Data Sheet

TDA8595
I2C-bus controlled 4  45 W power amplifier
Rev. 5 — 11 June 2013
Product data sheet
1. General description
The TDA8595 is a complementary quad Bridge Tied Load (BTL) audio power amplifier
made in BCDMOS technology. It contains four independent amplifiers in BTL
configuration. Through the I2C-bus, diagnosis of temperature warning and clipping level is
fully programmable and the information available via two diagnostic pins is selectable.
The status of each amplifier (output offset, load or no load, short-circuit or speaker
incorrectly connected) can be read separately.
2. Features and benefits
2.1 General












Operates in legacy mode (non I2C-bus) and I2C-bus mode (3.3 V and 5 V compliant)
Three hardware-programmable I2C-bus addresses
Drive 4  or 2  loads
Speaker fault detection
Independent short-circuit protection per channel
Loss of ground and open VP safe (with 150 m series impedance and a supply
decoupling capacitor of 2200 F maximum)
All outputs short-circuit proof to ground, supply voltage and across the load
All pins short-circuit proof to ground
Temperature-controlled gain reduction to prevent audio holes at high junction
temperatures
Low battery voltage detection
Offset detection
This part has been qualified in accordance with AEC-Q100
2.2 I2C-bus mode
 DC load detection: open-circuit, short-circuit and load present
 AC load (tweeter) detection
 During start-up, can detect which load is connected so the appropriate gain can be
selected without audio pop
 Independently selectable soft mute of front channels (channel 1 and channel 3) and
rear channels (channel 2 and channel 4)
 Programmable gain (26 dB and 16 dB) of front channels and rear channels
 Fully programmable diagnostic levels can be set:
 Programmable clip detection: 2 %, 5 % or 10 %
 Programmable thermal pre-warning
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
 Selectable information on the DIAG and STB pins:
 The STB pin can be programmed/multiplexed with second clip detection
 Clip information of each channel can be directed separately to the DIAG pin or the
STB pin
 Independent enabling of thermal, clip or load fault detection (short across or to VP
or to ground) on DIAG pin
3. Quick reference data
Table 1.
Quick reference data
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ;
normal mode; unless otherwise specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to
+105 C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VP
supply voltage
RL = 4 
8
14.4
18
V
Iq
quiescent current
no load
-
270
400
mA
Po
output power
VP = 14.4 V
RL = 4 ; THD = 0.5 %
18
20
-
W
RL = 4 ; THD = 10 %
23
25
-
W
RL = 4 ; maximum
power; Vi = 2 V (RMS)
square wave
37
40
-
W
RL = 2 ; maximum
power; Vi = 2 V (RMS)
square wave
58
64
-
W
-
0.01
0.1
%
normal mode
-
45
65
V
line driver mode
-
22
29
V
THD
total harmonic
distortion
RL = 4 ; f = 1 kHz;
Po = 1 W to 12 W
Vn(o)
noise output
voltage
filter 20 Hz to 22 kHz;
RS = 1 k
4. Ordering information
Table 2.
TDA8595
Product data sheet
Ordering information
Type
number
Package
Name
Description
Version
TDA8595J
DBS27P
plastic DIL-bent-SIL (special bent) power package;
27 leads (lead length 6.8 mm)
SOT827-1
TDA8595TH
HSOP36
plastic, heatsink small outline package; 36 leads;
low stand-off height
SOT851-2
TDA8595SD
RDBS27P
plastic rectangular-DIL-bent-SIL (reverse bent) power
package; 27 leads (row spacing 2.54 mm)
SOT878-1
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I2C-bus controlled 4  45 W power amplifier
5. Block diagram
SCL
ADSEL SDA
VP2
VP1
1 (28) 26 (26) 23 (22)
21 (20, 21)
7 (34, 35)
5 (33)
STB
IN1
2 (29)
DIAG
I2C-BUS
INTERFACE
STANDBY/
FAST MUTE
12 (6)
CLIP DETECT/DIAGNOSTIC
MUTE
10 (4)
26 dB/
16 dB
8 (2)
OUT1+
OUT1−
PROTECTION/
DIAGNOSTIC
IN3
16 (12)
MUTE
18 (14)
26 dB/
16 dB
20 (17)
OUT3+
OUT3−
PROTECTION/
DIAGNOSTIC
IN2
13 (7)
6 (30)
MUTE
26 dB/
16 dB
4 (32)
OUT2+
OUT2−
PROTECTION/
DIAGNOSTIC
IN4
15 (11)
22 (25)
MUTE
26 dB/
16 dB
VP
24 (23)
SVR
14 (9)
SGND
OUT4−
PROTECTION/
DIAGNOSTIC
TDA8595J
TDA8595SD
(TDA8595TH)
11 (5)
OUT4+
27 (36)
17 (13)
ACGND
9 (3)
PGND1
3 (31)
PGND2
19 (16)
PGND3
25 (24)
TAB
001aad135
PGND4
The pin numbers in parenthesis represent TDA8595TH.
Fig 1. Block diagram
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
6. Pinning information
6.1 Pinning
ADSEL
1
STB
2
PGND2
3
OUT2−
4
DIAG
5
OUT2+
6
VP2
7
OUT1−
8
PGND1
9
OUT1+ 10
SVR 11
IN1 12
IN2 13
SGND 14
IN4 15
TDA8595J
TDA8595SD
IN3 16
ACGND 17
OUT3+ 18
PGND3 19
OUT3− 20
VP1 21
OUT4+ 22
SCL 23
OUT4− 24
PGND4 25
SDA 26
TAB 27
001aad136
Fig 2. Pin configuration TDA8595J and TDA8595SD
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
TAB 36
1
n.c.
VP2 35
2
OUT1−
VP2 34
3
PGND1
DIAG 33
4
OUT1+
OUT2− 32
5
SVR
PGND2 31
6
IN1
OUT2+ 30
7
IN2
STB 29
8
n.c.
ADSEL 28
9
SGND
TDA8595TH
n.c. 27
10 n.c.
SDA 26
11 IN4
OUT4+ 25
12 IN3
PGND4 24
13 ACGND
OUT4− 23
14 OUT3+
SCL 22
15 n.c.
VP1 21
16 PGND3
VP1 20
17 OUT3−
n.c. 19
18 n.c.
001aad138
Fig 3. Pin configuration TDA8595TH
6.2 Pin description
Table 3.
Symbol
TDA8595
Product data sheet
Pin description
Pin
Description
TDA8595J
TDA8595SD[1]
TDA8595TH
ADSEL
1
28
I2C-bus address select
STB
2
29
standby (I2C-bus mode) or mode pin (legacy
mode); programmable second clip indicator
PGND2
3
31
power ground channel 2
OUT2
4
32
negative channel 2 output
DIAG
5
33
diagnostic/clip detection output
OUT2+
6
30
positive channel 2 output
VP2
7
34 and 35
supply voltage 2
n.c.
-
1
not connected
OUT1
8
2
negative channel 1 output
PGND1
9
3
power ground channel 1
OUT1+
10
4
positive channel 1 output
SVR
11
5
half supply filter capacitor
IN1
12
6
channel 1 input
IN2
13
7
channel 2 input
n.c.
-
8
not connected
SGND
14
9
signal ground
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
Table 3.
Symbol
Pin description …continued
Pin
Description
TDA8595J
TDA8595SD[1]
TDA8595TH
n.c.
-
10
not connected
IN4
15
11
channel 4 input
IN3
16
12
channel 3 input
ACGND
17
13
AC ground input
OUT3+
18
14
positive channel 3 output
n.c.
-
15
not connected
PGND3
19
16
power ground channel 3
OUT3
20
17
negative channel 3 output
n.c.
-
18 and 19
not connected
VP1
21
20 and 21
supply voltage 1
OUT4+
22
25
positive channel 4 output
SCL
23
22
I2C-bus clock input
OUT4
24
23
negative channel 4 output
PGND4
25
24
power ground channel 4
SDA
26
26
I2C-bus data input/output
n.c.
-
27
not connected
TAB
27
36
heatsink connection; must be connected to
ground
[1]
To keep the output pins on the front side, special reverse bending is applied.
7. Functional description
The TDA8595 is a complementary quad BTL audio power amplifier made in BCDMOS
technology. It contains four independent amplifiers in BTL configuration (see Figure 1).
Through the I2C-bus, the diagnostic functions of temperature level and clip level are fully
programmable and the information to be shown on the two diagnostic pins can be
selected. The status of each amplifier (output offset, load or no load, short-circuit or
speaker incorrectly connected) can be read separately. The TDA8595 is protected against
overvoltage, short-circuit, over-temperature, open ground and open VP connections.
Three different I2C-bus addresses are selected with an external resistor connected to the
ADSEL pin. If the ADSEL pin is short-circuit to ground, the TDA8595 operates in legacy
mode. In this mode, no I2C-bus is needed and the function of the STB pin will change from
two level (Standby mode and On mode) to a three level pin (Standby mode, On mode and
mute).
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
7.1 Input stage
The input stage is a high-impedance pseudo-differential input stage. The negative inputs
of the four channels are combined on the ACGND pin. For the best performance on
supply voltage ripple rejection and pop noise, the capacitor connected to the ACGND pin
must be four times the value of the input capacitor (or as close to the value as possible).
7.2 Output stage
The output stage of each amplifier channel consists of two PMOS power transistors and
two NMOS transistors in BTL configuration. The process used is the BCDMOS process
with an isolated substrate, SOI process, which has almost no parasitic components and
therefore prevents latch-up.
7.3 Distortion (clip-) detection
If the output of the amplifier starts clipping to the supply voltage or to ground, the output
will become distorted. If the distortion per channel exceeds a selectable threshold (2 %,
5 % or 10 %), one of the two diagnostic pins (DIAG pin or STB pin) will be activated. To be
able to detect if, for instance, the front channels (channel 1 and channel 3) or rear
channels (channel 2 and channel 4) are clipping, the clip information can be directed per
channel to the DIAG pin or the STB pin. It is possible to have only the clip information on
the diagnostic pins by disabling the temperature and load information on the diagnostic
pin. In this mode the temperature and load protection are still functional but can only be
read via the I2C-bus.
7.4 Output protection and short-circuit operation
When a short-circuit to ground, VP or across the load occurs on one or more outputs of an
amplifier, only the amplifier with the short-circuit is switched off. The channel that has a
short-circuit and the type of short-circuit can be read-back via the I2C-bus. If the
diagnostic pin is enabled for load fault information (IB2[D4] = 0) the DIAG pin will be
pulled LOW. After 16 ms the amplifier will be switched on again and, if the short-circuit
conditions still occur, the amplifier will be switched off.
The 16 ms cycle will reduce the dissipation. To prevent audible distortion, the amplifier
channel with the short-circuit can be disabled via the I2C-bus.
7.5 SOAR protection
The output transistors are protected by Safe Operating ARea (SOAR) protection. The
TDA8595 has a two-stage SOAR protection:
• If the differential output voltage across the load is less than 1 V, and the current
through the load is more than 4 A, the amplifier channel will be switched off during
16 ms. To prevent incorrect switch-off with an inductive load or very high input signals,
the condition (Vo < 1 V and IL > 4 A) must exist for more than 300 s.
• If the differential output voltage across the load is more than 1 V, and the current
through the load is more than 8 A, the amplifier channel will be switched off during
16 ms.
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
7.6 Speaker protection
To prevent damage of the speaker when one side of the speaker is connected to ground,
a missing current protection is implemented. When in one channel the current in the high
side power is not equal to the current in the low side power, a fault condition is assumed
and the channel will be switched off. The speaker protection will be activated under the
following conditions:
• Vo < 1.75 V and Imissing(det) > 1 A during 80 s
• Vo > 1.75 V and Imissing(det) > 3 A during 80 s
7.7 Standby and mute operation
The function of the STB pin is different in legacy mode and I2C-bus mode.
7.7.1 I2C-bus mode
When the STB pin is LOW, the total quiescent current is low, and the I2C-bus lines will not
be loaded.
When the STB pin is switched HIGH the TDA8595 is put in operating condition and will
perform a power-on reset, which results in a LOW-level DIAG pin. The TDA8595 will start
up when instruction bit IB1[D0] is set. Bit D0 will also reset the ‘power-on reset occurred’
bit (DB2[D7]) and releases the DIAG pin.
The soft mute and soft mute can be activated via the I2C-bus. The soft mute can be
activated independently for the front channels (channel 1 and channel 3) and rear
channels (channel 2 and channel 4), and mutes the audio in 20 ms. The fast mute
activates the mute for all channels at the same time and mutes the audio in 0.1 ms.
Releasing the mute after a fast mute will be by a soft un-mute of approximately 20 ms.
When the STB pin is switched to Standby mode and the amplifier has started, first the fast
mute will be activated and then the amplifier will shut-down. For instance, during an
engine start, it is possible to fully mute the amplifiers within 100 s by switching the
STB pin to zero.
7.7.2 Legacy mode (pin ADSEL connected to ground)
The function of the STB pin will change from standby/operating to standby/mute/operating
and the amplifier will start directly when the STB is put into mute or operating. Mute
operating is controlled via an internal timer (20 ms) to minimize mute-on pops. When the
STB pin is switched directly from operating to standby, first the fast mute will be activated
(switching to mute within 100 s) and then the amplifier will shut-down.
7.8 Start-up and shut-down sequence
To prevent the amplifier producing switch-on or switch-off pop noise, the capacitor on the
SVR pin is used for smooth start-up and shut-down. Increasing the value of the SVR
capacitor will mean a longer start-up and shut-down time. The amplifier output voltage is
charged to half the supply voltage minus 1.4 V in mute condition, independent of the
I2C-bus mute settings in I2C-bus mode or pin STB voltage in legacy mode. The last 1.4 V,
where the output will reach half the supply voltage, is used to release the mute if the
I2C-bus bits (IB2[D2:D0] = 000) were set to mute-off (VSTB > 6.5 V in legacy mode), or will
stay in mute when the bits were set to mute (2.6 V < VSTB < 4.5 V in legacy mode).
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
When the amplifier is switched off by pulling the STB pin LOW, the amplifier is first muted
(fast mute) and then the capacitor on the SVR pin is discharged. With an SVR capacitor of
22 F the standby current is reached 1 second after the STB pin is switched to zero (see
Figure 4, Figure 5, Figure 6 and Figure 7).
The start-up and shut-down pop can be further decreased by activating the low pop mode.
When the low pop mode is enabled (IB2[D3] = 0), the output voltage rise from ground
level during start-up will be slower (see Figure 6). This will decrease the pop even more
but will increase the start-up time.
VP
DIAG
DB2 bit D7
POR
IB1 bit D0
start enable
twake
STB
SVR
toff
tamp_on
fast
mute
amplifier
output
td(mute_off)
Fig 4.
td(soft_mute)
td(fast_mute)
001aad168
Start-up and shut-down timing in I2C-bus mode
TDA8595
Product data sheet
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
VP
DIAG
DB2 bit D7
POR
IB1 bit D0
start enable
twake
STB
SVR
tload
tamp_on
toff
fast
mute
amplifier
output
td(mute_off)
Fig 5.
td(soft_mute)
td(fast_mute)
001aad169
Start-up and shut-down timing with DC load active in I2C-bus mode
TDA8595
Product data sheet
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
VP
DIAG
DB2 bit D7
POR
IB1 bit D0
start enable
twake
STB
SVR
tload
tamp_on
toff
fast
mute
amplifier
output
td(mute_off)
td(soft_mute)
td(fast_mute)
001aad170
Fig 6. Start-up and shut-down timing with low audible pop and DC load activated
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
VP
DIAG
on
STB
mute
standby
SVR
tamp_on
toff
soft
mute
fast
mute
amplifier
output
td(mute_off)
td(soft_mute)
td(mute_on)
td(fast_mute)
001aad171
Fig 7. Start-up and shut-down timing in legacy mode
7.9 Power-on reset and supply voltage spikes
If in I2C-bus mode the supply voltage drops below 5 V (see Figure 10) the content of the
I2C-bus latches cannot be guaranteed and the power-on reset will be activated. All latches
are reset, the amplifier is switched off and the DIAG pin is pulled LOW to indicate that a
power-on reset has occurred (see bit DB2[D7]). When bit IB1[D0] is set, the power-on flag
is reset, the DIAG pin will be released and the amplifier will start-up.
In legacy mode a supply voltage drop below 5 V will switch off the amplifier and the DIAG
pin will not be pulled LOW.
7.10 Engine start and low voltage operation
The DC output voltage of the amplifier (VO) is set to half of the supply voltage and is
related to the voltage on the SVR pin (see Figure 8; VO = VSVR  1.4 V). A capacitor is
connected on the SVR pin to suppress the ripple on the power supply.
If the supply voltage drops, for instance, during an engine start, the output follows slowly
due to the SVR capacitor. The headroom voltage is the voltage needed for good operation
of the amplifier and is defined as Vhr = VP  VO (see Figure 8). If the headroom voltage
becomes lower than the headroom protection threshold of 1.6 V, the headroom protection
is activated to prevent pop noise at the output. This protection first activates the hard mute
and then discharges the capacitors on the SVR and ACGND pins to generate more
headroom for the amplifier (see Figure 9.)
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
When the SVR capacitor has discharged, the amplifier starts up again if the VP voltage is
above the low VP mute threshold, typically 7.5 V. Below the low VP mute threshold, the
outputs of the amplifier remain low. In I2C-bus mode, a supply voltage drop below VP(reset),
typically 5 V, results in setting bit DB2[D7]. The amplifiers will not start-up but wait for an
I2C-bus command to start-up.
The amplifier prevents audio pops during engine start. To prevent pops on the output
caused by the application during an engine start (for instance tuner regulator out of
regulation), the STB pin can be made zero when an engine start is detected. The STB pin
activates the fast mute and disturbances at the amplifier inputs are suppressed.
V
(V)
14
VP
VSVR
Vhr (1)
8.4
7
VO (2)
1.6 V
headroom protection
threshold (3)
t (s)
001aad172
(1) Headroom voltage Vhr = VP  VO.
(2) Steady state output voltage VO = VSVR  1.4 V.
(3) Headroom protection threshold = VO + 1.6 V.
Fig 8. Low headroom protection
TDA8595
Product data sheet
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
VO
(V)
legacy and I2C-bus mode
VP
14.4
output
voltage
(1)
8.8
Vhr
8.6
(3)
(2)
7.2
VSVR
3.5
output voltage
(3)
t (s)
t(start-Vo(off))
t(start-SVRoff)
001aad173
(1) Headroom protection activated:
a) Fast mute
b) Discharge of SVR.
(2) Low VP mute activated.
(3) Low VP mute released.
Fig 9.
Low VP behavior; legacy and I2C-bus modes
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
VO
(V)
I2C-bus mode only
VP
14.4
8.8
8.6
(1)
7.2
(2)
5.0
3.5
VSVR
output voltage
0
POR
IB1 bit D0
DIAG
t (s)
001aad185
(1) Low VP mute activated.
(2) VPOR: VP level at which Power-On Reset (POR) is activated.
Fig 10. Low VP behavior; I2C-bus mode only
7.11 Overvoltage and load dump protection
When the battery voltage VP is higher than 22 V, the amplifier stage will be switched to
high-impedance. The TDA8595 is protected against load dump voltage with supply
voltage up to 50 V.
7.12 Thermal pre-warning and thermal protection
If the average junction temperature reaches a level that is adjustable via the I2C-bus,
selected with bit IB3[D4], the pre-warning will be activated resulting in a LOW-level on pin
DIAG (if selected) and can be read out via the I2C-bus. The default setting for the thermal
pre-warning is IB3[D4] = 0, setting the warning level at 145 C. In legacy mode the
thermal pre-warning is set at 145 C.
If the temperature increases further, the temperature controlled gain reduction will be
activated for all four channels to reduce the output power (see Figure 11). If this does not
reduce the average junction temperature, all four channels will be switched off at the
absolute maximum temperature Toff, typical 175 C.
TDA8595
Product data sheet
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
001aad174
30
Gv
(dB)
20
10
0
145
155
165
175
Tj (°C)
Fig 11. Temperature controlled amplifier gain
7.13 Diagnostics
Diagnostic information can be read via the I2C-bus, and can also be available on the
DIAG pin or on the STB pin. The DIAG pin has both fixed information (power-on reset
occurred, low battery and high battery) and, via the I2C-bus, selectable information
(temperature, load fault and clip). This information will be seen at the DIAG pin as a logic
OR. In case of a failure, the DIAG pin remains LOW and the microprocessor can read the
failure information via the I2C-bus (the DIAG pin can be used as microprocessor interrupt
to minimize I2C-bus traffic). When the failure is removed, the DIAG pin will be released.
To have full control over the clipping information, the STB pin can be programmed as a
second clip detection pin. The clip detection level can be selected for all channels at once.
It is possible to select whether the clip information is available on the DIAG pin or on the
STB pin, for each channel separately. It is, for instance, possible to distinguish between
clipping of the front and the rear channels.
Diagnostic information selection possibilities are shown in Table 4.
Table 4.
TDA8595
Product data sheet
Diagnostic information availability
Diagnostic
information
I2C-bus mode
Power-On Reset
(POR)
after power-on reset,
no
DIAG pin will remain
LOW until amplifier has
been started
no
Low battery
yes
no
yes
Clip detection
can be enabled per
channel
can be enabled per
channel
yes, fixed level for all
channels on 2 %
Temperature prewarning
can be enabled
no
yes, pre-warning level
is 145 C
Short
can be enabled
no
yes
DIAG pin
Legacy mode
STB pin
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DIAG pin
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 4.
Diagnostic information availability …continued
Diagnostic
information
I2C-bus mode
DIAG pin
STB pin
DIAG pin
Speaker protection
(missing current)
can be enabled
no
yes
Offset detection
no
no
no
Load detection
no
no
no
Overvoltage
yes
no
yes
Legacy mode
7.14 Offset detection
The offset detection can be performed with no input signal (for instance when the DSP is
in mute after a start-up) or with an input signal. In I2C-bus mode, if an I2C-bus read of the
output offset is performed, the I2C-bus latches DBx[D2] will be set. When the amplifier
BTL output voltage is within a window with threshold of 1.75 V typical, the latches DBx[D2]
are reset and setting is disabled. If, for instance, after one second an I2C-bus read is
performed again and the offset bits are still set, the output has not crossed the offset
threshold during the last second (see Figure 12). This can mean the applied frequency is
below 1 Hz (one second I2C-bus read interval) or an output offset of more than 1.75 V is
present.
I2C-bus mode only
VO = VOUT+ − VOUT−
offset
threshold
t
reset:
setting
disabled
t = 1 s:
read = no offset
DB1 bit D2 reset
VO = VOUT+ − VOUT−
offset
threshold
t
read = set bit
t = 1 s:
read = offset
DB1 bit D2 set
001aad175
Fig 12. Offset detection
7.15 DC load detection
When the DC load detection is enabled with bit IB1[D1], an offset is slowly applied at the
output of the amplifiers during the start-up cycle and the load currents are measured.
Different load levels will be detected to differentiate between normal load, line driver load
or open load (see Figure 13).
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
NORMAL
LOAD
DETECTION
LEVEL
LINE DRIVER MODE
20 Ω
100 Ω
800 Ω
OPEN-CIRCUIT
5 kΩ
001aad176
Fig 13. DC load detection levels
If the amplifier is used as line driver and the external booster has an input impedance of
more than 100  and less than 800  (DC-coupled), the DC load bits will contain
DBx[D5:D4] = 10, independent of the gain setting (see Table 5).
Table 5.
DC load detection
DC load bits
Meaning (when IB1[D2] = 0)
DBx[D5]
DBx[D4]
0
0
normal load
1
0
line driver load
1
1
open load
0
1
not valid
By reading the I2C-bus bits the microprocessor can determine, after the start-up of the
amplifier, whether a speaker or an external booster is connected.
Depending on these bits, the amplifier gain can be selected, 26 dB for normal mode or
16 dB for line driver mode. If the gain select is performed when the amplifier is muted, the
gain select will be pop free.
The DC load bits are combined with the AC load bits and are only valid when the AC load
detection is disabled. When the AC load detection is enabled (IB1[D2] = 1), the bits
DBx[D4] will show the content of the AC load detection. When the AC load detection is
disabled again, bit DBx[D4] will show the content of the DC load measurement, which was
stored during the AC load measurement. The AC load detection can only be performed
after the amplifier has completed its start-up cycle and will not conflict with the DC load
detection.
7.16 AC load detection
The AC load detection, enabled with IB1[D2] = 1, is used to detect if AC coupled
speakers, for example tweeters, are connected correctly during assembly. The detection
is audible because a sine wave of a certain frequency (e.g. 19 kHz) needs to be applied to
the inputs of the amplifier. The output voltage over the load impedance will generate an
amplifier current. If the amplifier peak current triggers a 460 mA (peak) threshold detector
three times, the AC load detection bit will be set. A three ‘threshold cross’ counter is used
to prevent false AC load detection when switching the input signal on or off.
An AC coupled speaker will reduce the impedance at the output of the amplifier in a
certain frequency band. The presence of an AC coupled speaker can be determined using
460 mA (peak) and 230 mA (peak) threshold current detection. For instance, at an output
voltage of 2 V (peak) the total impedance must be less than 4  to detect the AC coupled
load, or more than 8  to guarantee only a DC connection is detected.
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
The interpretation of line driver and normal mode DC load bit setting for AC load detection
is shown in Table 6.
Table 6.
AC load detection
DBx[D4]
Meaning (when IB1[D2] = 1)
0
no AC load detected
1
AC load detected
When bit IB1[D2] = 1, the AC load detection is enabled. The AC load detection can only
be performed after the amplifier has completed its start-up cycle and will not conflict with
the DC load detection.
001aad177
20
|Zth(load)|
(Ω)
16
(1)
12
8
(2)
4
0
0
1
2
3
4
5
VoM (V)
(1) IoM < 230 mA (no load detection level)
(2) IoM > 460 mA (load detection level)
Fig 14. AC load impedance as a function of peak output voltage
7.17 I2C-bus diagnostic readout
The diagnostic information of the amplifier can be read via the I2C-bus. The I2C-bus bits
are set on a failure and will be reset with the I2C-bus read command. Even when the
failure is removed, the microprocessor will know what was wrong by reading the I2C-bus.
The consequence of this procedure is that old information is read during the I2C-bus
readout. Most actual information will be gathered after two successive read commands.
The DIAG pin will give actual diagnostic information (when selected). When a failure is
removed, the DIAG pin will be released instantly, independently of the I2C-bus latches.
TDA8595
Product data sheet
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
8. I2C-bus specification
Table 7.
TDA8595 hardware address select
Pin ADSEL
A6
A5
A4
A3
A2
A1
A0
R/W
Open
1
1
0
1
1
0
0
0 = write to TDA8595
1 = read from TDA8595
51 k to ground
1
1
0
1
1
0
1
0 = write to TDA8595
1 = read from TDA8595
10 k to ground
1
1
0
1
1
1
1
0 = write to TDA8595
1 = read from TDA8595
Ground
no
I2C-bus;
legacy mode
SDA
SCL
S
P
START condition
STOP condition
mba608
Fig 15. Definition of START and STOP conditions
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 16. Bit transfer
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
I2C-BUS WRITE
SCL
1
SDA
MSB
2
7
MSB − 1
S
8
LSB + 1
ADDRESS
9
ACK
1
MSB
2
MSB − 1
A
W
7
LSB + 1
8
LSB
9
ACK
A
WRITE DATA
P
To stop the transfer, after the last acknowledge (A)
a STOP condition (P) must be generated
I2C-BUS READ
SCL
1
SDA
MSB
2
7
MSB − 1
S
8
LSB + 1
9
ACK
R
ADDRESS
1
MSB
2
7
MSB − 1
A
LSB + 1
READ DATA
: generated by slave
: START
P
: STOP
A
: acknowledge
NA
: not acknowledge
R/W
: read / write
LSB
9
ACK
NA
P
To stop the transfer, the last byte must not be acknowledged
and a STOP condition (P) must be generated
: generated by master (microcontroller)
S
8
001aac649
Fig 17. I2C-bus read and write modes
8.1 Instruction bytes
I2C-bus mode:
• If R/W bit = 0, the TDA8595 expects three instruction bytes; IB1, IB2 and IB3
• After a power-on reset, all instruction bits are set to zero
Legacy mode:
• All bits equal to zero define the setting, with the exception of bit IB1[D0] which is
ignored (see Table 8).
Table 8.
Instruction byte IB1
Bit
Description
D7
don’t care
D6
channel 3 clip information on DIAG or STB pin
0 = clip information on DIAG pin
1 = clip information on STB pin
D5
channel 1 clip information on DIAG or STB pin
0 = clip information on DIAG pin
1 = clip information on STB pin
TDA8595
Product data sheet
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I2C-bus controlled 4  45 W power amplifier
Table 8.
Instruction byte IB1 …continued
Bit
Description
D4
channel 4 clip information on DIAG or STB pin
0 = clip information on DIAG pin
1 = clip information on STB pin
D3
channel 2 clip information on DIAG or STB pin
0 = clip information on DIAG pin
1 = clip information on STB pin
D2
AC load detection enable:
0 = AC load detection disabled
1 = AC load detection enabled; bit DBx[D4] not available for DC load detection
D1
DC load detection enable:
0 = DC load detection disabled
1 = DC load detection enabled
D0
amplifier start enable
0 = amplifier not enabled, DIAG pin will remain LOW
1 = amplifier will start up, power-on occurred (DB2[D7] will be reset) and DIAG
pin will be released
Table 9.
Instruction byte IB2
Bit
Description
D7 and D6
clip detection level
00 = clip detection level 2 %
01 = clip detection level 5 %
10 = clip detection level 10 %
11 = clip detection level disabled
D5
temperature information on DIAG pin
0 = temperature information on DIAG pin
1 = no temperature information on DIAG pin
D4
load fault information (shorts, missing current) on DIAG pin
0 = fault information on DIAG pin
1 = no fault information on DIAG pin
D3
low pop (slow start) enable
0 = low pop enabled
1 = low pop disabled
D2
soft mute channel 1 and channel 3 (mute delay 20 ms)
0 = no mute
1 = mute
D1
soft mute channel 2 and channel 4 (mute delay 20 ms)
0 = no mute
1 = mute
TDA8595
Product data sheet
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NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 9.
Instruction byte IB2 …continued
Bit
Description
D0
fast mute all amplifier channels (mute delay 100 s)
0 = no mute
1 = mute
Table 10.
Instruction byte IB3
Bit
Description
D7
don’t care
D6
amplifier channel 1 and channel 3 gain select
0 = 26 dB
1 = 16 dB
D5
amplifier channel 2 and channel 4 gain select
0 = 26 dB
1 = 16 dB
D4
temperature pre-warning level
0 = warning level on 145 C
1 = warning level on 122 C
D3
disable channel 3
0 = channel 3 enabled
1 = channel 3 disabled
D2
disable channel 1
0 = channel 1 enabled
1 = channel 1 disabled
D1
disable channel 4
0 = channel 4 enabled
1 = channel 4 disabled
D0
disable channel 2
0 = channel 2 enabled
1 = channel 2 disabled
8.2 Data bytes
I2C-bus mode:
• If R/W = 1, the TDA8595 sends four data bytes to the microprocessor: DB1, DB2,
DB3 and DB4
• All bits except DB1[D7] and DB3[D7] are latched
• All bits except DBx[D4] and DBx[D5] are reset after a read operation. Bit DBx[D2] is
set after a read operation, see Section 7.14
• For explanation of AC and DC load detection bits, see Section 7.15 and Section 7.16
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 11.
Data byte DB1
Bit
Description
D7
temperature pre-warning
0 = no warning
1 = junction temperature too high
D6
speaker fault channel 2 (missing current)
0 = no missing current
1 = missing current
D5 and D4
channel 2 DC load or AC load detection
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 is don’t care, bit D4 has the
following meaning
0 = no AC load
1 = AC load detected
if bit IB1[D2] = 0, AC load detection is disabled, bits D5 and D4 are available for
DC load detection
00 = normal load
01 = not valid
10 = line driver load
11 = open load
D3
channel 2 shorted load
0 = not shorted load
1 = shorted load
D2
channel 2 output offset
0 = no output offset
1 = output offset
D1
channel 2 short to VP
0 = no short to VP
1 = short to VP
D0
channel 2 short to ground
0 = no short to ground
1 = short to ground
Table 12.
Data byte DB2
Bit
Description
D7
power-on reset and amplifier status
0 = amplifier on
1 = power-on reset has occurred; amplifier off
D6
speaker fault channel 4 (missing current)
0 = no missing current
1 = missing current
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 12.
Data byte DB2 …continued
Bit
Description
D5 and D4
channel 4 DC load or AC load detection
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 is don’t care, bit D4 has the
following meaning
0 = no AC load
1 = AC load detected
if bit IB1[D2] = 0, AC load detection is disabled, bits D5 and D4 are available for
DC load detection
00 = normal load
01 = not valid
10 = line driver load
11 = open load
D3
channel 4 shorted load
0 = not shorted load
1 = shorted load
D2
channel 4 output offset
0 = no output offset
1 = output offset
D1
channel 4 short to VP
0 = no short to VP
1 = short to VP
D0
channel 4 short to ground
0 = no short to ground
1 = short to ground
Table 13.
Data byte DB3
Bit
Description
D7
maximum temperature protection
0 = no protection
1 = maximum temperature protection
D6
speaker fault channel 1 (missing current)
0 = no missing current
1 = missing current
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 13.
Data byte DB3 …continued
Bit
Description
D5 and D4
channel 1 DC load or AC load detection
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 is don’t care, bit D4 has the
following meaning
0 = no AC load
1 = AC load detected
if bit IB1[D2] = 0, AC load detection is disabled, bits D5 and D4 are available for
DC load detection
00 = normal load
01 = not valid
10 = line driver load
11 = open load
D3
channel 1 shorted load
0 = not shorted load
1 = shorted load
D2
channel 1 output offset
0 = no output offset
1 = output offset
D1
channel 1 short to VP
0 = no short to VP
1 = short to VP
D0
channel 1 short to ground
0 = no short to ground
1 = short to ground
Table 14.
Data byte DB4
Bit
Description
D7
reserved
D6
speaker fault channel 3 (missing current)
0 = no missing current
1 = missing current
D5 and D4
channel 3 DC load or AC load detection
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 is don’t care, bit D4 has the
following meaning
0 = no AC load
1 = AC load detected
if bit IB1[D2] = 0, AC load detection is disabled, bits D5 and D4 are available for
DC load detection
00 = normal load
01 = not valid
10 = line driver load
11 = open load
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 14.
Data byte DB4 …continued
Bit
Description
D3
channel 3 shorted load
0 = not shorted load
1 = shorted load
D2
channel 3 output offset
0 = no output offset
1 = output offset
D1
channel 3 short to VP
0 = no short to VP
1 = short to VP
D0
channel 3 short to ground
0 = no short to ground
1 = short to ground
9. Limiting values
Table 15. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
TDA8595
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VP
supply voltage
operating
-
18
V
non operating
1
+50
V
load dump protection;
duration 50 ms, rise
time > 2.5 ms
-
50
V
10 minutes maximum
VP(r)
reverse supply voltage
-
2
V
IOSM
non-repetitive peak
output current
-
13
A
IORM
repetitive peak output
current
-
8
A
Tj(max)
maximum junction
temperature
-
150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
V(prot)
protection voltage
Vx
voltage on pin x
40
+105
C
-
VP
V
SCL and SDA
0
6.5
V
IN1, IN2, IN3, IN4,
SVR, ACGND and
DIAG
0
13
V
STB
0
24
V
AC and DC short-circuit
voltage of output pins and
across the load
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
Table 15. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Ptot
total power dissipation
Tcase = 70 C
-
80
W
Vesd
electrostatic discharge
voltage
human body model;
C = 100 pF; Rs = 1.5 k
-
2000
V
machine model;
C = 200 pF; Rs = 10 ;
Ls = 0.75 H
-
200
V
10. Thermal characteristics
Table 16.
Symbol
Thermal characteristics
Parameter
Conditions
Typ
Unit
TDA8595J; TDA8595SD
Rth(j-c)
thermal resistance from junction to case
1
K/W
Rth(j-a)
thermal resistance from junction to ambient in free air
40
K/W
TDA8595TH
Rth(j-c)
thermal resistance from junction to case
1
K/W
Rth(j-a)
thermal resistance from junction to ambient in free air
40
K/W
11. Characteristics
Table 17. Characteristics
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise
specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to +105 C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
8
14.4
18
V
Supply voltage behavior
VP
supply voltage
RL = 4 
RL = 2 
[1]
8
14.4
16
V
Iq
quiescent current
no load
-
270
400
mA
Istb
standby current
VSTB = 0.4 V
-
4
15
A
VO
output voltage
6.7
7
7.2
V
VP(low)(mute)
low supply voltage mute
with rising supply voltage
6.9
7.5
8
V
with falling supply voltage
6.3
6.8
7.4
V
VP(low)(mute)
low supply voltage mute
hysteresis
0.1
0.7
1
V
Vth(ovp)
overvoltage protection
threshold voltage
18
20
22
V
Vhr
headroom voltage
1.1
1.6
2.0
V
VPOR
power-on reset voltage
see Figure 9
4.1
5.0
5.8
V
VO(offset)
output offset voltage
amplifier on
95
0
+95
mV
amplifier mute
25
0
+25
mV
line driver mode
40
0
+40
mV
TDA8595
Product data sheet
when headroom protection is
activated; see Figure 8
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TDA8595
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I2C-bus controlled 4  45 W power amplifier
Table 17. Characteristics …continued
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise
specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to +105 C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RL(tol)
load resistance tolerance
VP  18 V
3.2
4
-

VP  16 V
1.6
2
-

I2C-bus mode
-
-
1
V
legacy mode
-
-
1
V
2.5
-
4.5
V
I2C-bus mode
2.5
-
VP
V
legacy mode
6.5
-
VP
V
ISTB = 150 A
5.6
-
6.1
V
ISTB = 500 A
6.1
-
7.2
V
clip detection not active;
I2C-bus mode
-
4
30
A
legacy mode
-
10
70
A
-
300
500
s
-
-
10
A
I2C-bus mode;
with ILO = 10 A  +15 ms;
no DC load (IB1[D1] = 0);
low pop disabled (IB2[D3] = 1);
see Figure 4
295
465
795
ms
I2C-bus mode;
with ILO = 10 A  +20 ms;
DC load active (IB1[D1] = 1);
low pop disabled (IB2[D3] = 1);
see Figure 5
500
640
940
ms
I2C-bus mode;
with ILO = 10 A  +20 ms;
DC load active (IB1[D1] = 1);
low pop enabled (IB2[D3] = 0);
see Figure 6
640
830
1190
ms
legacy mode;
with ILO = 10 A  +20 ms;
VSTB = 7 V; RADSEL = 0 ;
see Figure 7
430
650
1030
ms
Mode select and second clip detection: pin STB
VSTB
voltage on pin STB
Standby mode selected
mute selected
legacy mode
Operating mode selected
low voltage on pin STB when
pulled down during clipping
ISTB
current on pin STB
[2]
VSTB from 0 V to 8.5 V
Start-up / shut-down / mute timing
twake
wake-up time
ILO(SVR)
output leakage current on
pin SVR
td(mute_off)
mute off delay time
TDA8595
Product data sheet
time after wake-up via STB pin
before first I2C-bus transmission
is recognized; see Figure 4
10 % of output signal; ILO = 0 A
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Rev. 5 — 11 June 2013
[3]
© NXP B.V. 2013. All rights reserved.
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 17. Characteristics …continued
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise
specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to +105 C.
Symbol
tamp_on
toff
Parameter
amplifier on time
amplifier switch-off time
Conditions
Min
Typ
Max
Unit
I2C-bus mode;
with ILO = 10 A  +30 ms;
no DC load (IB1[D1] = 0);
low pop disabled (IB2[D3] = 1);
see Figure 4
360
520
870
ms
I2C-bus mode;
with ILO = 10 A  +35 ms;
DC load active (IB1[D1] = 1);
low pop disabled (IB2[D3] = 1);
see Figure 5
565
695
1015
ms
I2C-bus mode;
with ILO = 10 A  +30 ms;
DC load active (IB1[D1] = 1);
low pop enabled (IB2[D3] = 0);
see Figure 6
710
890
1270
ms
legacy mode;
with ILO = 10 A  +20 ms;
VSTB = 7 V; RADSEL = 0 ;
see Figure 7
510
720
1120
ms
low pop disabled (IB2[D3] = 1);
with ILO = 10 A  +0 ms;
see Figure 5
120
245
530
ms
low pop enabled (IB2[D3] = 0);
with ILO = 10 A  +0 ms;
see Figure 6
140
280
620
ms
time from amplifier mute to
amplifier on; 90 % of output
signal; ILO = 0 A
time to DC output voltage < 0.1 V;
I2C-bus mode; ILO = 0 A
[3]
[3]
td(mute-on)
mute to on delay time
from 10 % to 90 % of output
signal; IB2[D1/D2] = 1 to 0;
Vi = 50 mV; see Figure 7
-
20
40
ms
td(soft_mute)
soft mute delay time
from 90 % to 10 % of output
signal; Vi = 50 mV;
IB2[D1/D2] = 0 to 1; see Figure 7
-
20
40
ms
td(fast_mute)
fast mute delay time
from 90 % to 10 % of output
signal; VSTB from 8 V to 1.3 V;
see Figure 7
-
0.1
1
ms
t(start-Vo(off))
engine start to output off
time
VP from 14.4 V to 7 V; Vo < 0.5 V;
see Figure 9
-
0.1
1
ms
t(start-SVRoff)
engine start to SVR off time VP from 14.4 V to 7 V;
VSVR < 2 V; see Figure 9
-
40
75
ms
-
-
1.5
V
5.5
V
-
0.4
V
I2C-bus interface[4]
VIL
LOW-level input voltage
pins SCL and SDA
VIH
HIGH-level input voltage
pins SCL and SDA
2.3
VOL
LOW-level output voltage
pin SDA; IL = 5 mA
-
TDA8595
Product data sheet
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30 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 17. Characteristics …continued
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise
specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to +105 C.
Symbol
Parameter
fSCL
SCL clock frequency
Conditions
Min
Typ
Max
Unit
-
400
-
kHz
I2C-bus
address
A[6:0] = 110 1100
155
-
-
k
I2C-bus address
A[6:0] = 110 1101
42
51
57
k
I2C-bus address
A[6:0] = 110 1111
7
10
15
k
legacy mode
-
-
0.5
k
fault condition; IDIAG = 1 mA
-
-
0.3
V
1.5
1.75
2.2
V
IB2[D7:D6] = 10
5
10
16
%
IB2[D7:D6] = 01
3
5
7
%
IB2[D7:D6] = 00
1
2
3
%
total harmonic distortion
clip detection level
variation
between IB2[D7:D6] = 10 and
IB2[D7:D6] = 01
1
4
9
%
between IB2[D7:D6] = 01 and
IB2[D7:D6] = 00
1
3.5
6
%
Tj(AV)(pwarn)
pre-warning average
junction temperature
IB3[D4] = 0
135
145
155
C
IB3[D4] = 1
112
122
132
C
Tj(AV)(G(0.5dB))
average junction
Vi = 0.05 V
temperature for 0.5 dB gain
reduction
150
155
160
C
Tj(pw-G(0.5dB)) prewarning to 0.5 dB gain
reduction junction
temperature difference
7
10
13
C
Tj(G(0.5dB)-off) difference in junction
temperature between
0.5 dB gain reduction and
off
10
15
20
C
-
20
-
dB
normal load detection
-
-
20

line driver load detection
100
-
800

5000
-
-

AC load bit is set
460
-
-
mA
AC load bit is not set
-
-
230
mA
RADSEL
resistance on pin ADSEL
Diagnostic
VOL(DIAG)
LOW-level output voltage
on pin DIAG
VO(offset_det)
output voltage at offset
detection
THDclip
total harmonic distortion
clip detection level
THDclip
G(th_fold)
gain reduction of thermal
foldback
all channels will switch off
Zth(load)
load detection threshold
impedance
I2C-bus mode
Zth(open)
open load detection
threshold impedance
I2C-bus
Ith(o)det(load)AC
AC load detection output
threshold current
I2C-bus mode
TDA8595
Product data sheet
mode
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 17. Characteristics …continued
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise
specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to +105 C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
output power
RL = 4 ; VP = 14.4 V;
THD = 0.5 %
18
20
-
W
RL = 4 ; VP = 14.4 V;
THD = 10 %
23
25
-
W
RL = 4 ; VP = 14.4 V; maximum
power; Vi = 2 V (RMS) square
wave
37
40
-
W
RL = 4 ; VP = 15.2 V; maximum
power; Vi = 2 V (RMS) square
wave
41
45
-
W
RL = 2 ; VP = 14.4 V;
THD = 0.5 %
29
32
-
W
RL = 2 ; VP = 14.4 V;
THD = 10 %
37
41
-
W
RL = 2 ; VP = 14.4 V; maximum
power; Vi = 2 V (RMS) square
wave
58
64
-
W
Po = 1 W to 12 W; f = 1 kHz;
RL = 4 
-
0.01
0.1
%
Po = 1 W to 12 W; f = 10 kHz
-
0.09
0.3
%
Amplifier
Po
THD
cs
total harmonic distortion
channel separation
Po = 1 W to 12 W; f = 20 kHz
-
0.14
0.4
%
line driver mode; Vo = 1 V (RMS)
and 5 V (RMS),
f = 20 Hz to 20 kHz; complex
load; see Figure 32
-
0.02
0.05
%
f = 1 kHz; RS = 1 k;
RACGND = 250 
[5]
65
80
-
dB
f = 10 kHz; RS = 1 k;
RACGND = 250 
[5]
60
65
-
dB
SVRR
supply voltage ripple
rejection
100 Hz to 10 kHz; RS = 1 k;
RACGND = 250 
[5]
55
70
-
dB
CMRR
common mode rejection
ratio
normal mode; Vcm = 0.3 V (p-p);
f = 1 kHz to 3 kHz, RS = 1 k;
RACGND = 250 
[5]
45
65
-
dB
Vcm(max)(rms)
maximum common mode
voltage (RMS value)
f = 1 kHz
-
-
0.6
V
Vn(o)
output noise voltage
filter 20 Hz to 22 kHz; RS = 1 k
mute mode
-
19
26
V
line driver mode
-
22
29
V
normal mode
-
45
65
V
normal mode
25.5
26
26.5
dB
line driver mode
15.5
16
16.5
dB
Gv
voltage gain
TDA8595
Product data sheet
single ended in; differential out
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Table 17. Characteristics …continued
Refer to test circuit (see Figure 30) at VP = VP1 = VP2 = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise
specified. Tested at Tamb = 25 C; guaranteed for Tamb = 40 C to +105 C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Zi
input impedance
Tamb = 40 C to +105 C
50
70
95
k
Tamb = 0 C to 105 C
60
70
95
k
mute
mute attenuation
Vo / Vo(mute); Vi = 50 mV
80
92
-
dB
Vo(mute)(RMS)
RMS mute output voltage
Vi = 1 V (RMS);
filter 20 Hz to 22 kHz
-
25
-
V
Bp
power bandwidth
1 dB
-
20 to
20000
-
Hz
[1]
Operation above 16 V in a 2  mode with reactive load can trigger the amplifier protection. The amplifier switches off and will restart
after 16 ms resulting in an ‘audio hole’.
[2]
VSTB depends on the current into the STB pin: minimum = (1429   ISTB) + 5.4 V, maximum = (3143   ISTB) + 5.6 V.
[3]
The times are specified without leakage current. For a leakage current of 10 A on the SVR pin, the delta time is specified. If the
capacitor value on the SVR pin changes with  30 %, the specified time will also change with  30 %. The specified times include an
ESR of 15  for the capacitor on the SVR pin.
[4]
Standard I2C-bus specification: maximum LOW-level = 0.3  VDD, minimum HIGH-level = 0.7  VDD. To comply with 5 V and 3.3 V logic
the maximal LOW-level is defined by VDD = 5 V and the minimum HIGH-level by VDD = 3.3 V.
[5]
For optimum channel separation (cs), supply voltage ripple rejection (SVRR) and common mode rejection ratio (CMRR), a resistor
RS
R ACGND = ------  should be in series with the ACGND capacitor.
4
12. Performance diagrams
001aad139
102
THD
(%)
10
1
10−1
(1)
10−2
(2)
(3)
10−3
10−2
10−1
1
102
10
Po (W)
VP = 14.4 V.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
Fig 18. Total harmonic distortion as a function of output power; 4  load
TDA8595
Product data sheet
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TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
001aad140
102
THD
(%)
10
1
(1)
10−1
(2)
(3)
10−2
10−3
10−2
10−1
1
102
10
Po (W)
VP = 14.4 V.
(1) f = 10 kHz.
(2) f = 100 Hz.
(3) f = 1 kHz.
Fig 19. Total harmonic distortion as a function of output power; 2  load
001aad141
28
(1)
Po
(W)
26
24
22
(2)
20
18
10−2
10−1
1
102
10
f (kHz)
VP = 14.4 V.
(1) THD = 10 %.
(2) THD = 0.5 %.
Fig 20. Output power as a function of frequency; 4  load
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
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34 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
001aad142
55
Po
(W)
45
(1)
35
(2)
25
10−2
10−1
1
102
10
f (kHz)
VP = 14.4 V.
(1) THD = 10 %.
(2) THD = 0.5 %.
Fig 21. Output power as a function of frequency; 2  load
001aad143
60
Po
(W)
(1)
40
(2)
(3)
20
0
5
10
15
20
VP (V)
f = 1 kHz.
(1) Po(max).
(2) THD = 10 %.
(3) THD = 0.5 %.
Fig 22. Output power as a function of supply voltage; 4  load
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
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35 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
001aad144
100
Po
(W)
80
(1)
60
(2)
40
(3)
20
0
5
10
15
20
VP (V)
f = 1 kHz.
(1) Po(max).
(2) THD = 10 %.
(3) THD = 0.5 %.
Fig 23. Output power as a function of supply voltage; 2  load
001aad145
1
THD
(%)
10−1
10−2
(1)
(2)
10−3
10−2
10−1
1
102
10
f (kHz)
VP = 14.4 V; RL = 4 .
(1) Po = 1 W.
(2) Po = 10 W.
Fig 24. Total harmonic distortion as a function of frequency; normal mode
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
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36 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
001aad146
10−1
THD
(%)
10−2
(1)
(2)
10−3
10−2
10−1
1
102
10
f (kHz)
VP = 14.4 V; RL = 600 .
(1) Vo = 1 V.
(2) Vo = 5 V.
Fig 25. Total harmonic distortion as a function of frequency; line driver mode
001aad147
−40
SVRR
(dB)
−50
−60
−70
−80
−90
10−2
10−1
1
102
10
f (kHz)
VP = 14.4 V; RL = 4 ; RS = 1 k; Vripple = 2 V (p-p).
Fig 26. Supply voltage ripple rejection as a function of frequency
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
37 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
001aad148
100
αcs
(dB)
90
80
70
60
50
10−2
10−1
1
102
10
f (kHz)
VP = 14.4 V; RL = 4 ; RS = 1 k; Po = 1 W.
Fig 27. Channel separation as a function of frequency
001aad711
50
P
(W)
40
30
20
10
0
0
10
20
30
40
Po (W)
VP = 14.4 V; RL = 4 ; f = 1 kHz.
Fig 28. Power dissipation as a function of output power; 4  load
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
38 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
001aad712
100
P
(W)
80
60
40
20
0
0
20
40
60
80
Po (W)
VP = 14.4 V; RL = 2 ; f = 1 kHz.
Fig 29. Power dissipation as a function of output power; 2  load
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
39 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
13. Application information
8.5 V
(2)
RADSEL
SDA
5V
VP2
VP1
SCL
ADSEL
1 (28) 26 (26) 23 (22)
21 (20, 21)
7 (34, 35)
10 kΩ
5 (33) DIAG
STB 2 (29)
I2C-BUS
INTERFACE
STANDBY/
FAST MUTE
CLIP DETECT/DIAGNOSTIC
(4)
RS
470 nF
MUTE
IN1 12 (6)
(1)
1.8 nF
RS
470 nF
RS
MUTE
IN3 16 (12)
470 nF
8 (2) OUT1−
(4)
18 (14) OUT3+
26 dB/
16 dB
20 (17) OUT3−
PROTECTION/
DIAGNOSTIC
IN2 13 (7)
MUTE
(1)
1.8 nF
RS
26 dB/
16 dB
PROTECTION/
DIAGNOSTIC
(1)
1.8 nF
470 nF
10 (4) OUT1+
(4)
6 (30) OUT2+
26 dB/
16 dB
4 (32) OUT2−
PROTECTION/
DIAGNOSTIC
IN4 15 (11)
(1)
1.8 nF
MUTE
VP
26 dB/
16 dB
24 (23) OUT4−
PROTECTION/
DIAGNOSTIC
TDA8595J
TDA8595SD
(TDA8595TH)
27 (36) TAB
11 (5)
14 (9)
17 (13)
SVR
SGND
ACGND
(2)
22 μF
(4)
22 (25) OUT4+
9 (3)
PGND1
3 (31)
PGND2
19 (16)
PGND3
25 (24)
PGND4
(3) (2)
2.2 μF
001aad149
The pin numbers in parenthesis represent TDA8595TH.
(1) For EMC reasons a capacitor of 1.8 nF from the input pin to the SGND is advised (optional).
(2) The SVR and ACGND capacitors and the RADSEL resistor should first be connected to SGND before connecting to PGND.
(3) ACGND capacitor value must be close to 4  input capacitor value. 4  470 nF capacitors can be used as an alternative to the
2.2 F capacitor shown.
(4) For EMC reasons, a 10 nF capacitor can be added from each amplifier output to ground.
Fig 30. Test and application information
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
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40 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
ACGND 17
(13) TDA8595
1 μF
0.22 μF
1.7 kΩ
MICROCONTROLLER
100 Ω
47 pF
001aad150
The pin number in parenthesis represents TDA8595TH.
Fig 31. Beep input circuit (gain = 0 dB) to apply a microcontroller beep signal to all four
amplifiers
positive output
180 pF
a)
47 kΩ
negative output
3.9 nF
3.9 nF
47 kΩ
positive output
200 Ω
180 pF
b)
negative output
3.9 nF
3.9 nF
001aad134
Fig 32. Complex loads for measuring THD in line driver mode
8.5 V
5.6 kΩ
4.7 kΩ
18 kΩ
3.3 V
MICROCONTROLLER
2 STB
TDA8595 (29)
switch
10 kΩ
001aad152
The pin number in parenthesis represents TDA8595TH.
Fig 33. Circuit for combined STB and clip detection functions on pin STB
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
41 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
13.1 PCB layout
top
001aad162
Fig 34. PCB layout of test and application circuit for TDA8595J or TDA8595SD; copper
layer top
tob
001aad163
Fig 35. PCB layout of test and application circuit for TDA8595J or TDA8595SD; copper
layer bottom (top view)
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
42 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Sense
GND
address
select
top
TDA8594/TDA8595
VP
2200 μF
D8 (00)
DA (01)
clip 2
+
12C
supply
1 μF
Philips Semiconductors
DE (11)
+
2.2 μF
+
mode on
+
2.2 μF
+
10 μF
D1
470 nF
470 nF
diag s. by
12C
on
GND
VP
Mute
−4+
−3+
+1−
OUT
off
+2−
+ 5V
SGND
10 kΩ
Legacy
3
4
DZ 8.2 V
IN
SCL
GND
OUT
2
SDA
1
001aad164
Fig 36. PCB layout of test and application circuit for TDA8595J or TDA8595SD;
components top
tob
220 nF
10 kΩ
220 nF
BC859
TDA3664
2 kΩ
10 kΩ
12 kΩ
4 × 470 nF
51 kΩ
250
Ω
4.7 kΩ
18 kΩ
470 nF
22 kΩ
470 nF
001aad165
Fig 37. PCB layout of test and application circuit for TDA8595J or TDA8595SD;
components bottom (top view)
14. Test information
14.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
TDA8595
Product data sheet
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Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
43 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
15. Package outline
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm)
SOT827-1
non-concave
x
Dh
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L4
L3
L
1
L2
27
e1
Z
w
bp
e
c
Q
v
e2
m
0
10
20 mm
x
Z(1)
scale
1.8
0.03
1.2
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A
A2
bp
c
4.6
0.60
0.5
D(1)
d
Dh
29.2 24.8
19
E(1)
0.45
0.3
e1
e2
Eh
j
L
2
1
4
8
3.55
3.40
3.25
6.8
15.9
12
4.4
e
28.8 24.4
15.5
L2
3.9
L3
L4
1.15 22.9
References
IEC
JEDEC
JEITA
Q
3.1
0.85 22.1
v
w
0.6
0.25
2.1
4
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Outline
version
m
1.8
sot827-1_po
European
projection
Issue date
13-02-13
13-05-30
SOT827-1
Fig 38. Package outline SOT827-1 (DBS27P)
TDA8595
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
44 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height
SOT851-2
D
E
A
x
c
y
X
E2
v
HE
M
A
D1
D2
1
18
pin 1 index
Q
A
A2
E1
(A 3)
A4
θ
Lp
detail X
36
19
z
w
bp
e
M
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT max. A2
mm
3.5
A3
A4(1)
+0.08
3.5
0.35
−0.04
3.2
D1
D2
E (2)
E1
E2
e
HE
Lp
Q
0.38 0.32 16.0 13.0
0.25 0.23 15.8 12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
0.65
14.5
13.9
1.1
0.8
1.7
1.5
bp
c
D (2)
v
w
x
y
0.25 0.12 0.03 0.07
Z
θ
2.55
2.20
8°
0°
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
SOT851-2
EUROPEAN
PROJECTION
ISSUE DATE
04-05-04
Fig 39. Package outline SOT851-2 (HSOP36)
TDA8595
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
45 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
RDBS27P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm)
SOT878-1
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L
1
27
c
e1
Z
e
e2
Q
w
bp
v
L1
0
10
20 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
max
nom 13.5
min
A2
bp
c
4.6
0.60
0.5
D(1)
d
Dh
29.2 24.8
E(1)
0.45
0.3
e1
e2
Eh
2
1
2.54
8
15.9
12
4.4
e
28.8 24.4
15.5
j
L
L1
3.55 3.75 3.75
3.40
3.25 3.15 3.15
Q
v
References
IEC
JEDEC
JEITA
Z(1)
x
2.1
1.8
0.6
1.8
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Outline
version
w
0.25 0.03
1.2
sot878-1_po
European
projection
Issue date
12-12-19
13-02-13
SOT878-1
Fig 40. Package outline SOT878-1 (RDBS27P)
TDA8595
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
46 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
16. Mounting
2
1
27
1
2.54
26
2
hole diameter min. 0.92
∅ 0.08
M
Dimensions in mm
sot878-1_fr
Dimensions in mm.
Reflow soldering is the recommended soldering method.
Dimension ‘1’ relates to dimension ‘e1’ in Figure 40; dimension ‘2’ relates to dimension ‘e2’ in
Figure 40.
Fig 41. SOT878-1 reflow soldering footprint
17. Abbreviations
Table 18.
TDA8595
Product data sheet
Abbreviations
Acronym
Description
BCDMOS
Bipolar CMOS/DMOS
BTL
Bridge Tied Load
CMOS
Complementary Metal-Oxide Semiconductor
DMOS
Diffusion Metal Oxide Semiconductor
DSP
Digital Signal Processor
EMC
ElectroMagnetic Compatibility
ESR
Equivalent Series Resistance
NMOS
Negative Metal Oxide Semiconductor
PMOS
Positive Metal Oxide Semiconductor
POR
Power-On Reset
SOAR
Safe Operating ARea
SOI
Silicon On Insulator
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
47 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
18. Revision history
Table 19.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA8595 v.5
20130611
Product data sheet
-
TDA8595_4
-
TDA8595_3
Modifications:
TDA8595 v.4
Modifications:
TDA8595 v.3
Modifications:
TDA8595_2
Modifications:
TDA8595_1
(9397 750 15067)
TDA8595
Product data sheet
•
The package outline Figure 38 has been updated.
20130226
•
20130221
•
Product data sheet
The template has been updated to the latest version.
Product data sheet
-
TDA8595_2
The package outline figures, Figure 38 and Figure 40, have been updated.
20071121
Product data sheet
-
TDA8595_1
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
•
•
•
•
Figure 33: changed base-emitter resistor value 10 k to 5.6 k.
Changed the term ‘plop’ into ‘pop’.
Figure 1 and Figure 30: changed internal circuit on pin SVR and pull-down transistors on pins
STB and DIAG.
Table 17: changed names of junction temperature-related symbols.
Table 17: changed symbol IoM into Ith(o)det(load)AC and adapted parameter description.
Section 2.1 and Section 14: added AEC-Q100 quality information.
20060420
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
-
© NXP B.V. 2013. All rights reserved.
48 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TDA8595
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
49 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TDA8595
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
50 of 51
TDA8595
NXP Semiconductors
I2C-bus controlled 4  45 W power amplifier
21. Contents
1
2
2.1
2.2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.7.1
7.7.2
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
8
8.1
8.2
9
10
11
12
13
13.1
14
14.1
15
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
I2C-bus mode . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Distortion (clip-) detection . . . . . . . . . . . . . . . . . 7
Output protection and short-circuit operation . . 7
SOAR protection. . . . . . . . . . . . . . . . . . . . . . . . 7
Speaker protection . . . . . . . . . . . . . . . . . . . . . . 8
Standby and mute operation. . . . . . . . . . . . . . . 8
I2C-bus mode . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legacy mode (pin ADSEL connected to
ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Start-up and shut-down sequence . . . . . . . . . . 8
Power-on reset and supply voltage spikes . . . 12
Engine start and low voltage operation. . . . . . 12
Overvoltage and load dump protection. . . . . . 15
Thermal pre-warning and thermal protection . 15
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Offset detection. . . . . . . . . . . . . . . . . . . . . . . . 17
DC load detection . . . . . . . . . . . . . . . . . . . . . . 17
AC load detection . . . . . . . . . . . . . . . . . . . . . . 18
I2C-bus diagnostic readout . . . . . . . . . . . . . . . 19
I2C-bus specification . . . . . . . . . . . . . . . . . . . . 20
Instruction bytes . . . . . . . . . . . . . . . . . . . . . . . 21
Data bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 27
Thermal characteristics . . . . . . . . . . . . . . . . . 28
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 28
Performance diagrams . . . . . . . . . . . . . . . . . . 33
Application information. . . . . . . . . . . . . . . . . . 40
PCB layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Test information . . . . . . . . . . . . . . . . . . . . . . . . 43
Quality information . . . . . . . . . . . . . . . . . . . . . 43
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 44
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 47
18
19
19.1
19.2
19.3
19.4
20
21
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48
49
49
49
49
50
50
51
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 June 2013
Document identifier: TDA8595