Plastic Packages for Integrated Circuits Package Outline Drawing V256.13.5x13.5 256 LOW PROFILE, FINE PITCH PLASTIC BALL GRID ARRAY PACKAGE (LFBGA) Rev 0, 3/13 3 X 13.50 PIN A1 CORNER COMMON DIMENSIONS Y 4 SYMBOL MIN Package Body Size 13.50 0.20 TOP VIEW aaa(4X) E A A1 BALL PAD CORNER B E1 Øb(n X) Øeee M C A B Øfff M C e A B C D E F G H J K L M N P R T E 13.50 Y D 13.50 e 0.800 Total Thickness A Mold Thickness M 0.700 Ref. Substrate Thickness - S 0.560 Ref. Ball Diameter A1 0.270 - 0.370 Ball Width b 0.380 - 0.480 Package Edge Tolerance aaa 0.150 Mold Parallelism bbb 0.200 Coplanarity ddd 0.120 Ball Offset (Package) eee 0.150 Ball Offset (Ball) fff 0.080 Ball Count n 256 X E1 12.000 Y D1 12.000 D D1 e A A1 16151413121110 9 8 7 6 5 4 3 2 1 BOTTOM VIEW PACKAGE OUTLINE (0.80 TYP) C M S SIDE VIEW (12.00) 1 1.700 0.400 ddd C bbb C TYPICAL RECOMMENDED LAND PATTERN - Stand Off Edge Ball Center to Center (12.00) MAX LFBGA X Ball Pitch (4X) NOM NON SOLDER MASK DEFINED PAD 0.38 NOM/0.40mm DIAMETER MAX.