Data Sheet

TEF701X
Scalable advanced background receiver
Rev. 1 — 30 July 2013
Product short data sheet
1. General description
The TEF7016 and TEF7018 are analog single-chip radio background ICs specifically
designed for background reception. Both devices support all major global background
receiver standards such as Radio Data System (RDS), Radio Broadcast Data System
(RBDS), Traffic Message Channel (TMC), DARC (VICS and RTIC) and optional support of
digital radio via a co-processor (HD Radio and DRM).
The devices are following the industry-proven background receiver TEF7006 and
TEF7007 with improved performance and feature set optimizing the total system costs.
They are completing NXP Semiconductors Car Radio portfolio to provide an efficient, high
performing application. The TEF701X are housed in a HVQFN32 package designed for
two- and multi-layer PCB applications.
The radio receiver includes the AM/FM front-ends, tuning synthesizer, channel filtering,
demodulation, weak signal processing, noise blanking in FM mode, RDS and DARC
reception and optional FM multipath improvements.
The TEF7018 supports AM and FM, HD Radio and Digital Radio Mondiale (DRM30 and
DRM+). The TEF7016 is an FM-only version and supports optionally the digital radio
standards FM-HD Radio and DRM+. For both TEF7016 and TEF7018, these digital radio
standards are supported when used with NXP Semiconductors’ digital radio coprocessors
such as SAF356X and SAF360X.
Furthermore the TEF7018 provides the complete feature set including AM IF noise
blanking, AM SoftMute on Modulation and the TEF701X provides digital audio output
(mono) via I2S.
2. Features and benefits
 Alignment free digital receiver including tuner and software-defined radio processing
 Read information with device and tuning status, reception quality and RDS data
 FM background receiver with a tuning range of 65 MHz to 108 MHz covering Eastern
Europe (OIRT), Japan, Europe and US bands
 AM background receiver (TEF7018) receiver covering LW, MW and full SW
 Fully integrated tuning system with low phase noise and fast tuning
 Variable IF bandwidth filtering (FM PACS) and demodulation
 Baseband I2S output supporting digital radio standards
 FM-HD Radio and DRM+ (TEF7016) with external digital radio coprocessor
TEF701X
NXP Semiconductors
Scalable advanced background receiver











HD Radio and DRM1 (TEF7018) with external digital radio coprocessor
AM and FM noise blanking, Signal quality detection and weak signal processing
Advanced RDS and RBDS demodulation and decoding
Excellent RDS sensitivity performance
MPX output supporting an external DARC demodulator and RTIC
Two mono audio DACs: one analog output for FM MPX and mono analog audio
output.
Single 3.3 V supply voltage
Fast mode I2C-bus (400 kHz)
Configurable GPIO pins for RDS, Quality Status, RDS data available interrupt and
generic I2C-bus controlled I/O
Qualified in accordance with AEC-Q100
I2S audio output
3. Applications
The TEF701X is a background receiver that can be used for Radio Data System (RDS),
Radio Broadcast Data System (RBDS), Traffic Message Channel (TMC) and background
reception for automotive applications. DARC reception is also supported via the MPX
output to VICS/RTIC decoders.
When used together with the digital radio coprocessors SAF356X and SAF360X, digital
radio standards background reception can be supported.
Additionally, due to a common technology platform, the TEF701X can be combined with
the TEF665X, TEF668X, SAF775X and SAF360X for optimal system application through
common crystal oscillator sharing.
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage
VDDA(RF)(3V3)
RF analog supply voltage
(3.3 V)
on pin VDDA_RF
3.0
3.3
3.5
V
VDDA(IF)(3V3)
IF analog supply voltage
(3.3 V)
on pin VDDA_IFADC
3.0
3.3
3.5
V
VDDD(3V3)
digital supply voltage (3.3 V)
on pin VDD_DIGITAL
3.0
3.3
3.5
V
Current in FM mode
IDDA(RF)
RF analog supply current
on pin VDDA_RF
33
37
42
mA
IDDA(IFADC)
IF ADC analog supply current
on pin VDDA_IFADC
81
94
110
mA
IDDD
digital supply current
on pin VDDD
37
38
48
mA
Current in AM - MW/LW
mode[1]
IDDA(RF)
RF analog supply current
on pin VDDA_RF
34
40
48
mA
IDDA(IFADC)
IF ADC analog supply current
on pin VDDA_IFADC
63
74
86
mA
1.
DRM includes DRM30 and DRM+ (band  and ).
TEF701X_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 July 2013
© NXP B.V. 2013. All rights reserved.
2 of 8
TEF701X
NXP Semiconductors
Scalable advanced background receiver
Table 1.
Quick reference data …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDDD
digital supply current
on pin VDDD
33
34
46
mA
Current in Standby mode
IDDA(RF)
RF analog supply current
on pin VDDA_RF
0
0.3
2
mA
IDDA(IFADC)
IF ADC analog supply current
on pin VDDA_IFADC
25
37
45
mA
IDDD
digital supply current
on pin VDDD
15
24
35
mA
[1]
TEF7018 only.
5. Ordering information
Table 2.
Ordering information
Type number
TEF7016HN/V101
Package
Name
Description
Version
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5  5  0.85 mm[1]
SOT617-3
TEF7018HN/V101
[1]
Wettable sides to allow for optical inspection.
TEF701X_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 July 2013
© NXP B.V. 2013. All rights reserved.
3 of 8
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
XTAL
OSC
DIGITAL
TUNING
DIVIDERS SYSTEM
DCO
Rev. 1 — 30 July 2013
All information provided in this document is subject to legal disclaimers.
FM
BPF
TEF701X
FM FRONT-END
MONO
DAC
ADC
AM
BPF
NXP Semiconductors
TEF701X_SDS
Product short data sheet
6. Block diagram
RADIO PROCESSING
MONO_AUDIO
AUDIO
PROCESSING
DAC
MPX_OUT
AM FRONT-END(2)
IC CONTROL
UNIT
DR_BCK(2)
DR_I_DATA(2)
DR_WS(2)
DR_Q_DATA(2)
(1) GPIO_1 and GPIO_2 are output only.
4 of 8
© NXP B.V. 2013. All rights reserved.
Fig 1.
Block diagram
GPIO_2(1)
SCL
I2S_WS
aaa-001517
TEF701X
(2) TEF7016 optionally and TEF7018.
GPIO_0
SDA
I2S_SD_1
I2S_BCK
GPIO_1(1)
I2C
Scalable advanced background receiver
3.3 V
I2S OUTPUT
BUFFER
DIGITAL RADIO
INTERFACE
POWER
TEF701X
NXP Semiconductors
Scalable advanced background receiver
7. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDDA(RF)(3V3) RF analog supply voltage (3.3 V) on pin VDDA_RF
Min
Max
Unit
0.5
+3.9
V
VDDA(IF)(3V3)
IF analog supply voltage (3.3 V)
on pin VDDA_IFADC
0.5
+3.9
V
VDDD(3V3)
digital supply voltage (3.3 V)
on pin VDDD
0.5
+3.9
V
between pins VDDA_IFADC and
VDDA_RF
0.3
+0.3
V
0.5
+VDDD(3V3) + 0.3 V
100
+100
mA
VDD(3V3-3V3) supply voltage difference
between two 3.3 V supplies
Vn
voltage on any other pin
Ilu
latch-up current
Vlu
latch-up voltage
-
1.5  VDDD(3V3)
V
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
Tj
junction temperature
40
+125
C
[1]
In accordance with AEC-Q100-004.
all supply voltages below the
maximum value
[1]
8. Revision history
Table 4.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEF701X_SDS v.1
20130730
Product short data sheet
-
-
TEF701X_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 July 2013
© NXP B.V. 2013. All rights reserved.
5 of 8
TEF701X
NXP Semiconductors
Scalable advanced background receiver
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEF701X_SDS
Product short data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 July 2013
© NXP B.V. 2013. All rights reserved.
6 of 8
TEF701X
NXP Semiconductors
Scalable advanced background receiver
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
9.4
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors ICs with HD Radio functionality are manufactured
under license from iBiquity Digital Corporation. Sale or distribution of
equipment that includes this device requires a license, which may be
obtained at: iBiquity Digital Corporation, 6711 Columbia Gateway Drive,
Suite 500, Columbia MD 21046, USA. Telephone: +1 (443) 539 4290, fax:
+1 (443) 539 4291, e-mail: [email protected]
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Licenses
ICs with HD Radio functionality
9.5
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
HD Radio — is a trademark of iBiquity Digital Corporation.
HD Radio — logo is a registered trademark of iBiquity Digital Corporation.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEF701X_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 July 2013
© NXP B.V. 2013. All rights reserved.
7 of 8
TEF701X
NXP Semiconductors
Scalable advanced background receiver
11. Contents
1
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
9.5
10
11
General description . . . . . . . . . . . . . . . . . . . . . .
Features and benefits . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
2
2
3
4
5
5
6
6
6
6
7
7
7
8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 30 July 2013
Document identifier: TEF701X_SDS
Similar pages