Plastic Packages for Integrated Circuits Plastic Leaded Chip Carrier Packages (PLCC) 0.042 (1.07) 0.048 (1.22) N32.45x55 (JEDEC MS-016AE ISSUE A) 0.042 (1.07) 0.056 (1.42) PIN (1) IDENTIFIER 0.004 (0.10) 0.050 (1.27) TP 0.025 (0.64) R 0.045 (1.14) ND CL C D2/E2 E1 E C L D2/E2 NE VIEW “A” A1 A D1 D 0.015 (0.38) MIN SEATING -C- PLANE 0.020 (0.51) MAX 3 PLCS 0.026 (0.66) 0.032 (0.81) 0.050 (1.27) MIN 0.013 (0.33) 0.021 (0.53) 0.025 (0.64) MIN (0.12) M A S -B S D S 0.005 VIEW “A” TYP. 62 32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.125 0.140 3.18 3.55 - A1 0.060 0.095 1.53 2.41 - D 0.485 0.495 12.32 12.57 - D1 0.447 0.453 11.36 11.50 3 D2 0.188 0.223 4.78 5.66 4, 5 E 0.585 0.595 14.86 15.11 - E1 0.547 0.553 13.90 14.04 3 E2 0.238 0.273 6.05 6.93 4, 5 N 28 28 6 ND 7 7 7 NE 9 9 7 Rev. 0 7/98 NOTES: 1. Controlling dimension: INCH. Converted millimeter dimensions are not necessarily exact. 2. Dimensions and tolerancing per ANSI Y14.5M-1982. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1 and E1 include mold mismatch and are measured at the extreme material condition at the body parting line. 4. To be measured at seating plane -C- contact point. 5. Centerline to be determined where center leads exit plastic body. 6. “N” is the number of terminal positions. 7. ND denotes the number of leads on the two shorts sides of the package, one of which contains pin #1. NE denotes the number of leads on the two long sides of the package.