Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages (BGA) o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T S A MIN MAX NOTES A - 0.059 - 1.50 - A1 0.012 0.016 0.31 0.41 - A2 0.037 0.044 0.95 1.13 - b 0.016 0.020 0.41 0.51 7 D/E 0.665 0.673 16.90 17.10 - D1/E1 0.587 0.595 14.90 15.10 - N 256 256 - e 0.039 BSC 1.0 BSC - MD/ME 16 x 16 16 x 16 - bbb 0.004 0.10 3 ααα 0.005 0.12 Rev. 2 01/03 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. Dimensioning and tolerancing conform to AMSE Y14.5M-1994. E1 3. “MD” and “ME” are the maximum ball matrix size for the “D” and “E” dimensions, respectively. 4. “N” is the maximum number of balls for the specific array size. 5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls. ALL ROWS AND COLUMNS A MAX NOTES: e S MILLIMETERS MIN BOTTOM VIEW 6. Dimension “A” includes standoff height “A1”, package body thickness and lid or cap height “A2”. 7. Dimension “b” is measured at the maximum ball diameter, parallel to the primary datum C. A1 A2 8. Pin “A1” is marked on the top and bottom sides adjacent to A1. bbb C aaa C C A SEATING PLANE SIDE VIEW 1 9. “S” is measured with respect to datum’s A and B and defines the position of the solder balls nearest to package centerlines. When there is an even number of balls in the outer row the value is “S” = e/2.