Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Packages (LQFP) Q64.7x7 (JEDEC MS-026BBD ISSUE C) 64 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE D D1 -D- INCHES -B- -AE E1 e PIN 1 SEATING A PLANE -H- 0.08 0.003 -C0.07 M 0.003 b 0.020 0.008 MIN b1 A2 A1 GAGE PLANE L 0o-7o 11o-13o 0.25 0.010 1 SYMBOL MIN MAX MIN MAX NOTES A - 0.062 - 1.60 - A1 0.002 0.005 0.05 0.15 - A2 0.054 0.057 1.35 1.45 - b 0.005 0.009 0.13 0.23 6 b1 0.005 0.007 0.13 0.19 - D 0.350 0.358 8.90 9.10 3 D1 0.272 0.280 6.90 7.10 4, 5 E 0.350 0.358 8.90 9.10 3 E1 0.272 0.280 6.90 7.10 4, 5 L 0.018 0.029 0.45 0.75 N 64 64 e 0.0157 BSC 0.40 BSC 7 Rev. 2 7/11 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . D S C A-B S 11o-13o 0o MIN MILLIMETERS 4. Dimensions D1 and E1 to be determined at datum plane -H- . 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm (0.003 inch). 0.09/0.16 0.004/0.006 BASE METAL WITH PLATING 0.09/0.20 0.004/0.008 7. “N” is the number of terminal positions.