948AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP28
CASE 948AA
ISSUE A
DATE 26 OCT 2011
SCALE 1:1
e
28
PIN ONE
LOCATION
2X
0.20 C B A
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
15
DETAIL A
E1 E
1
14
A
0.05
DIM
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
R
R1
S
01
02
03
A
A2
A
D
0.10 C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
B
A
SEATING
PLANE
C
28X
A1
b
02
0.10 C B A
S
H
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
R1
(b)
c
R
GAUGE PLANE
c1
L
(L1)
0.25
b1
03
SECTION A−A
GENERIC
MARKING DIAGRAM*
01
XXXXX
XXXXG
ALYW
DETAIL A
RECOMMENDED
SOLDERING FOOTPRINT
28X
MILLIMETERS
MIN
MAX
−−−
1.20
0.05
0.15
0.80
1.05
0.19
0.30
0.19
0.25
0.09
0.20
0.09
0.16
9.60
9.80
6.40 BSC
4.30
4.50
0.65 BSC
0.45
0.75
1.00 REF
0.09
−−−
0.09
−−−
0.20
−−−
0_
8_
12 _REF
12 _REF
0.42
XXXXX
A
L
Y
W
G
28X
1.15
6.70
0.65
PITCH
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
ON SEMICONDUCTOR STANDARD
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
http://onsemi.com
28 LEAD TSSOP, 9.7X4.4X1.0 MM,
0.65 PITCH
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
*This information is generic. Please refer
to device data sheet for actual part
marking.
DIMENSIONS: MILLIMETERS
98AON13023D
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON13023D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED
03 JUL 2003
A
ADDED SOLDER FOOTPRINT. REQ. BY S. RIGGS.
26 OCT 2011
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2011
October, 2011 − Rev. A
Case Outline Number:
948AA
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