Data Sheet

TDA8579T
Dual common-mode rejection differential line receiver
Rev. 4 — 23 September 2013
Product data sheet
1. General description
The TDA8579T is a two channel differential amplifier with 0 dB gain and low distortion.
The device has been primarily developed for car radio applications where long
connections between signal sources and amplifiers (or boosters) are necessary and
where ground noise has to be eliminated. The device is intended to be used to receive line
inputs in audio applications that require a high level of common-mode rejection. The
device is contained in an 8-pin Small Outline (SO) package.
2. Features and benefits









Excellent common-mode rejection, up to high frequencies
Elimination of source resistance dependency in the common-mode rejection
Few external components
High supply voltage ripple rejection
Low noise
Low distortion
All pins protected against electrostatic discharge
AC and DC short-circuit safe to ground and VCC
Fast DC settling
3. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VCC
supply voltage
ICC
supply current
GV
Conditions
Min
Typ
Max
Unit
5.0
8.5
18
V
-
11
14
mA
voltage gain
0.5
0
+0.5
dB
SVRR
supply voltage ripple rejection
55
60
-
dB
Vno
noise output voltage
-
3.7
5.0
V
|Zi|
input impedance
100
240
-
k
CMRR
common-mode rejection ratio
-
80
-
dB
VCC = 8.5 V
Rs = 0 
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
4. Ordering information
Table 2.
Ordering information
Type number
TDA8579T
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
5. Block diagram
VCC
8
INL+
1
7
VCC
2
IN-
INR+
TDA8579T
4
6
3
OUTL
SVRR
OUTR
5
GND
Fig 1.
aaa-008045
Block diagram
6. Pinning information
6.1 Pinning
8
VCC
7
OUTL
3
6
OUTR
4
5
GND
INL+
1
IN-
2
INR+
SVRR
TDA8579T
aaa-008040
Fig 2.
TDA8579T
Product data sheet
Pin configuration
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Dual common-mode rejection differential line receiver
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
INL+
1
positive input left
IN
2
common negative input
INR+
3
positive input right
SVRR
4
half supply voltage
GND
5
ground
OUTR
6
output right
OUTL
7
output left
Vcc
8
supply voltage
7. Functional description
The TDA8579T contains two identical differential amplifiers with a voltage gain of 0 dB.
The device is intended to receive line input signals for audio applications. The TDA8579T
has a very high level of common-mode rejection and thus eliminates ground noise. The
common-mode rejection remains constant up to high frequencies (the amplifier gain is
fixed at 0 dB). The inputs have a high input impedance. The output stage is a class AB
stage with a low output impedance. For a large common-mode rejection, also at low
frequencies, an electrolytic capacitor connected to the negative input is advised. Because
the input impedance is relatively high, this results in a large settling time of the DC input
voltage. Therefore a quick-charge circuit is included to charge the input capacitor within
0.2 seconds.
All input and output pins are protected against high electrostatic discharge conditions
(4000 V, 150 pF, 150 ).
TDA8579T
Product data sheet
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Dual common-mode rejection differential line receiver
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages and currents
are referenced to GND unless otherwise specified.
Symbol Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
-
18
V
IORM
repetitive peak output current
-
40
mA
Vsc
AC and DC short-circuit safe voltage
-
18
V
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
Tj
maximum junction temperature
-
150
C
Conditions
Value
Unit
in free air
160
K/W
9. Thermal characteristics
Table 5.
Thermal characteristics
According to IEC 60747-1.
Symbol Parameter
Rth(j-a)
TDA8579T
Product data sheet
thermal resistance from junction to ambient
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Dual common-mode rejection differential line receiver
10. Characteristics
Table 6.
Electrical characteristics
VCC = 8.5 V; Tamb = 25 C; test circuit (see Figure 3); unless otherwise specified.
Symbol Parameter
Conditions
Max
Unit
5.0
8.5
18
V
-
11
14
mA
-
4.3
-
V
supply voltage
ICC
supply current
VO
output voltage
tset
DC input voltage settling time
-
0.2
-
s
Gv
voltage gain
0.5
0
+0.5
dB
cs
channel separation
70
80
-
dB
|Gv|
channel unbalance
-
-
0.5
dB
20
-
-
Hz
20
-
-
kHz
[1]
Rs = 5 k
fL
LOW frequency roll-off
1 dB
fH
HIGH frequency roll-off
1 dB
[2]
|Zi|
input impedance
100
240
-
k
|Zo|
output impedance
-
-
10

Vi(max)
maximum input voltage
THD = 1 %
-
2.0
-
V
noise output voltage
Rs = 0 
-
3.7
5.0
V
-
-
1.0
V
[3]
VCM(rms) common-mode input voltage
(RMS value)
CMRR
common-mode rejection ratio
Rs = 5 k
66
70
-
dB
[4]
-
80
-
dB
[5]
55
65
-
dB
[6]
-
60
-
dB
Vi = 1 V;
-
0.02
-
%
Vi = 1 V;
f = 20 Hz to 20 kHz
-
-
0.1
%
Vi = 1 V; RL = 150 
-
-
1
%
Rs = 0 
SVRR
THD
supply voltage ripple rejection
total harmonic distortion
THDmax total harmonic distortion at
maximum output current
Product data sheet
Typ
VCC
Vno
TDA8579T
Min
[1]
The DC output voltage with respect to ground is approximately 0.5VCC.
[2]
The input coupling capacitors set the frequency response externally.
[3]
The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
[4]
The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in
accordance with the test circuit (see Figure 3). VINL and VINR are short-circuited. Frequencies are between
100 Hz and 100 kHz.
[5]
The ripple rejection is measured at the output, with Rs = 2 k, f = 1 kHz and a ripple amplitude of 2 V (p-p).
[6]
The ripple rejection is measured at the output. Rs = 0  to 2 k, f = 100 Hz to 20 kHz and a maximum
ripple amplitude of 2 V (p-p).
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TDA8579T
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Dual common-mode rejection differential line receiver
11. Application information
VCC
100 nF
Rs
5 kΩ
220 nF
8
1
7
+
-
2.2 μF
OUTL
VCC
VINL
TDA8579T
C2
VCM
2
SVRR
4
VINR
Rs
5 kΩ
220 nF
3
6
+
47 μF
2.2 μF
OUTR
RL
10 kΩ
5
RL
10 kΩ
aaa-007782
C2 = nominal 22 F
Fig 3.
Test and application circuit
mbd215
10-1
THD
(%)
10-2
10-3
Fig 4.
10
102
103
104
f (Hz)
105
Total harmonic distortion as a function of frequency; Vi = 1 V (RMS)
TDA8579T
Product data sheet
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Dual common-mode rejection differential line receiver
mbd216
0
CMR
(dB)
-20
-40
(1)
-60
(2)
-80
-100
(3)
10
102
103
104
f (Hz)
105
(1) Rs = 5 k
(2) Rs = 2 k
(3) Rs = 0 k
Fig 5.
Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS)
mbd213
1
THD
(%)
10-1
10-2
10-3
Fig 6.
10
102
103
Vi(rms) (mV)
104
Total harmonic distortion as a function of input voltage; f = 1 kHz
TDA8579T
Product data sheet
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Dual common-mode rejection differential line receiver
mbd214
-40
CMR
(dB)
-50
-60
-70
-80
-90
100
300
500
700
900
1100
VCM(rms) (mV)
1300
Common-mode rejection ratio as a function of common-mode input voltage; f = 1 kHz, Rs = 0 
Fig 7.
mbd211
0
CMR
(dB)
-20
-40
(1)
(2)
(3)
-60
-80
-100
10
102
103
104
f (Hz)
105
(1) C2 = 22 F
(2) C2 = 47 F
(3) C2 = 100 F
Fig 8.
Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS)
TDA8579T
Product data sheet
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TDA8579T
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Dual common-mode rejection differential line receiver
mbd212
-30
SVR
(dB)
-40
-50
-60
-70
Fig 9.
10
102
103
f (Hz)
104
Supply voltage ripple rejection as a function of frequency; Vripple = 2 V (p-p), Rs = 2 k
TDA8579T
Product data sheet
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TDA8579T
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Dual common-mode rejection differential line receiver
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 10. Package outline SOT96-1 (SO8)
TDA8579T
Product data sheet
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TDA8579T
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Dual common-mode rejection differential line receiver
13. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
TDA8579T
Product data sheet
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Dual common-mode rejection differential line receiver
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 8.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
TDA8579T
Product data sheet
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Dual common-mode rejection differential line receiver
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA8579T v.4
20130923
Product data sheet
-
TDA8579 v.3
Modifications:
TDA8579T v.3
Modifications:
•
Security status changed from company confidential to company public.
20130606
Product data sheet
-
TDA8579 v.2
•
The format of this document has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
TDA8579 v.2
19951215
Product data sheet
-
TDA8579 v.1
TDA8579 v.1
19940125
Product data sheet
-
-
TDA8579T
Product data sheet
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Dual common-mode rejection differential line receiver
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TDA8579T
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TDA8579T
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 23 September 2013
© NXP B.V. 2013. All rights reserved.
15 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
18. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Handling information. . . . . . . . . . . . . . . . . . . . 11
Soldering of SMD packages . . . . . . . . . . . . . . 11
Introduction to soldering . . . . . . . . . . . . . . . . . 11
Wave and reflow soldering . . . . . . . . . . . . . . . 11
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesad[email protected]
Date of release: 23 September 2013
Document identifier: TDA8579T