Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2.40x4
8 LEAD OPTICAL CO-PACKAGE
Rev 5, 12/13
2.40
0.90
0.30
1.08±0.05
4.00±0.10
2.20
1.20±0.10
0.625
R0.71±0.05
0.97
0.50
1.65±0.05
1.43±0.05
0.65
PIN 4 INDEX AREA
0.20
0.20
2.40±0.10
BOTTOM VIEW
0.80
PACKAGE OUTLINE
8-LEDA
2-IRDR
7-GND
3-INT
6-SCL
4-SDA
5-VDD
0.55
0.97
1-LEDC
0.80
TOP VIEW
2.40
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance: Decimal ± 0.05
4.
Pin #4 identifier is a laser-etched dot on bottom surface.