Package Outline Drawing (POD)

Package Outline Drawing
Y40.17x19
40 I/O 17.0mm x 19.0mm x 3.55mm HDA MODULE
Rev 2, 10/15
PIN 1 INDICATOR
C = 0.35
DATUM A
D
A
SEE
DETAIL A
B
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
(nE-1) x eR
j fff m C A B
E1
eR1
E
f1
d aaa C 2X
f1
d aaa C 2X
TOP VIEW
DATUM B
(nD-1) x eT
D1
j fff m C A B
BOTTOM VIEW
f
ccc C
d eee C
eT
A
f
SEATING PLANE
A1
SIDE VIEW
C
f
0.075 R REF
NOTES:
1.
All dimensions are in millimeters.
2.
‘eT’ and ‘eR’ represent the basic land grid pitch.
3.
“n” is the total number of I/O (excluding dummy pads).
4.
Dimensioning and tolerancing per ASME Y14.5M-2009.
5.
Tolerance for exposed DAP edge location dimension on
page 3 is ±0.1mm.
6.
Mold cap thickness: 3.40mm
3
3
nxL
nxb
j bbbm C A B
j bbbm C
eR
TERMINAL TIP
DETAIL A
DIMENSIONS
MIN
NOM
3.50
3.55
0.55
0.60
0.55
0.60
1.00 BSC
1.35 BSC
1.00 BSC
17.00 BSC
16.35
16.50
2.50
2.40
1.40
1.50
0.70
0.80
5.00
5.10
0.90
1.00
1.50
1.60
0.90
1.00
0.50
0.60
3.40
3.50
9.90
10.00
2.90
3.00
5.70
5.80
1.70
1.80
2.90
3.00
1.90
2.00
4.70
4.80
0.60
0.70
0.50
0.60
1.50
1.60
19.00 BSC
18.35
18.50
0.50
0.60
7.50
7.60
1.50
1.60
5.00
5.10
1.30
1.40
0.50
0.60
0.50
0.60
0.70
0.80
8.10
8.20
8.10
8.20
4.80
4.90
1.90
2.00
1.40
1.50
2.60
2.70
1.40
1.50
2.95
3.05
0.60
0.70
1.90
2.00
0.50
0.60
0.50
0.60
1.50
1.60
0.50
0.60
0.20 REF
0.30 REF
20
13
8
MAX
3.60
0.025
0.65
0.65
6
Plastic Packages for Integrated Circuits
TERMINAL #A1
INDEX AREA
(D/2 x E/2)
SYMBOL
A
A1
b
L
eR
eR1
eT
D
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
D22
D23
E
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
E11
E12
E13
E14
E15
E16
E17
E18
E19
E20
E21
E22
E23
f
f1
n
nD
nE
16.65
2.60
1.60
0.90
5.20
1.10
1.70
1.10
0.70
3.60
10.10
3.10
5.90
1.90
3.10
2.10
4.90
0.80
0.70
1.70
18.65
0.70
7.70
1.70
5.20
1.50
0.70
0.70
0.90
8.30
8.30
5.00
2.10
1.60
2.80
1.60
3.15
0.80
2.10
0.70
0.70
1.70
0.70
3
Plastic Packages for Integrated Circuits
D22
E2
D5
D2
D23 (2X)
E23 (2X)
E22
D3
D4(4X)
E5
E3
E21
D6
E4(4X)
D8
E9
E6
E7
D7
D9
E19
D16
E8
E20
E12
E15
E14
E10
E11
D15
E16
D14
E13
E18
E17
D10
D12
D18
D17
D13
D11
SIZE DETAILS FOR THE 16 EXPOSED DAPS
BOTTOM VIEW
2
8.20
6.70
5.70
6.00
5.20
5.30
3.70
4.70
4.30
2.70
3.30
1.70
2.20
2.30
0.70
1.30
0.00
0.30
1.70
1.30
1.10
0.70
0.30
2.70
2.30
3.30
2.90
3.70
4.70
4.40
4.30
5.40
5.70
5.30
6.30
7.30
6.70
7.70
8.30
Plastic Packages for Integrated Circuits
9.30
9.30
8.70
8.70
8.30
8.30
7.70
7.70
7.30
7.30
6.70
7.10
6.30
5.70
5.70
5.30
5.30
4.70
4.30
3.70
3.70
3.30
3.30
2.70
2.00
2.30
1.70
1.10
0.04
0.90
1.70
1.30
0.90
0.30
0.00
0.56
1.00
0.30
0.40
1.40
2.00
2.50
2.68
3.28
3.70
4.02
4.63
5.20
5.90
6.15
7.90
8.50
9.20
8.20
4.70
3.00
0.00
1.00
1.60
2.80
2.90
3.50
4.70
5.30
7.00
8.30
7.60
9.20
TYPICAL PCB LAND PATTERN (For Reference)
TOP VIEW
NOTE: All dimensions are in millimeters.
3
9.20
8.20
8.05
7.02
6.90
6.87
5.86
5.90
5.20
5.30
4.29
4.80
3.28
3.72
1.95
2.29
2.71
0.35
1.71
0.55
0.71
1.28
0.72
0.29
0.28
1.05
2.29
1.72
1.29
1.25
2.72
2.65
2.60
3.72
3.29
4.50
4.29
5.72
5.30
6.29
6.45
6.95
7.30
7.15
6.80
7.80
7.65
8.20
Plastic Packages for Integrated Circuits
9.29
8.80
9.20
8.80
7.72
8.29
7.80
6.85
7.20
7.80
7.28
6.72
7.15
6.28
6.10
5.72
5.29
5.25
4.29
3.72
3.65
3.28
2.72
2.20
2.15
1.80
5.45
5.80
4.85
4.72
3.80
3.85
2.35
1.80
1.10
1.05
4.61
3.60
2.15
1.20
0.90
0.00
0.06
0.20
0.50
1.20
2.30
2.70
0.15
2.50
2.69
3.26
3.90
4.65
3.20
2.25
0.30
0.46
0.75
0.90
1.50
1.90
5.20
3.40
1.00
0.15
5.90
3.70
4.10
4.04
4.30
5.00
7.70
7.70
7.90
8.60
9.00
8.00
8.00
6.90
6.35
6.55
4.90
2.80
1.60
0.00
0.20
1.40
1.01
5.35
5.60
6.50
6.45
6.40
6.30
5.50
5.40
4.55
4.50
4.40
4.20
4.00
3.60
3.10
2.80
2.60
1.58
1.40
1.20
6.80
7.40
7.25
7.20
9.10
7.70
8.45
6.10
7.30
8.10
7.45
5.90
6.30
8.20
6.10
TYPICAL STENCIL OPENING EDGE POSITION (For Reference)
TOP VIEW
NOTE: All dimensions are in millimeters.
4