
The serial peripheral interface creates the communication link between a microcontroller (master) and the 33911. The interface consists
of four pins (see Figure 20):
• CS — Chip Select
• MOSI — Master-out Slave-in
• MISO — Master-in Slave-out
• SCLK— Serial Clock
A complete data transfer via the SPI consists of 1 byte. The master sends 4 bits of address (A3:A0) + 4 bits of control information (C3:C0)
and the slave replies with 4 system status bits (VMS,LINS,HSS,LSS) + 4 bits of status information (S3:S0).
CS
Register Write Data
MOSI
A3
A2
A1
A0
C3
C2
C1
C0
S1
S0
Register Read Data
MISO
VMS LINS HSS
LSS
S3
S2
SCLK
Read Data Latch
Rising: 33911 changes MISO/
MCU changes MOSI
Write Data Latch
Falling: 33911 samples MOSI/
MCU samples MISO
Figure 20. SPI Protocol
During the inactive phase of the CS (HIGH), the new data transfer is prepared. The falling edge of the CS indicates the start of a new data
transfer, puts the MISO in the low-impedance state, and latches the analog status data (Register read data). With the rising edge of the
SPI clock (SCLK), the data is moved to the MISO/MOSI pins. With the falling edge of the SPI clock (SCLK), the data is sampled by the
receiver. The data transfer is only valid if exactly 8 sample clock edges are present during the active (low) phase of CS.
The rising edge of the Chip Select CS indicates the end of the transfer and latches the write data (MOSI) into the register. The CS high
forces MISO to the high-impedance state. Register reset values are described along with the reset condition. Reset condition is the
condition causing the bit to be set to its reset value. The main reset conditions are:
- Power-On Reset (POR): the level at which the logic is reset and BATFAIL flag sets.
- Reset mode
- Reset done by the RST pin (ext_reset)
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Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.2
SPI Register Overview
Table 8. System Status Register
Adress(A3:A0)
$0 - $F
BIT
Register Name / Read / Write Information
SYSSR - System Status Register
R
7
6
5
4
VMS
LINS
HSS
LSS
Table 9 summarizes the SPI Register content for Control Information (C3:C0) = W and status information (S3:S0) = R.
Table 9. SPI Register Overview
Adress(A3:A0)
$0
$1
$2
$3
$4
$5
BIT
Register Name / Read / Write Information
3
2
1
0
MCR - Mode Control Register
W
HVSE
0
MOD2
MOD1
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
WUCR - Wake-up Control Register
W
0
0
L2WE
L1WE
WUSR - Wake-up Status Register
R
-
-
L2
L1
WUSR - Wake-up Status Register
R
-
-
L2
L1
LINCR - LIN Control Register
W
DIS_J2602
RXONLY
LSR1
LSR0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
0
HSCR - High-side Control Register
W
0
PWMHS1
0
HS1
HSSR - High-side Status Register
R
-
-
HS1OP
HS1CL
HSSR - High-side Status Register
R
-
-
HS1OP
HS1CL
LSCR - Low-side Control Register
W
PWMLS2
PWMLS1
LS2
LS1
LSSR - Low-side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
LSSR - Low-side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
TIMCR - Timing Control Register
W
CS/WD
WD2
WD1
WD0
CYST2
CYST1
CYST0
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$B
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$C
AMUXCR - Analog Multiplexer Control Register
W
LXDS
MX2
MX1
MX0
$6
$7
$8
$9
$A
$D
$E
$F
CFR - Configuration Register
W
0
CYSX8
0
0
IMR - Interrupt Mask Register
W
HSM
LSM
LINM
VMM
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
7.2.3
7.2.3.1
Register Definitions
System Status Register - SYSSR
The System Status Register (SYSSR) is always transferred with every SPI transmission and gives a quick system status overview. It
summarizes the status of the Voltage Monitor Status (VMS), LIN Status (LINS), High-side Status (HSS), and the Low-side Status (LSS).
Table 10. System Status Register
Read
7.2.3.2
S7
S6
S5
S4
VMS
LINS
HSS
LSS
VMS - Voltage Monitor Status
This read-only bit indicates one or more bits in the VSR are set.
1 = Voltage Monitor bit set
0 = None
BATFAIL
VDDOT
VSUV
VMS
VSOV
Figure 21. Voltage Monitor Status
7.2.3.3
LINS - LIN Status
This read-only bit indicates one or more bits in the LINSR are set.
1 = LIN Status bit set
0 = None
LINOT
TXDOM
LINS
RXSHORT
Figure 22. LIN Status
7.2.3.4
HSS - High-side Switch Status
This read-only bit indicates one or more bits in the HSSR are set.
1 = High-side Status bit set
0 = None
HS1CL
HS1OP
HSS
Figure 23. High-side Status
33911
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.3.5
LSS - Low-side Switch Status
This read-only bit indicates one or more bits in the LSSR are set.
1 = Low-side Status bit set
0 = None
LS1CL
LS1OP
LSS
LS2CL
LS2OP
Figure 24. Low-side Status
7.2.3.6
Mode Control Register - MCR
The Mode Control Register (MCR) allows switching between the operation modes and to configure the 33911. Writing the MCR returns
the VSR.
Table 11. Mode Control Register - $0
C3
7.2.3.7
C2
C1
C0
Write
HVSE
0
MOD2
MOD1
Reset Value
1
0
-
-
Reset Condition
POR
POR
-
-
HVSE - High-Voltage Shutdown Enable
This write-only bit enables/disables automatic shutdown of the high-side and the low-side drivers during a high-voltage VSOV condition.
1 = automatic shutdown enabled
0 = automatic shutdown disabled
7.2.3.8
MOD2, MOD1 - Mode Control Bits
These write-only bits select the operating mode and allow clearing the watchdog in accordance with Table 7 Mode Control Bits.
Table 12. Mode Control Bits
7.2.3.9
MOD2
MOD1
Description
0
0
Normal mode
0
1
Stop mode
1
0
Sleep mode
1
1
Normal mode + Watchdog Clear
Voltage Status Register - VSR
Returns the status of the several voltage monitors. This register is also returned when writing to the Mode Control Register (MCR).
Table 13. Voltage Status Register - $0/$1
Read
S3
S2
S1
S0
VSOV
VSUV
VDDOT
BATFAIL
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
7.2.3.10
VSOV - VSUP Overvoltage
This read-only bit indicates an overvoltage condition on the VS1 pin.
1 = Overvoltage condition.
0 = Normal condition.
7.2.3.11
VSUV - VSUP Undervoltage
This read-only bit indicates an undervoltage condition on the VS1 pin.
1 = Undervoltage condition.
0 = Normal condition.
7.2.3.12
VDDOT - Main Voltage Regulator Overtemperature Warning
This read-only bit indicates the main voltage regulator temperature reached the Overtemperature Prewarning Threshold.
1 = Overtemperature Prewarning
0 = Normal
7.2.3.13
BATFAIL - Battery Fail Flag
This read-only bit is set during power-up and indicates the 33911 had a Power-On-Reset (POR). Any access to the MCR or VSR clears
the BATFAIL flag.
1 = POR Reset has occurred
0 = POR Reset has not occurred
7.2.3.14
Wake-up Control Register - WUCR
This register is used to control the digital wake-up inputs. Writing the WUCR returns the Wake-up Status Register (WUSR).
Table 14. Wake-up Control Register - $2
C3
C1
C0
Write
0
0
L2WE
L1WE
Reset Value
1
1
1
1
Reset Condition
7.2.3.15
C2
POR, Reset mode or ext_reset
LxWE - Wake-up Input x Enable
This write-only bit enables/disables which Lx inputs are enabled. In Stop and Sleep mode the LxWE bit determines which wake inputs are
active for wake-up. If one of the Lx inputs is selected on the analog multiplexer, the corresponding LxWE is masked to 0.
1 = Wake-up Input x enabled.
0 = Wake-up Input x disabled.
7.2.3.16
Wake-up Status Register - WUSR
This register is used to monitor the digital wake-up inputs and is also returned when writing to the WUCR.
Table 15. Wake-up Status Register - $2/$3
Read
S3
S2
S1
S0
-
-
L2
L1
33911
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.3.17
Lx - Wake-up Input X
This read-only bit indicates the status of the corresponding Lx input. If the Lx input is not enabled, then the according Wake-up status
returns 0. After a wake-up from Stop or Sleep mode these bits also allow to determine which input has caused the wake-up, by first reading
the Interrupt Status Register (ISR) and then reading the WUSR. The source of the wake-up is only reported on the first WUCR or WUSR
access.
1 = Lx pin high, or Lx is the source of the wake-up.
0 = Lx pin low, disabled or selected as an analog input.
7.2.3.18
LIN Control Register - LINCR
This register controls the LIN physical interface block. Writing the LIN Control Register (LINCR) returns the LIN Status Register (LINSR).
Table 16. LIN Control Register - $4
C3
C2
C1
C0
Write
DIS_J2602
RXONLY
LSR1
LSR0
Reset Value
0
0
0
0
Reset Condition
POR
POR, Reset mode,
ext_reset or LIN
failure gone*
POR
* LIN failure gone: if LIN failure (overtemp, TXD/RXD short) was set, the flag resets automatically when the failure is gone.
7.2.3.19
J2602 - LIN Dominant Voltage Select
This write-only bit controls the J2602 circuitry. If the circuitry is enabled (bit sets to 0), the TXD-LIN-RXD communication works down to
the battery undervoltage condition is detected. Below, the bus is in recessive state. If the circuitry is disabled (bit sets to 1), the
communication TXD-LIN-RXD works down to 4.6 V (typical value).
0 = Enabled J2602 feature.
1 = Disabled J2602 feature.
7.2.3.20
RXONLY - LIN Receiver Operation Only
This write-only bit controls the behavior of the LIN transmitter. In Normal mode, the activation of the RXONLY bit disables the LIN
transmitter. During a LIN error condition, this bit is automatically set. In Stop mode this bit disables the LIN wake-up functionality, and the
RXD pin reflects the state of the LIN bus.
1 = only LIN receiver active (Normal mode) or LIN wake-up disabled (Stop mode).
0 = LIN fully enabled.
7.2.3.21
LSRx - LIN Slew-Rate
This write-only bit controls the LIN driver slew-rate in accordance with Table 17.
Table 17. LIN Slew Rate Control
LSR1
LSR0
Description
0
0
Normal Slew Rate (up to 20 kb/s)
0
1
Slow Slew Rate (up to 10 kb/s)
1
0
Fast Slew Rate (up to 100 kb/s)
1
1
Reserved
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
7.2.3.22
LIN Status Register - LINSR
This register returns the status of the LIN physical interface block and is also returned when writing to the LINCR.
Table 18. LIN Status Register - $4/$5
Read
7.2.3.23
S3
S2
S1
S0
RXSHORT
TXDOM
LINOT
0
RXSHORT - RXD Pin Short-circuit
This read-only bit indicates a short-circuit condition on the RXD pin (shorted either to 5.0 V or to Ground). The short-circuit delay must be
a worst case of 8.0 μs to be detected and to shutdown the driver. To clear this bit, it must be read after the condition is gone (transition
detected on RXD pin). The LIN driver is automatically re-enabled once the condition is gone and TXD is high.
1 = RXD short-circuit condition.
0 = None.
7.2.3.24
TXDOM - TXD Permanent Dominant
This read-only bit signals the detection of a TXD pin stuck at dominant (Ground) condition and the resultant shutdown in the LIN
transmitter. This condition is detected after the TXD pin remains in dominant state for more than 1.0 second (typical value). To clear this
bit, it must be read after TXD has gone high. The LIN driver is automatically re-enabled once TXD goes High.
1 = TXD stuck at dominant fault detected.
0 = None.
7.2.3.25
LINOT - LIN Driver Overtemperature
This read-only bit signals the LIN transceiver was shutdown due to overtemperature. The transmitter is automatically re-enabled after the
overtemperature condition is gone and TXD is high. The LINOT bit is cleared after the SPI read once the condition is gone.
1 = LIN overtemperature shutdown
0 = None
7.2.3.26
High-side Control Register - HSCR
This register controls the operation of the high-side driver. Writing to this register returns the High-side Status Register (HSSR).
Table 19. High-side Control Register - $6
C3
C2
C1
C0
Write
0
PWMHS1
0
HS1
Reset Value
0
0
0
0
Reset Condition
7.2.3.27
POR
POR, Reset mode, ext_reset, HS1
overtemp or (VSOV & HVSE)
PWMHS1 - PWM Input Control Enable.
This write-only bit enables/disables the PWMIN input pin to control the high-side switch. The high-side switch must be enabled (HS1 bit).
1 = PWMIN input controls HS1 output.
0 = HS1 is controlled only by SPI.
33911
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Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.3.28
HS1 - HS1 Switch Control.
This write-only bit enables/disables the high-side switch.
1 = HS1 switch on.
0 = HS1 switch off.
7.2.3.29
High-side Status Register - HSSR
This register returns the status of the high-side switch and is also returned when writing to the HSCR.
Table 20. High-side Status Register - $6/$7
Read
7.2.3.30
S3
S2
S1
S0
-
-
HS1OP
HS1CL
High-side Thermal Shutdown
A thermal shutdown of the high-side driver is indicated by setting the HS1OP and HS1CL bits simultaneously.
7.2.3.31
HS1OP - High-side Switch Open Load Detection
This read-only bit signals the high-side switch is conducting current below a certain threshold indicating possible load disconnection.
1 = HS1 Open Load detected (or thermal shutdown)
0 = Normal
7.2.3.32
HS1CL - High-side Current Limitation
This read-only bit indicates the high-side switch is operating in current limitation mode.
1 = HS1 in current limitation (or thermal shutdown)
0 = Normal
Low-side Control Register - LSCR
This register controls the operation of the low-side drivers. Writing the Low-side Control Register (LSCR) also returns the Low-side Status
Register (LSSR).
Table 21. Low-side Control Register - $8
C3
Write
Reset Value
Reset Condition
7.2.3.33
C2
PWMLS2 PWMLS1
0
0
POR
C1
C0
LS2
LS1
0
0
POR, Reset mode, ext_reset, LSx
overtemp or (VSOV & HVSE)
PWMLx - PWM Input Control Enable
This write-only bit enables/disables the PWMIN input pin to control the respective low-side switch. The corresponding low-side switch must
be enabled (LSx bit).
1 = PWMIN input controls LSx.
0 = LSx is controlled only by SPI.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
7.2.3.34
LSx - LSx Switch Control
This write-only bit enables/disables the corresponding low-side switch.
1 = LSx switch on.
0 = LSx switch off.
7.2.3.35
Low-side Status Register - LSSR
This register returns the status of the low-side switches and is also returned when writing to the LSCR.
Table 22. Low-side Status Register - $8/$9
Read
7.2.3.36
C3
C2
C1
C0
LS2OP
LS2CL
LS1OP
LS1CL
Low-side Thermal Shutdown
A thermal shutdown of the low-side drivers is indicated by setting all LSxOP and LSxCL bits simultaneously.
7.2.3.37
LSxOP - Low-side Switch Open Load Detection
This read-only bit signals the low-side switches are conducting current below a certain threshold indicating possible load disconnection.
1 = LSx Open Load detected (or thermal shutdown)
0 = Normal
7.2.3.38
LSxCL - Low-side Current Limitation
This read-only bit indicates the respective low-side switch is operating in current limitation mode.
1 = LSx in current limitation (or thermal shutdown)
0 = Normal
7.2.3.39
Timing Control Register - TIMCR
This register allows to configure the watchdog, the cyclic sense and forced wake-up periods. Writing to the Timing Control Register
(TIMCR) also returns the Watchdog Status Register (WDSR).
Table 23. Timing Control Register - $A
C3
7.2.3.40
Write
CS/WD
Reset Value
-
Reset Condition
-
C2
C1
C0
WD2
WD1
WD0
CYST2
CYST1
CYST0
0
0
0
POR
CS/WD - Cyclic Sense or Watchdog Prescaler Select
This write-only bit selects which prescaler is being written to the Cyclic Sense/Forced Wake-up prescaler or the Watchdog prescaler.
1 = Cyclic Sense/Forced Wake-up Prescaler selected
0 = Watchdog Prescaler select
33911
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.3.41
WDx - Watchdog Prescaler
This write-only bits selects the divider for the watchdog prescaler and therefore selects the watchdog period in accordance with Table 24.
This configuration is valid only if windowing watchdog is active.
Table 24. Watchdog Prescaler
7.2.3.42
WD2
WD1
WD0
Prescaler Divider
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
6
1
0
0
8
1
0
1
10
1
1
0
12
1
1
1
14
CYSTx - Cyclic Sense Period Prescaler Select
This write-only bits selects the interval for the wake-up cyclic sensing together with the bit CYSX8 in the Configuration Register (CFR)
(see Configuration Register - CFR on page 49). This option is only active if the high-side switch is enabled when entering in Stop or Sleep
mode. Otherwise a timed wake-up is performed after the period shown in Table 25.
Table 25. Cyclic Sense and Force Wake-up Interval
CYSX8 (68)
CYST2
CYST1
CYST0
Interval
X
0
0
0
No cyclic sense (69)
0
0
0
1
20 ms
0
0
1
0
40 ms
0
0
1
1
60 ms
0
1
0
0
80 ms
0
1
0
1
100 ms
0
1
1
0
120 ms
0
1
1
1
140 ms
1
0
0
1
160 ms
1
0
1
0
320 ms
1
0
1
1
480 ms
1
1
0
0
640 ms
1
1
0
1
800 ms
1
1
1
0
960 ms
1
1
1
1
1120 ms
Notes
68. bit CYSX8 is located in Configuration Register (CFR)
69. No Cyclic Sense and no Force Wake up available.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
7.2.3.43
Watchdog Status Register - WDSR
This register returns the Watchdog status information and is also returned when writing to the TIMCR.
Table 26. Watchdog Status Register - $A/$B
Read
7.2.3.44
S3
S2
S1
S0
WDTO
WDERR
WDOFF
WDWO
WDTO - Watchdog Timeout
This read-only bit signals the last reset was caused by either a watchdog timeout or by an attempt to clear the watchdog within the window
closed. Any access to this register or the Timing Control Register (TIMCR) clears the WDTO bit.
1 = Last reset caused by watchdog timeout
0 = None
7.2.3.45
WDERR - Watchdog Error
This read-only bit signals the detection of a missing watchdog resistor. In this condition the watchdog is using the internal, lower precision
timebase. The Windowing function is disabled.
1 = WDCONF pin resistor missing
0 = WDCONF pin resistor not floating
7.2.3.46
WDOFF - Watchdog Off
This read-only bit signals the watchdog pin connected to Ground and therefore disabled. In this case, watchdog timeouts are disabled and
the device automatically enters Normal mode out of Reset. This might be necessary for software debugging and for programming the flash
memory.
1 = Watchdog is disabled
0 = Watchdog is enabled
7.2.3.47
WDWO - Watchdog Window Open
This read-only bit signals when the watchdog window is open for clears. The purpose of this bit is for testing. This should be ignored if
WDERR is High.
1 = Watchdog window open
0 = Watchdog window closed
7.2.3.48
Analog Multiplexer Control Register - MUXCR
This register controls the analog multiplexer and selects the divider ration for the Lx input divider.
Table 27. Analog Multiplexer Control Register -$C
Write
7.2.3.49
C3
C2
C1
C0
LXDS
MX2
MX1
MX0
0
0
0
Reset Value
1
Reset Condition
POR
POR, Reset mode or ext_reset
LXDS - Lx Analog Input Divider Select
This write-only bit selects the resistor divider for the Lx analog inputs. Voltage is internally clamped to VDD.
0 = Lx Analog divider: 1
1 = Lx Analog divider: 3.6 (typ.)
33911
48
Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.3.50
MXx - Analog Multiplexer Input Select
These write-only bits selects which analog input is multiplexed to the ADOUT0 pin according to Table 28. When disabled or when in Stop
or Sleep mode, the output buffer is not powered and the ADOUT0 output is left floating to achieve lower current consumption.
Table 28. Analog Multiplexer Channel Select
MX2
MX1
MX0
Meaning
0
0
0
Disabled
0
0
1
Reserved
0
1
0
Die Temperature Sensor (70)
0
1
1
VSENSE input
1
0
0
L1 input
1
0
1
L2 input
1
1
0
Reserved
1
1
1
Reserved
Notes
70. Accessing the Die Temperature Sensor directly from the Disabled state is not
recommended. If this transition must be performed and to avoid the intermediate
state, wait at least 1.0 ms, then start the die temp measurement.
Possible access is Disabled → Vsense input → Die Temperature Sensor.
7.2.3.51
Configuration Register - CFR
This register controls the cyclic sense timing multiplier.
Table 29. Configuration Register - $D
C3
C2
C1
C0
0
CYSX8
0
0
Reset Value
0
0
0
0
Reset Condition
POR, Reset mode or
ext_reset
POR
POR
POR
Write
7.2.3.52
CYSX8 - Cyclic Sense Timing x 8
This write-only bit influences the cyclic sense and forced wake-up period as shown in Table 25.
1 = Multiplier enabled
0 = None
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
7.2.3.53
Interrupt Mask Register - IMR
This register allows masking of some of the interrupt sources. No interrupt is generated to the MCU and no flag is set in the ISR register.
The 5.0 V Regulator overtemperature prewarning interrupt and undervoltage (VSUV) interrupts can not be masked and always causes an
interrupt. Writing to the IMR returns the ISR.
Table 30. Interrupt Mask Register - $E
C3
C2
C1
C0
Write
HSM
LSM
LINM
VMM
Reset Value
1
1
1
1
Reset Condition
7.2.3.54
POR
HSM - High-side Interrupt Mask
This write-only bit enables/disables interrupts generated in the high-side block.
1 = HS Interrupts Enabled
0 = HS Interrupts Disabled
7.2.3.55
LSM - Low-side Interrupt Mask
This write-only bit enables/disables interrupts generated in the low-side block.
1 = LS Interrupts Enabled
0 = LS Interrupts Disabled
7.2.3.56
LINM - LIN Interrupts Mask
This write-only bit enables/disables interrupts generated in the LIN block.
1 = LIN Interrupts Enabled
0 = LIN Interrupts Disabled
7.2.3.57
VMM - Voltage Monitor Interrupt Mask
This write-only bit enables/disables interrupts generated in the voltage monitor block. The only maskable interrupt in the voltage monitor
block is the VSUP overvoltage interrupt.
1 = Interrupts Enabled
0 = Interrupts Disabled
7.2.3.58
Interrupt Source Register - ISR
This register allows the MCU to determine the source of the last interrupt or wake-up respectively. A read of the register acknowledges
the interrupt and leads IRQ pin to high, in case there are no other pending interrupts. If there are pending interrupts, IRQ is driven high for
10µs and then be driven low again. This register is also returned when writing to the Interrupt Mask Register (IMR).
Table 31. Interrupt Source Register - $E/$F
Read
S3
S2
S1
S0
ISR3
ISR2
ISR1
ISR0
33911
50
Analog Integrated Circuit Device Data
Freescale Semiconductor
7.2.3.59
ISRx - Interrupt Source Register
These read-only bits indicate the interrupt source following Table 32. If no interrupt is pending then all bits are 0. In case more than one
interrupt is pending, the interrupt sources are handled sequentially multiplex.
Table 32. Interrupt Sources
Interrupt Source
Priority
ISR3
ISR2
ISR1
ISR0
none maskable
maskable
0
0
0
0
no interrupt
no interrupt
none
0
0
0
1
Lx Wake-up from Stop and Sleep mode
-
highest
0
0
1
0
-
HS Interrupt (overtemperature)
0
0
1
1
-
LS Interrupt (overtemperature)
0
1
0
0
LIN Wake-up
LIN Interrupt (RXSHORT, TXDOM, LIN OT)
0
1
0
1
Voltage Monitor Interrupt (low-voltage and VDD
overtemperature)
Voltage Monitor Interrupt (high-voltage)
0
1
1
0
Forced Wake-up
-
lowest
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
51
8
Typical Application
The 33911 can be configured in several applications. The figure below shows the 33911 in the typical Slave Node Application.
VBAT
VS2
VS1
D1
C2
C1
C4
Interrupt
Control Module
LVI, HVI, HTI, OCI
IRQ
C3
Internal
Bus
VDD
Voltage Regulator
AGND
VDD
IRQ
Reset
Control Module
LVR, HVR, HTR, WD,
RST
LS1
Low Side Control
Module
RST
TIMER
HB Type Relay
PGND
Window
Watchdog Module
PWMIN
LS2
R1
Motor Output
High Side Control
Module
HS1
MISO
MOSI
Chip Temp Sense Module
SCLK
Analog Multiplexer
SPI
&
CONTROL
SPI
CS
MCU
VSENSE
VBAT Sense Module
L1
Analog Input Module
A/D
ADOUT0
L2
R2
R3
Wake Up Module
Digital Input Module
RXD
LIN Physical Layer
SCI
LIN
LIN
TXD
WDCONF
LGND
AGND
PGND
C5
R4
Typical Component Values:
C1 = 47 µF; C2 = C4 = 100 nF; C3 = 10 µF; C5 = 220 pF
R1 = 10 kΩ; R2 = R3 = 10 kΩ; R4 = 20 kΩ-200 kΩ
Recommended Configuration of the not Connected Pins (NC):
Pin 15, 16, 20, 21 = GND
Pin 11, 30 = open (floating)
Pin 24 = open (floating) or VS2
Pin 28 = this pin is not internally connected and may be used for PCB
routing optimization.
33911
52
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
MC33911BAC Product Specifications - page 53 to page 100
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
53
10
Internal Block Diagram
VS2
INTERRUPT
CONTROL
MODULE
LVI, HVI, HTI, OCI
VS1
INTERNAL BUS
RST IRQ
VDD
AGND
VOLTAGE REGULATOR
RESET CONTROL
MODULE
LVR, HVR, HTR, WD
WINDOW
WATCHDOG
MODULE
VS2
HIGH-SIDE
CONTROL
MODULE
MISO
CS
ADOUT0
WAKE-UP MODULE
RXD
TXD
HS1
SPI
&
CONTROL
ANALOG MULTIPLEXER
SCLK
LS2
PGND
PWMIN
MOSI
LS1
LOW-SIDE
CONTROL
MODULE
VBAT
SENSE MODULE
VSENSE
CHIP TEMPERATURE
SENSE MODULE
L1
ANALOG INPUT
MODULE
L2
DIGITAL INPUT MODULE
LIN PHYSICAL
LAYER
LIN
LGND
WDCONF
Figure 25. 33911BAC Simplified Internal Block Diagram
33911
54
Analog Integrated Circuit Device Data
Freescale Semiconductor
VDD
NC*
VSENSE
NC
VS1
VS2
HS1
30
29
28
27
26
25
Pinout Diagram
31
12
AGND
Pin Connections
32
11
RXD
1
24
NC*
TXD
2
23
L1
MISO
3
22
L2
MOSI
4
21
NC*
SCLK
5
20
NC*
CS
6
19
LS1
ADOUT0
7
18
PGND
PWMIN
8
17
LS2
9
10
11
12
13
14
15
16
RST
IRQ
NC*
WDCONF
LIN
LGND
NC*
NC*
* Special Configuration Recommended /
Mandatory for Marked NC Pins
Figure 26. 33911 Pin Connections
12.1
Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section.
Table 33. 33911 Pin Definitions
Pin
Pin Name
Formal Name
1
RXD
Receiver Output
This pin is the receiver output of the LIN interface which reports the state of the bus
voltage to the MCU interface.
2
TXD
Transmitter Input
This pin is the transmitter input of the LIN interface which controls the state of the bus
output.
3
MISO
SPI Output
4
MOSI
SPI Input
SPI (Serial Peripheral Interface) data input.
5
SCLK
SPI Clock
SPI (Serial Peripheral Interface) clock Input.
6
CS
SPI Chip Select
7
ADOUT0
Analog Output Pin 0
Definition
SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the highimpedance state.
SPI (Serial Peripheral Interface) chip select input pin. CS is active low.
Analog Multiplexer Output.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
Table 33. 33911 Pin Definitions
Pin
Pin Name
Formal Name
Definition
8
PWMIN
PWM Input
9
RST
Internal Reset I/O
Bidirectional reset I/O pin - driven low when any internal reset source is asserted. RST
is active low.
10
IRQ
Internal Interrupt
Output
Interrupt output pin, indicating wake-up events from Stop mode or events from Normal
and Normal Request modes. IRQ is active low.
12
WDCONF
Watchdog
Configuration Pin
This input pin is for configuration of the watchdog period and allows the disabling of the
watchdog.
High-side and low-side pulse-width modulation input.
13
LIN
LIN Bus
14
LGND
LIN Ground Pin
This pin represents the single-wire bus transmitter and receiver.
17
19
LS2
LS1
Low-side Outputs
Relay drivers low-side outputs.
18
PGND
Power Ground Pin
This pin is the device low-side ground connection. It is internally connected to the LGND
pin.
22
23
L2
L1
Wake-up Inputs
These pins are the wake-up capable digital inputs (71). In addition, all LX inputs can be
sensed analog via the analog multiplexer.
25
HS1
High-side Output
High-side switch output.
26
27
VS2
VS1
Power Supply Pin
These pins are device battery level power supply pins. VS2 is supplying the HS1 driver
while VS1 supplies the remaining blocks.(72)
29
VSENSE
Voltage Sense Pin
Battery voltage sense input. (73)
31
VDD
Voltage Regulator
Output
+5.0V main voltage regulator output pin. (74)
32
AGND
Analog Ground Pin
This pin is the device analog ground connection.
This pin is the device LIN ground connection. It is internally connected to the PGND pin.
Notes
71. When used as a digital input, a series 33 kΩ resistor must be used to protect against automotive transients.
72. Reverse battery protection series diodes must be used externally to protect the internal circuitry.
73. This pin can be connected directly to the battery line for voltage measurements. The pin is self-protected against reverse battery connections. It
is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
74. External capacitor (2.0 µF < C < 100 µF; 0.1Ω < ESR < 10 Ω) required.
33911
56
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
Electrical Characteristics
13.1
Maximum Ratings
Table 34. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
Ratings
Value
Unit
Supply Voltage at VS1 and VS2
• Normal Operation (DC)
• Transient Conditions (load dump)
-0.3 to 27
-0.3 to 40
V
VDD
Supply Voltage at VDD
-0.3 to 5.5
V
VIN
Input / Output Pins Voltage
• CS, RST, SCLK, PWMIN, ADOUT0, MOSI, MISO, TXD, RXD
• Interrupt Pin (IRQ)
-0.3 to VDD +0.3
-0.3 to 11
V
HS1 Pin Voltage (DC)
- 0.3 to VSUP +0.3
V
LS1 and LS2 Pin Voltage (DC)
-0.3 to 45
V
L1 and L2 Pin Voltage
• Normal Operation with a series 33 kΩ resistor (DC)
• Transient input voltage with external component (according to ISO7637-2)
(See Figure 28)
-18 to 40
±100
V
VVSENSE
VSENSE Pin Voltage (DC)
-27 to 40
V
VBUSDC
VBUSTR
LIN Pin Voltage
• Normal Operation (DC)
• Transient input voltage with external component (according to ISO7637-2)
(See Figure )
-18 to 40
-150 to 100
V
Internally Limited
A
Notes
Electrical Ratings
VSUP(SS)
VSUP(PK)
VIN(IRQ)
VHS1
VLS
VLxDC
VLxTR
IVDD
VESD1-1
VESD1-2
VESD2
VESD3-1
VESD3-2
VNC
VDD output current
ESD Voltage
• Human Body Model - LIN Pin
• Human Body Model - all other Pins
• Machine Model
• Charge Device Model
• Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25, and 32)
• All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
NC Pin Voltage (NC pins 11, 15, 16, 20, 21, 24, 28, and 30)
(75)
± 8000
±2000
± 150
(76)
(77)
(77)
V
(78)
(79)
± 750
± 500
Note 80
(80)
Notes
75. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device.
76. Extended voltage range for programming purpose only.
77. Testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω),
78.
Testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω),
79.
Testing is performed in accordance with the Charge Device Model, Robotic (CZAP = 4.0 pF).
80.
Special configuration recommended / mandatory for marked NC pins. Please refer to the typical application shown on page 100.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
57
Table 34. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
Ratings
Value
Unit
Notes
(81)
Thermal Ratings
TA
Operating Ambient Temperature
• 33911
• 34911
-40 to 125
-40 to 85
°C
TJ
Operating Junction Temperature
-40 to 150
°C
TSTG
Storage Temperature
-55 to 150
°C
RθJA
Thermal Resistance, Junction to Ambient
• Natural Convection, Single Layer board (1s)
85
56
°C/W
23
°C/W
(85)
Note 87
°C
(86), (87)
RθJC
TPPRT
• Natural Convection, Four Layer board (2s2p)(82), (84)
Thermal Resistance, Junction to Case
Peak Package Reflow Temperature During Reflow
(82), (83)
(82), (84)
Notes
81. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
82.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
83.
84.
85.
86.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to
view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
87.
33911
58
Analog Integrated Circuit Device Data
Freescale Semiconductor
13.2
Static Electrical Characteristics
Table 35. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
5.5
–
18
V
Notes
Supply Voltage Range (VS1, VS2)
VSUP
Nominal Operating Voltage
VSUPOP
Functional Operating Voltage
–
–
27
V
VSUPLD
Load Dump
–
–
40
V
(88)
Supply Current Range (VSUP = 13.5 V)
IRUN
Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State
–
4.5
10
mA
ISTOP
Stop Mode, VDD ON with IOUT = 100 µA, LIN Recessive State
• 5.5 V < VSUP < 12 V
• VSUP = 13.5 V
–
–
48
58
80
90
µA
ISLEEP
Sleep Mode, VDD OFF, LIN Recessive State
• 5.5 V < VSUP < 12 V
• 12 V ≤ VSUP < 13.5 V
–
–
27
37
35
48
µA
(89), (91)
ICYCLIC
Cyclic Sense Supply Current Adder
–
10
–
µA
(92)
Power-On Reset (BATFAIL)
• Threshold (measured on VS1)
• Hysteresis (measured on VS1)
1.5
–
3.0
0.9
3.9
–
V
VSUV_HYS
VSUP Undervoltage Detection (VSUV Flag) (Normal and Normal Request Modes,
Interrupt Generated)
• Threshold (measured on VS1)
• Hysteresis (measured on VS1)
5.55
–
6.0
1.0
6.6
–
VSOV
VSOV_HYS
VSUP Overvoltage Detection (VSOV Flag) (Normal and Normal Request Modes,
Interrupt Generated)
• Threshold (measured on VS1)
• Hysteresis (measured on VS1)
18
–
19.25
1.0
20.5
–
(89)
(89), (90),
(91)
Supply Under/over Voltage Detections
VBATFAIL
VBATFAIL_HYS
VSUV
(93)
(92)
(92)
V
V
Notes
88. Device is fully functional. All features are operating.
89. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled.
90. Total IDD current (including loads) below 100 µA.
91.
92.
93.
Stop and Sleep modes current increases if VSUP exceeds 13.5 V.
This parameter is guaranteed by process monitoring but not production tested.
The flag is set during power-up sequence. To clear the flag, a SPI read must be performed.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
59
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Voltage Regulator
Characteristic
(94)
Min
Typ
Max
Unit
4.75
5.00
5.25
V
Notes
(VDD)
VDDRUN
Normal Mode Output Voltage
• 1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V
IVDDRUN
Normal Mode Output Current Limitation
60
110
200
mA
VDDDROP
Dropout Voltage
• IVDD = 50 mA
–
0.1
0.25
V
VDDSTOP
Stop Mode Output Voltage
• IVDD < 5.0 mA
4.75
5.0
5.25
V
IVDDSTOP
Stop Mode Output Current Limitation
6.0
12
36
mA
–
–
20
5.0
25
25
mV
–
–
15
10
80
50
mV
LRRUN
Line Regulation
• Normal Mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA
LRSTOP
• Stop Mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA
(95)
LDRUN
Load Regulation
• Normal Mode, 1.0 mA < IVDD < 50 mA
LDSTOP
• Stop Mode, 0.1 mA < IVDD < 5.0 mA
TPRE
Overtemperature Prewarning (Junction)
• Interrupt generated, Bit VDDOT Set
110
125
140
°C
(96)
TPRE_HYS
Overtemperature Prewarning hysteresis
–
10
–
°C
(96)
155
170
185
°C
(96)
–
10
–
°C
(96)
TSD
TSD_HYS
Overtemperature Shutdown Temperature (Junction)
Overtemperature Shutdown hysteresis
Notes
94. Specification with external capacitor 2.0 µF < C < 100 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
95. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V).
96. This parameter is guaranteed by process monitoring but not production tested.
33911
60
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
VDD Low-Voltage Reset Threshold
4.3
4.5
4.7
V
VOL
Low-state Output Voltage
• IOUT = 1.5 mA; 3.5 V ≤ VSUP ≤ 27 V
0.0
–
0.9
V
IOH
High-state Output Current (0 < VOUT < 3.5 V)
-150
-250
-350
µA
Pull-down Current Limitation (internally limited)
VOUT = VDD
1.5
–
8.0
mA
VIL
Low-state Input Voltage
-0.3
–
0.3 x
VDD
V
VIH
High-state Input Voltage
0.7 x
VDD
–
VDD +0.3
V
Notes
RST Input/Output Pin (RST)
VRSTTH
IPD_MAX
MISO SPI Output Pin (MISO)
VOL
Low-state Output Voltage
• IOUT = 1.5 mA
0.0
–
1.0
V
VOH
High-state Output Voltage
• IOUT = -250 µA
VDD -0.9
–
VDD
V
ITRIMISO
Tri-state Leakage Current
• 0 V ≤ VMISO ≤ VDD
-10
–
10
µA
SPI Input Pins (MOSI, SCLK, CS)
VIL
Low-state Input Voltage
-0.3
–
0.3 x
VDD
V
VIH
High-state Input Voltage
0.7 x
VDD
–
VDD +0.3
V
IIN
MOSI, SCLK Input Current
• 0 V ≤ VIN ≤ VDD
-10
–
10
µA
CS Pull-up Current
• 0 V < VIN < 3.5 V
10
20
30
µA
IPUCS
Interrupt Output Pin (IRQ)
VOL
Low-state Output Voltage
• IOUT = 1.5 mA
0.0
–
0.8
V
VOH
High-state Output Voltage
• IOUT = -250 µA
VDD -0.8
–
VDD
V
VOH
Leakage Current
• VDD ≤ VOUT ≤ 10 V
–
–
2.0
mA
Pulse Width Modulation Input Pin (PWMIN)
VIL
Low-state Input Voltage
-0.3
–
0.3 x
VDD
V
VIH
High-state Input Voltage
0.7 x
VDD
–
VDD +0.3
V
10
20
30
µA
IPUPWMIN
Pull-up current
• 0 V < VIN < 3.5 V
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
61
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
–
–
–
–
–
–
7.0
10
14
Unit
Notes
Ω
(97)
High-side Output HS1 PIN (HS1)
RDS(on)
Output Drain-to-Source On resistance
• TJ = 25 °C, ILOAD = 50 mA; VSUP > 9.0 V
• TJ = 150 °C, ILOAD = 50 mA; VSUP > 9.0 V
• TJ = 150 °C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V
(97)
ILIMHS1
Output Current Limitation
• 0 V < VOUT < VSUP - 2.0 V
60
120
250
mA
(98)
IOLHS1
Open Load Current Detection
–
5.0
7.5
mA
(99)
ILEAK
Leakage Current
• -0.2 V < VHS1 < VS2 + 0.2 V
–
–
10
µA
VTHSC
Short-circuit Detection Threshold
• 5.5 V < VSUP < 27 V
VSUP -2
–
–
V
THSSD
Overtemperature Shutdown
150
165
180
°C
–
10
–
°C
–
–
–
–
–
–
2.5
4.5
10
160
275
350
mA
(102)
(103)
THSSD_HYS
Overtemperature Shutdown Hysteresis
(100)
(101),
(106)
(106)
Low-side Outputs LS1 and LS2 PINS (LS1, LS2)
RDS(ON)
Output Drain-to-Source On resistance
• TJ = 25 °C, ILOAD = 150 mA, VSUP > 9.0 V
• TJ = 125 °C, ILOAD = 150 mA, VSUP > 9.0 V
• TJ = 125 °C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
Ω
ILIMLSX
Output Current Limitation
• 2.0 V < VOUT < VSUP
IOLLSX
Open Load Current Detection
–
8.0
12
mA
ILEAK
Leakage Current
• -0.2 V < VOUT < VS1
–
–
10
µA
VSUP +2
–
VSUP +5
V
VCLAMP
Active Output Energy Clamp
• IOUT = 150 mA
VTHSC
Short-circuit Detection Threshold
• 5.5 V < VSUP < 27 V
2.0
–
–
V
TLSSD
Overtemperature Shutdown
150
165
180
°C
–
10
–
°C
TLSSD_HYS
Overtemperature Shutdown Hysteresis
(104)
(105),
(106)
(106)
Notes
97. This parameter is production tested up to TA = 125 °C and guaranteed by process monitoring up to TJ = 150 °C.
98.
99.
100.
101.
102.
103.
104.
105.
106.
When overcurrent occurs, the high-side stays ON with limited current capability and the HS1CL flag is set in the HSSR.
When open Load occurs, the flag (HS1OP) is set in the HSSR.
When short-circuit occurs and if the HVSE flag is enabled, HS1 automatically shutdown.
When overtemperature Shutdown occurs, the high-side is turned off. All flags in HSSR are set.
When overcurrent occurs, the corresponding low-side stays ON with limited current capability and the LSxCL flag is set in the LSSR.
When open load occurs, the flag (LSxOP) is set in the LSSR.
When short-circuit occurs and if the HVSE flag is enabled, both LS automatically shutdown.
When overtemperature shutdown occurs, both low-sides are turned off. All flags in LSSR are set.
Guaranteed by characterization but not production tested
33911
62
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
L1 and L2 Input Pins (L1, L2)
VTHL
Low Detection Threshold
• 5.5 V < VSUP < 27 V
2.0
2.5
3.0
V
VTHH
High Detection Threshold
• 5.5 V < VSUP < 27 V
3.0
3.5
4.0
V
VHYS
Hysteresis
• 5.5 V < VSUP < 27 V
0.5
1.0
1.5
V
Input Current
• -0.2 V < VIN < VS1
-10
–
10
µA
(107)
Analog Input Impedance
800
1550
–
kΩ
(108)
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
• LXDS (Lx Divider Select) = 0
• LXDS (Lx Divider Select) = 1
0.95
3.42
1.0
3.6
1.05
3.78
VRATIOLx-OFFSET
Analog Output offset Ratio
• LXDS (Lx Divider Select) = 0
• LXDS (Lx Divider Select) = 1
-80
-22
0.0
0.0
80
22
mV
LxMATCHING
Analog Inputs Matching
• LXDS (Lx Divider Select) = 0
• LXDS (Lx Divider Select) = 1
96
96
100
100
104
104
%
External Resistor Range
20
–
200
kΩ
Watchdog Period Accuracy with External Resistor (Excluding Resistor Accuracy)
-15
–
15
%
–
10.5
–
mV/K
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0)
• 5.5 V < VSUP < 27 V
5.0
5.25
5.5
VSENSE Output Related Offset
• -40 °C < TA < -20 °C
-30
-45
–
–
30
45
mV
IIN
RLxIN
RATIOLx
Window Watchdog Configuration Pin (WDCONF)
REXT
WDACC
(109)
Analog Multiplexer
STTOV
RATIOVSENSE
OFFSETVSENSE
Internal Chip Temperature Sense Gain
Analog Output (ADOUT0)
VOUT_MAX
Maximum Output Voltage
• -5.0 mA < IO < 5.0 mA
VDD 0.35
–
VDD
V
VOUT_MIN
Minimum Output Voltage
• -5.0 mA < IO < 5.0 mA
0.0
–
0.35
V
Notes
107. Analog Multiplexer input disconnected from Lx input pin.
108. Analog Multiplexer input connected to Lx input pin.
109. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in kΩ)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
63
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
RxD Output Pin (LIN Physical Layer) (RxD)
VOL
Low-state Output Voltage
• IOUT = 1.5 mA
0.0
–
0.8
V
VOH
High-state Output Voltage
• IOUT = -250 µA
VDD -0.8
–
VDD
V
TxD Input Pin (LIN Physical Layer) (TxD)
VIL
Low-state Input Voltage
-0.3
–
0.3 x
VDD
V
VIH
High-state Input Voltage
0.7 x
VDD
–
VDD +0.3
V
10
20
30
µA
40
120
200
mA
-1.0
–
-1.0
–
–
–
–
–
–
20
1.0
100
mA
µA
mA
µA
–
0.6
0.475
–
–
–
0.5
–
0.4
–
0.525
0.175
VSUP-1
–
–
–
1.1
1.7
–
1.4
2
IPUIN
Pin Pull-up Current, 0 V < VIN < 3.5 V
LIN Physical Layer, Transceiver (LIN) (110)
IBUSLIM
IBUS_PAS_DOM
IBUS_PAS_REC
IBUS_NO_GND
IBUS
VBUSDOM
VBUSREC
VBUS_CNT
VHYS
VLIN_REC
VLIN_DOM_0
VLIN_DOM_1
Output Current Limitation
• Dominant State, VBUS = 18 V
Leakage Output Current to GND
• Dominant State; VBUS = 0 V; VBAT = 12 V
• Recessive State; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS ≥ VBAT
• GND Disconnected; GNDDEVICE = VSUP; VBAT = 12 V; 0 V < VBUS < 18 V
• VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V
Receiver Input Voltages
• Receiver Dominant State
• Receiver Recessive State
• Receiver Threshold Center (VTH_DOM + VTH_REC)/2
• Receiver Threshold Hysteresis (VTH_REC - VTH_DOM)
LIN Transceiver Output Voltage
• Recessive State, TXD HIGH, IOUT = 1.0 µA
• Dominant State, TXD LOW, 500 Ω External Pull-up Resistor, LDVS = 0
• Dominant State, TXD LOW, 500 Ω External Pull-up Resistor, LDVS = 1
VSUP
V
RSLAVE
LIN Pull-up Resistor to VSUP
20
30
60
kΩ
TLINSD
Overtemperature Shutdown
150
165
180
°C
–
10
–
°C
TLINSD_HYS
Overtemperature Shutdown Hysteresis
(111)
Notes
110.
111.
Parameters guaranteed for 7.0 V ≤ VSUP ≤ 18 V.
When overtemperature shutdown occurs, the LIN bus goes into a recessive state and the flag LINOT in the LINSR is set.
33911
64
Analog Integrated Circuit Device Data
Freescale Semiconductor
13.3
Dynamic Electrical Characteristics
Table 36. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise
noted.
Symbol
Characteristic
Min
Typ
Max
Unit
–
–
4.0
MHz
Notes
SPI Interface Timing (see Figure 36)
f SPIOP
SPI Operating Frequency
tPSCLK
SCLK Clock Period
250
–
N/A
ns
tWSCLKH
SCLK Clock High Time
110
–
N/A
ns
(112)
tWSCLKL
SCLK Clock Low Time
110
–
N/A
ns
(112)
Falling Edge of CS to Rising Edge of SCLK
100
–
N/A
ns
(112)
tLAG
Falling Edge of SCLK to CS Rising Edge
100
–
N/A
ns
(112)
tSISU
MOSI to Falling Edge of SCLK
40
–
N/A
ns
(112)
tSIH
Falling Edge of SCLK to MOSI
40
–
N/A
ns
(112)
tRSO
MISO Rise Time
• CL = 220 pF
–
40
–
ns
(112)
tFSO
MISO Fall Time
• CL = 220 pF
–
40
–
ns
(112)
0.0
0.0
–
–
50
50
ns
(112)
Time from Rising Edge of SCLK to MISO Data Valid
• 0.2 x VDD ≤ MISO ≥ 0.8 x VDD, CL = 100 pF
0.0
–
75
ns
(112)
Reset Low-Level Duration after VDD High (see Figure 35)
0.65
1.0
1.35
ms
Reset Deglitch Filter Time
350
600
900
ns
8.5
79
110
10
94
150
11.5
108
205
tLEAD
tSOEN
tSODIS
tVALID
Time from Falling or Rising Edges of CS to:
- MISO Low-impedance
- MISO High-impedance
RST Output Pin
t RST
t RSTDF
Window Watchdog Configuration Pin (WDCONF)
t PWD
Watchdog Time Period
• External Resistor REXT = 20 kΩ (1%)
• External Resistor REXT = 200 kΩ (1%)
• Without External Resistor REXT (WDCONF pin open)
ms
(113)
Notes
112. This parameter is guaranteed by process monitoring but not production tested.
113. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in kΩ)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
65
Table 36. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise
noted.
Symbol
Characteristic
Min
Typ
Max
Unit
8.0
20
38
μs
–
–
5.0
μs
110
150
205
ms
Notes
L1 AND L2 Inputs
t WUF
Wake-up Filter Time
State Machine Timing
t STOP
t NR TOUT
Delay Between CS LOW-to-HIGH Transition (at the End of a SPI Stop
Command) and Stop Mode Activation
Normal Request Mode Timeout (see Figure 35)
(114)
t S-ON
Delay Between the SPI Command and HS /LS Turn On
• 9.0 V < VSUP < 27 V
–
–
10
μs
(115)
t S-OFF
Delay Between the SPI Command and HS /LS Turn Off
• 9.0 V < VSUP < 27 V
–
–
10
μs
(115)
t SNR2N
Delay Between Normal Request and Normal Mode After a Watchdog Trigger
Command (Normal Request Mode)
–
–
10
μs
(114)
t WUCS
t WUSPI
Delay Between CS Wake-Up (CS LOW to HIGH) in Stop Mode and:
• Normal Request Mode, VDD ON and RST HIGH
• First Accepted SPI Command
9.0
90
15
—
80
N/A
μs
Minimum Time Between Rising and Falling Edge on the CS
4.0
—
—
μs
t 2CS
LIN Physical Layer: Driver Characteristics for Normal Slew Rate - 20.0 kBit/sec
(116), (117)
D1
Duty Cycle 1: D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs
• 7.0 V ≤ VSUP ≤ 18 V
0.396
—
—
D2
Duty Cycle 2: D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs
• 7.6 V ≤ VSUP ≤ 18 V
—
—
0.581
LIN Physical Layer: Driver Characteristics for Slow Slew Rate - 10.4 kBit/sec(116), (118)
D3
Duty Cycle 3: D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs
• 7.0 V ≤ VSUP ≤ 18 V
0.417
—
—
μs
D4
Duty Cycle 4: D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs
• 7.6 V ≤ VSUP ≤ 18 V
—
—
0.590
μs
Notes
114. This parameter is guaranteed by process monitoring but not production tested.
115. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to an external load.
116. Bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to LIN signal threshold defined
at each parameter. See Figure 29.
117. See Figure 30.
118. See Figure 31.
33911
66
Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 36. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40 °C ≤ TA ≤ 125 °C for the 33911 and -40 °C ≤ TA ≤ 85 °C for the 34911,
otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise
noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
—
20
—
V / μs
—
- 2.0
3.0
—
6.0
2.0
μs
(120)
Bus Wake-up Deglitcher (Sleep and Stop Modes)
42
70
95
μs
(121)
Bus Wake-up Event Reported
• From Sleep Mode
• From Stop Mode
—
9.0
—
13
1500
17
μs
(122)
TXD Permanent Dominant State Delay
0.65
1.0
1.35
s
LIN Physical Layer: Driver Characteristics for Fast Slew Rate
SRFAST
LIN Fast Slew Rate (Programming Mode)
LIN Physical Layer: Characteristics and Wake-Up
t REC_PD
t REC_SYM
t PROPWL
t WAKE
t WAKE
t TXDDOM
Timings(119)
Propagation Delay and Symmetry
• Propagation Delay Receiver, tREC_PD = max (tREC_PDR, tREC_PDF)
• Symmetry of Receiver Propagation Delay tREC_PDF - tREC_PDR
(123)
Pulse Width Modulation Input Pin (PWMIN)
fPWMIN
PWMIN pin
• Max. frequency to drive HS and LS output pins
10
kHz
(124)
Notes
119. VSUP from 7.0 V to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to
LIN signal threshold defined at each parameter. See Figure 29.
120. See Figure 32.
121. See Figure 33 for Sleep and Figure 34 for Stop mode.
122. The measurement is done with 1.0 µF capacitor and 0 mA current load on VDD. The value takes into account the delay to charge the capacitor.
The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0V. See Figure 33. The
delay depends of the load and capacitor on VDD.
123. In Stop mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 34.
124. This parameter is guaranteed by process monitoring but not production tested.
13.4
Timing Diagrams
33911
1.0nF
LIN
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
PGND LGND
AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 27. Test Circuit for Transient Test Pulses (LIN)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
67
33911
TRANSIENT PULSE
GENERATOR
(NOTE)
1.0nF
L1, L2
10kΩ
PGND LGND
GND
AGND
NOTE: Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 28. Test Circuit for Transient Test Pulses (Lx)
VSUP
LIN
TXD
R0
R0 AND C0 COMBINATIONS:
• 1.0 KΩ and 1.0 nF
• 660 Ω and 6.8 nF
• 500 Ω and 10 nF
RXD
C0
Figure 29. Test Circuit for LIN Timing Measurements
TXD
tBIT
tBIT
tBUS_DOM (MAX)
VLIN_REC
tREC - MAX
tDOM - MIN
74.4% VSUP
tDOM - MIN
58.1% VSUP
40.0% VSUP
LIN
tBUS_REC (MIN)
58.1% VSUP
40.0% VSUP
60.0% VSUP
28.4% VSUP
28.4% VSUP
42.2% VSUP
tREC - MIN
tDOM - MAX
tBUS_DOM (MIN)
tBUS_REC (MAX)
RXD
tRDOM
tRREC
Figure 30. LIN Timing Measurements for Normal Slew Rate
33911
68
Analog Integrated Circuit Device Data
Freescale Semiconductor
TXD
tBIT
tBIT
tBUS_DOM (MAX)
VLIN_REC
tBUS_REC (MIN)
tREC - MAX
tDOM - MIN
61.6% VSUP
40.0% VSUP
LIN
tDOM - MIN
77.8% VSUP
61.6% VSUP
40.0% VSUP
60.0% VSUP
25.1% VSUP
25.1% VSUP
38.9% VSUP
tREC - MIN
tDOM - MAX
tBUS_DOM (MIN)
tBUS_REC (MAX)
RXD
tRDOM
tRREC
Figure 31. LIN Timing Measurements for Slow Slew Rate
VLIN_REC
VBUSrec
VBUSdom
VSUP
LIN BUS SIGNAL
RXD
tRX_PDF
tRX_PDR
Figure 32. LIN Receiver Timing
VLIN_REC
LIN
0.4 VSUP
DOMINANT LEVEL
VDD
tPROPWL
tWAKE
Figure 33. LIN Wake-up Sleep Mode Timing
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
69
Vrec
VLIN_REC
LIN
0.4VSUP
0.4 VSUP
Dominant
Level
Dominant level
IRQ
t WAKE
Twake
t PROPWL
TpropWL
Figure 34. LIN Wake-up Stop Mode Timing
VSUP
VDD
RST
tNRTOUT
tRST
Figure 35. Power On Reset and Normal Request Timeout Timing
tPSCLK
CS
tWSCLKH
tLEAD
tLAG
SCLK
tWSCLKL
tSISU
MOSI
UNDEFINED
D0
tSIH
DON’T CARE
D7
DON’T CARE
tVALID
tSODIS
tSOEN
MISO
D0
DON’T CARE
D7
Figure 36. SPI Timing Characteristics
33911
70
Analog Integrated Circuit Device Data
Freescale Semiconductor
14
Functional Description
14.1
Introduction
The 33911 was designed and developed as a highly integrated and cost-effective solution for automotive and industrial applications. For
automotive body electronics, the 33911 is well suited to perform relay control in applications like window lift, sunroof, etc. via a LIN bus.
Power switches are provided on the device configured as high-side and low-side outputs. Other ports are also provided, which include a
voltage sense port and two wake-up capable pins. An internal voltage regulator provides power to a MCU device.
Also included in this device is a LIN physical layer, which communicates using a single wire. This enables this device to be compatible
with 3-wire bus systems, where one wire is used for communication, one for battery, and one for ground.
14.2
Functional Pin Description
See Figure 1, 33911 Simplified Application Diagram, for a graphic representation of the various pins referred to in the following
paragraphs. See the 33911 Pin Connections diagram for a description of the pin locations in the package.
14.2.1 Receiver Output (RxD)
The RXD pin is a digital output. It is the receiver output of the LIN interface and reports the state of the bus voltage: RXD Low when LIN
bus is dominant, RXD High when LIN bus is recessive.
14.2.2 Transmitter Input (TxD)
The TXD pin is a digital input. It is the transmitter input of the LIN interface and controls the state of the bus output (dominant when TXD
is Low, recessive when TXD is High). This pin has an internal pull-up to force recessive state in case the input is left floating.
14.2.3 LIN Bus (LIN)
The LIN pin represents the single-wire bus transmitter and receiver. It is suited for automotive bus systems and is compliant to the LIN
bus specification 2.0. The LIN interface is only active during Normal and Normal Request modes.
14.2.4 Serial Data Clock (SCLK)
The SCLK pin is the SPI clock input pin. MISO data changes on the negative transition of the SCLK. MOSI is sampled on the positive
edge of the SCLK.
14.2.5 Master Out Slave In (MOSI)
The MOSI digital pin receives the SPI data from the MCU. This data input is sampled on the positive edge of SCLK.
14.2.6 Master In Slave Out (miso)
The MISO pin sends data to a SPI-enabled MCU. It is a digital tri-state output used to shift serial data to the microcontroller. Data on this
output pin changes on the negative edge of the SCLK. When CS is High, this pin remains in high-impedance state.
14.2.7 Chip Select (CS)
CS is an active low digital input. It must remain low during a valid SPI communication and allow for several devices to be connected in the
same SPI bus without contention. A rising edge on CS signals the end of the transmission and the moment the data shifted in is latched.
A valid transmission must consist of 8 bits only. While in STOP mode a low-to-high level transition on this pin generates a wake-up
condition.
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14.2.8 Analog Multiplexer (ADOUT0)
The ADOUT0 pin can be configured via the SPI to allow the MCU A/D converter to read the several inputs of the Analog Multiplexer,
including the VSENSE, L1, L2 input voltages and the internal junction temperature.
14.2.9 PWM Input Control (PWMIN)
This digital input can control the high-side and low-side drivers in Normal Request and Normal mode. To enable PWM control, the MCU
must perform a write operation to the High-side Control Register (HSCR), or the Low-side Control Register (LSCR). This pin has an internal
20 μA current pull-up.
14.2.10Reset (Rst)
This bidirectional pin is used to reset the MCU in case the 33911 detects a reset condition, or to inform the 33911 the MCU was just reset.
After release of the RST pin Normal Request mode is entered. The RST pin is an active low filtered input and output formed by a weak
pull-up and a switchable pull-down structure, which allows this pin to be shorted either to VDD or to GND during software development
without the risk of destroying the driver.
14.2.11Interrupt (IRQ)
The IRQ pin is a digital output used to signal events or faults to the MCU while in Normal and Normal Request mode or to signal a wakeup from Stop mode. This active low output transitions high only after the interrupt is acknowledged by a SPI read of the respective status
bits.
14.2.12Watchdog Configuration (WDCONF)
The WDCONF pin is the configuration pin for the internal watchdog. A resistor can be connected to this pin to configure the window
watchdog period. When connected directly to ground, the watchdog is disabled. When this pin is left open, the watchdog period is fixed to
its lower precision internal default value (150 ms, typical).
14.2.13Ground Connections (AGND, PGND, LGND)
The AGND, PGND, and LGND pins are the Analog and Power ground pins. The AGND pin is the ground reference of the voltage regulator.
The PGND and LGND pins are used for high-current load return as in the relay-drivers and LIN interface pin.
Note: PGND, AGND and LGND pins must be connected together.
14.2.14Low-sides (LS1 and LS2)
LS1 and LS2 are the low-side driver outputs. Those outputs are short-circuit protected and include active clamp circuitry to drive inductive
loads. Due to the energy clamp voltage on this pin, it can raise above the battery level when switched off. The switches are controlled
through the SPI and can be configured to respond to a signal applied to the PWMIN input pin. Both low-side switches are protected against
overheating.
14.2.15Digital/Analogs (L1 and L2)
The Lx pins are multi purpose inputs. They can be used as digital inputs, which can be sampled by reading the SPI and used for wake-up
when 33911 is in Low-power mode or used as analog inputs for the analog multiplexer. When used to sense voltage outside the module,
a 33 kΩ series resistor must be used on each input.
When used as wake-up inputs L1 and L2 can be configured to operate in cyclic sense mode. In this mode, the high-side switch is
configured to be periodically turned on and sample the wake-up inputs. If a state change is detected between two cycles, a wake-up is
initiated. The 33911 can also wake-up from Stop or Sleep by a simple state change on L1 and L2. When used as an analog input, the
voltage present on the Lx pins are scaled down by a selectable internal voltage divider and can be routed to the ADOUT0 output through
the analog multiplexer.
Note: If an Lx input is selected in the analog multiplexer, it is disabled as a digital input and remains disabled in low-power mode. No wakeup feature is available in this condition.
When an Lx input is not selected in the analog multiplexer, the voltage divider is disconnected from this input.
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14.2.16High-side Output (HS1)
This high-side switch is able to drive loads such as relays or lamps. Its structure is connected to the VS2 supply pin. The pin is short-circuit
protected and also protected against overheating. HS1 is controlled by SPI and can respond to a signal applied to the PWMIN input pin.
The HS1 output can also be used during Low-power mode for the cyclic-sense of the wake inputs.
14.2.17Power Supplies (VS1 and VS2)
These are the battery level voltage supply pins. In application, VS1 and VS2 pins must be protected against a reverse battery connection
and negative transient voltages with external components. These pins sustain standard automotive voltage conditions such as a load
dump at 40 V. The high-side switch (HS1) is supplied by the VS2 pin, all other internal blocks are supplied by the VS1 pin.
14.2.18Voltage Sense (VSENSE)
This input can be connected directly to the battery line. It is protected against a battery reverse connection. The voltage present on this
input is scaled down by an internal voltage divider, and can be routed to the ADOUT0 output pin and used by the MCU to read the battery
voltage. The ESD structure on this pin allows for excursion up to +40 V and down to -27 V, allowing this pin to be connected directly to
the battery line. It is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
14.2.19+5.0 V Main Regulator Output (VDD)
An external capacitor must be placed on the VDD pin to stabilize the regulated output voltage. The VDD pin is intended to supply a
microcontroller. The pin is current limited against shorts to GND and overtemperature protected. During Stop mode, the voltage regulator
does not operate with its full drive capabilities and the output current is limited. During Sleep mode the regulator output is completely
shutdown.
14.3
Functional Internal Block Description
MC33911 - Functional Block Diagram
Digital / Analog Input
High Side Drivers
HS1
WakeUp
Voltage & Temperature
Sense
Low Side Driver
LS1 - LS2
SPI Interface
Reset & IRQ Logic
Voltage Regulator
VDD
Window Watchdog
LS/HS - PMW Control
LIN Interface / Control
LIN Physical Layer
Interface LIN
Analog Output 0
Analog Circutry
MCU Interface and Output Control
Drivers
Figure 37. Functional Internal Block Diagram
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14.3.1 Analog Circuitry
The 33911 is designed to operate under automotive operating conditions. A fully configurable window watchdog circuit resets the
connected MCU in case of an overflow. Two low-power modes are available with several different wake-up sources to reactivate the
device. Two analog / digital inputs can be sensed or used as the wake-up source. The device is capable of sensing the supply voltage
(VSENSE), the internal chip temperature (CTEMP), as well as the motor current using an external sense resistor.)
14.3.2 High-side Driver
One current and temperature protected high-side driver with PWM capability is provided to drive small loads such as status LEDs or small
lamps. The driver can be configured for periodic sense during low-power modes.
14.3.3 Low-side Drivers
Two current and temperature protected low-side drivers with PWM capability are provided to drive H-Bridge type relays for power motor
applications.
14.3.4 MCU Interface
The 33911 is providing its control and status information through a standard 8-Bit SPI interface. Critical system events such as low or highvoltage/temperature conditions as well as overcurrent conditions in any of the driver stages can be reported to the connected MCU via
IRQ or RST. Both low-side and both high-side driver outputs can be controlled via the SPI register as well as PWMIN input. The integrated
LIN physical layer interface can be configured via the SPI register and its communication is driven through the RXD and TXD device pin.
All internal analog sources are multiplexed to the ANOUT0 pin.
14.3.5 Voltage Regulator Outputs
One voltage regulators is implemented on the 33911. The VDD main regulator output is designed to supply an MCU with a precise 5.0 V.
14.3.6 LIN Physical Layer Interface
The 33911 provides a LIN 2.0 compatible LIN physical layer interface with selectable slew rate and various diagnostic features.
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15
Functional Device Operations
15.1
Operational Modes
15.1.1 Introduction
The 33911 offers three main operating modes: Normal (Run), Stop, and Sleep (Low-power). In Normal mode, the device is active and
operating under normal application conditions. The Stop and Sleep modes are Low-power modes with wake-up capabilities. In Stop mode,
the voltage regulator still supplies the MCU with VDD (limited current capability), and in Sleep mode the voltage regulator is turned off (VDD
= 0 V). Wake-up from Stop mode is initiated by a wake-up interrupt. Wake-up from Sleep mode is done with a reset and the voltage
regulator turned back on. The selection of the different modes is controlled by the MOD1:2 bits in the Mode Control Register (MCR).
Figure 38 describes how transitions are done between the different operating modes, and Table 37, gives an overview of the operating
modes.
15.1.2 Reset Mode
The 33911 enters the Reset mode after a power up. In this mode, the RST pin is low for 1.0 ms (typical value). After this delay, the 33911
enters the Normal Request mode and the RST pin is driven high. The Reset mode is entered if a reset condition occurs (VDD low,
watchdog trigger fail, after a wake-up from Sleep mode, or a Normal Request mode timeout).
15.1.3 Normal Request Mode
This is a temporary mode automatically accessed by the device after the Reset mode, or after a wake-up from Stop mode. In Normal
Request mode, the VDD regulator is ON, the Reset pin is high and the LIN is operating in RX Only mode. As soon as the device enters
the Normal Request mode, an internal timer is started for 150 ms (typical value). During these 150 ms, the MCU must configure the Timing
Control Register (TIMCR) and the MCR with MOD2 and MOD1 bits set = 0, to enter in Normal mode. If within the 150 ms timeout the MCU
does not command the 33911 to Normal mode, it enters in Reset mode. If the WDCONF pin is grounded to disable the watchdog function,
the 33911 goes directly in Normal mode after the Reset mode. If the WDCONF pin is open, the 33911 stays typically for 150 ms in Normal
Request before entering in Normal mode.
15.1.4 Normal Mode
In Normal mode, all 33911 functions are active and can be controlled by the SPI interface and the PWMIN pin. The VDD regulator is ON
and delivers its full current capability. If an external resistor is connected between the WDCONF pin and the Ground, the window watchdog
function is enabled. The wake-up inputs (L1 and L2) can be read as digital inputs or have its voltage routed through the analog multiplexer.
The LIN interface has slew rate and timing compatible with the LIN protocol specification 2.0. The LIN bus can transmit and receive
information. The high-side and the low-side switches are active and have PWM capability according to the SPI configuration. The
interrupts are generated to report failures for VSUP over/undervoltage, thermal shutdown, or thermal shutdown prewarning on the main
regulator.
15.1.5 Sleep Mode
The Sleep mode is a Low-power mode. From Normal mode, the device enters the Sleep mode by sending one SPI command through the
MCR. All blocks are in their lowest power consumption condition. Only some wake-up sources (wake-up inputs with or without cyclic
sense, forced wake-up, and LIN receiver) are active. The 5.0 V regulator is OFF. The internal low-power oscillator may be active if the IC
is configured for cyclic sense. In this condition, the high-side switches are turned on periodically and the wake-up inputs are sampled.
Wake-up from Sleep mode is similar to a power-up. The device goes into Reset mode except the SPI reports the wake-up source, and
the BATFAIL flag is not set.
15.1.6 Stop Mode
The Stop mode is the second Low-power mode, but in this case the 5.0 V regulator is ON with limited current drive capability. The
application MCU is always supplied while the 33911 is operating in Stop mode.
The device can enter the Stop mode only by sending a SPI command. When the application is in this mode, it can wake-up from the 33911
side (for example: cyclic sense, force wake-up, LIN bus, wake inputs) or the MCU side (CS, RST pins). Wake-up from Stop mode
transitions the 33911 to Normal Request mode and generate an interrupt, except if the wake-up event is a low to high transition on the
CS pin or comes from the RST pin.
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Normal Request Timeout Expired (t NRTOUT)
VDD LOW
VDD LOW
VDD LOW (>t NRTOUT) EXPIRED
AND VSUV = 0
SLEEP COMMAND
STOP COMMAND
NORMAL
WD FAILED
WAKE-UP (INTERRUPT)
NORMAL
REQUEST
WD DISABLED
RESET
VDD HIGH AND
RESET DELAY (t RST) EXPIRED
WD TRIGGER
POWER
DOWN
Power Up
WAKE-UP (RESET)
SLEEP
STOP
VDD LOW
Legend
WD: Watchdog
WD Disabled: Watchdog disabled (WDCONF pin connected to GND)
WD Trigger: Watchdog is triggered by SPI command
WD Failed: No watchdog trigger or trigger occurs in closed window
Stop Command: Stop command sent via SPI
Sleep Command: Sleep command sent via SPI
wake-up from Stop mode: Lx state change, LIN bus wake-up, Periodic wake-up, CS rising edge wake-up or RST wake-up.
wake-up from Sleep mode: Lx state change, LIN bus wake-up, Periodic wake-up.
Figure 38. Operating Modes and Transitions
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Table 37. Operating Modes Overview
Function
Reset Mode
Normal Request Mode
Normal Mode
Stop Mode
Sleep Mode
VDD
Full
Full
Full
Stop
-
LSx
-
SPI/PWM (125)
SPI/PWM
-
-
HS1
-
SPI/PWM (125)
SPI/PWM
Note (126)
Note (127)
Analog Mux
-
SPI
SPI
-
-
Lx
-
Inputs
Inputs
Wake-up
Wake-up
LIN
-
Rx-Only
full/Rx-Only
Rx-Only/Wake-up
Wake-up
-
-
VDD
-
Watchdog
-
150 ms (typ.) timeout
VSENSE
On
On
Notes
125.
126.
127.
128.
On
(128)/Off
On
Operation can be controlled by the PWMIN input.
HS switch can be configured for cyclic sense operation in Stop mode.
HS switch can be configured for cyclic sense operation in Sleep mode.
Windowing operation when enabled by an external resistor.
15.1.7 Interrupts
Interrupts are used to signal a microcontroller a peripheral needs to be serviced. The interrupts which can be generated change according
to the operating mode. While in Normal and Normal Request modes, the 33911 signals through interrupts special conditions which may
require a MCU software action. Interrupts are not generated until all pending wake-up sources are read in the Interrupt Source Register
(ISR). While in Stop mode, interrupts are used to signal wake-up events. Sleep mode does not use interrupts, wake-up is performed by
powering-up the MCU. In Normal and Normal Request mode the wake-up source can be read by the SPI.
The interrupts are signaled to the MCU by a low logic level of the IRQ pin, which remains low until the interrupt is acknowledged by a SPI
read. The IRQ pin is then driven high. Interrupts are only asserted while in Normal, Normal Request and Stop mode. Interrupts are not
generated while the RST pin is low. Following is a list of the interrupt sources in Normal and Normal Request modes, some of those can
be masked by writing to the SPI-Interrupt Mask Register (IMR).
15.1.7.1
Low-voltage Interrupt
The low-voltage interrupt signals when the supply line (VS1) voltage drops below the VSUV threshold (VSUV).
15.1.7.2
High-voltage Interrupt
The high-voltage interrupt signals when the supply line (VS1) voltage increases above the VSOV threshold (VSOV).
15.1.7.3
Overtemperature Prewarning
Overtemperature prewarning signals when the 33911 temperature has reached the pre-shutdown warning threshold. It is used to warn
the MCU an overtemperature shutdown in the main 5.0 V regulator is imminent.
15.1.7.4
LIN Overcurrent Shutdown/Overtemperature Shutdown/TXD Stuck at
Dominant/RXD Short-Circuit
These signal fault conditions within the LIN interface causes the LIN driver to be disabled, except for the LIN overcurrent. To restart an
operation, the fault must be removed and must be acknowledged by reading the SPI. The LINOC bit functionality in the LIN Status Register
(LINSR) is to indicate an LIN overcurrent occurred and the driver stays enabled.
15.1.7.5
High-side Overtemperature Shutdown
The high-side overtemperature shutdown signals a shutdown in the high-side output.
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15.1.7.6
Low-side Overtemperature Shutdown
The low-side overtemperature shutdown signals a shutdown in the low-side outputs.
15.1.8 Reset
To reset an MCU, the 33911 drives the RST pin low for the time the reset condition lasts. After the reset source is removed, the state
machine drives the RST output low for at least 1.0 ms (typical value) before driving it high. In the 33911 four main reset sources exist.
15.1.8.1
5.0 V Regulator Low-voltage-Reset (VRSTTH)
The 5.0 V regulator output VDD is continuously monitored against brown outs. If the supply monitor detects the voltage at the VDD pin has
dropped below the reset threshold VRSTTH the 33911 issues a reset. During an overtemperature, the voltage regulator is disabled and the
voltage monitoring issues a VDDOT Flag independently of the VDD voltage.
15.1.8.2
Window Watchdog Overflow
If the watchdog counter is not properly serviced while its window is open, the 33911 detects an MCU software run-away and resets the
microcontroller.
15.1.8.3
Wake-Up from Sleep Mode
During Sleep mode, the 5.0 V regulator is not active. Hence, all wake-up requests from Sleep mode require a power-up/reset sequence.
15.1.8.4
External Reset
The 33911 has a bidirectional reset pin which drives the device to a safe state (same as Reset mode) for as long as this pin is held low.
The RST pin must be held low long enough to pass the internal glitch filter and get recognized by the internal reset circuit. This functionality
is also active in Stop mode. After the RST pin is released, there is no extra t RST to be considered.
15.1.9 Wake-Up CApabilities
Once entered into one of the Low-power modes (Sleep or Stop) only wake-up sources can bring the device into Normal mode operation.
In Stop mode, a wake-up is signaled to the MCU as an interrupt, while in Sleep mode, the wake-up is performed by activating the 5.0 V
regulator and resetting the MCU. In both cases, the MCU can detect the wake-up source by accessing the SPI registers. There is no
specific SPI register bit to signal a CS wake-up or external reset. If necessary, this condition is detected by excluding all other possible
wake-up sources.
15.1.9.1
Wake-up from Wake-up Inputs (L1-L2) with Cyclic Sense Disabled
The wake-up lines are dedicated to sense state changes of external switches, and wake-up the MCU (in Sleep or Stop mode). To select
and activate direct wake-up from Lx inputs, the Wake-up Control Register (WUCR) must be configured with appropriate LxWE inputs
enabled or disabled. The wake-up inputs state are read through the Wake-up Status Register (WUSR). Lx inputs are also used to perform
cyclic sense wake-up.
Note: Selecting an Lx input in the analog multiplexer before entering Low-power mode disables the wake-up capability of the Lx input.
15.1.9.2
Wake-up from Wake-up Inputs (L1-L2) with Cyclic Sense Timer Enabled
The SBCLIN can wake-up at the end of a cyclic sense period if on one of the two wake-up input lines (L1-L2), a state change occurs. The
HS1 switch is activated in Sleep or Stop modes from an internal timer. Cyclic sense and force wake-up are exclusive. If cyclic sense is
enabled, the force wake-up can not be enabled. To select and activate the cyclic sense wake-up from Lx inputs, before entering in Lowpower modes (Stop or Sleep modes), the following SPI set-up must be performed:
• In WUCR: select the Lx input to WU-enable.
• In HSCR: enable HS1.
• In TIMCR: select the CS/WD bit and determine the cyclic sense period with CYSTx bits.
• Perform Go to Sleep/Stop command.
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15.1.9.3
Forced Wake-up
The 33911 can wake-up automatically after a predetermined time spent in Sleep or Stop mode. Cyclic sense and forced wake-up are
exclusive. If forced wake-up is enabled, the cyclic sense can not be enabled. To determine the wake-up period, the following SPI set-up
has to be sent before entering in Low-power modes:
• In TIMCR: select the CS/WD bit and determine the Low-power mode period with CYSTx bits.
• In HSCR: the HS1 bit must be disabled.
15.1.9.4
CS Wake-up
While in Stop mode, a rising edge on the CS causes a wake-up. The CS wake-up does not generate an interrupt and is not reported on
the SPI.
15.1.9.5
LIN Wake-up
While in the Low-power mode the 33911 monitors the activity on the LIN bus. A dominant pulse larger than t PROPWL followed by a dominant
to recessive transition causes a LIN wake-up. This behavior protects the system from a short-to ground bus condition.
15.1.9.6
RST Wake-up
While in Stop mode, the 33911 can wake-up when the RST pin is held low long enough to pass the internal glitch filter. Then, it changes
to Normal Request or Normal modes depending on the WDCONF pin configuration. The RST wake-up does not generate an interrupt and
is not reported via the SPI.
From Stop mode, the following wake-up events can be configured.
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• CS wake-up
• LIN wake-up
• RST wake-up
From Sleep mode, the following wake-up events can be configured.
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• LIN wake-up
15.1.10Window Watchdog
The 33911 includes a configurable window watchdog which is active in Normal mode. The watchdog can be configured by an external
resistor connected to the WDCONF pin. The resistor is used to achieve higher precision in the timebase used for the watchdog. SPI clears
are performed by writing through the SPI in the MOD bits of the Mode Control Register (MCR). During the first half of the SPI timeout,
watchdog clears are not allowed, but after the first half of the SPI timeout window, the clear operation opens. If a clear operation is
performed outside the window, the 33911 resets the MCU, in the same way as when the watchdog overflows.
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WINDOW CLOSED
NO WATCHDOG CLEAR
ALLOWED
WD TIMING X 50%
WINDOW OPEN
FOR WATCHDOG
CLEAR
WD TIMING X 50%
WD PERIOD (tPWD)
WD TIMING SELECTED BY REGISTER
ON WDCONF PIN
Figure 39. Window Watchdog Operation
To disable the watchdog function in Normal mode, the user must connect the WDCONF pin to ground. This measure effectively disables
Normal Request mode. The WDOFF bit in the Watchdog Status Register (WDSR) is set. This condition is only detected during Reset
mode. If neither a resistor nor a connection to ground is detected, the watchdog falls back to the internal lower precision timebase of
150 ms (typ.), and signals the faulty condition through the WDSR.
The watchdog timebase can be further divided by a prescaler which can be configured by the Timing Control Register (TIMCR). During
Normal Request mode, the window watchdog is not active but there is a 150 ms (typ.) timeout for leaving the Normal Request mode. In
case of a timeout, the 33911 enters into Reset mode, resetting the microcontroller before entering again into Normal Request mode.
15.1.11High-side Output Pin HS1
This output is one high-side driver intended to drive small resistive loads or LEDs incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Overtemperature shutdown (with maskable interrupt)
• High-voltage shutdown (software maskable)
• Cyclic sense
The high-side switch is controlled by the HS1 bit in the High-side Control Register (HSCR).
15.1.11.1 PWM Capability (Direct Access)
The high-side driver offers additional (to the SPI control) direct control via the PWMIN pin. If the HS1 bit and PWMHS1 is set in the HSCR,
then the HS1 driver is turned on if the PWMIN pin is high, and turned off if the PWMIN pin is low.
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Interrupt
Control
Module
MOD1:2
HS1
HS1OP
VDD
VDD
PWMIN
High-side Interrupt
High-voltage Shutdown
HVSE
PWMHS1
VS2
on/off
Control
Status
HS1CL
HIgh-side - Driver
charge pump
open load detection
current limitation
overtemperture shutdown (interrupt maskable)
High-voltage shutdown (maskable)
Cyclic Sense
HS1
Wake-up
Module
Figure 40. High-side Driver HS1
15.1.11.2 Open Load Detection
The high-side driver signals an open load condition if the current through the high-side is below the open load current threshold. The open
load condition is indicated with the HS1OP bits in the High-side Status Register (HSSR).
15.1.11.3 Current Limitation
The high-side driver has an output current limitation. In combination with the overtemperature shutdown, the high-side driver is protected
against overcurrent and short-circuit failures. When the driver operates in the current limitation area, it is indicated with the bit HS1CL in
the HSSR.
Note: If the driver is operating in current limitation mode excessive power might be dissipated.
15.1.11.4 Overtemperature Protection (HS Interrupt)
The high-side driver is protected against overtemperature. In case of an overtemperature condition, the high-side driver is shutdown and
the event is latched in the Interrupt Control Module. The shutdown is indicated as an HS Interrupt in the Interrupt Source Register (ISR).
A thermal shutdown of the high-side driver is indicated by setting the HS1OP and HS1CL bits simultaneously. If the bit HSM is set in the
Interrupt Mask Register (IMR) than an interrupt (IRQ) is generated. A write to the High-side Control Register (HSCR), when the
overtemperature condition is gone, re-enables the high-side driver.
15.1.11.5 High-voltage Shutdown
In case of a high-voltage condition, and if the high-voltage shutdown is enabled (bit HVSE in the Mode Control Register (MCR) is set), the
high-side driver is shutdown. A write to the HSCR, when the high-voltage condition is gone, re-enables the high-side driver.
15.1.11.6 Sleep And Stop Mode
The high-side driver can be enabled to operate in Sleep and Stop mode for cyclic sensing. Also see Table 37, Operating Modes Overview.
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15.1.12Low-side Output Pins LS1 and LS2
These outputs are two low-side drivers intended to drive relays incorporating the following features.
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Overtemperature shutdown (with maskable interrupt)
• Active clamp (for driving relays)
• High-voltage shutdown (software maskable)
The low-side switches are controlled by the bit LS1:2 in the Low-side Control Register (LSCR). To protect the device against overvoltage
when an inductive load (relay) is turned off, an active clamp re-enables the low-side FET if the voltage on the LS1 or LS2 pin exceeds a
certain level.
15.1.12.1 PWM Capability (direct access)
Each low-side driver offers additional (to the SPI control) direct control via the PWMIN pin. If both the LS1 and PWMLS1 bits are set in the
LSCR, then the LS1 driver is turned on if the PWMIN pin is high, and turned off if the PWMIN pin is low. The same applies to the LS2 and
PWMLS2 bits for the LS2 driver.
HVSE
VDD
Interrupt
Control
Module
VDD
MOD1:2
LSx
LSxOP
PWMLSx
Low-side Interrupt
High-voltage Shutdown
PWMIN
active
clamp
LSx
on/off
Control
Status
LSxCL
Low-side - Driver
(active clamp)
Open Load Detection
Current Limitation
Overtemperture Shutdown (interrupt maskable)
High-voltage Shutdown (maskable)
PGND
Figure 41. Low-side Drivers LS1 and LS2
15.1.12.2 Open Load Detection
Each low-side driver signals an open load condition if the current through the low-side is below the open load current threshold. The open
load condition is indicated with the bit LS1OP and LS2OP in the Low-side Status Register (LSSR).
15.1.12.3 Current Limitation
Each low-side driver has a current limitation. In combination with the overtemperature shutdown, the low-side drivers are protected against
overcurrent and short-circuit failures. When the drivers operate in current limitation, this is indicated with the LS1CL and LS2CL bits in the
LSSR.
Note: If the drivers are operating in current limitation mode excessive power might be dissipated.
15.1.12.4 Overtemperature Protection (LS Interrupt)
Both low-side drivers are protected against overtemperature. During an overtemperature condition both low-side drivers are shutdown and
the event is latched in the Interrupt Control Module. The shutdown is indicated as an LS Interrupt in the Interrupt Source Register (ISR).
If the bit LSM is set in the Interrupt Mask Register (IMR), then an Interrupt (IRQ) is generated. A write to the Low-side Control Register
(LSCR), when the overtemperature condition is gone, re-enables the low-side drivers.
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15.1.12.5 High-voltage Shutdown
During a high-voltage condition, and if the high-voltage shutdown is enabed (bit HVSE in the Mode Control Register (MCR) is set), both
low-side drivers are shutdown. A write to the LSCR, when the high-voltage condition is gone, re-enables the low-side drivers.
15.1.12.6 Sleep And Stop Mode
The low-side drivers are disabled in Sleep and Stop mode. See Table 37, Operating Modes Overview.
15.1.13LIN Physical Layer
The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to
meet the LIN physical layer specification and has the following features:
• LIN physical layer 2.0 compliant
• Slew rate selection
• Overcurrent shutdown
• Overtemperature shutdown
• LIN pull-up disable in Stop and Sleep modes
• Advanced diagnostics
• LIN dominant voltage level selection
The LIN driver is a low-side MOSFET with overcurrent and thermal shutdown. An internal pull-up resistor with a serial diode structure is
integrated, so no external pull-up components are required for the application in a slave node. The fall time from dominant to recessive
and the rise time from recessive to dominant is controlled. The symmetry between both slopes is guaranteed.
15.1.13.1 LIN Pin
The LIN pin offers a high susceptibility immunity level from external disturbance, guaranteeing communication.
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Analog Integrated Circuit Device Data
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83
INTERRUPT
CONTROL
MODULE
High-voltage
Shutdown
High-side
Interrupt
WAKE-UP
MODULE
LIN
Wake-up
MOD1:2
LSR0:1
VS1
LINPE
LIN – DRIVER
LDVS
RXONLY
RXSHORT
Slope and Slew Rate Control
Overcurrent Shutdown (interrupt maskable)
Overtemperature Shutdown (interrupt maskable)
TXDOM
LINOT
LINOC
30K
LIN
TXD
SLOPE
CONTROL
WAKE-UP
FILTER
LGND
RXD
RECEIVER
Figure 42. LIN Interface
15.1.13.2 Slew Rate Selection
The slew rate can be selected for optimized operation at 10.4 and 20 kBit/s as well as a fast baud rate for test and programming. The slew
rate can be adapted with the LSR1:0 bits in the LIN Control Register (LINCR). The initial slew rate is optimized for 20 kBit/s.
15.1.13.3 LIN Pull-up Disable In Stop And Sleep Modes
In case of a LIN bus short to GND or LIN bus leakage during Low-power mode, the internal pull-up resistor on the LIN pin can be
disconnected by clearing the LINPE bit in the Mode Control Register (MCR). The bit LINPE also changes the bus wake-up threshold
(VBUSWU). This feature reduces the current consumption in STOP and SLEEP modes. It also improves performance and safe operation.
15.1.13.4 Current Limit (LIN Interrupt)
The output low-side FET is protected against overcurrent conditions. If an overcurrent condition occurs (e.g. LIN bus short to VBAT), the
transmitter is not shutdown. The bit LINOC in the LIN Status Register (LINSR) is set. If the LINM bit is set in the Interrupt Mask Register
(IMR) an Interrupt IRQ is generated.
15.1.13.5 Overtemperature Shutdown (LIN Interrupt)
The output low-side FET is protected against overtemperature conditions. If an overtemperature condition occurs, the transmitter is
shutdown and the LINOT bit in the LINSR is set. If the LINM bit is set in the IMR an Interrupt IRQ is generated. The transmitter is
automatically re-enabled once the condition is gone and TXD is high. A read of the LINSR with the TXD pin high re-enables the transmitter.
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15.1.13.6 RXD Short-circuit Detection (LIN Interrupt)
The LIN transceiver has a short-circuit detection for the RXD output pin. In case of a short-circuit condition, either 5.0 V or Ground, the
RXSHORT bit in the LINSR is set and the transmitter is shutdown. If the LINM bit is set in the IMR an Interrupt IRQ is generated. The
transmitter is automatically re-enabled once the condition is gone (transition on RXD) and TXD is high. A read of the LINSR without the
RXD pin short-circuit condition clears the RXSHORT bit.
15.1.13.7 TXD Dominant Detection (LIN Interrupt)
The LIN transceiver monitors the TXD input pin to detect stuck-in-dominant (0 V) condition. If a stuck condition occurs (TXD pin
overvoltage for more than 1 second (typ.), the transmitter is shutdown and the TXDOM bit in the LINSR is set. If the bit LINM is set in the
IMR an Interrupt IRQ is generated. The transmitter is automatically re-enabled once TXD is high. A read of the LINSR with the TXD pin
is high clears the bit TXDOM.
15.1.13.8 LIN Dominant Voltage Level Selection
The LIN dominant voltage level can be selected by the LDVS bit in the LIN Control Register (LINCR).
15.1.13.9 LIN Receiver Operation Only
While in Normal mode, the activation of the RXONLY bit disables the LIN TXD driver. If a LIN error condition occurs, this bit is automatically
set. If a Low-power mode is selected with this bit set, the LIN wake-up functionality is disabled. Then in STOP mode, the RXD pin reflects
the state of the LIN bus.
15.1.13.10STOP Mode And Wake-up Feature
During Stop mode operation, the transmitter of the physical layer is disabled. If the LIN-PU bit was set in the Stop mode sequence, the
internal pull-up resistor is disconnected from VSUP and a small current source keeps the LIN pin in the recessive state. The receiver is
still active and able to detect wake-up events on the LIN bus line. A dominant level longer than tPROPWL followed by a rising edge
generates a wake-up interrupt and is reported in the Interrupt Source Register (ISR). Also see Figure 34.
15.1.13.11SLEEP Mode and Wake-up Feature
During Sleep mode operation, the transmitter of the physical layer is disabled. If the LIN-PU bit was set in the Sleep mode sequence, the
internal pull-up resistor is disconnected from VSUP and a small current source keeps the LIN pin in recessive state. The receiver must still
active to detect wake-up events on the LIN bus line. A dominant level longer than tPROPWL followed by a rising edge generates a system
wake-up (Reset), and is reported in the ISR. See Figure 33.
15.2
Logic Commands and Registers
15.2.1 33911 SPI Interface AND CONFIGURATION
The serial peripheral interface creates the communication link between a microcontroller (master) and the 33911. The interface consists
of four pins (see Figure 43):
• CS — Chip Select
• MOSI — Master-Out Slave-In
• MISO — Master-In Slave-Out
• SCLK— Serial Clock
A complete data transfer via the SPI consists of 1 byte. The master sends 4 bits of address (A3:A0) + 4 bits of control information (C3:C0)
and the slave replies with four system status bits (VMS,LINS,HSS,LSS) + 4 bits of status information (S3:S0).
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CS
Register Write Data
MOSI
A3
A2
A1
A0
C3
C2
C1
C0
S1
S0
Register Read Data
MISO
VMS LINS HSS
LSS
S3
S2
SCLK
Read Data Latch
Rising Edge of SCLK
Change MISO/MISO Output
Write Data Latch
Falling Edge of SCLK
Sample MISO/MISO Input
Figure 43. SPI Protocol
During the inactive phase of the CS (HIGH), the new data transfer is prepared. The falling edge of the CS indicates the start of a new data
transfer and puts the MISO in the low-impedance state and latches the analog status data (Register read data). With the rising edge of
the SPI clock (SCLK), the data is moved to MISO/MOSI pins. With the falling edge of the SPI clock (SCLK), the data is sampled by the
receiver.
The data transfer is only valid if exactly eight sample clock edges are present during the active (low) phase of CS. The rising edge of the
Chip Select (CS) indicates the end of the transfer and latches the write data (MOSI) into the register. The CS high forces MISO to the highimpedance state. Register reset values are described along with the reset condition. Reset condition is the condition causing the bit to be
set to its reset value. The main reset conditions are:
• Power-On Reset (POR): level at which the logic is reset and BATFAIL flag sets.
• Reset mode
• Reset done by the RST pin (ext_reset)
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15.3
SPI Register Overview
Table 38. System Status Register
Adress(A3:A0)
$0 - $F
BIT
Register Name / Read / Write Information
SYSSR - System Status Register
R
7
6
5
4
VMS
LINS
HSS
LSS
Table 39 summarizes the SPI Register content for Control Information (C3:C0) = W and status information (S3:S0) = R.
Table 39. SPI Register Overview
Adress(A3:A0)
$0
$1
$2
$3
$4
$5
$6
$7
BIT
Register Name / Read / Write Information
3
2
1
0
MCR - Mode Control Register
W
HVSE
LINPE
MOD2
MOD1
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
WUCR - Wake-up Control Register
W
-
-
L2WE
L1WE
WUSR - Wake-up Status Register
R
-
-
L2
L1
WUSR - Wake-up Status Register
R
-
-
L2
L1
LINCR - LIN Control Register
W
LDVS
RXONLY
LSR1
LSR0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
LINOC
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
LINOC
HSCR - High-side Control Register
W
-
PWMHS1
-
HS1
HSSR - High-side Status Register
R
-
-
HS1OP
HS1CL
HSSR - High-side Status Register
R
-
-
HS1OP
HS1CL
LSCR - Low-side Control Register
W
PWMLS2
PWMLS1
LS2
LS1
LSSR - Low-side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
LSSR - Low-side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
TIMCR - Timing Control Register
W
CS/WD
WDSR - Watchdog Status Register
R
$B
WDSR - Watchdog Status Register
$C
$D
$8
$9
$A
$E
$F
WD2
WD1
WD0
CYST2
CYST1
CYST0
WDTO
WDERR
WDOFF
WDWO
R
WDTO
WDERR
WDOFF
WDWO
AMUXCR - Analog Multiplexer Control Register
W
LXDS
MX2
MX1
MX0
CFR - Configuration Register
W
-
CYSX8
-
-
IMR - Interrupt Mask Register
W
HSM
LSM
LINM
VMM
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
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15.3.1 Register Definitions
15.3.1.1
System Status Register - SYSSR
The System Status Register (SYSSR) is always transferred with every SPI transmission and gives a quick system status overview. It
summarizes the status of the Voltage Status Register (VSR), LIN Status Register (LINSR), High-side Status Register (HSSR), and the
Low-side Status Register (LSSR).
Table 40. System Status Register
Read
15.3.1.2
S7
S6
S5
S4
VMS
LINS
HSS
LSS
VMS - Voltage Monitor Status
This read-only bit indicates one or more bits in the VSR are set.
1 = Voltage Monitor bit set
0 = None
BATFAIL
VDDOT
VSUV
VMS
VSOV
Figure 44. Voltage Monitor Status
15.3.1.3
LINS - LIN Status
This read-only bit indicates one or more bits in the LINSR are set.
1 = LIN Status bit set
0 = None
LINOC
LINOT
TXDOM
LINS
RXSHORT
Figure 45. LIN Status
15.3.1.4
HSS - High-side Switch Status
This read-only bit indicates one or more bits in the HSSR are set.
1 = High-side Status bit set
0 = None
HS1CL
HS1OP
HSS
Figure 46. High-side Status
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15.3.1.5
LSS - Low-side Switch Status
This read-only bit indicates one or more bits in the LSSR are set.
1 = Low-status bit set
0 = None
LS1CL
LS1OP
LSS
LS2CL
LS2OP
Figure 47. Low-side Status
15.3.1.6
Mode Control Register - MCR
The Mode Control Register (MCR) allows to switch between the operation modes and to configure the 33911. Writing the MCR returns
the VSR.
Table 41. Mode Control Register - $0
15.3.1.7
C3
C2
C1
C0
Write
HVSE
LINPE
MOD2
MOD1
Reset Value
1
1
-
-
Reset Condition
POR
POR
-
-
HVSE - High-Voltage Shutdown Enable
This write-only bit enables/disables automatic shutdown of the high-side and the low-side drivers during a high-voltage VSOV condition.
1 = automatic shutdown enabled
0 = automatic shutdown disabled
15.3.1.8
LINPE - LIN Pull-up Enable
This write-only bit enables/disables the 30 kΩ LIN pull-up resistor in STOP and SLEEP modes. This bit also controls the LIN bus wake-up
threshold.
1 = LIN pull-up resistor enabled
0 = LIN pull-up resistor disabled
15.3.1.9
MOD2, MOD1 - Mode Control Bits
These write-only bits select the operating mode and allow to clear the watchdog in accordance with Table 42, Mode Control bits.
Table 42. Mode Control Bits
MOD2
MOD1
Description
0
0
Normal Mode
0
1
Stop Mode
1
0
Sleep Mode
1
1
Normal Mode + watchdog Clear
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15.3.1.10 Voltage Status Register - VSR
Returns the status of the several voltage monitors. This register is also returned when writing to the Mode Control Register (MCR).
Table 43. Voltage Status Register - $0/$1
Read
S3
S2
S1
S0
VSOV
VSUV
VDDOT
BATFAIL
15.3.1.11 VSOV - VSUP Overvoltage
This read-only bit indicates an overvoltage condition on the VS1 pin.
1 = Overvoltage condition.
0 = Normal condition.
15.3.1.12 VSUV - VSUP Undervoltage
This read-only bit indicates an undervoltage condition on the VS1 pin.
1 = Undervoltage condition.
0 = Normal condition.
15.3.1.13 VDDOT - Main Voltage Regulator Overtemperature Warning
This read-only bit indicates the main voltage regulator temperature reached the Overtemperature Prewarning Threshold.
1 = Overtemperature Prewarning
0 = Normal
15.3.1.14 BATFAIL - Battery Fail Flag
This read-only bit is set during power-up and indicates the 33911 had a Power On Reset (POR). Any access to the MCR or Voltage Status
Register (VSR) clears the BATFAIL flag.
1 = POR Reset has occurred
0 = POR Reset has not occurred
15.3.1.15 Wake-up Control Register - WUCR
This register is used to control the digital wake-up inputs. Writing the Wake-up Control Register (WUCR) returns the Wake-up Status
Register (WUSR).
Table 44. Wake-up Control Register - $2
C3
C2
C1
C0
Write
0
0
L2WE
L1WE
Reset Value
1
1
1
1
Reset Condition
POR, Reset mode or ext_reset
15.3.1.16 LxWE - Wake-up Input x Enable
This write-only bit enables/disables which Lx inputs are enabled. In Stop and Sleep mode the LxWE bit determines which wake inputs are
active for wake-up. If one of the Lx inputs is selected on the analog multiplexer, the corresponding LxWE is masked to 0.
1 = Wake-up Input x enabled.
0 = Wake-up Input x disabled.
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15.3.1.17 Wake-up Status Register - WUSR
This register is used to monitor the digital wake-up inputs and is also returned when writing to the WUCR.
Table 45. Wake-Up Status Register - $2/$3
S3
S2
S1
S0
-
-
L2
L1
Read
15.3.1.18 Lx - Wake-up Input x
This read-only bit indicates the status of the corresponding Lx input. If the Lx input is not enabled then the according wake-up status
returns 0. After a wake-up form Stop or Sleep mode these bits also allow to determine which input has caused the wake-up, by first reading
the Interrupt Status Register (ISR) and then reading the WUSR.
1 = Lx Wake-up.
0 = Lx Wake-up disabled or selected as analog input.
15.3.1.19 LIN Control Register - LINCR
This register controls the LIN physical interface block. Writing the LIN Control Register (LINCR) returns the LIN Status Register (LINSR).
Table 46. LIN Control Register - $4
C3
C2
C1
C0
Write
LDVS
RXONLY
LSR1
LSR0
Reset Value
0
0
0
0
Reset Condition
POR, Reset mode
or ext_reset
POR, Reset mode,
ext_reset or LIN
failure gone*
POR
* LIN failure gone: if LIN failure (overtemp, TxD/RxD short) was set, the flag resets automatically when the failure is gone.
15.3.1.20 LDVS - LIN Dominant Voltage Select
This write-only bit controls the LIN dominant voltage:
1 = LIN Dominant Voltage = VLIN_DOM_1 (1.7 V typ)
0 = LIN Dominant Voltage = VLIN_DOM_0 (1.1 V typ)
15.3.1.21 RXONLY - LIN Receiver Operation Only
This write-only bit controls the behavior of the LIN transmitter. In Normal mode, the activation of the RXONLY bit disables the LIN
transmitter. During a LIN error condition, this bit is automatically set. In Stop mode, this bit disables the LIN wake-up functionality and the
RXD pin reflects the state of the LIN bus.
1 = only LIN receiver active (Normal mode) or LIN wake-up disabled (Stop mode).
0 = LIN fully enabled.
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15.3.1.22 LSRx - LIN Slew Rate
This write-only bit controls the LIN driver slew rate in accordance with Table 47.
Table 47. LIN Slew-rate Control
LSR1
LSR0
Description
0
0
Normal Slew Rate (up to 20 kb/s)
0
1
Slow Slew Rate (up to 10 kb/s)
1
0
Fast Slew Rate (up to 100 kb/s)
1
1
Reserved
15.3.1.23 LIN Status Register - LINSR
This register returns the status of the LIN physical interface block and is also returned when writing to the LIN Control Register (LINCR).
Table 48. LIN Status Register - $4/$5
Read
S3
S2
S1
S0
RXSHORT
TXDOM
LINOT
LINOC
15.3.1.24 RXSHORT - RXD Short-circuit
This read-only bit indicates a short-circuit condition on RXD (shorted either to 5.0 V or to Ground). The short-circuit delay must be 8.0 μs
worst case to be detected and to shutdown the driver. To clear this bit, it must be read after the condition is gone (transition detected on
RXD). The LIN driver is automatically re-enabled once the condition is gone.
1 = RxD short-circuit condition.
0 = None.
15.3.1.25 TXDOM - TXD Permanent Dominant
This read-only bit signals the detection of a TXD pin stuck at dominant (Ground) condition and the resultant shutdown in the LIN
transmitter. This condition is detected after the TXD pin remains in dominant state for more than 1 second typical value. To clear this bit,
it must be read after TXD has gone high. The LIN driver is automatically re-enabled once TXD goes high.
1 = TXD stuck at dominant fault detected.
0 = None.
15.3.1.26 LINOT - LIN Driver Overtemperature Shutdown
This read-only bit signals the LIN transceiver was shutdown due to overtemperature. The transmitter is automatically re-enabled after the
overtemperature condition is gone and TXD is high. The LINOT bit is cleared after SPI read once the condition is gone.
1 = LIN overtemperature shutdown
0 = None
15.3.1.27 LINOC - LIN Driver Overcurrent Shutdown
This read-only bit signals an overcurrent condition occurred on the LIN pin. The LIN driver is not shutdown but an IRQ is generated. To
clear this bit, it must be read after the condition is gone.
1 = LIN overcurrent shutdown
0 = None
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15.3.1.28 High-side Control Register - HSCR
This register controls the operation of the high-side driver. Writing to this register returns the High-side Status Register (HSSR).
Table 49. High-side Control Register - $6
C3
C2
C1
C0
Write
0
PWMHS1
0
HS1
Reset Value
0
0
0
0
Reset Condition
POR, Reset mode, ext_reset, HS1
overtemp or (VSOV & HVSE)
POR
15.3.1.29 PWMHS1 - PWM Input Control Enable
This write-only bit enables/disables the PWMIN input pin to control the high-side switch. The high-side switch must be enabled (HS1 bit).
1 = PWMIN input controls HS1 output.
0 = HS1 is controlled only by SPI.
15.3.1.30 HS1 - High-side Switch Control
This write-only bit enables/disables the high-side switch.
1 = HS1 switch on.
0 = HS1 switch off.
15.3.1.31 High-side Status Register - HSSR
This register returns the status of the high-side switch and is also returned when writing to the High-side Control Register (HSCR).
Table 50. High-side Status Register - $6/$7
Read
S3
S2
S1
S0
-
-
HS1OP
HS1CL
15.3.1.32 High-side Thermal Shutdown
A thermal shutdown of the high-side drivers is indicated by setting the HS1OP and HS1CL bits simultaneously.
15.3.1.33 HS1OP - High-side Switch Open Load Detection
This read-only bit signals the high-side switch is conducting current below a certain threshold indicating possible load disconnection.
1 = HS1 Open Load detected (or thermal shutdown)
0 = Normal
15.3.1.34 HS1CL - High-side Current Limitation
This read-only bit indicates the high-side switch is operating in current limitation mode.
1 = HS1 in current limitation (or thermal shutdown)
0 = Normal
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15.3.1.35 Low-side Control Register - LSCR
This register controls the operation of the low-side drivers. Writing the Low-side Control Register (LSCR) also returns the Low-side Status
Register (LSSR).
Table 51. Low-side Control Register - $8
C3
Write
Reset Value
C2
PWMLS2 PWMLS1
0
Reset Condition
0
C1
C0
LS2
LS1
0
0
POR, Reset mode, ext_reset, LSx
overtemp or (VSOV & HVSE)
POR
15.3.1.36 PWMLx - PWM Input Control Enable
This write-only bit enables/disables the PWMIN input pin to control the respective low-side switch. The corresponding low-side switch must
be enabled (LSx bit).
1 = PWMIN input controls LSx.
0 = LSx is controlled only by SPI.
15.3.1.37 LSx - LSx Switch Control
This write-only bit enables/disables the corresponding low-side switch.
1 = LSx switch on.
0 = LSx switch off.
15.3.1.38 Low-side Status Register - LSSR
This register returns the status of the low-side switches and is also returned when writing to the LSCR.
Table 52. Low-side Status Register - $8/$9
Read
C3
C2
C1
C0
LS2OP
LS2CL
LS1OP
LS1CL
15.3.1.39 Low-side Thermal Shutdown
A thermal shutdown of the low-side drivers is indicated by setting all LSxOP and LSxCL bits simultaneously.
15.3.1.40 LSxOP - Low-side Switch Open Load Detection
This read-only bit signals the low-side switches are conducting current below a certain threshold indicating possible load disconnection.
1 = LSx Open load detected (or thermal shutdown)
0 = Normal
15.3.1.41 LSxCL - Low-side Current Limitation
This read-only bit indicates the respective low-side switch is operating in current limitation mode.
1 = LSx in current limitation (or thermal shutdown)
0 = Normal
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15.3.1.42 Timing Control Register - TIMCR
This register is a double purpose register which allows to configure the watchdog and the cyclic sense periods. Writing to the Timing
Control Register (TIMCR) also returns the Watchdog Status Register (WDSR).
Table 53. Timing Control Register - $A
C3
Write
CS/WD
Reset Value
-
Reset Condition
-
C2
C1
C0
WD2
WD1
WD0
CYST2
CYST1
CYST0
0
0
0
POR
15.3.1.43 CS/WD - Cyclic Sense or Watchdog Prescaler Select
This write-only bit selects which prescaler is being written to, the Cyclic Sense prescaler or the watchdog prescaler.
1 = Cyclic Sense Prescaler selected
0 = watchdog Prescaler select
15.3.1.44 WDx - Watchdog Prescaler
This write-only bits selects the divider for the watchdog prescaler and therefore selects the watchdog period in accordance with Table 54.
This configuration is valid only if windowing watchdog is active.
Table 54. Watchdog Prescaler
WD2
WD1
WD0
Prescaler Divider
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
6
1
0
0
8
1
0
1
10
1
1
0
12
1
1
1
14
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15.3.1.45 CYSTx - Cyclic Sense Period Prescaler Select
This write-only bits selects the interval for the wake-up cyclic sensing together with the bit CYSX8 in the Configuration Register (CFR) (see
Configuration Register - CFR). This option is only active if the high-side switch is enabled when entering in Stop or Sleep mode. Otherwise
a timed wake-up is performed after the period shown in Table 55.
Table 55. Cyclic Sense Interval
CYSX8 (129)
CYST2
CYST1
CYST0
Interval
X
0
0
0
No cyclic sense
0
0
0
1
20 ms
0
0
1
0
40 ms
0
0
1
1
60 ms
0
1
0
0
80 ms
0
1
0
1
100 ms
0
1
1
0
120 ms
0
1
1
1
140 ms
1
0
0
1
160 ms
1
0
1
0
320 ms
1
0
1
1
480 ms
1
1
0
0
640 ms
1
1
0
1
800 ms
1
1
1
0
960 ms
1
1
1
1
1120 ms
Notes
129. bit CYSX8 is located in Configuration Register (CFR)
15.3.1.46 Watchdog Status Register - WDSR
This register returns the watchdog status information and is returned when writing to the TIMCR.
Table 56. Watchdog Status Register - $A/$B
Read
S3
S2
S1
S0
WDTO
WDERR
WDOFF
WDWO
15.3.1.47 WDTO - Watchdog Timeout
This read-only bit signals the last reset was caused by either a watchdog timeout or by an attempt to clear the watchdog within the window
closed. Any access to this register or the TIMCR clears the WDTO bit.
1 = Last reset caused by watchdog timeout
0 = None
15.3.1.48 WDERR - Watchdog Error
This read-only bit signals the detection of a missing watchdog resistor. In this condition, the watchdog uses the internal, lower precision
timebase. The Windowing function is disabled.
1 = WDCONF pin resistor missing
0 = WDCONF pin resistor not floating
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15.3.1.49 WDOFF - Watchdog Off
This read-only bit signals the watchdog pin connected to Ground and therefore disabled. In this case watchdog timeouts are disabled and
the device automatically enters Normal mode out of Reset. This might be necessary for software debugging and for programming the flash
memory.
1 = Watchdog is disabled
0 = Watchdog is enabled
15.3.1.50 WDWO - Watchdog Window Open
This read-only bit signals when the watchdog window is open for clears. The purpose of this bit is for testing. Should be ignored in case
WDERR is High.
1 = Watchdog window open
0 = Watchdog window closed
15.3.1.51 Analog Multiplexer Control Register - MUXCR
This register controls the analog multiplexer and selects the divider ration for the Lx input divider.
Table 57. Analog Multiplexer Control Register -$C
C3
C2
C1
C0
Write
LXDS
MX2
MX1
MX0
Reset Value
1
0
0
0
Reset Condition
POR
POR, Reset mode or ext_reset
15.3.1.52 LXDS - Lx Analog Input Divider Select
This write-only bit selects the resistor divider for the Lx analog inputs. Voltage is internally clamped to VDD.
0 = Lx Analog divider: 1
1 = Lx Analog divider: 3.6 (typ.)
15.3.1.53 MXx - Analog Multiplexer Input Select
These write-only bits selects which analog input is multiplexed to the ADOUT0 pin according to Table . When disabled or when in Stop or
Sleep mode, the output buffer is not powered and the ADOUT0 output is left floating to achieve lower current consumption.
Table 58. Analog Multiplexer Channel Select
MX2
MX1
MX0
Meaning
0
0
0
Disabled
0
0
1
Reserved
0
1
0
Die Temperature Sensor
0
1
1
VSENSE input
1
0
0
L1 input
1
0
1
L2 input
1
1
0
Reserved
1
1
1
Reserved
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15.3.1.54 Configuration Register - CFR
This register controls the cyclic sense timing multiplier.
Table 59. Configuration Register - $D
C3
C2
C1
C0
Write
0
CYSX8
0
0
Reset Value
0
0
0
0
Reset
Condition
POR, Reset mode
or ext_reset
POR
POR
POR
15.3.1.55 CYSX8 - Cyclic Sense Timing x 8
This write-only bit influences the cyclic sense period as shown in Table .
1 = Multiplier enabled
0 = None
15.3.1.56 Interrupt Mask Register - IMR
This register allow to mask some of interrupt sources. The respective flags within the Interrupt Source Register (ISR) continues to work
but does not generate interrupts to the MCU. The 5.0 V Regulator overtemperature prewarning interrupt and undervoltage (VSUV)
interrupts can not be masked and always causes an interrupt.
Writing to the Interrupt Mask Register (IMR) returns the ISR.
Table 60. Interrupt Mask Register - $E
C3
C2
C1
C0
Write
HSM
LSM
LINM
VMM
Reset Value
1
1
1
1
Reset Condition
POR
15.3.1.57 HSM - High-side Interrupt Mask
This write-only bit enables/disables interrupts generated in the high-side block.
1 = HS Interrupts Enabled
0 = HS Interrupts Disabled
15.3.1.58 LSM - Low-side Interrupt Mask
This write-only bit enables/disables interrupts generated in the low-side block.
1 = LS Interrupts Enabled
0 = LS Interrupts Disabled
15.3.1.59 LINM - LIN Interrupts Mask
This write-only bit enables/disables interrupts generated in the LIN block.
1 = LIN Interrupts Enabled
0 = LIN Interrupts Disabled
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Analog Integrated Circuit Device Data
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15.3.1.60 VMM - Voltage Monitor Interrupt Mask
This write-only bit enables/disables interrupts generated in the Voltage Monitor block. The only maskable interrupt in the Voltage Monitor
block is the VSUP overvoltage interrupt.
1 = Interrupts Enabled
0 = Interrupts Disabled
15.3.1.61 Interrupt Source Register - ISR
This register allows the MCU to determine the source of the last interrupt or wake-up respectively. A read of the register acknowledges
the interrupt and leads IRQ pin to high, in case there are no other pending interrupts. If there are pending interrupts, IRQ is driven high
for 10 μs and then be driven low again. This register is also returned when writing to the IMR.
Table 61. Interrupt Source Register - $E/$F
Read
S3
S2
S1
S0
ISR3
ISR2
ISR1
ISR0
15.3.2 ISRx - Interrupt Source Register
These read-only bits indicate the interrupt source following Table . If no interrupt is pending than all bits are 0. If more than one interrupt
is pending, than the interrupt sources are handled sequentially multiplex.
Interrupt Sources
Interrupt Source
Priority
ISR3
ISR2
ISR1
ISR0
none maskable
maskable
0
0
0
0
no interrupt
no interrupt
none
0
0
0
1
Lx Wake-up from Stop mode-
highest
0
0
1
0
-
HS Interrupt (Overtemperature)
0
0
1
1
-
LS Interrupt (Overtemperature)
0
1
0
0
0
1
0
1
Voltage Monitor Interrupt (Low-voltage and VDD
overtemperature)
Voltage Monitor Interrupt (High-voltage)
0
1
1
0
-
Forced Wake-up
LIN Interrupt (RXSHORT, TXDOM, LIN OT, LIN
OC) or LIN Wake-up
lowest
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99
16
Typical Application
The 33911 can be configured in several applications. The figure below shows the 33911 in the typical Slave Node Application.
VBAT
VS2
VS1
D1
C2
C1
C4
Interrupt
Control Module
LVI, HVI, HTI, OCI
IRQ
C3
Internal
Bus
VDD
Voltage Regulator
AGND
VDD
IRQ
Reset
Control Module
LVR, HVR, HTR, WD,
RST
LS1
Low Side Control
Module
RST
TIMER
LS2
HB Type Relay
PGND
Window
Watchdog Module
PWMIN
R1
Motor Output
High Side Control
Module
HS1
MISO
MOSI
Chip Temp Sense Module
SCLK
Analog Multiplexer
SPI
&
CONTROL
SPI
CS
MCU
VSENSE
VBAT Sense Module
L1
Analog Input Module
A/D
ADOUT0
L2
R2
R3
Wake Up Module
Digital Input Module
RXD
LIN Physical Layer
SCI
LIN
LIN
TXD
WDCONF
LGND
AGND
PGND
C5
Typical Component Values:
C1 = 47µF; C2 = C4 = 100nF; C3 = 10µF; C5 = 220pF
R1 = 10kΩ; R2 = R3 = 10kΩ; R4 = 20kΩ-200kΩ
R4
Recommended Configuration of the not Connected Pins (NC):
Pin 15, 16, 20, 21 = GND
Pin 11, 30 = open (floating)
Pin 24 = open (floating) or VS2
Pin 28 = this pin is not internally connected and may be used for PCB routing
optimization.
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17
Packaging
17.1
Package Dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.freescale.com and
perform a keyword search for the drawing’s document number.
Table 62. Package Dimensions
Package
Suffix
32-Pin LQFP
AC
Package Outline Drawing Number
98ASH70029A
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Analog Integrated Circuit Device Data
Freescale Semiconductor
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Analog Integrated Circuit Device Data
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18
Revision History
Revision
1.0
Date
Description of Changes
5/2007
•
Initial Release
2.0
9/2007
•
•
•
•
•
Several textual corrections
Page 11: “Analog Output offset Ratio” (LXDS=1) changed to “Analog Output offset” +/-22mV
Page 11: VSENSE Input Divider Ratio adjusted to 5,0/5,25/5,5
Page 12: Common mode input impedance corrected to 75kΩ
Page 13/15: LIN PHYSICAL LAYER parameters adjusted to final LIN specification release
3.0
9/2007
•
Revision number incremented at engineering request.
4.0
2/2008
•
Changed Functional Block Diagram on page 24.
•
•
•
Datasheet updated according to the Pass1.2 silicon version electrical parameters
Add Maximum Rating on IBUS_NO_GND parameter
Added L1 and L2, Temperature Sense Analog Output Voltage per characterization, Internal Chip Temperature
Sense Gain per characterization at 3 temperatures. See Figure 16, Temperature Sense Gain, VSENSE Input
Divider Ratio (RATIOVSENSE=Vsense/Vadout0) per characterization, and VSENSE Output Related Offset per
characterization parameters
Added Temperature Sense Gain section
5.0
11/2008
•
•
•
Minor corrections to ESD Capability, (17), Cyclic Sense ON Time from Stop and Sleep Mode, Lin Bus Pin (LIN),
Serial Data Clock Pin (SCLK), Master Out Slave In Pin (MOSI), Master In Slave Out Pin (MISO), Low-side Pins
(LS1 and LS2), Digital/Analog Pins (L1 and L2), Normal Request Mode, Sleep Mode, LIN Overtemperature
Shutdown/TXD Stuck At Dominant/RXD Short-circuit, Fault Detection Management Conditions, Lin Physical
Layer, LIN Interface, Overtemperature Shutdown (LIN Interrupt), LIN Receiver Operation Only, SPI Protocol,
Lx - Wake-up Input X, LIN Control Register - LINCR, and RXSHORT - RXD Pin Short-circuit
Updated Freescale form and style
6.0
2/2009
•
Added explanation for pins Not Connected (NC).
7.0
3/2009
•
Changed VBAT_SHIFT and GND_SHIFT maximum from 10% to 11.5% for both parameters on page 14.
•
8.0
3/2010
Combined Complete Data sheet for Part Numbers MC33911BAC and MC34911BAC to the back of this data
sheet.
Changed ESD Voltage for Machine Model from ± 200 to ± 150
•
9.0
01/2014
10.0
9/2015
•
No technical changes. Revised back page. Updated document properties. Added SMARTMOS sentence to last
paragraph.
•
Added note (70) to Table 28
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© 2015 Freescale Semiconductor, Inc.
Document Number: MC33911
Rev. 10.0
9/2015
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