Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x3C 10 LEAD DUAL FLAT PACKAGE (DFN) Rev 4, 3/15 3.00 5 PIN #1 INDEX AREA A B 10 5 PIN 1 INDEX AREA 1 2.38 3.00 0.50 2 10 x 0.25 6 (4X) 0.10 C B 1.64 TOP VIEW 10x 0.40 BOTTOM VIEW (4X) 0.10 M C B SEE DETAIL "X" (10 x 0.60) (10x 0.25) 0.90 MAX 0.10 C BASE PLANE 2.38 0.20 C SEATING PLANE 0.08 C SIDE VIEW (8x 0.50) 1.64 2.80 TYP C TYPICAL RECOMMENDED LAND PATTERN 0.20 REF 4 0.05 DETAIL "X" NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 6. Compliant to JEDEC MO-229-WEED-3 except for E-PAD dimensions.