776-02

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
28 LEAD PLLC
CASE 776−02
ISSUE F
DATE 29 JUL 2008
281
SCALE 1:1
B
Y BRK
−N−
0.007 (0.180)
U
M
T L-M
0.007 (0.180)
M
N
S
T L-M
S
S
N
S
D
Z
−M−
−L−
W
28
D
X
V
1
G1
0.010 (0.250)
T L-M
S
N
S
S
VIEW D−D
Z
A
0.007 (0.180)
R
0.007 (0.180)
M
M
T L-M
S
T L-M
S
N
N
H
S
0.007 (0.180)
T L-M
M
N
S
S
S
K1
C
E
G
S
K
PLANE
F
0.007 (0.180)
M
T L-M
S
N
S
VIEW S
G1
0.010 (0.250)
0.004 (0.100)
−T− SEATING
J
T L-M
S
N
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DOCUMENT NUMBER:
STATUS:
VIEW S
S
1 28
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
--0.64
--11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
--0.50
2_
10_
10.42
10.92
1.02
---
28 LEAD PLLC
XXXXXXXXXXXX
XXXXXXXXXXXG
AWLYYWW
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
October, DESCRIPTION:
2002 − Rev. 0
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
--0.025
--0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
--0.020
2_
10_
0.410
0.430
0.040
---
98ASB42596B
© Semiconductor Components Industries, LLC, 2002
GENERIC
MARKING DIAGRAM*
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ASB42596B
PAGE 2 OF 2
ISSUE
F
REVISION
UPDATED MAX VALUES FOR DIMENSION F TO 0.021 IN AND 0.53 MM. CORRECTED GENERIC MARKING INFORMATION. REQ. BY L. JAMES.
DATE
29 JUL 2008
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2008
July, 2008 − Rev. 02F
Case Outline Number:
776
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