Plastic Packages for Integrated Circuits Package Outline Drawing L8.3x3H 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) Rev 1, 5/15 2.38 1.50 REF 3.00 A PIN #1 INDEX AREA 6 PIN 1 INDEX AREA 6 X 0.50 6 B 1 8 X 0.40 4 2.20 3.00 (4X) 1.64 0.15 5 8 0.10 M C A B TOP VIEW 8 X 0.25 BOTTOM VIEW ( 2.38 ) SEE DETAIL "X" 0 .80 MAX 0.10 C C BASE PLANE SEATING PLANE 0.08 C 2 . 80 ( 2 .20 ) SIDE VIEW ( 1.64 ) C 0.2 REF 8X 0.60 0 . 00 MIN. 0 . 05 MAX. ( 8X 0.25 ) DETAIL “X” ( 6X 0 . 5 ) NOTES: TYPICAL RECOMMENDED LAND PATTERN 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Lead width dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1