Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L20.4x4G
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 1/12
4X 2.00
4.00
16X 0.50
A
B
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
20
16
1
4.00
15
2 . 50
11
(4X)
5
0.15
6
10
TOP VIEW
0.10 M C A B
20 X 0.30 ± 0.10
4 0.25
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0.9
C
C
0 . 2 REF
5
BASE PLANE
0 . 00 MIN.
0 . 05 MAX.
SEATING PLANE
0.08 C
SIDE VIEW
DETAIL "X"
NOTES:
(3.9 TYP) (
( 16X 0 . 50 )
2 . 50 )
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO-229.
( 20X 0 . 25 )
( 20 X 0 . 50 )
either a mold or mark feature.
TYPICAL RECOMMENDED LAND PATTERN
1