Package Outline Drawing (POD)

Hermetic Packages for Integrated Circuits
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
D18.3 MIL-STD-1835 CDIP2-T18 (D-6, CONFIGURATION C)
LEAD FINISH
c1
-A-
18 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
-DBASE
METAL
E
b1
M
(b)
M
-Bbbb S C A - B S
SECTION A-A
D S
D
BASE
PLANE
Q
S2
-C-
SEATING
PLANE
A
L
S1
eA
A A
b2
b
e
eA/2
c
aaa M C A - B S D S
ccc M C A - B S D S
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
5
INCHES
(c)
SYMBOL
MILLIMETERS
MIN
MAX
MIN
MAX
A
-
b
0.014
b1
b2
0.200
-
5.08
-
0.026
0.36
0.66
2
0.014
0.023
0.36
0.58
3
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.960
-
24.38
-
E
0.220
0.310
5.59
7.87
-
e
0.100 BSC
2.54 BSC
NOTES
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.070
0.38
1.78
5
S1
0.005
-
0.13
-
6
S2
0.005
-
0.13
-
7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
18
18
8
Rev. 0 5/18/94