Hermetic Packages for Integrated Circuits Package Outline Drawing K18.E 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE WITH BOTTOM METAL Rev 1, 3/13 PIN NO. 1 ID OPTIONAL 1 0.015(0.381) 0.005(0.127) 2 A A 0.040(1.016 BSC) 0.476(12.09) 0.456(11.58) PIN NO. 1 ID AREA 0.020(0.508) 0.013(0.330) 0.122(3.10) 0.100(2.54) 0.005(0.127) MIN. 4 TOP VIEW 0.036(0.92) 0.026(0.66) 6 0.397(10.084) 0.377(9.576) -D0.010(0.254) 0.004(0.102) -CSEATING AND BASE PLANE BOTTOM METAL 7 0.303(7.70) 0.283(7.19) SIDE VIEW 0.295(7.49) 0.250(6.35) -H- 0.03(0.76) MIN. BOTTOM METAL 0.005(0.127) REF OFFSET FROM CERAMIC EDGE BOTTOM VIEW NOTES: 0.007(0.178) 0.004(0.102) 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. LEAD FINISH 2. If a pin one identification mark is used in addition to a tab, the limits of the tab dimension do not apply. ~ BASE METAL 0.010(0.254) 0.004(0.102) 4. Measure dimension at all four corners. 0.017(0.432) 0.013(0.330) 0.0015(0.04) MAX 0.020(0.508) 0.013(0.330) 3 SECTION A-A 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 6. Dimension shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 7. The bottom of the package is a solderable metal surface. 8. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 9. Dimensions = INCH (mm). Controlling dimension: INCH. 1