EVB-SEC1110/EVB-SEC1210/
EVB-SEC1212-DEV
Evaluation Board User’s Guide
2013 Microchip Technology Inc.
DS00001574A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 9781620774649
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS00001574A-page 2
Object of Declaration: EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV User’s Guide
2013 Microchip Technology Inc.
DS00001574A-page 3
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
NOTES:
DS00001574A-page 4
2013 Microchip Technology Inc.
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Conventions Used in this Guide ............................................................................ 8
The Microchip Web Site ........................................................................................ 9
Development Systems Customer Change Notification Service ............................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................. 10
Chapter 1. Introduction
1.1 SEC1110 Features ....................................................................................... 11
1.1.1 Smartcard .................................................................................................. 11
1.1.2 USB ........................................................................................................... 11
1.2 SEC1210 Features ....................................................................................... 12
1.2.1 SPI1 ........................................................................................................... 12
1.2.2 UART ......................................................................................................... 12
1.3 SEC1212-DEV Features .............................................................................. 12
1.4 Directory structure ........................................................................................ 13
Chapter 2. EVBPCBA Documentation
2.5 EVB-SEC2112-DEV ..................................................................................... 14
2.5.1 Board Layout ............................................................................................. 16
2.5.2 Inserting a Chip into the Socket ................................................................ 17
2.5.3 Connector Description ............................................................................... 17
2.5.4 Switch Description ..................................................................................... 20
2.5.5 Test Points Description ............................................................................. 20
2.5.6 Bond Options ............................................................................................. 20
2.5.7 Selecting the Code Fetch Source .............................................................. 21
2.6 EVB-SEC1210 .............................................................................................. 21
2.6.1 Placing a Chip in the Socket ..................................................................... 22
2.6.2 Connector Description ............................................................................... 23
2.7 EVB-SEC1110 .............................................................................................. 24
2.7.1 Placing a Chip in the Socket ..................................................................... 25
2.7.2 Connector Description ............................................................................... 26
Chapter 3. CCID Firmware
3.8 Features ....................................................................................................... 27
3.9 Single Slot CCID Firmware .......................................................................... 27
3.10 Dual Slot CCID Firmware ........................................................................... 27
3.11 Smartcard Reader Driver Installation under Windows ............................... 27
Chapter 4. Checking Device Firmware Revision
Chapter 5. OTP Programming Procedures
Chapter 6. SPI Programming Procedures
2013 Microchip Technology Inc.
DS00001574A-page 5
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
Worldwide Sales and Service .....................................................................................41
DS00001574A-page 6
2013 Microchip Technology Inc.
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
2013 Microchip Technology Inc.
DS00001574A-page 7
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents code supplied by
user
DS00001574A-page 8
Examples
File>Save
Press <Enter>, <F1>
var_name [,
var_name...]
void main (void)
{ ...
}
2013 Microchip Technology Inc.
Preface
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers, assemblers, linkers
and other language tools. These include all MPLAB C compilers; all MPLAB
assemblers (including MPASM assembler); all MPLAB linkers (including MPLINK
object linker); and all MPLAB librarians (including MPLIB object librarian).
• Emulators – The latest information on Microchip in-circuit emulators.This
includes the MPLAB REAL ICE and MPLAB ICE 2000 in-circuit emulators.
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit 3 debug
express.
• MPLAB IDE – The latest information on Microchip MPLAB IDE, the Windows
Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and
MPLAB SIM simulator, as well as general editing and debugging features.
• Programmers – The latest information on Microchip programmers. These include
production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB
ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included
are nonproduction development programmers such as PICSTART Plus and
PIC-kit 2 and 3.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
2013 Microchip Technology Inc.
DS00001574A-page 9
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support
DOCUMENT REVISION HISTORY
Revision A (September 2013)
• Initial Release of this Document.
DS00001574A-page 10
2013 Microchip Technology Inc.
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Chapter 1. Introduction
The SEC1110/SEC1210/SEC1212-DEV is a family low power, OEM configurable, single-chip smartcard reader solutions. Three evaluation boards (EVBs) are available for
device development:
• EVB-SEC2112-DEV
• EVB-SEC1210
• EVB-SEC1110
These EVBs demonstrate standalone solutions with all of the interfaces and features
listed the following sub-sections. For details on each individual EVB, refer to Chapter 2.
1.1
SEC1110 FEATURES
1.1.1
Smartcard
• Single Smartcard slot
• Fully compliant with the ISO/IEC 7816, EMV and PC/SC standards
• Versatile ETU rate generation, supporting current and proposed rates (to 861
Kbps and beyond)
• Full support of both T=0 and T=1 protocols
• Full-packet FIFO (259 bytes) for transmit and receive
• Half-Duplex operation, with no software intervention required between transmit
and receive phases of an exchange
• Very loose real-time response required of software
• (worst case scenario of approximately 180 ms)
• Dynamically programmable FIFO threshold, with byte granularity
• Time-out FIFO flush interrupt, independent of threshold
• Programmable Smart Card clock frequency
• UART-like register file structure
• Supports Class A, Class B, Class C, or Class AB Smart Cards (all 1.8 V, 3 V and
5 V cards)
• Automatic Character Repetition for T=0 protocol Parity Error recovery
• Automatic card deactivation on card removal and on other system events, including persistent Parity Errors
1.1.2
•
•
•
•
•
USB
Supports Full-Speed data transfer
Endpoints can be configured for control, bulk & interrupt transfer types
Max packet size configurable for each endpoint
(8 / 16/ 32/ 64 bytes are allowed)
Ping pong buffers supported for non-control endpoints
2013 Microchip Technology Inc.
DS00001574A-page 11
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
• Supports Suspend, Resume, and Remote Wakeup per the USB specification
requirements
• Endpoint buffer may be located anywhere in the 1.5K SRAM, as per the alignment
requirements based on the max packet size
1.2
SEC1210 FEATURES
Along with the features mentioned in Section 1.1, the SEC1210 includes two Smartcard
slots and the following additional features:
1.2.1
•
•
•
•
•
•
•
•
•
•
SPI1
Supports full-duplex mode
Supports master or slave mode
Supports seven SPI1 Master baud rates
Slave Clock rate up to spi1_clk/8
Serial clock with programmable polarity and phase
Master Mode fault error flag with MCU interrupt capability
Write collision flag protection
Byte Transfer/Receive APIs
Bulk Transfer/ Receive APIs
Simultaneous Transfer/ Receive APIs
1.2.2
UART
• Software compatible with Standard 16C450 and 16C550A
• Separate 16 byte FIFO for transmission and reception
- Prevents buffer overrun
- Helps software to be less time critical in handling transmission / reception
• Programmable baud rate generator - Up to 3 Mbps baud rate can be achieved
• Supports flow control using RTS / CTS signals
• Pin Polarity control
• Programmable communication parameters:
- Word length - 5, 6, 7, 8 bits
- Stop bits - 1, 1.5, 2 bits
- Parity - None, Odd, Even, Mark, Space
• Low power sleep mode available
Note:
1.3
A voltage level shifter board / cable is required to connect the UART port to
the PC. An FTDI cable is used for this.
SEC1212-DEV FEATURES
Along with the features mentioned in section 1.1 and1.2 the following modules are also
available in the SEC1212-DEV:
• Boot from SPI2 Interface
• The SVB is equipped with a 1Kbyte Atmel SPI flash (AT26DF081A-SSU). SPI
flash from Atmel and Windbond are supported.
• On-board RS232 Transceiver for debugging as well as RS232 host interface
• On-board Reset button
• On-board EDP header for f/w debugging.
• On-board JTAG header for entering ASIC test mode and debugging
DS00001574A-page 12
2013 Microchip Technology Inc.
Introduction
1.4
DIRECTORY STRUCTURE
The EVB-SEC2112-DEV release package provides the following file/folder structure:
EVB Schematics & BOM
Contains EVB schematics and BOM
SW Tools/WinUSB Driver
This is the device driver required for BootROM USB Device
SW Tools/OTPProgrammer
Contains the OTP programming utility and user manual
SW Tools/Linux Libraries
Contains the required Linux libraries
SW Tools/SPIFlashUtitly
Contains utility to program the SEC1212-DEV SPI2 flash and the relevant user manual.
Firmware
This folder contains the firmware binary files for programming into the OTP / SPI Flash.
Filenames with "SPI2" are intended to be programmed onto the SPI flash using SPIFlashWriter application. Filenames with "OTP" are intended to be programmed onto
the OTP using OTPProgrammer application. Similarly, "SINGLESLOT" or
"DUALSLOT" in the file name indicates a single slot or dual slot reader, respectively.
2013 Microchip Technology Inc.
DS00001574A-page 13
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Chapter 2. EVBPCBA Documentation
This chapter details the evaluation boards available for the SEC family of ASIC's and
their hardware settings. A standard USB A-to-B cable is required to connect the EVB
to the USB Host.
2.5
EVB-SEC2112-DEV
The EVB-SEC2112-DEV includes a 48-pin QFN SEC1212-DEV with the following
interfaces and features:
•
•
•
•
•
•
USB host interface
Two smartcard slots
SPI1
SPI2 Code execution (Either from external or on board flash)
UART
Input bond options allow a single chip to function as either an SEC1110 or
SEC1210.
2013 Microchip Technology Inc.
DS00001574A-page 14
EVBPCBA Documentation
FIGURE 2-1:
EVB-SEC2112-DEV PROTOTYPE COMPONENT SIDE TOP LAYER
2013 Microchip Technology Inc.
DS00001574A-page 15
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
2.5.1
Board Layout
Please follow this legend to understand the following figure.
1. In each header, Pin 1 is represented by a thick band near the edge.
2. Pins filled in dark red indicate they are to be shorted by a jumper.
FIGURE 2-2:
DS00001574A-page 16
DEFAULT BOARD SETUP TO RUN FROM OTP USING INTERNAL OSCILLATOR
IN SEC1212-DEV (QFN48) MODE
2013 Microchip Technology Inc.
EVBPCBA Documentation
2.5.2
Inserting a Chip into the Socket
This section is applicable only if the ASIC is not directly soldered on the PCB and the
EVB is equipped with a socket. The following guidelines must be followed when replacing the ASIC in the socket.
Place the ASIC in the socket in such a way that the Pin1 marking (dot) on the ASIC and
the socket Pin1 marking on the PCB (triangle) align, as shown in Figure 2-3.
Note:
FIGURE 2-3:
EVB-SEC2112-DEV PIN 1 SOCKET ALIGNMENT
2.5.3
Note:
Connector
The socket is manufactured by R&D Interconnect (P/N: 106458-0020).
Connector Description
The board’s default settings are indicated in the Settings column.
Description
Settings
1 --- 2
2 --- 3
Supplied Externally
Supplied by Upstream VBUS (default)
J2
Self/Bus Power Header
J3
Power IN
1-2
Short (default)
J4
5V_DUT
1-2
Short (default)
MUX’d RS232-I/F
1-2
3-4
5-6
7-8
Short (and open J11) to select RS232 interface
J9
2013 Microchip Technology Inc.
DS00001574A-page 17
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
Connector
Description
Settings
J11
MUX’d SPI1-I/F
1-2
3-4
5-6
7-8
J12
TEST
1-2
2-3
J13
Short (and open J9) to select SPI1 interface
Chip will enter TEST mode
Chip will enter functional mode (default)
1 --- 2
JTAG_CLK (JTAG CLK is routed from J39 when this setting
is selected)
2 --- 3
VBUS_DET(default)
JTAG Select Header
J14
PCLK_ENABLE
1-2
2-3
Chip starts with external oscillator
Chip starts with internal oscillator (default)
J15
OSC_IN
1-2
External oscillator is fed to PCLK_IN_48MHZ. To be shorted
if the chip is to work from external oscillator
J20
SC1_Load
1-2
Open (default)
1-2
J21
SC1_PRSNT
2-3
SC1 Card detect pin routed from smartcard connector
(default)
SC1 card detect pin is permanently grounded
1-2
Open (default)
1-2
SC2 Card detect pin routed from smartcard connector
(default)
2-3
SC2 card detect pin is permanently grounded
J26
J27
BootROM select
SC2_PRSNT
J28
SC2_Load
1-2
Open (default)
J29
OSC_SEL
Unused
Open (default)
J31
SPI1_Interface
1-10
Open (default). Header for connecting Cheetah / Aardvark
SPI host adapters
J34
SPI2_Internal Flash
1-8
Short to program SPI2 flash and execute code from
J35
RS232 10 pin header
1-10
Header to which Microchip’s 10 pin serial cable to be connected
DS00001574A-page 18
2013 Microchip Technology Inc.
EVBPCBA Documentation
Connector
Description
Settings
J36
Bond 0 Configuration
Header
1 --- 2
2 --- 3
Pulled high to VDD33 (default)
Pulled down to GND
J37
Bond 1 Configuration
Header
1 --- 2
2 --- 3
Pulled high to VDD33 (default)
Pulled down to GND
J38
Bond 2 Configuration
Header
1 --- 2
2 --- 3
Pulled high to VDD33
Pulled down to GND (default) for OTP / ROM execution
J19
J25
Smart Card 1 (SC1 I/F –
Credit Card)
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC1_PRSNT#
SC1_C8
SC1_C4
SC1_IO
SC1_CLK
NC
SC1_RST#
GND
SC1_VCC
Smart Card 2 (SC2 I/F –
Credit Card)
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC2_PRSNT#
NC
NC
SC2_IO
SC2_CLK
NC
SC2_RST#
GND
SC2_VCC
2,6,10,16 nc pins
J39
DUT EDP/EDP-T JTAG
Header
J40
General purpose pull up
to 3.3V thru 1K ohm
resistor
2013 Microchip Technology Inc.
1,3,4,5,7,9 GND Test Points
,11,13,15,
17,19,20
8
12
14
18
TCK (JTAG_CLK)
TDO (PJTAG_TDO)
TDI (PJTAG_TDI)
TMS (PJTAG_TMS)
1-4
Open (default)
DS00001574A-page 19
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
Connector
Description
Settings
J41
General purpose pull
down to GND thru 1K
ohm resistor
J42
1-4
Open (default)
Open JTAG Header
Unused
Open (default)
J43
LED Polarity control
2-3
Short (default)
J44
3V3
1-4
Open (default). Connected to 3.3V
J45
GND
1-4
Open (default). Connected to GND
2.5.4
Switch Description
Ref. Des
SW2
Description
Settings
Reset Switch
2.5.5
Press : In Reset
Release : Out of Reset
Test Points Description
Test Point
Description
Connection
TP1
5V
5V input to MIC37100 3.3V regulator (U1) &
SEC1210 (U2)
TP2
3.3V
3.3V output of MIC37100 3.3V regulator (U1)
TP4
GND
GND
TP5
VDD33
VDD33 power output of internal regulator
2.5.6
Bond Options
Depending on the Bond option set on jumper J36, J37 and J38, the SEC1212-DEV prototype can work in SEC1210 (QFN24) and SEC1110 (QFN16) pin modes also.
PART No.
BOND0(J36)
BOND1(J37)
BONd2(J38)
SEC1110
0
0
x
Remarks
SEC1210
0
1
x
SEC1212-DEV
1
1
0
OTP/Internal ROM boot
SEC1212-DEV
1
1
1
External SPI2 Flash boot
DS00001574A-page 20
2013 Microchip Technology Inc.
EVBPCBA Documentation
2.5.7
Selecting the Code Fetch Source
SEC1212-DEV can execute code from Internal /OTP ROM as well as from external
serial SPI flash (one at a time).
The following sub-sections detail the pre-requisites to select the required code fetch
source.
2.5.7.1
CODE EXECUTION FROM INTERNAL BOOT ROM
1. OTP_ROM_EN & FORCE_OTP_ROM bits are not programmed through OTP
Programmer application
2. Pins 2-3 of J38 are to be shorted
2.5.7.2
CODE EXECUTION FROM INTERNAL OTP ROM
1. OTP should have been programmed through OTP Programmer application
2. OTP_ROM_EN bit is programmed through OTP Programmer application
3. Pins 2-3 of J38 are to be shorted
2.5.7.3
CODE EXECUTION FROM SPI FLASH
1. SPI Flash should have been programmed through SPI Flashwriter application
2. FORCE_OTP_ROM bit is not programmed through OTP Programmer application
3. Pins 1-2 of J38 are to be shorted
2.6
EVB-SEC1210
The EVB-SEC1210 utilizes the 24-pin QFN SEC1210 and includes the following interfaces and features.
• USB
• Two smartcard slots
• SPI1 or UART Interface
Note 1:
2:
2013 Microchip Technology Inc.
A standard USB A-to-B cable is required to connect to the USB Host.
Code execution is possible only from internal SRAM or OTP.
DS00001574A-page 21
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
FIGURE 2-4:
EVB-SEC1210 COMPONENT SIDE TOP LAYER
2.6.1
Placing a Chip in the Socket
This section is applicable only if the ASIC is not directly soldered on the PCB and the
EVB is equipped with a socket. The following guidelines must be followed when replacing the ASIC in the socket.
Place the ASIC in the socket in such a way that the Pin1 marking (dot) on the ASIC and
the socket Pin1 marking on the PCB (triangle) align, as shown in Figure 2-5.
Note:
DS00001574A-page 22
The socket is manufactured by R&D Interconnect (P/N: 106458-0133).
2013 Microchip Technology Inc.
EVBPCBA Documentation
FIGURE 2-5:
EVB-SEC1210 PIN 1 SOCKET ALIGNMENT
2.6.2
Ref. Des.
Connector Description
Description
Settings
5,6
J1
J2
USB-B Upstream Connector
Smart Card 1
(SC1 I/F – Credit Card)
J3
Smart Card 2
(SC2 I/F – Credit Card)
J4
RS-232 D-sub9 connector
2013 Microchip Technology Inc.
1
2
3
4
Shield connections to earth
GND
VBUS_UP
USBUP_DM
USBUP_DP
GND
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC1_PRSNT#
SC1_C8
SC1_C4
SC1_IO
SC1_CLK
NC
SC1_RST#
GND
SC1_VCC
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC2_PRSNT#
NC
NC
SC2_IO
SC2_CLK
NC
SC2_RST#
GND
SC2_VCC
1-10
Header to which SMSC’s
10 pin RS232 cable needs
to be connected
DS00001574A-page 23
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
2.7
EVB-SEC1110
The EVB-SEC1110 utilizes the 16-pin QFN SEC1110 and includes the following interfaces and features.
• USB
• One smartcard slot
Note 1:
2:
FIGURE 2-6:
DS00001574A-page 24
A standard USB A-to-B cable is required to connect to the USB Host.
Code execution is possible only from internal SRAM or OTP.
EVB-SEC1110 COMPONENT SIDE TOP LAYER
2013 Microchip Technology Inc.
EVBPCBA Documentation
2.7.1
Placing a Chip in the Socket
This section is applicable only if the ASIC is not directly soldered on the PCB and the
EVB is equipped with a socket. The following guidelines must be followed when replacing the ASIC in the socket.
Place the ASIC in the socket in such a way that the Pin1 marking (dot) on the ASIC and
the socket Pin1 marking on the PCB (triangle) align, as shown in Figure 2-7.
Note:
FIGURE 2-7:
The socket is manufactured by R&D Interconnect (P/N:
106458-0134).
EVB-SEC1110 PIN 1 SOCKET ALIGNMENT
2013 Microchip Technology Inc.
DS00001574A-page 25
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
2.7.2
Ref.
Des.
P1
J1
Connector Description
Description
USB-A Upstream Connector
Smart Card 1 (SC1 I/F – Credit
Card)
DS00001574A-page 26
Settings
5,6
1
2
3
4
Shield connections to earth GND
VBUS_UP
USBUP_DM
USBUP_DP
GND
10
9
8
4
7
3
6
2
5
1
CDSW2 (GND)
SC1_PRSNT#
SC1_C8
SC1_C4
SC1_IO
SC1_CLK
NC
SC1_RST#
GND
SC1_VCC
2013 Microchip Technology Inc.
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Chapter 3. CCID Firmware
3.8
FEATURES
• Supports smartcards of all voltages (1.8V, 3V and 5V)
• Supports T=0 and T=1 protocols
• Supports the fastest possible smartcards. (As per ISO Spec, ATR with TA1=17 is
the maximum speed possible for a smartcard. This is equivalent to 826Kbps.)
• Has a maximum CCID command length of 271 bytes
• Supports suspending the device in order to save power
• Remote wake-up is possible through smartcard insertion. When host is in suspended state, on inserting a smartcard, the device will wake up the host.
• Support in-box drivers of all Windows and Linux versions
3.9
SINGLE SLOT CCID FIRMWARE
• USB CCID class compliant single slot firmware
• This firmware supports EVB-SEC1110, EVB-SEC1210 & EVB-SEC2112-DEV
boards
• Card can be removed / re-inserted. Interrupt notification will be sent to host
according to card changes in slot.
3.10
DUAL SLOT CCID FIRMWARE
• USB CCID class compliant dual slot firmware (enumerates as a composite USB
device)
• This firmware supports EVB-SEC1210 & EVB-SEC2112-DEV boards
• In slot1, card removed / re-insertion is supported
• In slot2, card removal / re-insertion is not supported as no status change interrupt
endpoint is supported for this interface
3.11
SMARTCARD READER DRIVER INSTALLATION UNDER WINDOWS
Most Windows OS installations include USBCCID drivers integrated by default. In
these cases, as soon as the EVB is connected to the system, the usbccid.sys driver is
loaded and the EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV smartcard reader
will be listed in the Device Manager as shown below.
2013 Microchip Technology Inc.
DS00001574A-page 27
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
FIGURE 3-8:
SEC1110 DEVICE ENUMERATION UNDER WINDOWS 7
FIGURE 3-9:
SEC1210/SEC1212-DEV DEVICE ENUMERATION UNDER WINDOWS 7
DS00001574A-page 28
2013 Microchip Technology Inc.
CCID Firmware
If the driver is has not been pre-installed on the PC, follow the steps below to install the
driver via the Windows Update site (Shown for SEC1110 under Windows XP OS).
• Connect the reader to a free USB port on the PC.
• Once the smartcard reader is connected, Window reports that new hardware has
been detected and will offer to connect to Windows Update to search for a suitable driver.
• Choose Recommended Option and click Next to continue.
FIGURE 3-10:
FOUND NEW HARDWIRE WIZARD
• Choose "Yes, Connect and search for software on the Internet" and click
Next.
2013 Microchip Technology Inc.
DS00001574A-page 29
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
FIGURE 3-11:
DS00001574A-page 30
FOUND NEW HARDWARE WIZARD - OPTIONS
2013 Microchip Technology Inc.
CCID Firmware
FIGURE 3-12:
FOUND NEW HARDWARE WIZARD - SEARCH
2013 Microchip Technology Inc.
DS00001574A-page 31
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
FIGURE 3-13:
FOUND NEW HARDWARE WIZARD - COMPLETED
• Click Finish when the last window shows that the installation has finished.
• After successful driver installation, the device will be included in the Device Manager, as shown in Figure 3-14.
DS00001574A-page 32
2013 Microchip Technology Inc.
CCID Firmware
FIGURE 3-14:
DEVICE MANAGER - NEW DEVICE
2013 Microchip Technology Inc.
DS00001574A-page 33
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Chapter 4. Checking Device Firmware Revision
To check the device's firmware revision, go to Device Manager and select the smart
card reader. Right click and select Properties.
FIGURE 4-15:
DEVICE MANAGER - PROPERTIES
In the Details tab select Hardware Ids, where the revision number is listed.
2013 Microchip Technology Inc.
DS00001574A-page 34
Checking Device Firmware Revision
FIGURE 4-16:
DEVICE MANAGER - FIRMWARE REVISION
Note 1:
2:
2013 Microchip Technology Inc.
F/W version in the above case is 2.19
If the reader is enumerated as SMSC WINUSB, then the device is not programmed.
DS00001574A-page 35
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Chapter 5. OTP Programming Procedures
Note:
This procedure is applicable only to EVB-SEC2112-DEV, as the
EVB-SEC1110 and EVB-SEC1210 are pre-programmed with appropriate
firmware. Only the EVB-SEC2112-DEV includes firmware loaded to SPI2
Flash - and user has an option to program the OTP only once. Once the
OTP is programmed and the "OTP_ROM_EN" option is set as detailed in
step 6 of the procedure below, the SPI flash cannot be updated again and
the boot from OTP or SPI2 can be switched using Jumper J38.
1. The device should enumerate as "SMSC WINUSB". Otherwise the device can't
be programmed.
2. Open the OTP Programmer and confirm the device enumerated
3. Select the .bin file using Browse… button
4. Click Execute
2013 Microchip Technology Inc.
DS00001574A-page 36
OTP Programming Procedures
FIGURE 5-17:
OTP PROGRAMMER - DEVICE LIST
5. After successful completion, the message shown in Figure 5-17 will be shown in
the status box.
6. Select Modify OTP Special Register and click the OTP_ROM_EN check box,
as shown in Figure 5-18.
7. Select Update and press OK.
Note:
2013 Microchip Technology Inc.
Steps 4, 5 and 6 must be performed without resetting the device after OTP
programming. Otherwise, the device will enumerate as SMSC WINUSB.
DS00001574A-page 37
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
FIGURE 5-18:
DS00001574A-page 38
OTP PROGRAMMER - SPECIAL REGISTER CONTROL PANEL
2013 Microchip Technology Inc.
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
EVALUATION BOARD USER’S GUIDE
Chapter 6. SPI Programming Procedures
Note:
SPI Programming can only be performed on the EVB-SEC2112-DEV.
1. In order for the device to enumerate as "SMSC WINUSB", the Bond2 jumper
(J38) must be set to 1-2 during power-up.
2. Open SPI Flashwriter and confirm the device has enumerated.
3. Select the .bin file using Browse… button
4. Click Program SPI2 Flash
FIGURE 6-19:
SPI FLASH WRITER - SELECT DEVICE
5. After successful completion, the Status box will change to "Programming SPI2
flash completed successfully".
2013 Microchip Technology Inc.
DS00001574A-page 39
EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide
FIGURE 6-20:
SPI FLASH WRITER - COMPLETED SUCCESSFULLY
6. Change the Bond2 jumper (J38) to 2-3 and reset the board. The EVB will now
boot from SPI.
DS00001574A-page 40
2013 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS00001574A-page 41
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
08/20/13
2013 Microchip Technology Inc.