Plastic Packages for Integrated Circuits Dual Flat No-Lead Package Family (DFN) MDP0047 A DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229) D MILLIMETERS N N-1 0.075 C 2X PIN #1 I.D. E 1 2 0.075 C B 2X TOP VIEW (D2) 4 L1 N-1 N L (N LEADS) SYMBOL DFN8 DFN10 TOLERANCE A 0.85 0.90 ±0.10 A1 0.02 0.02 +0.03/-0.02 b 0.30 0.25 ±0.05 c 0.20 0.20 Reference D 4.00 3.00 Basic D2 3.00 2.25 ±0.05 E 4.00 3.00 Basic E2 2.20 1.50 ±0.05 e 0.80 0.50 Basic L 0.50 0.50 ±0.10 L1 0.10 0 Maximum Rev. 4 1/16 NOTES: (E2) 1. Dimensioning and tolerancing per ASME Y14.5M-1994. PIN #1 I.D. 1 2 5 e b 0.10 M C A B C 6. N is the total number of leads on the device. SEATING PLANE C SEE DETAIL "X" (N LEADS & EXPOSED PAD) 2 C A 3. Bottom-side pin #1 I.D. may be a diepad chamfer, an extended tiebar tab, or a small square as shown. 5. Inward end of lead may be square or circular in shape with radius (b/2) as shown. C 0.08 2. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 4. Exposed leads may extend to the edge of the package or be pulled back. See dimension “L1”. BOTTOM VIEW 0.10 3 (c) A1 DETAIL X 1