TDF8546 I2C-bus controlled 4 45 W best efficiency amplifier Rev. 8 — 27 September 2013 Product short data sheet 1. General description The TDF8546 is one of a new generation of complementary quad Bridge-Tied Load (BTL) audio power amplifiers intended for automotive applications. It has a best efficiency mode with full I2C-bus controlled diagnostics, including start-up diagnostics. The TDF8546 can operate at a battery voltage as low as 6 V making this amplifier suitable for stop/start-car operation. The new best efficiency principle uses a patented switch technique which reduces switching distortion. To reduce power dissipation, the new best efficiency principle uses the audio information on all four channels instead of only the front or rear signals. Dissipation is more than 65 % less than standard BTL when used for front and rear correlated audio signals. Dissipation is 35 % less than standard BTL when used for uncorrelated (delayed) audio signals between front and rear. It is 17 % less for uncorrelated audio signals when the front or rear information is used. The amplifier uses a complementary DMOS output stage in a Silicon-On-Insulator (SOI) based BCD process. The DMOS output stage ensures a high-power output signal with perfect sound quality. The SOI-based BCD process ensures a robust amplifier, where latch-up cannot occur, with good separation between the four independent channels, with every component isolated and without substrate currents. 2. Features and benefits Stop/start-car prepared: keeps operating without audible disturbance during engine start at a battery voltage as low as 6 V New best efficiency mode with patented low switching distortion Extreme best efficiency mode (uses information from 4 channels) with 17 % less dissipation for uncorrelated signals compared to 2-channel best efficiency mode. Operates in either legacy (non-I2C-bus) or I2C-bus modes (3.3 V and 5 V compliant) Four hardware-programmable I2C-bus addresses Can drive 2 and 4 loads Speaker fault detection Start-up diagnostics with load detection: open, short, present; filtered for door-slam and chatter relays AC load (tweeter) detection with low and high current mode Gain select after start-up without audible disturbance Independent selectable soft mute of front and rear channels Programmable gain (26 dB and 16 dB), independently programmable for the front and rear channels TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier Line driver mode supports engine start at a battery voltage as low as 6 V (16 dB and mid-tap voltage 0.25 VP) Programmable clip detect: 2 %, 5 % or 10 % Programmable thermal pre-warning Pin STB can be programmed/multiplexed with second-clip detect Clip information of each channel can be directed separately to pin DIAG or pin STB Independent enabling of thermal-, clip- or load fault information (short across the load or to VP or to ground) on pin DIAG Loss-of-ground and open VP safe (minimum series resistance required) All amplifier outputs short-circuit proof to ground, supply voltage and across the load (channel independent) All pins short-circuit proof to ground Temperature controlled gain reduction to prevent audio holes at high junction temperatures Programmable low battery voltage detection to enable 7.5 V or 6 V minimum battery voltage operation Overvoltage protection (load-dump safe up to VP = 50 V) with overvoltage pre-warning at 16 V Offset detection 3. Quick reference data Table 1. Quick reference data Conditions Min Typ Max Unit VP(oper) Symbol Parameter operating supply voltage RL = 4 6 14.4 18 V Iq quiescent current no load - 260 350 mA no load; VP = 7 V - 190 - mA RL = 4 ; VP = 14.4 V; maximum power; Vi = 2 V RMS square wave 37 40 - W RL = 4 ; VP = 15.2 V; maximum power; Vi = 2 V RMS square wave 41 45 - W RL = 4 ; VP = 14.4 V; THD = 0.5 % 18 20 - W RL = 4 ; VP = 14.4 V; THD = 10 % 23 25 - W RL = 2 ; VP = 14.4 V; THD = 10 % 40 44 - W RL = 2 ; VP = 14.4 V; maximum power; Vi = 2 V RMS square wave 58 64 - W Po = 1 W to 12 W; fi = 1 kHz; RL = 4 ; BTL mode - 0.01 0.1 % Po = 4 W; fi = 1 kHz; RL = 4 ; best efficiency mode - 0.03 - % amplifier mode - 43 65 V line driver mode - 25 33 V Po output power THD total harmonic distortion Vn(o) output noise voltage TDF8546_SDS Product short data sheet filter 20 Hz to 22 kHz; RS = 1 k All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 2 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 4. Ordering information Table 2. Ordering information Type number Package Name Description Version TDF8546J DBS27P plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) SOT827-1 TDF8546TH HSOP36 plastic, heatsink small outline package; 36 leads; low stand-off height SOT851-1 TDF8546JS DBSMS27P plastic dual bent surface mounted SIL power package; 27 leads SOT1154-1 TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 3 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 5. Pinning information 5.1 Pinning ADSEL 1 STB 2 PGND2 3 OUT2- 4 DIAG 5 OUT2+ 6 VP2 7 OUT1- 8 PGND1 9 OUT1+ 10 SVR 11 IN1 12 IN2 13 SGND 14 TDF8546J/JS IN4 15 IN3 16 ACGND 17 OUT3+ 18 PGND3 19 OUT3- 20 VP1 21 OUT4+ 22 SCL 23 OUT4- 24 PGND4 25 SDA 26 TAB 27 aaa-005789 Fig 1. TDF8546_SDS Product short data sheet Pin configuration of TDF8546J/JS (packages DBS27P and DBSMS27P) All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 4 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier TAB 36 1 OUT3- n.c. 35 2 OUT3+ n.c. 34 3 VP1 n.c. 33 4 OUT4- PGND3 32 5 PGND4 n.c. 31 6 OUT4+ ACGND 30 7 SCL IN3 29 8 SDA IN4 28 9 DIAG SGND 27 TDF8546TH 10 ADSEL IN2 26 11 STB IN1 25 12 n.c. SVR 24 13 OUT2+ PGND1 23 14 PGND2 n.c. 22 15 OUT2- n.c. 21 16 VP2 n.c. 20 17 OUT1+ n.c. 19 18 OUT1001aam684 Fig 2. TDF8546_SDS Product short data sheet Pin configuration TDF8546TH All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 5 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 5.2 Pin description TDF8546_SDS Product short data sheet Table 3. Pin description Symbol Pin Description TDF8546J/JS TDF8546TH ADSEL 1 10 I2C-bus address select STB 2 11 Standby (I2C-bus mode) or mode pin (legacy mode) programmable second clip indicator PGND2 3 14 channel 2 power ground OUT2 4 15 channel 2 negative output (right rear) DIAG 5 9 diagnostic and clip detection output OUT2+ 6 13 channel 2 positive output (right rear) VP2 7 16 power supply voltage 2 OUT1 8 18 channel 1 negative output (right front) PGND1 9 23 channel 1 power ground OUT1+ 10 17 channel 1 positive output (right front) SVR 11 24 half supply voltage filter capacitor IN1 12 25 channel 1 input IN2 13 26 channel 2 input SGND 14 27 signal ground IN4 15 28 channel 4 input IN3 16 29 channel 3 input ACGND 17 30 AC ground OUT3+ 18 2 channel 3 positive output (left front) PGND3 19 32 channel 3 power ground OUT3 20 1 channel 3 negative output (left front) VP1 21 3 power supply voltage 1 OUT4+ 22 6 channel 4 positive output (left rear) SCL 23 7 I2C-bus clock input OUT4 24 4 channel 4 negative output (left rear) PGND4 25 5 channel 4 power ground SDA 26 8 I2C-bus data input and output TAB 27 36 heatsink connection; must be connected to ground n.c. - 12, 19, 20, 21, 22, 31, 33, 34, 35 not connected All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 6 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 6. Thermal characteristics Table 4. Symbol Thermal characteristics Parameter Conditions Typ Unit DBS27/DBSMS27P Rth(j-c) thermal resistance from junction to case 1 K/W Rth(j-a) thermal resistance from junction to ambient 40 K/W Rth(j-c) thermal resistance from junction to case 1 K/W Rth(j-a) thermal resistance from junction to ambient 35 K/W HSOP36 TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 7 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 7. Characteristics Table 5. Characteristics Tamb = 25 C; VP = 14.4 V; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tj = 40 C to +150 C; functionality is guaranteed for VP < 10 V unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit RL = 4 6 14.4 18 V RL = 2 6 14.4 16 V - 260 350 mA Supply voltage behavior VP(oper) operating supply voltage Iq quiescent current no load no load; VP = 7 V - 190 - mA Ioff off-state current VSTB = 0.4 V - 4 10 A VO output voltage DC amplifier on; high gain/low gain mode 6.6 7.1 7.6 V line driver mode; IB4[D2] = 0; IB3[D5:D6] = 1 3.0 3.4 3.8 V IB4[D0] = 1 7.0 7.7 8.1 V IB4[D0] = 0 5.4 5.7 6.2 V 6.5 7.2 7.7 V VP(low)(mute) low supply voltage mute rising supply voltage falling supply voltage IB4[D0] = 1 IB4[D0] = 0 VP(low)(mute) VP(ovp)pwarn 5.2 5.5 5.9 V low supply voltage mute hysteresis IB4[D0] = 1 0.1 0.5 0.8 V IB4[D0] = 0 0.1 0.3 0.7 V pre-warning overvoltage protection supply voltage rising supply voltage 15.2 16 16.9 V falling supply voltage 14.4 15.2 16.2 V hysteresis - 0.8 - V Vth(ovp) overvoltage protection threshold voltage rising supply voltage 18 20 22 V VPOR power-on reset voltage falling supply voltage - 3.1 4.5 V VO(offset) output offset voltage amplifier on 75 0 +75 mV amplifier mute 25 0 +25 mV line driver mode 45 0 +45 mV TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 8 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier Table 5. Characteristics …continued Tamb = 25 C; VP = 14.4 V; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tj = 40 C to +150 C; functionality is guaranteed for VP < 10 V unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - - 0.8 V - - 0.8 V 2.5 - 4.5 V Mode select and second clip detection: pin STB VSTB voltage on pin STB off-by mode selected I2C-bus mode legacy mode off) (I2C-bus mode mute selected legacy mode (I2C-bus mode off) operating mode selected I2C-bus mode 2.5 - VP V legacy mode (I2C-bus mode off) 5.9 - VP V 5.6 5.9 6.5 V 6.1 - 7.4 V - 5 30 A - 300 500 s - - 5 A I2C-bus mode; with ILO = 5 A +15 ms; no DC-load (IB1[D1] = 0); - 430 650 ms legacy mode; with ILO = 5 A +20 ms; VSTB = 7 V; RADSEL = 0 ; - 430 650 ms I2C-bus mode; with ILO = 5 A +30 ms; no DC-load (IB1[D1] = 0); - 550 800 ms legacy mode; with ILO = 5 A +20 ms; VSTB = 7 V; RADSEL = 0 ; - 550 800 ms low voltage on pin STB when pulled LOW during clipping; clip detection on STB active [1] ISTB = 150 A ISTB = 500 A ISTB current on pin STB 0 V < VSTB < 8.5 V; clip detection not active [1] Start-up/shut-down/mute timing twake wake-up time ILO(SVR) output leakage current on pin SVR td(mute_off) mute off delay time tamp_on amplifier on time TDF8546_SDS Product short data sheet time after wake-up via pin STB before first I2C-bus transmission is recognized; time from amplifier start to 10 % of output signal; ILO = 0 A time from amplifier start to amplifier on; 90 % of output signal; ILO = 0 A All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 [2] [2] © NXP B.V. 2013. All rights reserved. 9 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier Table 5. Characteristics …continued Tamb = 25 C; VP = 14.4 V; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tj = 40 C to +150 C; functionality is guaranteed for VP < 10 V unless otherwise specified. Symbol toff Parameter Conditions amplifier switch-off time Min Typ Max Unit I2C-bus mode; with ILO = 5 A +0 ms; 250 500 750 ms via pin STB; (IB4[D6] = 0); with ILO = 5 A +0 ms; 250 500 750 ms time to DC output voltage < 0.1 V; ILO = 0 A [2] td(mute-on) delay time from mute to on from 10 % to 90 % of output signal; Vi = 50 mV; I2C-bus mode (IB2[D1, D2] = 1 to 0) or IB2(D0 = 1 to 0) or legacy mode (VSTB = 3 V to 7 V); 5 15 40 ms td(soft_mute) soft mute delay time from 90 % to 10 % of output signal; Vi = 50 mV; I2C-bus mode (IB2[D1, D2] = 0 to 1) or legacy mode (VSTB = 7 V to 3 V); 5 15 40 ms td(fast_mute) fast mute delay time from 90 % to 10 % of output signal; Vi = 50 mV; I2C-bus mode (IB2[D0] = 0 to 1, or VSTB from > 5.9 V to < 0.8 V in 1 s; - 0.4 1 ms t(start-Vo(off)) engine start to output off time VP from 14.4 V to 5 V in 1.5 ms; Vo < 0.5 V; - 0.1 1 ms t(start-SVRoff) engine start to SVR off time VP from 14.4 V to 5 V in 1.5 ms; VSVR < 0.7 V; - 40 75 ms pins SCL and SDA - - 1.5 V I2C-bus interface[3] VIL LOW-level input voltage VIH HIGH-level input voltage pins SCL and SDA 2.3 5.5 V VOL LOW-level output voltage pin SDA; IL = 5 mA - - 0.4 V fSCL SCL clock frequency - 400 - kHz RseriesADSEL = 0 4 5 11 V RseriesADSEL = 100 k - - VP V input current on pin ADSEL VSTB = 5 V; VADSEL = 5 V - 2 10 A resistance on pin ADSEL I2C-bus address A[6:0] = 1101 110 99 100 101 k I2C-bus address A[6:0] = 1101 111 29.7 30 30.3 k I2C-bus address A[6:0] = 1101 010 9.9 10 10.1 k legacy mode - - 0.47 k does not react to address selection changes - - 6 V VADSEL II(ADSEL) RADSEL VP(latch) I2C-bus voltage on pin ADSEL latch supply voltage address A[6:0] = 1101 101 Start-up diagnostics TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 10 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier Table 5. Characteristics …continued Tamb = 25 C; VP = 14.4 V; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tj = 40 C to +150 C; functionality is guaranteed for VP < 10 V unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tsudiag start-up diagnostic time from start-up diagnostic command via I2C-bus until completion of start-up diagnostic; VO + < 0.1 V; VO < 0.1 V (no load) IB1[D1] = 1; 50 130 250 ms td(sudiag-on) start-up diagnostic to on delay time at 90 % of output signal; IB1[D0:D1] = 11; - 680 - ms Voffset offset voltage start-up diagnostic offset voltage under no load condition 1.3 2 2.5 V RLdet(sudiag) start-up diagnostic load detection resistance shorted load high gain; IB3[D6:D5] = 00 - - 0.5 low gain; IB3[D6:D5] = 11 - - 1.5 normal load high gain (IB3[D6:D5] = 00) 1.5 - 20 low gain (IB3[D6:D5] = 11) 3.2 - 20 line driver load 80 - 200 open load 400 - - Amplifier diagnostics VOL(DIAG) LOW-level output voltage on pin fault condition; IDIAG = 1 mA DIAG - - 0.3 V VO(offset_det) output voltage at offset detection 1.0 1.3 2.0 V THDclip total harmonic distortion clip detection level IB2[D7:D6] = 10 - 10 - % IB2[D7:D6] = 01 - 5 - % VP > 10 V - 2 - % pre-warning average junction temperature IB3[D4] = 0 or legacy mode IB2[D7:D6] = 00 150 160 170 C IB3[D4] = 1 125 135 145 C Tj(AV)(G(0.5dB)) average junction temperature for 0.5 dB gain reduction Vi = 0.05 V; best efficiency mode turns off when activated - 175 - C G(th_fold) gain reduction of thermal foldback when all channels switch off - 20 - dB Io output current I2C-bus mode; IB5[D7] = 0; AC load bit set; peak current IB4[D1] = 1 500 - - mA IB4[D1] = 0 275 - - mA IB4[D1] = 1 - - 250 mA IB4[D1] = 0 - - 100 mA Tj(AV)(pwarn) I2C-bus mode; IB5[D7] = 0; AC load bit not set; peak current TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 11 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier Table 5. Characteristics …continued Tamb = 25 C; VP = 14.4 V; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tj = 40 C to +150 C; functionality is guaranteed for VP < 10 V unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit output power RL = 4 ; VP = 14.4 V; THD = 0.5 % 18 20 - W RL = 4 ; VP = 14.4 V; THD = 10 % 23 25 - W RL = 2 ; VP = 14.4 V; THD = 0.5 % 29 32 - W RL = 2 ; VP = 14.4 V; THD = 10 % 40 44 - W RL = 4 ; VP = 14.4 V; Vi = 2 V RMS square wave 37 40 - W RL = 4 ; VP = 15.2 V; Vi = 2 V RMS square wave 41 45 - W RL = 2 ; VP = 14.4 V; Vi = 2 V RMS square wave 58 64 - W Po = 1 W to 12 W; fi = 1 kHz; RL = 4 ; BTL mode - 0.01 0.1 % Po = 1 W; fi = 1 kHz; RL = 4 ; VP = 7 V; BTL and best efficiency mode - 0.01 0.1 % Po = 4 W; fi = 1 kHz; RL = 4 ; best efficiency mode - 0.03 0.1 % Po = 1 W to 12 W; fi = 20 kHz; RL = 4 ; best efficiency mode - 0.3 0.4 % Vo = 1 V (RMS) and 4 V (RMS), fi = 1 kHz; line driver mode - 0.02 0.05 % Po = 1 W to 12 W; fi = 1 kHz; RL = 4 ; low gain mode - 0.01 0.1 % 65 80 - dB 55 65 - dB 55 70 - dB common mode input to differential output (VO(dif) / VI(cm) + 26 dB) 55 65 - dB common mode input to common mode output (VO(cm) / VI(cm) + 26 dB) 50 58 - dB Amplifier Po Po(max) THD cs maximum output power total harmonic distortion channel separation best efficiency mode; RS = 1 k; RACGND = 250 [4] fi = 1 kHz fi = 10 kHz SVRR supply voltage ripple rejection fi = 1 kHz; RS = 1 k; RACGND = 250 ; best efficiency mode; tested at VP = 10.5 V [4] CMRR common mode rejection ratio amplifier mode; Vcm = 0.3 V (p-p); fi = 1 kHz to 3 kHz, RS = 1 k; RACGND = 250 ; best efficiency mode [4] TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 12 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier Table 5. Characteristics …continued Tamb = 25 C; VP = 14.4 V; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tj = 40 C to +150 C; functionality is guaranteed for VP < 10 V unless otherwise specified. Symbol Vo Parameter Conditions output voltage variation Vn(o) Min Typ Max Unit from off to mute and mute to off - - 7.5 mV from mute to on and on to mute (soft mute) - - 7.5 mV from off to on and on to off (start-up diagnostic enabled) - - 7.5 mV plop during switch-on and switch-off; best efficiency mode [5] filter 20 Hz to 22 kHz (6th order); RS = 1 k output noise voltage mute mode - 15 23 V line driver mode - 25 33 V amplifier mode; best efficiency mode - 43 65 V amplifier mode; best efficiency mode; RS = 50 - 40 60 V Gv(amp) voltage gain amplifier mode single-ended in to differential out; best efficiency mode 25.5 26 26.5 dB Gv(ld) voltage gain line driver mode single-ended in to differential out; best efficiency mode 15.5 16 16.5 dB Zi input impedance Tamb = 40 C to +105 C 38 62 105 k Tamb = 0 C to 105 C 55 62 105 k mute mute attenuation Vo(on) / Vo(mute); Vi = 50 mV 80 92 - dB Vo(mute)(RMS) RMS mute output voltage Vi = 1 V RMS; filter 20 Hz to 22 kHz - 16 29 V Bp power bandwidth 1 dB - 20 to 20000 - Hz CL(crit) critical load capacitance no oscillation; RL between 2 and open load; CL from all outputs to GND 22 - - nF best efficiency switch-off output best efficiency switch open voltage 4 load selected; IB5[D4] = 1 - 0.9 - V 2 load selected; IB5[D4] = 0 - 1.7 - V - 1.0 - Best efficiency mode control Vo(swoff)be Rsw(be) best efficiency switch resistance [1] VSTB depends on the current into pin STB: minimum = (1429 ISTB) + 5.4 V, maximum = (3143 ISTB) + 5.6 V. [2] The times are specified without leakage current. For a leakage current of 5 A on pin SVR, the delta time is specified. If the capacitor value on pin SVR changes 30 %, the specified time also changes 30 %. The specified times include an ESR of 15 for the capacitor on pin SVR. [3] Standard I2C-bus specification: maximum LOW-level = 0.3VDD, minimum HIGH-level = 0.7VDD. To comply with 5 V and 3.3 V logic, VDD = 5 V defines the maximum LOW-level and VDD = 3.3 V defines the minimum HIGH-level. [4] For optimum channel separation (cs), supply voltage ripple rejection (SVRR) and common mode rejection ratio (CMRR), a resistor RS R ACGND = ------ must be in series with the ACGND capacitor. 4 [5] The plop-noise during amplifier switch-on and switch-off is measured using an ITU-R 2 k filter; see Figure 4. TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 13 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier input 5th ORDER 20 kHz BUTTERWORTH LOW-PASS FILTER DIFFERENTIAL TO SINGLE − ENDED RECTIFIER PEAK DETECTOR ITU-R 2K FILTER OUTPUT BUFFER + 40 dB GAIN output 001aam706 Fig 3. Location of ITU-R 2K filter 001aam707 10 (4) output (dB) −10 (1) maximum 6 dB at 6 kHz −30 0 dB at 2 kHz (2) −50 (3) −70 10 102 103 104 105 f (Hz) (1) 20 Hz. (2) A-weighting. (3) ITU-R average response meter. (4) 20 kHz bandwidth limit. Fig 4. TDF8546_SDS Product short data sheet Plop noise test using ITU-R 2K filter All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 14 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 8. Package outline DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) SOT827-1 non-concave x Dh D Eh view B: mounting base side A2 d B j E A L4 L3 L 1 L2 27 e1 Z w bp e c Q v e2 m 0 10 20 mm x Z(1) scale 1.8 0.03 1.2 Dimensions (mm are the original dimensions) Unit max nom min mm A A2 bp c 4.6 0.60 0.5 D(1) d Dh 29.2 24.8 19 E(1) 0.45 0.3 e1 e2 Eh j L 2 1 4 8 3.55 3.40 3.25 6.8 15.9 12 4.4 e 28.8 24.4 15.5 L2 3.9 L3 L4 1.15 22.9 References IEC JEDEC JEITA 3.1 0.85 22.1 v w 0.6 0.25 2.1 1.8 sot827-1_po European projection Issue date 13-02-13 13-05-30 SOT827-1 Fig 5. Q 4 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. Outline version m Package outline SOT827-1 (DBS27P) TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 15 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height SOT851-1 D E A x c y X E2 v HE A D1 D2 1 18 pin 1 index Q A A2 E1 (A 3) A4 θ Lp detail X 36 19 z w bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) A UNIT max. A2 mm 3.5 A3 A4(1) +0.08 3.4 0.35 −0.04 3.3 D1 D2 E (2) E1 E2 e HE Lp Q 0.38 0.32 16.0 13.0 0.25 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 0.65 14.5 13.9 1.1 0.8 1.7 1.5 bp c D (2) v w x y 0.25 0.12 0.03 0.07 Z θ 2.55 2.20 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 04-03-09 04-05-25 SOT851-1 Fig 6. EUROPEAN PROJECTION Package outline SOT851-1 (HSOP36) TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 16 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier DBSMS27P: plastic dual bent surface mounted SIL power package; 27 leads SOT1154-1 L4 L3 θ2 gauge plane seating plane A3 S R 1 R 2 D θ1 y Lp2 Lp1 aaa S c detail X non-concave x d A2 Dh Eh E j 27 L1 1 L2 A1 e1 e Z Q R1 0 10 A A1 max 4.65 0.10 nom 4.50 0.00 min 4.35 -0.08 mm A2 4.6 4.5 4.4 D(1) A3 bp c 0.5 0.60 0.50 0.45 0.5 0.4 0.3 d 29.2 24.8 29.0 24.6 28.8 24.4 R2 0.85 0.35 0.60 0.25 0.35 0.15 20 mm scale Dimensions Unit c X v w bp Dh E(1) 12 15.9 15.7 15.5 e 2 e1 1 aaa v 0.1 0.6 j Eh 8 L1 w x 0.25 0.03 L2 3.55 3.03 5.03 3.40 2.83 4.83 3.25 2.63 4.63 References IEC JEDEC JEITA SOT1154-1 --- --- --- Fig 7. Z(1) θ1 θ2 1.8 1.5 1.2 9° 10° 0.1 3° 4° Lp2 Q L3 L4 Lp1 1.2 1.0 0.8 3.2 3.0 2.8 1.43 1.43 2.10 1.25 1.25 1.95 1.07 1.07 1.80 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. Outline version y sot1154-1_po European projection Issue date 12-12-19 13-02-13 Package outline SOT1154-1 (DBSMS27P) TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 17 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 9. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes TDF8546 v.8 20130927 Product short data sheet - - TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 18 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TDF8546_SDS Product short data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 19 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 10.4 Trademarks Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDF8546_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 8 — 27 September 2013 © NXP B.V. 2013. All rights reserved. 20 of 21 TDF8546 NXP Semiconductors I2C-bus controlled 4 45 W best efficiency amplifier 12. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 September 2013 Document identifier: TDF8546_SDS