485AZ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN40 6x6, 0.5P
CASE 485AZ−01
ISSUE O
1 40
SCALE 2:1
ÉÉÉ
ÉÉÉ
ÉÉÉ
D
PIN ONE
LOCATION
2X
A B
L
DETAIL A
ALTERNATE
CONSTRUCTIONS
ÉÉ
ÉÉ
0.15 C
EXPOSED Cu
2X
TOP VIEW
0.15 C
(A3)
DETAIL B
0.10 C
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. POSITIONAL TOLERANCE APPLIES TO ALL
THREE EXPOSED PADS.
DIM
A
A1
A3
b
D
D2
D3
E
E2
E3
e
G
K
L
L1
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
A
43X
0.08 C
L
L1
E
DATE 09 JAN 2009
A1
C
NOTE 4
SEATING
PLANE
0.10 C A B
D3
D2
NOTE 5
G
DETAIL A
40X
L
MILLIMETERS
MIN
MAX
0.80
1.00
−−−
0.05
0.20 REF
0.18
0.30
6.00 BSC
2.30
2.50
1.40
1.60
6.00 BSC
4.30
4.50
1.90
2.10
0.50 BSC
2.20 BSC
0.20
−−−
0.30
0.50
−−−
0.15
GENERIC
MARKING DIAGRAM*
E3
1
E2
XXXXXXXX
XXXXXXXX
AWLYYWWG
E3
1
40
K
G
e
40X
e/2
G
BOTTOM VIEW
b
0.10 C A B
0.05 C
NOTE 3
SOLDERING FOOTPRINT
6.30
4.56
1.66
40X
0.63
2.56
1
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.16
4.56
6.30
2.16
PKG
OUTLINE
0.50
PITCH
DOCUMENT NUMBER:
40X
0.30
DIMENSIONS: MILLIMETERS
98AON38217E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN40 6x6, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON38217E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED.
DATE
09 JAN 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2009
January, 2009 − Rev. 01O
Case Outline Number:
485AZ