Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Exposed Pad Package (LQFP-EP) 4X Q128.14x14A 0.2 YT-U Z 128 Lead Low Plastic Quad Flatpack Exposed Pad Package (0.4mm pitch) D PIN 1 128 97 Z 1 MILLIMETERS 96 SYMBOL U T E E1 32 65 33 4X NOM 0.2 HT-U Z A - - 1.60 0.05 - 0.15 A2 1.35 1.40 1.45 b 0.13 0.18 0.23 b1 0.13 0.16 0.19 c 0.09 - 0.20 c1 0.09 - 0.16 14 BSC 3 E 16 BSC 4 14 BSC 0.45 Y 124X e SEATING PLANE 0.080 Y 0.07 YT-UZ b c PLATING c1 b 3 0.60 L1 0.75 1.00 REF R1 128X b 4 D1 L H NOTES 16 BSC E1 DETAIL F MAX A1 D 64 D1 MIN 0.08 - - R2 0.08 - 0.20 S 0.20 - - θ 0° 3.5° 7.0° θ1 0° - - θ2 11° 12° 13° θ3 11° 12° 13° e 0.40 BSC M 6.855 6.955 7.055 N 6.855 6.955 7.055 Rev. 1 7/11 NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. N 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Dimensions D1 and E1 are excluding mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are inclusive of mold mismatch and determined by datum plane H. 4. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08mm. Dambar cannot be located at the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07mm. M 0.05 θ2 0.3 MAX. θ1 R1 A A2 R2 θ3 A EXPOSED PAD 1 DETAIL F S θ L (L1) 0.25 GAUGE PLANE