Plastic Packages for Integrated Circuits Package Outline Drawing L6.1.6x1.6B 6 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) Rev 2, 05/15 1.60 0.60 R 0.20 A B 6 PIN 1 INDEX AREA 0.50BSC 1.00 1.60 (4X) 6 PIN #1 INDEX AREA 0.15 1.00 6X 0.25 0.10 M C A B 6X 0.24 1.12 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.75 0.10 C C BASE PLANE (6X 0.6) SEATING PLANE 0.08 C 0.000-0.50 SIDE VIEW 0.50 1.00 C 0.60 5 0 . 00 MIN. 0 . 05 MAX. ( 6 X 0 . 25 ) DETAIL "X" 1.12 TYPICAL RECOMMENDED LAND PATTERN 0 . 2 REF NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.20mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 1