Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Low Plastic Quad Flatpack Package (LQFP)
Q144.20x20B
D
144 Lead Low Plastic Quad Flatpack Package
D1
MILLIMETERS
Z
PIN 1
CORNER
GG
144
109
108
1
U
T
E1
E
SYMBOL
MIN
NOM
MAX
A
-
-
1.60
A1
0.05
-
0.15
A2
1.35
1.40
1.45
b
0.17
0.22
0.27
b1
0.17
0.20
0.23
c
0.09
-
0.20
c1
0.09
-
0.16
D
22 BSC
D1
20 BSC
E
22 BSC
E1
20 BSC
L
36
4X
4X
0.2 H T-U Z
0.2 Y T-U Z
DETAIL F
140X
e
0.08 Y
H
0.45
L1
73
0.60
NOTES
4
3
3
0.75
1.00 REF
R1
0.08
-
-
R2
0.08
-
0.20
S
0.20
-
-
θ
0°
3.5°
7.0°
θ1
0°
-
-
θ2
11°
12°
13°
θ3
11°
12°
13°
N
128
e
0.50 BSC
5
Rev. 1 7/11
e/2
144X
b
0.08 M Y T-U Z
b/1
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
4. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum b dimension by more than 0.08mm. Dambar cannot
be located at the lower radius or the foot. Minimum space
between protrusion and an adjacent lead is 0.07mm.
b
SECTION G-G
NOTES:
3. Dimensions D1 and E1 are excluding mold protrusion. Allowable
protrusion is 0.25mm per side. Dimensions D1 and E1 are
inclusive of mold mismatch and determined by datum plane H.
c/1
c
PLATING
Y SEATING
PLANE
BASE
METAL
5. N is total number of the lead terminals.
0.05
02
01
R1
A A2
R2
03
A1
S
L1
DETAIL F
1
L
0.25 GAUGE
PLANE