Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2.36x3.94
8 LEAD OPTICAL CO-PACKAGE
Rev 1, 4/13
1.35±0.10
R0.4 APERTURE
0.18 0.6
0.58
0.63
0.19
4-LEDA
0.8
0.6
0.16
5-LEDK
0.72
R0.4 LENS
0.63
R0.4
3-GND
3.94
0.25
6-LDR
7-INT
0.97
1.3
2-SCL
8-SDA
1-VDD
0.6
0.16
1.56
0.8
0.18
2.36
PIN 1
INDEX AREA
BOTTOM VIEW
1.03
0.8
5-LEDK
4-LEDA
6-LDR
3-GND
7-INT
2-SCL
8-SDA
1-VDD
0.97
0.25
1.82
0.72
0.16
1.43
0.16
TOP VIEW
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Pin #1 identifier is a laser-etched dot on bottom surface.