Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q80.10x10
80 LEAD QUAD FLATPACK PACKAGE (LQFP)
Rev 0, 8/11
MILLIMETERS
D
D1
A
D2
A2
- 0.05 S
-D-
-B-
4X
4X
b
e
aaa C A-B D
bbb H A-B D
ddd M C A-B s D s
L1
E2
E
-AE1
A1
MIN
NOM
MAX
MIN
NOM
MAX
A
-
-
1.60
-
-
0.063
-
0.006
A1
0.05
-
0.15
0.002
A2
1.35
1.40
1.45
0.053 0.055 0.057
D
12.00 BSC.
0.472 BSC.
D1
10.00 BSC.
0.393 BSC.
E
12.00 BSC.
0.472 BSC.
E1
10.00 BSC.
0.393 BSC.
R2
0.08
-
0.20
0.003
-
R1
0.08
-
-
0.003
-
-
θ
0°
3.5°
7°
0°
3.5°
7°
0°
-
-
0°
-
-
θ2
11°
12°
13°
11°
12°
13°
θ3
11°
12°
13°
11°
12°
13°
c
0.09
-
0.20
0.004
-
0.008
L
0.45
0.60
0.75
0.018 0.024 0.030
L1
SEE DETAIL "A"
θ1
θ
-C- SEATING PLANE
SIDE VIEW
ccc C
0.008
θ1
c
TOP VIEW
MILLIMETERS
SYMBOL
1.00 REF
0.039 REF
S
0.20
-
-
b
0.13
0.16
0.23
0.008
-
-
0.005 0.006 0.009
e
0.40 BSC.
0.016 BSC.
D2
7.60
0.299
E2
7.60
0.299
TOLERANCES OF FORM AND POSITION
aaa
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.07
0.003
NOTES:
1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
(12.60)
(0.23) TYP
2. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located on the lower radius or the foot. Minimum
space between protrusion and an adjacent lead is 0.07mm
for 0.4mm and 0.5mm pitch packages.
3. Dimension of 44L "b" different with JEDEC spec
(ASE: 0.22/0.30/0.38)
(JEDEC: 0.30/0.37/0.45)
(12.60)
θ2
(0.40)
R1
R2
-H(1.20) TYP
S
L
GAUGE
PLANE
0.25mm
θ3
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "A"
1