Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7A 48 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE (LQFP) Rev 4, 7/11 9.00 BSC 7.00 BSC -D3 -B(8.2) 7.00 BSC TYP (48X 1.6 ) (48x 0.3 ) 0.50 BSC (44x 0.5 ) TYPICAL RECOMMENDED LAND PATTERN TOP VIEW 1.60 MAX -HSEATING PLANE 0.08 0.003 SIDE VIEW -C0.08 0.003 M C A-B S 0° MIN. DS 0.22±0.05 0.08/0.20 R. -H- 9.00 BSC -A- 0.20±0.03 1.40±0.05 0.08 R. MIN. 0.25 0-7° GAUGE PLANE 0.10±0.05 0.09/0.16 0.004/0.006 0.09/0.20 0.004/0.008 0.20 MIN. 0.60±0.15 (1.00) DETAIL "X" BASE METAL WITH PLATING NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982 3. Lead to lead width and length to be determined at seating plane. -C4. Body width and length to be determined at datum plane. -H5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.025mm (0.10 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more that 0.08mm (0.003 inch) 7. Package outline compliant to JEDEC MS-026BBC. 1