Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Package with Top Exposed Pad (LQFP-TEP) Q128.14x20A 4 D NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB 3 SYMBOL A B 3 D2 E 4 e E2 N/4 TIPS 0.20 C A-B D 4X SEE DETAIL "A" TOP VIEW 5 7 D1/2 XX U NT RY E1/2 5 - - 1.60 0.05 - 0.15 A2 1.35 1.40 1.45 7 E1 NOTES 13 22 BSC 4 D1 20 BSC 7, 8 D2 12.50 BSC 14 E 16 BSC 4 E1 14 BSC 7, 8 L CO MAX A E2 D1 NOM A1 D E/2 PIN 1 ID MIN 6.5 BSC 0.45 0.60 N 128 e 0.50 BSC 14 0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 Rev. 1 7/11 4X NOTES: BOTTOM VIEW 0.20 H A-B D 1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 8 PLACES 11/13° 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. A H 0.05 2 / / 0.10 C ccc C 4. To be determined at seating plane C. SEE DETAIL "B" 5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254mm per side on D1 and E1 dimensions. ddd M C A-B S D S 9 WITH LEAD FINISH b 0.09/0.20 6. “N” is the total number of terminals. 7. These dimensions to be determined at datum plane H. 0.09/0.16 b 1 8. Package top dimensions are smaller than package bottom dimensions and top of package will not overhang bottom of package. BASE METAL 9. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall not be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located at the lower radius or the foot. 0° MIN. A2 - 0.08/0.20 R. DATUM PLANE H 0.05 S 3. Datums A-B and D to be determined at center lines between leads where leads exit plastic body at datum plane H. 10. Controlling dimension: millimeter. A1 0.08 R.MIN. 0.20 MIN. 0-7° 11. Maximum allowable die thickness to be assembled in this package family is 0.38 millimeters. 0.25 GAUGE PLANE 12. This outline conforms to JEDEC publication 95 Registration MS-026, variations BHA & BHB. L 1.00 REF. 13. A1 is defined as the distance from the seating plane to the lowest point of the package body. DETAIL "B" ODD LEAD SIDES EVEN LEAD SIDES 3 b 3 e/2 9 A, B, D A, B, D DETAIL "A" 1 14. Dimensions D2 and E2 represent the size of the exposed pad. The actual dimensions may be reduced up to 0.76mm due to mold flash.