Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
Q44.7x7
44 LEAD QUAD FLATPACK PACKAGE 0.5mm PITCH (LQFP)
Rev 0, 9/12
MILLIMETERS
A
A2
-D-
- 0.05 S
D
D1
D2
A1
MIN
NOM
MAX
MIN
NOM
MAX
A
-
-
1.60
-
-
0.063
-
0.006
A1
0.05
-
0.15
0.002
A2
1.35
1.40
1.45
0.053 0.055 0.057
D
9.00 BSC.
D1
7.00 BSC.
0.276 BSC.
E
9.00 BSC.
0.354 BSC.
E1
-B-
4X
4X
e
b
aaa C A-B D
bbb H A-B D
c
ddd M C A-B s D s
TOP VIEW
0.354 BSC.
7.00 BSC.
0.276 BSC.
R2
0.08
-
0.20
0.003
-
R1
0.08
-
-
0.003
-
-
θ
0°
3.5°
7°
0°
3.5°
7°
0.008
θ1
0°
-
-
0°
-
-
θ2
11°
12°
13°
11°
12°
13°
θ3
11°
12°
13°
11°
12°
13°
c
0.09
-
0.20
0.004
-
0.008
L
0.45
0.60
0.75
0.018 0.024 0.030
L1
E
E1
E2
-A-
INCH
SYMBOL
L1
1.00 REF
0.039 REF
S
0.20
-
-
b
0.17
0.20
0.27
0.008
-
-
0.007 0.008 0.011
e
0.50 BSC.
0.020 BSC.
D2
5.00
0.197
E2
5.00
0.197
TOLERANCES OF FORM AND POSITION
θ1
aaa
0.20
0.008
bbb
0.20
0.008
ccc
0.08
0.003
ddd
0.08
0.003
NOTES:
θ
-C- SEATING PLANE
SIDE VIEW
ccc C
1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are
maximum plastic body size dimensions including mold
mismatch.
2. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm. Dambar
cannot be located on the lower radius or the foot. Minimum
space between protrusion and an adjacent lead is 0.07mm
for 0.4mm and 0.5mm pitch packages.
3. All dimensions of 44L were based on those of 48L since they
are not mentioned in JEDEC spec MS-026.
θ2
R1
R2
-HS
L
GAUGE
PLANE
0.25mm
θ3
DETAIL "A"
1