Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L6.1.65x1.65A
6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN)
Rev 1, 4/15
1.65
0.55 (1x)
0.70
PIN #1 INDEX AREA
6
PIN 1
1.65
0.50
0.25 (6x) 4
(4X)
0.10
0.10 M CAB
0.20
TOP VIEW
0.40
0.85
BOTTOM VIEW
0.75 (1x)
SEE DETAIL "X"
0.70
0.10 C
0.50 ± 0.05
0.25 (6x)
SIDE VIEW
0.50
0.20 REF
1.02
C
BASE PLANE
SEATING PLANE
0.08 C
5
C
0.60
TYPICAL RECOMMENDED LAND PATTERN
0.05
0.00
DETAIL “X”
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for reference only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1