Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x2 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD (TDFN) Rev 1, 4/15 1.40 2.00 6 A PIN #1 INDEX AREA B 1 0.50 2.39 3.00 6 PIN 1 INDEX AREA 0.25 (4X) 0.15 (10x0.30) 0.84 TOP VIEW BOTTOM VIEW (10x0.20) Package Outline (10x0.30) (10X0.25) 0.75 SEE DETAIL "X" C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW 3.00 2.39 0.05 (8x 0.50) 0.20 REF 5 C 0.84 2.00 0.05 DETAIL “X” TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. 2. 3. 4. Dimensions are in mm. Dimensions in ( ) for reference only. Dimensioning and tolerancing conform to AMSEY14.5m-1994. Unless otherwise specified, tolerance : Decimal ±0.05 Dimension b applies to the metalized terminal and is measured between 0.18mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1