Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD
Rev 2, 05/15
0.25
B
0.50
2.20
6
PIN 1
INDEX AREA
(4X)
6
PIN #1 INDEX AREA
3.00
A
1.80 +0.1/ -0.15
2.00
0.15
(8x0.40)
1.65 +0.1/ -0.15
TOP VIEW
BOTTOM VIEW
(8x0.25)
PACKAGE
OUTLINE
(6x0.50)
0.75
SEE DETAIL "X"
SIDE VIEW
1.80
3.00
0.05
(8x0.40)
1.65
C
0.20 REF
C
BASE PLANE
SEATING PLANE
0.08 C
5
(8x0.20)
0.05
2.00
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.20mm and 0.32mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1