2ED300C17-S Data Sheet (1.2 MB, EN)

Preliminary Datasheet, V4.03, August 2013
EiceDRIVER
TM
2 E D 300C 17 - S 2 E D 300C 17 - S T
Dual IGBT Driver Board for Infineon Medium
and High Power IGBT Modules
Power Management & Drives
EiceDRIVERTM
2ED300C17-S/-ST
2ED300C17-S 2ED300C17-ST
Revision History:
Previous Version:
2013-08
V4.02
Version
Page
Subjects (major changes since last revision)
4.03
2
Revision history modified. All changes included.
4.03
8; 18
Figure 4 and figure7 size changed.
4.02
19
Partial discharge test voltage added
4.02
Chapter 4.5 and 4.6 added
4.01
Update figure 2 and figure 6
4.00
all
V4.03
General review, new hardware version V6
Edition 2013-08-13
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2013.
All Rights Reserved.
ATTENTION PLEASE!
THE INFORMATION HEREIN IS GIVEN TO DESCRIBE CERTAIN COMPONENTS AND SHALL NOT BE
CONSIDERED AS A GUARANTEE OF CHARACTERISTICS.
TERMS OF DELIVERY AND RIGHTS TO TECHNICAL CHANGE RESERVED.
WE HEREBY DISCLAIM ANY AND ALL WARRANTIES, INCLUDING BUT NOT LIMITED TO
WARRANTIES OF NON-INFRINGEMENT, REGARDING CIRCUITS, DESCRIPTIONS AND CHARTS
STATED HEREIN.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or
system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
EiceDRIVERTM
2ED300C17-S/-ST
Safety notice
The driver may only be used for the purposes described by the manufacturer.
Inadmissible alterations and use of spare parts or accessories not recommend by Infineon
may cause fire, electric shock and injuries.
This document has to be available to all users, developers and qualified personnel working
with the driver.
If measurements and tests on the device have to be carried out during operation,
the regulations of the work on live parts are to be observed and suitable test equipment
is to be used.
Prior to installation and commissioning please read this document thoroughly.
 Commissioning is prohibited if there is visible damage by inappropriate handling
or transportation.
 Ensure ESD protection during handling.
 Connect or disconnect only when power is turned off.
 Always keep sufficient safety distance during commissioning without closed
protective housing.
 Contact under live condition is strictly prohibited.
 Work after turn-off is impermissible until the absence of supply voltage has been
verified.
 During work after turn-off it has to be observed that components heat up during
operation. Contact can cause injuries.
 Electrically and mechanically, the driver is mounted onto customer’s PCB by
soldering. The mechanical strength has to be verified by the user and, if necessary,
assured with appropriate tests.
 The driver is designed to be used in combination with Infineon IGBT modules,
especially IHM, EconoPACK+, PrimePACKTM and 62mm. In case of ulterior use,
safe operation cannot be ensured.
Exclusion clause:
The datasheet is part of the Infineon IGBT driver 2ED300C17-S/-ST. To ensure safe and reliable operation
it is necessary to read and understand this datasheet.
The Infineon IGBT driver 2ED300C17-S/-ST is only intended for control of Infineon IGBT modules.
Infineon cannot warrant against damage and/or malfunction if IGBT modules used not produced by Infineon.
In this context, Infineon retains the right to change technical data and product specifications without prior
notice to the course of improvement.
Prepared by: RK
Approved by: KS
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2ED300C17-S/-ST
This side is intentionally left blank.
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2ED300C17-S/-ST
Dual channel high voltage IGBT driver board
Product Highlights

Galvanically isolated dual channel IGBT driver

Reinforced isolation according to EN 50178

Integrated protection features

5kV isolation test performed as 100% test

High Electromagnetic Compatibility
Features

Designed for Infineon IGBT modules up to 1700V

High peak output current of 30A

Integrated DC-DC SMPS

Soft Shut Down in fault conditions

Dynamic Over Current Detection

IGBT desaturation monitoring

Interlocking in half-bridge mode

Open drain fault output
Typical Applications

Low impedance 15V inputs for high noise immunity

Renewable energies

±15 V secondary drive voltage

Drives and automation

Short propagation delay time

Transportation

Optional sense function

Power supplies

RoHS compliant

Medical

UL94V-2 compliant materials

UPS systems
Figure 1: Basic schematic for driver setup
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Approved by: KS
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Table of Contents
Page
1
Block Diagram and Schematic..................................................................................................... 7
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Functional Description ................................................................................................................. 8
Reinforced Isolation ........................................................................................................................ 8
Integrated SMPS ............................................................................................................................. 9
Undervoltage Lockout (UVLO) ........................................................................................................ 9
Dynamic Overcurrent Detection (DOCD) ........................................................................................ 9
Soft Shut Down (SSD) .................................................................................................................... 9
External Detected Failure Analysis (EDFA) .................................................................................... 9
Reset ............................................................................................................................................... 9
Control Inputs and Outputs 2ED300C17-S /-ST ............................................................................. 9
3
3.1
3.2
Pin Configuration and Functionality .........................................................................................10
Pin functionalities, Primary side ....................................................................................................11
Pin functionalities, Secondary side ...............................................................................................12
4
4.1
4.2
4.3
4.4
4.5
4.6
Electrical Parameters ..................................................................................................................14
Absolute Maximum Ratings ..........................................................................................................14
Operating Parameters ...................................................................................................................15
Recommended Operating Parameters .........................................................................................15
Electrical Characteristics ...............................................................................................................16
Driver performance .......................................................................................................................17
VCESAT reference ........................................................................................................................18
5
Isolation characteristics .............................................................................................................19
6
Timing diagrams .........................................................................................................................20
7
Mechanical dimensions ..............................................................................................................21
8
Handling and mounting ..............................................................................................................23
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Block Diagram and Schematic
1
Block Diagram and Schematic
Figure 2: Block Diagram 2ED300C17-S/-ST
Figure 3: Peripheric components for half-bridge mode
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Functional Description
2
Functional Description
EiceDRIVER™ (eupec IGBT controlled efficiency DRIVER) is the name of a family of IGBT-Drivers
consisting of IGBT driver boards and IGBT driver ICs.
The 2ED300C17-S/-ST is a dual channel high voltage gate driver board featuring reinforced isolation
between logic side and high voltage output.
Control and protection functions are included to ease the design of highly reliable systems.
The 2ED300C17-S is designed for use in industrial applications and the 2ED300C17-ST, with special
coating, for the use in more demanding applications like railway traction or windmills.
The device consists of two galvanically separated driver channels and features two operating functions, the
direct mode and the half-bridge mode, to drive IGBT modules.
The 2ED300C17-S/-ST is designed for use with Infineon IGBT modules up to 1700V in applications with high
safety and reliability requirements and aims for power ratings of 75kW to 1MW.
The driver also includes IGBT desaturation protection, external failure input and Undervoltage Lockout
(UVLO) detection. All fault states set the fault memory and activate the open drain fault output.
2.1
Reinforced Isolation
The most important safety feature of the 2ED300C17-S/-ST high voltage driver board is the reinforced
isolation between primary and secondary side. This is achieved by using a specially designed transformer
characterized by lowest coupling capacitances, , high isolation stability and by appropriate creepage and
clearance distances on the printed circuit board. Figure 4 shows the specially transformer design for high
isolation solution.
The clearance and creepage distances comply with VDE0110 and VDE0160 / EN50178 and are designed
for pollution degree 3, over voltage class III. All materials used within the transformer at least meet the
requirements of UL94V-2.
Figure 4: Additionally mechanical barriers for high isolation solution
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Functional Description
2.2
Integrated SMPS
A switch mode power supply with galvanically separated outputs is integrated on the 2ED300C17-S/-ST.
It generates the required voltages for both driver channels. The secondary supplies are not protected against
external short circuit.
2.3
Undervoltage Lockout (UVLO)
Undervoltage monitoring is implemented for both secondary sides, positive and negative driver supply
voltages are monitored. The Signal and Logic side is not monitored. Undervoltage lockout functionality in
both driver channels ensures correct IGBT switching operation.
If the absolute value of one of the driver channel’s power supplies drops below the UVLO detection level, the
IGBT is shut down using the soft shut down functionality; gate-signals are ignored and the fault output is
activated.
2.4
Dynamic Overcurrent Detection (DOCD)
The dynamic over current detection protects the IGBT in case of a short circuit. The saturation voltage during
IGBT on-state is measured and continuously compared with a defined reference signal.
The shut down reference curve has to be adapted to each individual IGBT connecting an external RC
network. If no measures are taken, the reference level for desaturation detection is approx. at 10 V. Adding
an RC network allows to tune the characteristics of the detection circuit.
2.5
Soft Shut Down (SSD)
Soft shut down is a technique to limit the current slope di/dt during turn-off. It is activated if the fault memory
is set as a consequence of a detected fault condition. A sense terminal can optionally be used to connect an
additional external resistor. This is done to adjusting the IGBT turn-off characteristics. This terminal can
optionally be used as an input for the active clamping or di/dt and dv/dt control.
2.6
External Detected Failure Analysis (EDFA)
Additional function, customizable according to individual applications such as thermo switches on heat sinks.
Digital high level on these terminals set the fault memory. Soft shut down is initiated and further operation
inhibited.
2.7
Reset
Resetting the driver can be done by applying a digital high level to the Reset-pin or by applying a digital low
level to both gate-signal inputs for at least 60ms.On Reset, the fault memory is deleted and restarting driver
operation is possible.
2.8
Control Inputs and Outputs 2ED300C17-S /-ST
Inputs of the Signal and Logic side require 15V CMOS levels according to 40xx CMOS technology. This
offers a high signal to noise ratio. In very harsh environments, negative low level input signals can be used
with the limits given for the maximum ratings.
The open drain fault output is a very low impedance output. Voltage levels similar to Signal and Logic ground
are achieved.
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Pin Configuration and Functionality
3
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
Pin Configuration and Functionality
Label
Function
VDDS
Signal and logic supply voltage primary side
/Fault
Reset
CA
INB
CB
Mode
/Fault
INA
Open drain fault output
Active high signal and logic reset input
External capacitor terminal for half-bridge mode dead time adjustment channel A
Active high PWM input channel B
External capacitor terminal for half-bridge mode dead time adjustment channel B
Operating mode selection input
Open drain fault output
Active high PWM input channel A
GNDS
Signal and logic common ground primary side
VDDP
DC/DC-SMPS supply voltage primary side
GNDP
DC/DC-SMPS ground primary side
E.B
VCEsatB
RCB
SenseB
VBVB+
Active high external digital fault input driver channel B
IGBT desaturation sensing input driver channel B
Desaturation reference curve RC network terminal driver channel B
Active clamping input or soft shut down resistor terminal driver channel B
External capacitor terminal for negative power supply driver channel B
External capacitor terminal for positive power supply driver channel B
COMB
Common ground terminal driver channel B
GateB
IGBT gate output driver channel B
E.A
VCEsatA
RCA
SenseA
VAVA+
Pin not existing; cut out
Pin not existing; cut out
Active high external digital fault input driver channel A
IGBT desaturation sensing input driver channel A
Desaturation reference curve RC network terminal driver channel A
Active clamping input or soft shut down resistor terminal driver channel A
External capacitor terminal for negative power supply driver channel A
External capacitor terminal for positive power supply driver channel A
COMA
Common ground terminal driver channel A
GateA
IGBT gate output driver channel A
Table 1 : Pin Configuration of 2ED300C17-S/-ST
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2ED300C17-S/-ST
Pin Configuration and Functionality
In addition to Table 1, Figure 5 gives an overview on the pin positions.
Figure 5 : EiceDRIVER™ pinning top view
3.1
Pin functionalities, Primary side
All input pins are compatible to 15V CMOS logic according to 40xx technology.
VDDS
15V supply voltage for signal and logic part on the primary side. All pins have to be connected.
/Fault
Open drain fault output for signalization of internal and external faults. Reset signal required to delete the
fault memory and for restarting operation after fault state.
External pull-up resistor needed.
Reset
Active high signal to delete the fault memory.
INA
Active high signal for PWM, channel A. Negative input voltage for low level is allowed within the limits given
for maximum values.
INB
Active high signal for PWM, channel B. Negative input voltage for low level is allowed within the limits given
for maximum values.
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2ED300C17-S/-ST
Pin Configuration and Functionality
CA
Terminal to connect external capacitor for dead time adjustment of channel A in half-bridge mode.
CB
Terminal to connect external capacitor for dead time adjustment of channel B in half-bridge mode.
Mode
Terminal for mode selection, choosing direct mode or half-bridge mode. High level or connection to VDDS
activates half-bridge mode. Low level or connection to ground GNDS activates direct mode.
GNDS
Common ground connection for signals and supply voltage of Signal and Logic part.
All pins have to be connected.
Connection between GNDS and GNDP is permissible.
VDDP
15V supply voltage for DC/DC switch mode power supply. An external capacitor to GNDP is mandatory at
this terminal.
All pins have to be connected.
GNDP
Ground connection for DC/DC switch mode power supply.
All pins have to be connected.
Connection between GNDS and GNDP is permissible.
3.2
Pin functionalities, Secondary side
GateA
Output to IGBT gate, driver channel A. Both pins have to be connected.
COMA
Common ground connection for IGBT auxiliary emitter and all signals of driver channel A. Both pins have to
be connected.
VA+
Positive power supply, driver channel A. An external capacitor to ground COMA is mandatory at this
terminal.
VANegative power supply driver channel A. An external capacitor to ground COMA is mandatory at this
terminal.
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2ED300C17-S/-ST
Pin Configuration and Functionality
SenseA
Terminal for additional external soft shut down resistor or input for active clamping, di/dt or dv/dt control,
driver channel A
RCA
Desaturation reference curve RC network terminal, driver channel A
VCEsatA
IGBT desaturation sensing input, driver channel A.
E.A
Active high external digital fault input driver channel A for set fault memory.
GateB
Output to IGBT gate, driver channel B. Both pins have to be connected.
COMB
Common ground connection for IGBT auxiliary emitter and all signals of driver channel B. Both pins have to
be connected.
VB+
Positive power supply, driver channel B. An external capacitor to ground COMB is mandatory at this
terminal.
VBNegative power supply, driver channel B. An external capacitor to ground COMB is mandatory at this
terminal.
SenseB
Terminal for additional external soft shut down resistor or input for active clamping, di/dt or dv/dt control,
driver channel B
RCB
Desaturation reference curve RC network terminal, driver channel B.
VCEsatB
IGBT desaturation sensing input, driver channel B.
E.B
Active high external digital fault input driver channel B for set fault memory.
Prepared by: RK
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2ED300C17-S/-ST
Electrical Parameters
4
Electrical Parameters
Electrical parameters are differentiated into maximum values that in no case are to be exceeded and
operational conditions typical to the application. All parameters are listed in the following sections.
4.1
Absolute Maximum Ratings
Absolute maximum ratings are defined as ratings, which when being exceeded may lead
to destruction of the driver board. Unless otherwise noted all primary side parameters
refer to GNDS. The secondary side signals from driver channel A and driver channel B are measured with
respect to their individual COMA or COMB.
Parameter
Symbol
Positive power supply voltage Logic and Signal
VVDDS
Limit Values
min
max
16,5
Positive power supply voltage DC/DC SMPS
VVDDP
Total input current VVDDS and VVDDP
IVDD,sum
PWM signal input voltage INA, INB
VINA, VINB
Logic signal input voltage Mode, Reset
VMode, VReset
Voltage on open drain fault output
Unit
Remarks
V
1
16,5
V
2
670
mA
3
-20
20
V
-20
20
V
VFault
20
V
Total fault output current on one or both terminals
IFault
40
mA
Peak turn on output current
IGateA, IGateB
30
A
4
Peak turn off output current
IGateA, IGateB
-30
A
4
DC/DC SMPS average current per output
IVX
133
mA
5
Total DC/DC SMPS output power
PSMPS
8
W
Collector emitter voltage of IGBT
VCES
1700
V
Minimum total gate resistor
RGmin
Maximum IGBT gate charge
QGmax
52
µC
Maximum slew rate
dvce/dt
50
kV/µs
6
Maximum switching frequency
fsmax
60
kHz
7
Maximum duty cycle
dmax
100
%
Operating temperature 2ED300C17-S
Top
-25
85
°C
7
Operating temperature 2ED300C17-ST
Top
-40
85
°C
7
Tsto
-40
Table 2: Absolute maximum ratings
85
°C
Storage temperature
Ω
1
1
With respect to GNDS
With respect to GNDP
3
Calculated value for equivalent average DC input current @ maximum SMPS output power of 8W
4
Maximum output current of the transistor power stage
5
Maximum DC output current per DC/DC output voltage calculated for total SMPS power of 8W
6
The parameter is not subject to production test – verified by design/characterization
7
Operating temperature depends on load and environmental conditions.
2
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2ED300C17-S/-ST
Electrical Parameters
4.2
Operating Parameters
Within the operating range the driver board operates as described in the functional description. Unless noted
otherwise, all primary side parameters refer to GNDS. The secondary side signals from driver channel A and
driver channel B are measured with respect to their individual COMA or COMB.
Parameter
Symbol
Positive power supply voltage Logic and Signal
VVDDS
Positive power supply voltage DC/DC SMPS
VVDDP
14
16
V
PWM signal input voltage INA, INB
VINA, VINB
-15
15
V
Logic signal input voltage Mode, Reset
Voltage on open drain fault output in non-fault
condition
Switching frequency
VMode, VReset
-15
15
V
16
V
0
60
kHz
dmax
0
Table 3: Operating parameters
100
%
Duty cycle
4.3
Limit Values
min
max
14
16
VFault
fsmax
Unit
Remarks
V
8
9
Recommended Operating Parameters
Unless noted otherwise, all primary side signals refer to GNDS. The secondary side signals from driver
channel A and driver channel B are measured with respect to their individual COMA or COMB.
Parameter
Symbol
Value
Unit
Positive power supply voltage logic and signal
VVDDS
15
V
Positive power supply voltage DC/DC SMPS
VVDDP
15
V
PWM signal input voltage INA, INB
VINA, VINB
15
V
Logic signal input voltage Mode, Reset
VMode, VReset
15
Voltage on open drain fault output in non-fault
VFault
15
condition
Switching frequency @ 65°C operating temperature
fsmax
60
Table 4: Recommended operating parameters
Remarks
10
V
V
kHz
11
8
With respect to GNDP
Operating temperature depends on load and environmental conditions.
10
With respect to GNDP
11
Operating temperature depends on load and environmental conditions.
9
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2ED300C17-S/-ST
Electrical Parameters
4.4
Electrical Characteristics
The electrical characteristics involve the spread of values for the supply voltages, load and junction
temperatures given below. Typical values represent the median values, which are related to production
processes at T = 25°C. VVDDS and VVDDP are 15V. Unless otherwise noted all voltages are given with respect
to GNDS. The specification for all output driver signals is valid for driver channel A and driver channel B
without special notice. The secondary signals are measured with respect to their individual COMA or COMB.
Parameter
Symbol
Unit
IVDDS
Limit Values
min
typ
max
80
No load SMPS average DC input current
Signal and Logic DC input current
IVDDP
10
mA
Turn on propagation delay time
tpd,on
670
ns
Turn off propagation delay time
tpd,off
580
ns
Transition time differences
tdif
50
ns
Minimal pulse suppression
tmd
400
ns
3300
Ω
DC input impedance of INA, INB, Mode, Reset
mA
Input threshold level
Input threshold for external failure input E.A or
E.B
Interlock delay time half-bridge mode
Reactivation after fault condition @ INA and INB
with low input signal
Reference voltage for IGBT desaturation sensing
VINA, VINB
8
V
VE.A, VE.B
5
V
Coupling capacitance primary/secondary
Ccps
tTD
1,6
treact
50
13
12
µs
60
ms
10
V
18
pF
Coupling capacitance between secondary sides
Ccss
15
External capacitor for Logic and Signal power
CVDDP
10
supply. Connected between VDDS and GNDS.
External capacitor for SMPS power supply.
CVDDS
470
Connected between VDDP and GNDP.
Positive supply voltage driver channel A and B
VVA+, VVB+
16
@ no switching operation
Negative supply voltage driver channel A and B
VVA-, VVB-16
@ no switching operation
Internal capacitor on positive supply voltage
CVA+,int,
28
driver channel VA+ and VB+
CVB+,int
Internal capacitor on negative supply voltage
CVA-,int,
23
driver channel VA- and VBCVB-,int
Internal UVLO level for positive supply voltage
VUVLO,pos
10,9
driver channel
Internal UVLO level for negative supply voltage
VUVLO,neg
-9,3
driver channel
External capacitor for interlocking generation
CCA, CCB
0
Table 5: Electrical characteristics
12
Remarks
pF
µF
µF
V
V
µF
µF
V
V
1
nF
13
If not use E.A and E.B should be connected to COMA or COMB
Capacitor terminal only. Connection to another terminals or voltages not allowed.
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2ED300C17-S/-ST
Electrical Parameters
4.5
Driver performance
The 2ED300C17-S can transmit a maximum power of 4 W per channel from primary to secondary side.
The power required to drive an IGBT is dependent of gate charge of the IGBT (datasheet value QG),
switching frequency fs and gate voltage difference ΔV. The safety factor 1.2 included 20% over all
tolerances. The power for IGBT drive may be calculated by the following equation:
Pdriver  1.2 * QG * f s * V
This power is dissipated in the driver itself, in the external gate resistor and in the internal IGBT gate resistor.
The share of the total power each part has to dissipate varies with load conditions. There is a limit for the
power dissipation of each channel of the driver which significantly varies with temperature inside the cabinet
and with airflow conditions. Figure 6 shows the usable driver output power for a typical mounting condition
with natural connection and several load conditions. Required gate power is considered to be constant.
The highest share of power dissipation inside the driver is to be expected when operating a small IGBT with
low total RG at high switching frequency. Whereas driving a larger IGBT with higher R G at low switching
frequency is less demanding regarding thermal considerations.
Figure 6: Power dissipation of the driver for different load conditions
Load 1 > load 2 > load 3 > load 4
Load 1 – small RG and small CG
Load 2 – small RG and high CG
Load 3 – high RG and small CG
Load 4 – high RG and high CG
The load is a combination of the gate resistors and the gate capacitance.
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2ED300C17-S/-ST
Electrical Parameters
4.6
VCESAT reference
The short circuit detection measurement is integrated in the 2ED300C17-S. The 2ED300C17-S measures
the VCE voltage while the IGBT is turned on. If the VCE voltage rises above the preset reference voltage
during this period, a fault is triggered and the IGBT is turned off via the internal soft shut-down.
The reference curve is only adjustable via an external R SX and CSX. RSX sets the reference voltage and CSX
sets the time constant for the decay to the stationary reference value.
The resistor and the capacitor are connected parallel between RC A and COM A or RC B and COM B.
Figure 7: Vce,sat reference curve
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2ED300C17-S/-ST
Isolation characteristics
5
Isolation characteristics
Electrical characteristics, at Ta = 25 °C, unless otherwise specified.
Parameter
Value
Unit
Isolation test voltage
5000
V
Signal and Logic Side - Driver Channel A
and Driver Channel B (RMS, 50Hz, 1s)
Isolation test voltage
2250
V
Driver Channel A - Driver Channel B (RMS,
50Hz, 1s)
Surge voltage test
9600
V
Surge test according to EN50178 Signal
and Logic Side to Driver Channels A and B
Partial discharge test voltage
>1920
V
Clearance and creepage distance
primary to secondary
>15
mm
Distance Signal and Logic Side to Driver
Channels A and B
Clearance distance secondary to
secondary
>4,59
mm
Distance Driver Channel A to
Channel B. 4mm air gap included.
Creepage distance secondary to
secondary
RMS; transformer series test
According to EN 61800-5-1
Distance Driver
Channel B
Table 6: Isolation characteristics
>14
mm
Prepared by: RK
Approved by: KS
Remarks
Channel
A
to
Driver
Driver
Preliminary data sheet
19
V4.03, 2013-08-13
EiceDRIVERTM
2ED300C17-S/-ST
Timing diagrams
6
Timing diagrams
Diagram in Figure 8 shows typical input and output signals. Figure 9 shows propagation delay times.
Figure 8: PWM timing diagram with interlocking time functionality
Figure 9: Propagation delay times
Prepared by: RK
Approved by: KS
Preliminary data sheet
20
V4.03, 2013-08-13
EiceDRIVERTM
2ED300C17-S/-ST
Mechanical dimensions
7
Mechanical dimensions
Figure 10: Package outlines top view
Figure 11: Package outlines side view
Prepared by: RK
Approved by: KS
Preliminary data sheet
21
V4.03, 2013-08-13
EiceDRIVERTM
2ED300C17-S/-ST
Mechanical dimensions
Figure 12: Label
Intent of DMX Code
Serial Number
SAP Material Number
Internal Production Order Number
Datecode (Production Year)
Datecode (Production Week)
DMX Code
digit
1-5
6-11
12-19
20-21
22-23
Table 7: Intent of DMX code
Prepared by: RK
Approved by: KS
DMX Code
digit quantity
5
6
8
2
2
Preliminary data sheet
22
V4.03, 2013-08-13
EiceDRIVERTM
2ED300C17-S/-ST
Handling and mounting
8
Handling and mounting
The device has been designed to be soldered onto a carrier board as a through-hole
component. Dual wave soldering process or selective soldering can be done. For more
information see IFX Additional Information, DS1, March 2008
The -ST version differentiates from the -S as it features an additional coating. The coating
used is type 1306N made by the company Peters. The soldering pins are not coated.
When further coating processes are done on the customer assembly, the compatibility of
the coated type has to be established first.
Prepared by: RK
Approved by: KS
Preliminary data sheet
23
V4.03, 2013-08-13
http://www. inf ineon.com
Published by Infineon Technologies AG
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