Plastic Packages for Integrated Circuits HMSOP (Heat-Sink MSOP) Package Family E B 0.25 M C A B E1 MDP0050 HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY MILLIMETERS 1 N SYMBOL D (N/2)+1 (N/2) PIN #1 I.D. A HMSOP8 HMSOP10 TOLERANCE NOTES A 1.00 1.00 Max. - A1 0.075 0.075 +0.025/-0.050 - A2 0.86 0.86 ±0.09 - b 0.30 0.20 +0.07/-0.08 - c 0.15 0.15 ±0.05 - D 3.00 3.00 ±0.10 1, 3 D1 1.85 1.85 Reference - E 4.90 4.90 ±0.15 - E1 3.00 3.00 ±0.10 2, 3 E2 1.73 1.73 Reference - e 0.65 0.50 Basic - L 0.55 0.55 ±0.15 - L1 0.95 0.95 Basic - N 8 10 Reference - TOP VIEW E2 EXPOSED THERMAL PAD D1 BOTTOM VIEW Rev. 1 2/07 e NOTES: H 1. Plastic or metal protrusions of 0.15mm maximum per side are not included. C SEATING PLANE 2. Plastic interlead protrusions of 0.25mm maximum per side are not included. 0.08 M C A B b 0.10 C N LEADS 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW L1 A c END VIEW SEE DETAIL "X" A2 GAUGE 0.25 PLANE L 3° ±3° DETAIL X 1 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. A1