HS-80C85RH Radiation Hardened 8-Bit CMOS Microprocessor February 1996 Features Description • Devices QML Qualified in Accordance With MIL-PRF-38535 The HS-80C85RH is an 8-bit CMOS microprocessor fabricated using the Intersil radiation hardened self-aligned junction isolated (SAJI) silicon gate technology. Latch-up free operation is achieved by the use of epitaxial starting material to eliminate the parasitic SCR effect seen in conventional bulk CMOS devices. • Detailed Electrical and Screening Requirements are Contained in SMD# 5962-95824 and Intersil’ QM Plan • Radiation Hardened EPI-CMOS - Parametrics Guaranteed 1 x 105 RAD(Si) - Transient Upset > 1 x 108 RAD(Si)/s - Latch-up Free > 1 x 1012 RAD(Si)/s The HS-80C85RH is a functional logic emulation of the HMOS 8085 and its instruction set is 100% software compatible with the HMOS device. The HS80C85RH is designed for operation with a single 5 volt power supply. Its high level of integration allows the construction of a radiation hardened microcomputer system with as few as three ICs (HS80C85RH CPU, HS83C55RH ROM I/O, and the HS-81C55/ 56RH RAM I/O. • Low Standby Current 500µA Max • Low Operating Current 5.0mA/MHz (X1 Input) • Electrically Equivalent to Sandia SA 3000 • 100% Software Compatible with INTEL 8085 • Operation from DC to 2MHz, Post Radiation • Single 5 Volt Power Supply • On-Chip Clock Generator and System Controller • Four Vectored Interrupt Inputs • Completely Static Design • Self Aligned Junction Isolated (SAJI) Process • Military Temperature Range -55oC to +125oC Pinouts 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835, CDIP2-T40 TOP VIEW X1 1 40 VDD X2 2 39 HOLD RESET OUT 3 SOD 4 SID 5 TRAP 6 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (FLATPACK) INTERSIL OUTLINE K42.A TOP VIEW 38 HLDA 37 CLOCK OUT 36 RESET IN 35 READY X1 1 42 VDD X2 RESET OUT SOD SID 2 41 HOLD 3 40 4 39 5 38 TRAP 6 37 7 8 36 35 HLDA CLOCK OUT RESET IN READY IO / M 9 34 RD RST 7.5 7 34 IO / M RST 6.5 8 33 S1 RST 7.5 RST 6.5 RST 5.5 9 32 RD RST 5.5 INTR 10 31 WR INTR 10 33 WR INTA 11 30 ALE INTA 11 32 ALE AD0 12 29 S0 AD0 12 31 AD1 13 28 A15 AD1 13 30 AD2 14 27 A14 AD2 14 29 S0 A15 A14 AD3 15 26 A13 AD3 15 28 A13 AD4 16 25 A12 AD4 16 27 A12 AD5 17 24 A11 23 A10 AD7 19 22 A9 17 18 19 26 25 24 A11 AD6 18 NC NC AD5 AD6 20 23 A8 AD7 21 22 GND GND 20 21 A8 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 1 S1 A10 A9 Spec Number File Number 518054 3036.2 HS-80C85RH Ordering Information PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962R9582401QQC -55oC to +125oC MIL-PRF-38535 Level Q 40 Lead SBDIP 5962R9582401QXC -55oC to +125oC MIL-PRF-38535 Level Q 42 Lead Ceramic Flatpack 5962R9582401VQC -55oC to +125oC MIL-PRF-38535 Level V 40 Lead SBDIP 5962R9582401VXC -55oC to +125oC MIL-PRF-38535 Level V 42 Lead Ceramic Flatpack HS1-80C85RH/SAMPLE +25oC Sample 40 Lead SBDIP HS9-80C85RH/SAMPLE +25oC Sample 42 Lead Ceramic Flatpack Functional Diagram RST 5.5 INTA INTR RST 6.5 RST 7.5 TRAP INTERRUPT CONTROL SID SOD SERIAL I/O CONTROL ACCUMULATOR (8) TEMP REG (8) FLAG (5) FLIP FLOPS INSTRUCTION REGISTER (8) POWER VDD SUPPLY GND X1 X2 CLK TIMING AND CONTROL CONTROL GEN WR READY CLK OUT RD STATUS S0 ALE C REG (8) D REG (8) E REG (8) H REG (8) L REG (8) STACK POINTER (16) INSTRUCTION DECODER AND MACHINE CYCLE ENCODING ARITHMETIC LOGIC UNIT (ALU) (8) B REG (8) PROGRAM COUNTER (16) INCREMENTER DECREMENTER ADDRESS LATCH (16) RESET DMA IO/M HLDA S1 HOLD REGISTER ARRAY 8-BIT INTERNAL DATA BUS RESET RESET IN OUT ADDRESS DATA ADDRESS BUFFER (8) BUFFER (8) A15-A8 ADDRESS BUS AD1-AD0 ADDRESS BUS Spec Number 2 518054 HS-80C85RH Pin Description SYMBOL PIN NUMBER TYPE DESCRIPTION A8 - A15 21-28 O Address Bus: The most significant 8 bits of the memory address or the 8 bits of the I/O address, 3-stated during Hold and Halt modes and during RESET. AD0-7 12-19 I/O Multiplexed Address/Data Bus: Lower 8 bits of the memory address (or I/O address) appear on the bus during the first clock cycle (T state) of a machine cycle. It then becomes the data bus during the second and third clock cycles. ALE 32 O Address Latch Enable: It occurs during the first clock state of a machine cycle and enables the address to get latched into the on-chip latch of peripherals. The falling edge of ALE is set to guarantee setup and hold times for the address information. The falling edge of ALE can also be used to strobe the status information. ALE is never 3-stated. S0, S1, and IO/M 31, 35, & 36 O Machine Cycle Status: IO/M S1 S0 0 0 1 Status Memory write 0 1 0 Memory write 1 0 1 I/O write 1 1 0 I/O read 0 1 1 Opcode fetch 1 1 1 Opcode fetch 1 1 1 Interrupt acknowledge T 0 0 Halt T X X Hold T X X Reset T = 3-State (high impedance) X = Unspecified S1 can be used as an advanced R/W status. IO/M, S0 and S1 become valid at the beginning of a machine cycle and remain stable throughout the cycle. The falling edge of ALE may be used to latch the state of these lines. RD 34 O Read Control: A low level on RD indicates the selected memory or I/O device is to be read and that the Data Bus is available for the data transfer, 3-stated during Hold and Halt modes and during RESET. WR 33 O Write Control: A low level on WR indicates the data on the Data Bus is to be written into the selected memory or I/O location. Data is set up at the trailing edge of WR, 3-stated during Hold and Halt modes and during RESET. READY 35 I Ready: If READY is high during a read or write cycle, it indicates that the memory or peripheral is ready to send or receive data. If READY is low, the cpu will wait an integral number of clock cycles for READY to go high before completing the read or write cycle. READY must conform to specified setup and hold times. HOLD 39 I Hold: Indicates that another master is requesting the use of the address and data buses. The cpu, upon receiving the hold request, will relinquish the use of the bus as soon as the completion of the current bus transfer. Internal processing can continue. The processor can regain the bus only after the HOLD is removed. When the HOLD is acknowledged, the Address, Data Bus, RD, WR, and IO/M lines are 3-stated. HLDA 38 O Hold Acknowledge: Indicates that the cpu has received the HOLD request and that it will relinquish the bus in the next clock cycle. HLDA goes low after the Hold request is removed. The cpu takes the bus one half clock cycle after HLDA goes low. Spec Number 3 518054 HS-80C85RH Pin Description (Continued) SYMBOL PIN NUMBER TYPE DESCRIPTION INTR 10 I Interrupt Request: Is used as a general purpose interrupt. It is sampled only during the next to the last clock cycle of an instruction and during Hold and Halt states. If it is active, the Program Counter (PC) will be inhibited from incrementing and an INTA will be issued. During this cycle a RESTART or CALL instruction can be inserted to jump to the interrupt service routine. The INTR is enabled and disabled by software. It is disabled by Reset and immediately after an interrupt is accepted. INTA 11 O Interrupt Acknowledge: Is used instead of (and has the same timing as) RD during the Instruction cycle after an INTR is accepted. It can be used to activate an 8259A Interrupt chip or some other interrupt port. RST 5.5 RST 6.5 RST 7.5 9 8 7 I Restart Interrupts: These three inputs have the same timing as INTR except they cause an internal RESTART to be automatically inserted. The priority of these interrupts is ordered as shown in Table 6. These interrupts have a higher priority than INTR. In addition, they may be individually masked out using the SIM instruction. TRAP 6 I Trap: Trap interrupt is a non-maskable RESTART interrupt. It is recognized at the same time as INTR or RST 5.5-7.5. It is unaffected by any mask or Interrupt Enable. It has the highest priority of any interrupt. (See Table 6.) RESET IN 36 I Reset In: Sets the Program Counter to zero and resets the Interrupt Enable and HLDA flip-flops. The data and address buses and the control lines are 3-stated during RESET and because of the asynchronous nature of RESET the processor’s internal registers and flags may be altered by RESET with unpredictable results. RESET IN is a Schmitt-triggered input, allowing connection to an R-C network for power-on RESET delay (see Figure 1). Upon power-up, RESET IN must remain low for at least 10 “clock cycle” after minimum VDD has been reached. For proper reset operation after the power-up duration, RESET IN should be kept low a minimum of three clock periods. The CPU is held in the reset condition as long as RESET IN is applied. RESET OUT 3 O Reset Out: Reset Out indicates cpu is being reset. Can be used as a system reset. The signal is synchronized to the processor clock and lasts an integral number of clock periods. X1 X2 1 2 I O X1 and X2: Are connected to a crystal, LC, or RC network to drive the internal clock generator. X, can also be an external clock Input from a logic gate. The input frequency is divided by 2 to give the processor’s internal operating frequency. CLK 37 O Clock: Clock output for use as a system clock. The period of CLK is twice the X1, X2 input period. SID 5 I Serial Input Data Line: The data on this line is loaded into accumulator bit 7 whenever a RIM instruction is executed. SOD 4 O Serial Output Data Line: The output SOD is set or reset as specified by the SlM instruction. VCC 40 I Power: +5V supply. GND 20 I Ground: Reference. RESET IN R1 C1 VDD TYPICAL POWER-ON RESET RC VALUES† R1 = 75KΩ C1 = 1µF † Values may have to vary due to applied power supply ramp up time. FIGURE 1. POWER-ON RESET CIRCUIT Spec Number 4 518054 Specifications HS-80C85RH Absolute Maximum Ratings Reliability Information Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.3V to VCC+0.3V Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC Typical Derating Factor. . . . . . . . . . .2.0mA/MHz Increase in IDDOP ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance θJA θJC SBDIP Package. . . . . . . . . . . . . . . . . . . . 45oC/W 10oC/W Ceramic Flatpack Package . . . . . . . . . . . 77oC/W 13oC/W Maximum Package Power Dissipation at +125oC Ambient SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.11W Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.65W If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22.2mW/oC Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . 13.0mW/oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Operating Conditions Operating Supply Voltage Range (VDD) . . . . . . . +4.75V to +5.25V Operating Temperature Range (TA) . . . . . . . . . . . . -55oC to +125oC Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +0.8V Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . VDD -0.5V to VDD TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL GROUP A SUBGROUPS CONDITIONS LIMITS TEMPERATURE MIN MAX UNITS Input Leakage Current IIH or IIL VDD = 5.25V, VI = VDD or GND 1, 2, 3 -55oC, +25oC, or +125oC -1.0 1.0 µA High Level Output Voltage VOH VDD = 4.75V, IOH = -1.0mA 1, 2, 3 -55oC, +25oC, or +125oC VDD -0.5 - V Low Level Output Voltage VOL VDD = 5.25V, IOL = 1.0mA, 1, 2, 3 -55oC, +25oC, or +125oC - 0.5 V Static Current IDDSB VDD = 5.25V, Clock Out = Hi and Low 1, 2, 3 -55oC, +25oC, or +125oC - 500 µA Operating Supply Current (Note 2) IDDOP VDD = 5.25V, f = 1MHz (Note 2) 1, 2, 3 -55oC, +25oC, or +125oC - 5.0 mA/MHz Functional Tests FT 7, 8A, 8B -55oC, +25oC, or +125oC - - - VDD = 4.75V and 5.25V, TCYC = 500ns, VOL ≤ VDD/2, VOH ≥ VDD/2 NOTES: 1. All devices guaranteed at worst case limits and over radiation. 2. Operating supply current (IDDOP) is proportional to crystal frequency. Parts are tested at 1MHz TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER CLK Low Time (Standard CLK Loading) CLK High Time (Standard CLK Loading) CLK Rise Time CLK Fall Time X1 Rising to CLK Rising X1 Rising to CLK Falling A8-15 Valid to Leading Edge of Control (Note 5) A0-7 Valid to Leading Edge of Control A0-15 Valid to Valid Data In Address Float After Leading Edge of READ (INTA) SYMBOL T1 T2 Tr Tf TXKR TXKF TAC TACL TAD TAFR GROUP A SUBGROUPS LIMITS TEMPERATURE MIN MAX UNITS 9, 10, 11 -55oC, +25oC, +125oC 40 - ns 9, 10, 11 -55oC, +25oC, +125oC 100 - ns 9, 10, 11 -55oC, +25oC, +125oC - 115 ns 9, 10, 11 -55oC, +25oC, +125oC - 115 ns 9, 10, 11 -55oC, +25oC, +125oC 30 250 ns 9, 10, 11 -55oC, +25oC, +125oC 50 275 ns 9, 10, 11 -55oC, +25oC, +125oC 300 - ns 9, 10, 11 -55oC, +25oC, +125oC 300 - ns 9, 10, 11 -55oC, +25oC, +125oC 875 - ns 9, 10, 11 -55oC, +25oC, +125oC - 70 ns Spec Number 5 518054 Specifications HS-80C85RH TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) LIMITS PARAMETER SYMBOL GROUP A SUBGROUPS A8-15 Valid Before Trailing Edge of ALE (Note 5) TAL 9, 10, 11 -55oC, +25oC, +125oC 75 - ns A0-7 Valid Before Trailing Edge of ALE tALL 9, 10, 11 -55oC, +25oC, +125oC 125 - ns TARY 9, 10, 11 -55oC, +25oC, +125oC 250 - ns TCA 9, 10, 11 -55oC, +25oC, +125oC 150 - ns +125oC 575 - ns READY Valid from Address Valid Address (A8-15) Valid After Control TEMPERATURE MIN MAX UNITS Width of Control Low (RD, WR, INTA) Edge of ALE TCC 9, 10, 11 -55oC, Trailing Edge of Control to Leading Edge of ALE TCL 9, 10, 11 -55oC, +25oC, +125oC 60 - ns Data Valid to Trailing Edge of WRITE TDW 9, 10, 11 -55oC, +25oC, +125oC 575 - ns HLDA to Bus Enable THABE 9, 10, 11 -55oC, +25oC, +125oC - 375 ns Bus Float After HLDA THABF 9, 10, 11 -55oC, +25oC, +125oC - 375 ns HLDA Valid to Trailing Edge of CLK THACK 9, 10, 11 -55oC, +25oC, +125oC 90 - ns HOLD Hold Time THDH 9, 10, 11 -55oC, +25oC, +125oC - 0 ns HOLD Setup Time to Trailing Edge of CLK THDS 9, 10, 11 -55oC, +25oC, +125oC - 300 ns INTR Hold Time TINH 9, 10, 11 -55oC, +25oC, +125oC - 0 ns INTR, RST and TRAP Setup Time to Falling Edge of CLK TINS 9, 10, 11 -55oC, +25oC, +125oC - 375 ns Address Hold Time After ALE TLA 9, 10, 11 -55oC, +25oC, +125oC 75 - ns 9, 10, 11 -55oC, +25oC, +125oC 150 - ns 9, 10, 11 -55oC, +25oC, +125oC 125 - ns 9, 10, 11 -55oC, +25oC, +125oC 675 - ns 9, 10, 11 -55oC, +25oC, +125oC - 350 ns 9, 10, 11 -55oC, +25oC, +125oC 200 - ns 9, 10, 11 -55oC, +25oC, +125oC - 175 ns TRAE 9, 10, 11 -55oC, +25oC, +125oC 120 - ns READ (or INTA) to Valid Data TRD 9, 10, 11 -55oC, +25oC, +125oC 375 - ns Control Trailing Edge to Leading Edge of Next Control TRV 9, 10, 11 -55oC, +25oC, +125oC 550 - ns TRDH 9, 10, 11 -55oC, +25oC, +125oC - 0 ns 9, 10, 11 -55oC, +25oC, +125oC - 0 ns 9, 10, 11 -55oC, +25oC, +125oC 250 - ns 9, 10, 11 -55oC, +25oC, +125oC 150 - ns 9, 10, 11 -55oC, +25oC, +125oC - 50 ns Trailing Edge of ALE to Leading Edge of Control ALE Low During CLK High ALE to Valid Data During Read ALE to Valid Data During Write ALE Width ALE to READY Stable Trailing Edge of READ to Re-Enabling the Address Data Hold Time After READ INTA READY Hold Time READY Setup Time to Leading Edge of CLK Data Valid After Trailing Edge of WRITE LEADING Edge of WRITE to Data Valid TLC TLCK TLDR TLDW TLL TLRY TRYH TRYS TWD TWDL +25oC, NOTES: 1. Output timings are measured with a purely capacitive load, CL = 150pF 2. VDD = 4.75V, VIH = 4.25V, VIL = 0.8V 3. Delay times are measured with a 1MHz clock. An algorithm is used to convert the delays into the AC timings above with a TCYC = 500ns. 4. The AC table is tested as shown above to guarantee the processor system timing. 5. A8 - A15 address specifications also apply to IO/M, S0 and S1 except A8 - A15 are undefined during T4-T6 of off cycle whereas IO/M, So, and S1 are stable. Spec Number 6 518054 Specifications HS-80C85RH TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER (NOTE 1) CONDITIONS SYMBOL TEMPERATURE MIN MAX UNITS Input Capacitance CIN VDD = Open, f = 1MHz TA = +25oC - 12 pF I/O Capacitance CI/O VDD = Open, f = 1MHz TA = +25oC - 13 pF COUT VDD = Open, f = 1MHz TA = +25oC - 12 pF Output Capacitance NOTE: 1. All measurements referenced to device ground. TABLE 4. POST 100K RAD ELECTRICAL PERFORMANCE CHARACTERISTICS NOTE: The post irradiation test conditions and limits are the same as those listed in Tables 1 and 2. TABLE 5. BURN-IN DELTA PARAMETERS (+25oC; In Accordance With SMD) TABLE 6. INTERRUPT PRIORITY, RESTART ADDRESS, AND SENSITIVITY PRIORITY ADDRESS BRANCHED TO (1) WHEN INTERRUPT OCCURS TRAP 1 24H Rising edge and high level until sampled. RST 7.5 2 3CH Rising edge (latched) RST 6.5 3 34CH High level until sampled. RST 5.5 4 2CH High level until sampled. INTR 5 See Note 2 High level until sampled. NAME TYPE TRIGGER NOTES: 1. The processor pushes the PC on the stack before branching to the indicated address. 2. The address branched to depends on the instruction provided to the cpu when the interrupt is acknowledged. TABLE 7. BUS TIMING SPECIFICATION AS A tCYC DEPENDENT SYMBOL HS-8OC85RH SYMBOL HS-8OC85RH tAL (1/2)T- 175 Minimum tCC (3/2 + N)T - 175 Minimum tLA (1/2)T- 175 Minimum tCL (1/2)T - 190 Minimum tLL (1/2)T-50 Minimum tARY (3/2)T - 500 Maximum tLCK (1/2)T- 125 Minimum tHACK (1/2)T - 160 Minimum tLC (1/2)T- 100 Minimum tHABF (1/2)T +125 Maximum tAD (5/2 + N)T - 375 Maximum tHABE (1/2)T +125 Maximum tRD (3/2 + N)T - 375 Maximum tAC (2/2)T - 200 Minimum tRAE (1/2)T- 130 Minimum t1 (1/2)T-210 Minimum tCA (1/2)T - 100 Minimum t2 (1/2)T- 150 Minimum tDW (3/2 + N)T - 175 Minimum tRV (3/2)T - 200 Minimum tWD (1/2)T-100 Minimum tLDR (4/2)T - 325 Maximum NOTE: N is equal to the total WAIT states T = tCYC Spec Number 7 518054 HS-80C85RH Waveforms X1 INPUT t2 tr tf CLK OUTPUT t1 tXKR tCYC tXKF FIGURE 2. CLOCK T1 T2 T3 T1 CLK tLCK A8-15 tCA ADDRESS tRAE tAD AD0-AD7 tRDH DATA IN ADDRESS tLL tLA tAFR ALE tCL tLDR tAL tRD tCC RD/INTA tLC tAC FIGURE 3. READ T1 T2 T3 T1 CLK tLCK A8-15 ADDRESS tLDW AD0-AD7 tCA DATA OUT ADDRESS tLL tLA ALE tDW tWD tWDL tAL tCC tLC WR tCL tAC FIGURE 4. WRITE Spec Number 8 518054 HS-80C85RH Waveforms (Continued) T2 T2 THOLD THOLD T1 CLK HOLD tHDS tHDH tHACK HLDA tHABF tHABE BUS (ADDRESS, CONTROLS) FIGURE 5. HOLD T1 T2 TWAIT T3 T3 CLK tLCK tCA A8-15 ADDRESS tRAE tAD tRDH DATA IN ADDRESS tLA AD0-AD7 tLL tAFR ALE tCL tLDR tAL tRD tCC tLC RD/INTA tLRY tAC tARY tRYS tRYH tRYS tRYH READY NOTE 1: READY MUST REMAIN STABLE DURING SETUP AND HOLD TIMES. FIGURE 6. READ OPERATION WITH WAIT CYCLE (TYPICAL) - SAME READY TIMING APPLIES TO WRITE T1 T2 T3 T4 T5 T6 THOLD T1 T2 A8-15 A0-7 CALL INST. BUS FLOATING† RD INTR tHABE INTR tINH tINS HOLD tHDH HLDA tHDS tHACK tHABF † IO/M IS ALSO FLOATING DURING THIS TIME. FIGURE 7. INTERRUPT AND HOLD Spec Number 9 518054 HS-80C85RH TABLE 9. INSTRUCTION SET SUMMARY INSTRUCTION CODE MNEMONIC D7 D6 D5 D4 D3 D2 D1 D0 INSTRUCTION CODE OPERATIONS DESCRIPTION MOVE, LOAD, AND STORE OPERATIONS DESCRIPTION D7 D6 D5 D4 D3 D2 D1 D0 RNZ 1 1 0 0 0 0 0 0 Return on no zero RP 1 1 1 1 0 0 0 0 Return on positive MNEMONIC MOVr1, r2 0 1 D D D S S S Move register to register RM 1 1 1 1 1 0 0 0 Return on minus MOV M.r 0 1 1 1 0 S S S Move register to memory RPE 1 1 1 0 1 0 0 0 Return on parity even MOV r.M 0 1 D D D 1 1 0 Move memory to register RPO 1 1 1 0 0 0 0 0 Return on parity odd MVl r 0 0 D D D 1 1 0 Move immediate register RESTART MVl M 0 0 1 1 0 1 1 0 Move immediate memory RST 1 1 A A A 1 1 1 Restart LXl B 0 0 0 0 0 0 0 1 Load immediate register Pair B & C IN 1 1 0 1 1 0 1 1 Input LXl D 0 0 0 1 0 0 0 1 Load immediate register Pair D & E OUT 1 1 0 1 0 0 1 1 Output INPUT/OUTPUT INCREMENT AND DECREMENT INR r 0 0 D D D 1 0 0 Increment register DCR r 0 0 D D D 1 0 1 Decrement register INR M 0 0 1 1 0 1 0 0 Increment memory DCR M 0 0 1 1 0 1 0 1 Decrement memory INX B 0 0 0 0 0 0 1 1 Increment B & C registers INX D 0 0 0 1 0 0 1 1 Increment D & E registers POP B 1 1 0 0 0 0 0 1 Pop register Pair B & C off stack Load H & L direct POP D 1 1 0 1 0 0 0 1 Exchange D & E, H & L Registers Pop register Pair D & E off stack POP H 1 1 1 0 0 0 0 1 Popregister Pair H & L off stack LXl H 0 0 1 0 0 0 0 1 Load immediate register Pair H & L STAX B 0 0 0 0 0 0 1 0 Store A indirect STAX D 0 0 0 1 0 0 1 0 Store A indirect LDAX B 0 0 0 0 1 0 1 0 Load A indirect LDAX D 0 0 0 1 1 0 1 0 Load A indirect STA 0 0 1 1 0 0 1 0 Store A direct LDA 0 0 1 1 1 0 1 0 Load A direct SHLD 0 0 1 0 0 0 1 0 Store H & L direct LHLD 0 0 1 0 1 0 1 0 XCHG 1 1 1 0 1 0 1 1 STACK OPS PUSH B 1 1 0 0 0 1 0 1 Push register Pair B & C on stack POP PSW 1 1 1 1 0 0 0 1 Pop A and Flags off stack PUSH D 1 1 0 1 0 1 0 1 Push register Pair D & E on stack XTHL 1 1 1 0 0 0 1 1 Exchange top ot stack, H & L PUSH H 1 1 1 0 0 1 0 1 Push register Pair H & L on stack SPHL 1 1 1 1 1 0 0 1 H & L to stack pointer PUSH PSW 1 1 1 1 0 1 0 1 Push A and Flags on stack LXI SP 0 0 1 1 0 0 0 1 Load immediate stack pointer CZ 1 1 0 0 1 1 0 0 Call on zero INX SP 0 0 1 1 0 0 1 1 Increment stack pointer CNZ 1 1 0 0 0 1 0 0 Call on no zero DCX SP 0 0 1 1 1 0 1 1 CP 1 1 1 1 0 1 0 0 Call on positive Decrement stack pointer CM 1 1 1 1 1 1 0 0 Call on minus JUMP CPE 1 1 1 0 1 1 0 0 Call on parity even JMP 1 1 0 0 0 0 1 1 Jump unconditional CPO 1 1 1 0 0 1 0 0 Call on parity odd JC 1 1 0 1 1 0 1 0 Jump on carry JNC 1 1 0 1 0 0 1 0 Jump on no carry RETURN RET 1 1 0 0 1 0 0 1 Return JZ 1 1 0 0 1 0 1 0 Jump on zero RC 1 1 0 1 1 0 0 0 Return on carry JNZ 1 1 0 0 0 0 1 0 Jump on no zero RNC 1 1 0 1 0 0 0 0 Return on no carry JP 1 1 1 1 0 0 1 0 Jump on positive RZ 1 1 0 0 1 0 0 0 Return on zero JM 1 1 1 1 1 0 1 0 Jump on minus Spec Number 10 518054 HS-80C85RH TABLE 9. INSTRUCTION SET SUMMARY (Continued) INSTRUCTION CODE OPERATIONS DESCRIPTION D7 D6 D5 D4 D3 D2 D1 D0 ADC M 1 0 0 0 1 1 1 0 Add memory to A with carry Jump on parity odd ADl 1 1 0 0 0 1 1 0 Add immediate to A H & L to program counter ACl 1 1 0 0 1 1 1 0 Add immediate to A with carry DAD B 0 0 0 0 1 0 0 1 Add B & C to H & L D7 D6 D5 D4 D3 D2 D1 D0 JPE 1 1 1 0 1 0 1 0 Jump on parity even JPO 1 1 1 0 0 0 1 0 PCHL 1 1 1 0 1 0 0 1 MNEMONIC INSTRUCTION CODE OPERATIONS DESCRIPTION MNEMONIC CALL CALL 1 1 0 0 1 1 0 1 Call unconditional DAD D 0 0 0 1 1 0 0 1 Add D & E to H & L CC 1 1 0 1 1 1 0 0 Call on carry DAD H 0 0 1 0 1 0 0 1 Add H & L to H & L CNC 1 1 0 1 0 1 0 0 Call on no carry DAD SP 0 0 1 1 1 0 0 1 Add stack pointer to H&L ANA r 1 0 1 0 0 S S S And register with A XRA r 1 0 1 0 1 S S S Exclusive OR register with A SUB r 1 0 0 1 0 S S S Subtract register from A ORA r 1 0 1 1 0 S S S OR register with A SBB r 1 0 0 1 1 S S S Subtract register from A with borrow CMP r 1 0 1 1 1 S S S Compare register with A SUB M 1 0 0 1 0 1 1 0 Subtract memory from A ANA M 1 0 1 0 0 1 1 0 And memory with A SBB M 1 0 0 1 1 1 1 0 XRA M 1 0 1 0 1 1 1 0 Exclusive OR memory with A Subtract memory from A with borrow SUl 1 1 0 1 0 1 1 0 ORA M 1 0 1 1 0 1 1 0 OR memory with A Subtract immediate from A CMP M 1 0 1 1 1 1 1 0 Compare memory with A SBl 1 1 0 1 1 1 1 0 Subtract immediate from A with borrow ANI 1 1 1 0 0 1 1 0 And immediate with A XRI 1 1 1 0 1 1 1 0 Exclusive OR immediate with A CMA 0 0 1 0 1 1 1 1 Complement A STC 0 0 1 1 0 1 1 1 Set carry ORl 1 1 1 1 0 1 1 0 OR immediate with A CMC 0 0 1 1 1 1 1 1 Complement carry DAA 0 0 1 0 0 1 1 1 Decimal adjust A El 1 1 1 1 1 0 1 1 Enable Interrupts LOGICAL CPl 1 1 1 1 1 1 1 0 SUBTRACT SPECIALS Compare immediate with A CONTROL ROTATE RLC 0 0 0 0 0 1 1 1 Rotate A left DI 1 1 1 1 0 0 1 1 Disable Interrupt RRC 0 0 0 0 1 1 1 1 Rotate A right NOP 0 0 0 0 0 0 0 0 No-operation RAL 0 0 0 1 0 1 1 1 Rotate A left through carry HLT 0 1 1 1 0 1 1 0 Halt RIM 0 0 1 0 0 0 0 0 RAR 0 0 0 1 1 1 1 1 Rotate A right through carry Read Interrupt Mask SlM 0 0 1 1 0 0 0 0 Set Interrupt Mask INX H 0 0 1 0 0 0 1 1 Increment H & L registers DCX B 0 0 0 0 1 0 1 1 Decrement B & C DCX D 0 0 0 1 1 0 1 1 Decrement D & E DCX H 0 0 1 0 1 0 1 1 Decrement H & L ADD r 1 0 0 0 0 S S S Add register to A ADC r 1 0 0 0 1 S S S Add register to A with carry ADD M 1 0 C 0 0 1 1 0 Add memory to A NOTES: 1. DDS or SSS: B000, C001, D010, E011, H100, L101, Memory 110, A111 2. Two possible cycle times (6/12) indicate instruction cycles dependent on condition flags. † All mnemonics copyrighted „ Intel Corporation 1976 ADD Spec Number 11 518054 HS-80C85RH Functional Description enabled or disabled by El or Dl software instructions), and causes the CPU to fetch in an RST instruction, externally placed on the data bus, which vectors a branch to any one of eight fixed memory locations (Restart addresses). The decimal addresses of these dedicated locations are: 0, 8, 16, 24, 32, 40, 48, and 56. Any of these addresses may be used to store the first instruction(s) of a routine designed to service the requirements of an interrupting device. Since the (RST) is a call, completion of the instruction also stores the old program counter contents on the STACK. Each of the three RESTART inputs, 5.5, 6.5, and 7.5, has a programmable mask. TRAP is also a RESTART interrupt but it is nonmaskable. The HS-80C85RH is a complete 8-bit parallel central processing unit implemented in a self aligned, silicon gate, CMOS technology. Its static design allows the device to be operated at any external clock frequency from a maximum of 4MHz down to DC. The processor clock can be stopped in either the high or low state and held there indefinitely. This type of operation is especially useful for system debug or power critical applications. The device is designed to fit into a minimum system of three ICs: CPU (HS-80C85RH), RAM/ IO (HS-81C55/56RH) and ROM/IO Chip (HS-83C55RH). Since the HS-80C85RH is implemented in CMOS, all of the advantages of CMOS technology are inherent in the device. These advantages include low standby and operating power, high noise immunity, moderately high speed, wide operating temperature range, and designed-in radiation hardness. Thus the HS-80C85RH is ideal for weapons and space applications. The three maskable interrupts cause the internal execution of RESTART (saving the program counter in the stack and branching to the RESTART address) if the interrupts are enabled and if the interrupt mask is not set. The nonmaskable TRAP causes the internal execution of a RESTART vector independent of the state of the interrupt enable or masks. (See Table 9.) The HS-80C85RH has twelve addressable 8-bit registers. Four of them can function only as two 16-bit register pairs. Six others can be used interchangeably as 8-bit registers or as 16-bit register pairs. The HS-80C85RH register set is as follows: MNEMONIC REGISTER There are two different types of inputs in the restart interrupts. RST 5.5 and RST 6.5 are high level-sensitive and are recognized with the same timing as INTR. RST 7.5 is rising edge sensitive. For RST 7.5, only a pulse is required to set an internal flipflop which generates the internal interrupt request (a normally high level signal with a low going pulse is recommended for highest system noise immunity). The RST 7.5 request flip-flop remains set until the request is serviced. Then it is reset automatically. This flip-flop may also be reset by using the SlM instruction or by issuing a RESET IN to the 80C85RH. The RST 7.5 internal flip-flop will be set by a pulse on the RST 7.5 pin even when the RST 7.5 interrupt is masked out. CONTENTS ACC or A Accumulator 8 -bits PC Program Counter 16-bit Address BC, DE, HL General-Purpose Registers; Data Pointer(HL) 8-bits x 6 or 16-bits x 3 SP Stack Pointer 16-bit Address Flags or F Flag Register 5 Flags (8-bit space) The status of the three RST interrupt masks can only be affected by the SIM instruction and RESET IN. The HS-80C85RH uses a multiplexed Data Bus. The address is split between the higher 8-bit Address Bus and the lower 8-bit Address/Data Bus. During the first T state (clock cycle) of a machine cycle the low order address is sent out on the Address/Data bus. These lower 8 bits may be latched externally by the Address Latch Enable signal (ALE). During the rest of the machine cycle the data bus is used for memory or I/O data. The interrupts are arranged in a fixed priority that determines which interrupt is to be recognized if more than one is pending as follows: TRAP-highest priority, RST 7.5, RST 6.5, RST 5.5, INTR-lowest priority. This priority scheme does not take into account the priority of a routine that was started by a higher priority interrupt. RST 5.5 can interrupt an RST 7.5 routine if the interrupts are re-enabled before the end of the RST 7.5 routine. The HS-80C85RH provides RD, WR, S0, S1, and IO/M signals for bus control. An Interrupt Acknowledge signal (INTA) is also provided. HOLD and all Interrupts are synchronized with the processor’s internal clock. The HS-80C85RH also provides Serial Input Data (SID) and Serial Output Data (SOD) lines for simple serial interface. The TRAP interrupt is useful for catastrophic events such as power failure or bus error. The TRAP input is recognized just as any other interrupt but has the highest priority. It is not affected by any flag or mask. The TRAP input is both edge and level sensitive. The TRAP input must go high and remain high until it is acknowledged. It will not be recognized again until it goes low, then high again. This avoids any false triggering due to noise or logic glitches. Figure 8illustrates the TRAP interrupt request circuitry within the HS-80C85RH. Note that the servicing of any interrupt (TRAP, RST 7.5, RST 6.5, RST 5.5, INTR) disables all future interrupts (except TRAPs) until an EI instruction is executed. In addition to these features, the HS-80C85RH has three maskable, vector interrupt pins, one nonmaskable TRAP interrupt, and a bus vectored interrupt, INTR. Interrupt and Serial I/O The HS-80C85RH has 5 interrupt inputs: INTR, RST 5.5, RST 6.5, RST 7.5, and TRAP INTR is maskable (can be Spec Number 12 518054 HS-80C85RH 2. A 10MΩ resistor is required between X1 and X2 for bias point stabilization. In addition, the crystal should have the following characteristics: EXTERNAL INSIDE THE 80C85RH TRAP INTERRUPT TRAP REQUEST RESET IN 1) Parallel resonance at twice the desired internal clock frequency TRAP SCHMITT TRIGGER RESET CLK D Q D F/F CLEAR VDD 2) CL (load capacitance) ≤ 30pF INTERRUPT REQUEST 3) CS (shunt capacitance) ≤ 7pF 4) RS (equivalent shunt resistance) ≤ 75Ω 5) Drive level: 10mW 6) Frequency tolerance: ±0.005% (suggested) TRAP F.F. INTERNAL TRAP ACKNOWLEDGE A parallel-resonant LC circuit may be used as the frequencydetermining network for the HS-80C85RH, providing that its frequency tolerance of approximately ±10% is acceptable. The components are chosen from the formula: 1 f= 2π√ L (Cext + Cint) To minimize variations in frequency, it is recommended that you choose a value for Cext that is at least twice that of Cint, or 30pF. The use of an LC circuit is not recommended for frequencies higher than approximately 4MHz. FIGURE 8. TRAP AND RESET IN CIRCUIT The TRAP interrupt is special in that is disables interrupts, but preserves the previous interrupt enable status. Performing the first RIM instruction following a TRAP interrupt allows you to determine whether interrupts were enabled or disabled prior to the TRAP. All subsequent RIM instructions provide current interrupt enable status. Performing a RIM instruction following INTR, or RST 5.5-7.5 will provide current interrupt enable status, revealing that interrupts are disabled. An RC circuit may be used as the frequency-determining network for the HS-80C85RH if maintaining a precise clock frequency is of no importance. Variations in the on-chip timing generation can cause a wide variation in frequency when using the RC mode. Its advantage is its low component cost. The driving frequency generated by the circuit shown is approximately 3MHz. It is not recommended that frequencies greatly higher or lower than this be attempted. The serial I/O system is also controlled by the RIM and SIM instructions. SID is read by RIM, and SIM sets the SOD data. Driving the X1 and X2 Inputs You may drive the clock inputs of the HS-80C85RH with a crystal, an LC tuned circuit, an RC network, or an external clock source. The driving frequency may be any value from DC to 4MHz and must be twice the desired internal clock frequency. Figure 9 shows the recommended clock driver circuits. For driving frequencies up to and including 4MHz you may supply the driving signal to X1 and leave X2 open-circuited (Figure 9D). The following guidelines should be observed when a crystal is used to drive the HS-80C85RH clock input: 1. A 20pF capacitor should be connected from X2 to ground to assure oscillator start-up at the correct frequency. X1 80C85RH 20pF REXT = 10MΩ 2 80C85RH X1 1 1 20pF CINT = 15pF -6K 2 X2 a.) QUARTZ CRYSTAL CLOCK DRIVER X2 c.) RC CIRCUIT CLOCK DRIVER LOW TIME > 60ns X1 X1 80C85RH 1 LEXT CINT = 15pF CEXT 2 † X2 † b.) LC TUNED CIRCUIT CLOCK DRIVER X2 X2 Left Floating d.) 0-4MHz INPUT FREQUENCY EXTERNAL CLOCK DRIVER CIRCUIT FIGURE 9. CLOCK DRIVER CIRCUITS Spec Number 13 518054 HS-80C85RH HS-80C85RH Caveats System Interface The HS-80C85RH family includes memory components, which are directly compatible to the HS-8OC8SRH CPU. For example, a system consisting of the three radiationhardened chips, HS-80C85RH, HS-81C56RH, and HS-83C55RH will have the following features: 1. An important caveat that is applicable to CMOS devices in general is that unused inputs should never be left floating. This rule also applies to inputs connected to a tri- state bus. The need for external pull-up resistors during tri-state bus conditions is eliminated by the presence of regenerative latches on the following HS-80C85RH output pins: AD0-AD7, A8-A15, and IO/M. Figure 10 depicts an output and corresponding regenerative latch. When the output driver assumes the high impedance state, the latch holds the bus in whatever logic state (high or low) it was before the tri-state condition. A transient drive current of approximately ±1.0mA at 0.5 VDD for 10nsec is required to switch the latch. Thus, CMOS device inputs connected to the bus are not allowed to float during tri-state conditions. 1. 2K Bytes ROM 2. 256 Bytes RAM 3. 1 Timer/Counter 4. 4 8-bit I/O Ports 5. 1 6-bit I/O Port 6. 4 Interrupt Levels 2. The RD and WR pins of the HS-80C85RH contain internal dynamic pull-up transistors to avoid spurious selection of memory devices when the RD and WR pins assume the high impedance state. This eliminates the need for external resistive pull-ups on these pins. 7. Serial In/Serial Out Ports This minimum system, using the standard I/O technique is as shown in Figure 12. In addition to standard 1/0, the memory mapped I/O offers an efficient I/O addressing technique. With this technique, an area of memory address space is assigned for I/O address, thereby, using the memory address for I/O manipulation. Figure 13 shows the system configuration of Memory Mapped I/O using HS-80C85RH. 3. The RESET IN and X1 inputs on the HS-80C85RH are schmit trigger inputs. This eliminates the possibility of internal oscillations in response to slow rise time input signals at these pins. 4. A high frequency bypass capacitor of approximately 0.1 µF should be connected between VDD and GND to shunt power supply transients. The HS-80C85RH CPU can also interface with the standard radiation-hardened memory that does not have the multiplexed address/data bus. It will require use of the HS-82C12RH (8-bit latch) as shown in Figure 14. 5. The HS-80C85RH is functional within 10 input clock cycles after application of power (assuming that reset has been asserted from power-on). Start up conditions in the crystal controlled oscillator mode must also account for the characteristics of the oscillator. VSS VDD X1 X2 RESET IN HOLD TRAP HLDA RST 7.5 SOD RST 6.5 HS-80C85RH SID RST 5.5 S1 INTR RESET INTA ADDR/ S0 OUT ADDR DATA ALE RD WR IO/M RDY CLK REGENERATIVE LATCH FIGURE 10. OUTPUT DRIVER AND LATCH FOR PINS ADO-AD7, A8-A15 AND IO/M. Generating An HS-80C85RH Wait State (8) VSS VDD (8) CE If your system requirements are such that slow memories or peripheral devices are being used, the circuit shown in Figure 11 may be used to insert one WAIT state in each HS-80C85RH machine cycle. PORT A (8) PORT B (8) DATA/ PORT ADDR C IN IO/M TIMER RESET OUT (6) WR RD ALE The D flip-flops should be chosen so that: 1. CLK is rising edge-triggered 2. CLEAR is low-level active. IOW RD ALE The READY line is used to extend the read and write pulse lengths so that the 80C85RH can be used with slow memory. HOLD causes the CPU to relinquish the bus when it is through with it by floating the Address and Data Buses. ALE † VDD CLEAR CLK “D” F/F D 80C85RH CLK OUTPUT Q CLK “D” F/F D CE HS-81C56RH OUTPUT DRIVER HS-83C55RH OUTPUT PIN PORT A (8) A0-10 DATA/ ADDR PORT IO/M B RESET RDY † IOR CLK TO 80C85RH READY INPUT (8) VDD Q VSS VDD VDD †ALE and CLK (OUT) should be buffered if CLK input of latch exceeds 80C85RH IOL or IOH. † Optional Connection FIGURE 12. HS-80C85RH MINIMUM SYSTEM (STANDARD I/O TECHNIQUE) FIGURE 11. GENERATION OF A WAIT STATE FOR HS-80C85RH CPU. Spec Number 14 518054 HS-80C85RH A8-15 AD0-7 ALE HS-80C85RH RD WR IO/M CLK RESET OUT READY (6) (8) RST CLK RD IOW ALE CE HS-83C55RH (ROM +I/O) (8) (8) † RDY HS-81C56RH (RAM + I/O + COUNTER/TIMER) IO/M AD0-7 A8-10 IO/M AD0-7 IN WR RD ALE CE RESET TIMER OUT † TIMER VDD (8) † Optional Connection FIGURE 13. HS-80C85RH MINIMUM SYSTEM (MEMORY MAPPED I/O) VSS VDD TRAP RST 7.5 RST 6.5 RST 5.5 INTR INTA ADDR (8) X1 X2 RESET IN HOLD HLDA SOD HS-80C85RH SID S1 RESET S0 ADDR/ DATA ALE RD WR IO/M OUT RDY CLK (8) IO/M (CS) WR RD STANDARD MEMORY HS-82C12RH DATA ADDR (CS) CLK RESET IO/M (CS) (16) WR I/O PORTS, CONTROLS RD DATA STANDARD I/O ADDR VDD VDD VDD FIGURE 14. HS-80C85RH SYSTEM (USING STANDARD MEMORIES) Spec Number 15 518054 HS-80C85RH Basic System Timing A machine cycle normally consists of three T states, with the exception of OPCODE FETCH, which normally has either four or six T states (unless WAIT or HOLD states are forced by the receipt of READY or HOLD inputs). Any T state must be one of ten possible states, shown in Table 11. The HS-80C85RH has a multiplexed Data Bus. ALE is used as a strobe to sample the lower 8-bits of address on the Data Bus. Figure 15 shows an instruction fetch, memory read and I/O write cycle (as would occur during processing of the OUT instruction). Note that during the I/O write and read cycle that the I/O port address is copied on both the upper and lower half of the address. TABLE 11. HS-80C85RH MACHINE STATE CHART MACHINE STATE There are seven possible types of machine cycles. Which of these seven takes place is defined by the status of the three status lines (lO/M, S1, S0) and the three control signals (RD, WR, and INTA). (See Table 10.) The status lines can be used as advanced controls (for device selection, for example), since they become active at the T1 state, at the outset of each machine cycle. Control lines RD and WR are used as command lines since they become active when the transfer of data is to take place. TABLE 10. HS-80C85RH MACHINE CYCLE CHART STATUS MACHINE CYCLE IO/M S1 CONTROL S0 RD WR INTA STATUS & BUSES CONTROL S1, S0 IO/M A8-15 AD0-7 RD,WR INTA ALE T1 X X X X 1 1 1† T2 X X X X X X 0 TWAIT X X X X X X 0 T3 X X X X X X 0 T4 1 0†† X TS 1 1 0 T5 1 0†† X TS 1 1 0 T6 1 0†† X TS 1 1 0 TRESET X TS TS TS TS 1 0 THALT 0 TS TS TS TS 1 0 THOLD X TS TS TS TS 1 0 Opcode Fetch (OF) 0 1 1 0 1 1 Memory Read (MR) 0 1 0 0 1 1 Memory Write (MW) 0 0 1 1 0 1 0 = Logic “0” 1 = Logic “1” I/O Read (IOR) 1 1 0 0 1 1 † ALE not generated during 2nd and 3rd machine cycles of DAD I/O Write (IOW) 1 0 1 1 0 1 1 1 1 1 1 0 DAD Ack. of 0 1 0 1 1 1 RST, TRAP 1 1 1 1 1 1 HALT TS 0 0 Acknowledge (INA) of INTR Bus Idle (BI) TS TS instruction. †† IO/M = 1 during T4, T6 of INA machine cycle. 1 M1 CLK A8-A15 AD0-7 ALE T1 T2 T3 TS = High Impedance X = Unspecified M2 T4 PCH (HIGH ORDER ADDRESS) PCL T1 T2 M3 T3 (PC + 1)H (PC+1)L T1 T2 T3 T IO PORT IO PORT (LOW ORDER DATA FROM ADDRESS) MEMORY (INSTRUCTION) DATA TO MEMORY OR PERIPHERAL DATA FROM MEMORY (I/O PORT ADDRESS) S1-S0 (FETCH) 10 (READ) 01 WRITE RD WR IO/M STATUS 11 FIGURE 15. 80C85RH BASIC SYSTEM TIMING Spec Number 16 518054 HS-80C85RH Metallization Topology DIE DIMENSIONS: 229 mils x 240 mils x 14 mils ±1 mil METALLIZATION: Type: SiAl Thickness: 11kÅ ±2kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ Metallization Mask Layout (36) RESET IN (37) CLOCK OUT (38) HLDA (39) HOLD (40) VDD (1) X1 (2) X2 (3) RESET OUT (4) SOD (5) SID HS-80C85RH TRAP (6) (35) READY RST 7.5 (7) (34) IO/M RST 6.5 (8) RST 5.5 (9) (33) S1 (32) RD INTR (10) INTA (11) (31) WR AD0 (12) (30) ALE (29) S0 (28) A15 AD1 (13) AD2 (14) (27) A14 (26) A13 (25) A12 AD3 (15) A11 (24) A9 (22) A10 (23) A8 (21) AD7 (19) GND (20) AD6 (18) AD5 (17) AD4 (16) Spec Number 17 518054 HS-80C85RH Packaging E 1 K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE N e INCHES A A SYMBOL MIN MAX MIN MAX NOTES A - 0.100 - 2.54 - b 0.017 0.025 0.43 0.64 - S1 b1 0.017 0.023 0.43 0.58 - c 0.007 0.013 0.18 0.33 - C c1 0.007 0.010 0.18 0.25 - D b E1 L A Q E2 c1 LEAD FINISH BASE METAL (c) b1 M M MILLIMETERS (b) SECTION A-A NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. D 1.045 1.075 26.54 27.31 3 E 0.630 0.650 16.00 16.51 - 17.27 3 13.97 - E1 - 0.680 E2 0.530 0.550 e 0.050 BSC k - - 13.46 1.27 BSC - 11 - - L 0.320 0.350 8.13 8.89 - Q 0.045 0.065 1.14 1.65 8 S1 0.000 - 0.00 - 6 M - 0.0015 - 0.04 - N 42 42 Rev. 0 6/17/94 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. 11. The basic lead spacing is 0.050 inch (1.27mm) between center lines. Each lead centerline shall be located within ±0.005 inch (0.13mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead. Spec Number 18 518054 HS-80C85RH All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 Spec Number 19