Hermetic Packages for Integrated Circuits Hermetic Metal Package ØP E T3.D A A1 3 LEAD JEDEC TO-257AA HERMETIC METAL PACKAGE INCHES D L1 D1 D2 MIN MAX MIN MAX NOTES A 0.188 0.200 4.78 5.08 7 A1 0.035 0.045 0.89 1.14 - A A2 e e1 Øb 3.05 BSC - D 0.645 0.665 16.39 16.89 - D1 0.410 0.430 10.41 10.92 - D2 - 0.038 0.97 - 0.100 BSC 0.200 BSC - 2.54 BSC - 5.08 BSC E 0.410 0.420 10.41 10.67 - Øb 0.025 0.040 0.64 1.02 1, 2 Øb1 0.025 0.035 0.64 0.89 1, 2 L 0.500 0.750 12.70 19.05 - L1 0.527 0.537 13.39 13.64 - P 0.140 0.150 3.56 N Øb 0.120 BSC A2 e1 LEAD #3 LEAD #1 A SYMBOL e L MILLIMETERS 3 3.81 - 3 Øb1 5 Rev. 2 3/09 NOTES: 3 PLC 1. Dimension Øb1 applies to base metal only. Dimension Øb applies to plated part. 2. Section A-A dimension apply between 0.100 inch (2.54mm) to 0.150 inch (3.81mm) from lead tip. 3. Die to base BeO isolated, terminals to case is plated. 4. Controlling dimensions are in inches (mm for reference only). 5. N is the maximum number of terminal positions. 6. Patterned after MIL-STD-1835 MSFM1-P3AA. 7. “A” minimum dimension not meeting the MIL-STD 0.190 minimum dimension. 1