Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L24.4x4C
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 10/06
4X 2.5
4.00
A
20X 0.50
B
PIN 1
INDEX AREA
PIN #1 CORNER
(C 0 . 25)
24
19
1
4.00
18
2 . 50 ± 0 . 15
13
0.15
(4X)
12
7
0.10 M C A B
0 . 07
24X 0 . 23 +- 0
. 05 4
24X 0 . 4 ± 0 . 1
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
C
0 . 90 ± 0 . 1
BASE PLANE
( 3 . 8 TYP )
SEATING PLANE
0.08 C
SIDE VIEW
(
2 . 50 )
( 20X 0 . 5 )
C
0 . 2 REF
5
( 24X 0 . 25 )
0 . 00 MIN.
0 . 05 MAX.
( 24X 0 . 6 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1