Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Packages (LQFP) Q128.14x14 4X 128 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE .4 MM PITCH 0.2 Y T-U Z D PIN 1 MILLIMETERS 97 Z 128 1 SYMBOL 96 U T E1 E MIN - 1.60 - 0.05 0.15 - A2 1.35 1.40 1.45 - b 0.13 0.16 0.23 4 b1 0.13 - 0.19 - c 0.09 - 0.20 - c1 0.09 - 0.16 - D 16 BSC - D1 14 BSC 3 E 16 BSC - 64 D1 0.2 H T-U Z 4X 14 BSC 0.45 L1 R1 33 DETAIL F H NOTES A L 65 MAX A1 E1 32 NOM 0.60 3 0.75 - 1.00 REF - 0.08 - - - R2 0.08 - 0.20 - S 0.20 - - - 0 0° 3.5° 7° - 01 0° - - - 02 11° 12° 13° - 03 11° 12° 13° - N 128 - e 0.40 BSC Rev. 1 7/11 128X b Y 124X SEATING PLANE 0.07 M Y T-U b1 c1 c 0.05 PLATING 02 b 01 A R1 A2 R2 A1 0.080 Y e 03 S DETAIL F 1 0 L (L1) 0.25 GAUGE PLANE NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensions and tolerances per AMSEY14.5M-1994. 3. Dimensions D1 and E1 are excluding mold protrusion. Allowable protrusion is 0.25 per side. Dimensions D1 and E1 are exclusive of mold mismatch and determined by datum plane H. 4. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm. Dambar cannot be located at the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm.