Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MC33883
Rev 10.0, 10/2012
H-Bridge Gate Driver IC
33883
The 33883 is an H-bridge gate driver (also known as a full-bridge
pre-driver) IC with integrated charge pump and independent high and
low side gate driver channels. The gate driver channels are
independently controlled by four separate input pins, thus allowing
the device to be optionally configured as two independent high side
gate drivers and two independent low side gate drivers. The low side
channels are referenced to ground. The high side channels are
floating.
The gate driver outputs can source and sink up to 1.0 A peak
current pulses, permitting large gate-charge MOSFETs to be driven
and/or high pulse- width modulation (PWM) frequencies to be utilized.
A linear regulator is incorporated, providing a 15 V typical gate supply
to the low side gate drivers.
This device powered by SMARTMOS technology.
H-BRIDGE GATE DRIVER IC
EG SUFFIX (PB-FREE)
98ASB42343B
20-PIN SOICW
Features
•
•
•
•
•
•
•
•
•
VCC operating voltage range from 5.5 V up to 55 V
VCC2 operating voltage range from 5.5 V up to 28 V
CMOS / LSTTL compatible I / O
1.0 A peak gate driver current
Built-in high side charge pump
Under-voltage lockout (UVLO)
Over-voltage lockout (OVLO)
Global enable with <10 A Sleep mode
Supports PWM up to 100 kHz
ORDERING INFORMATION
Device
(Add R2 Suffix for
Tape and Reel)
Temperature
Range (TA)
Package
MC33883HEG
- 40 °C to 125 °C
20 SOICW
VBAT VBOOST
33883
VCC
CP_OUT
VCC2
G_EN
LR_OUT
C1
C2
MCU
GATE_HS1
SRC_HS1
GATE_LS1
GATE_HS2
SRC_HS2
IN_HS1
GATE_LS2
IN_LS1
IN_HS2
/2
IN_LS2 GND_A GND
Figure 1. 33883 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007-2012. All rights reserved.
DC
Motor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
C2
C1
VCC, VCC2
Undervoltage/Overvoltage
VCC2
VCC
VCC
VDD
Charge
Pump
EN
VCC
C2
VPOS
GND
G_EN
VCC2
C1
CP_OUT
GND2 VCC2
VCC
VDD
CP_OUT
VCC2
+5.0 V
EN Linear
GND Reg +14.5 V LR_OUT
GND_A
GND2
HIGH- AND LOW-SIDE
CONTROL WITH CHARGE PUMP
VCC
BRG_EN
IN_HS1
TSD1
Control and
Logic
VDD / VPOS
Level Shift
BRG_EN
TSD1
Control and
Logic
TSD1
Thermal Shutdown
TSD2
VDD / VCC
Level Shift
IN Output
Pulse
Generator
VDD / VPOS
Level Shift
TSD2
Control and
Logic
GND
GATE_LS1
CP_OUT
IN Output
OU
Driver
TSD2
Thermal Shutdown
GATE_HS
SRC_HS2
LR_OUT
VDD / VCC
Level Shift
IN Output
Pulse
Generator
OU
Driver
GATE_LS2
GND2
LOW-SIDE CHANNEL
GND
SRC_HS1
GND1
Pulse
Generator
BRG_EN
OU
Driver
VCC
HIGH-SIDE CHANNEL
IN_LS2
GATE_HS
LR_OUT
BRG_EN
Control and
Logic
OU
Driver
LOW-SIDE CHANNEL
IN_HS2
CP_OUT
IN Output
Pulse
Generator
HIGH-SIDE CHANNEL
IN_LS1
LR_OUT
GND_
Figure 2. 33883 Simplified Internal Block Diagram
33883
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
VCC
1
20
G_EN
C2
2
19
CP_OUT
SRC_HS1
3
18
4
17
GATE_HS1
IN_HS1
IN_LS1
GATE_LS1
5
16
6
15
SRC_HS2
GATE_HS2
IN_HS2
IN_LS2
GATE_LS2
7
14
8
13
GND1
LR_OUT
9
12
10
11
GND2
C1
GND_A
VCC2
Figure 3. 33883 20-SOICW Pin Connections
A functional description of each pin can be found in the Functional Pin Description section beginning on page 10.
Table 1. 20-SOICW Pin Definitions
Pin
Pin Name
Formal Name
Definition
1
VCC
Supply Voltage 1
Device power supply 1.
2
C2
Charge Pump Capacitor
External capacitor for internal charge pump.
3
CP_OUT
Charge Pump Out
External reservoir capacitor for internal charge pump.
4
SRC_HS1
Source 1 Output High Side
Source of high-side 1 MOSFET
5
GATE_HS
1
Gate 1 Output High Side
Gate of high-side 1 MOSFET.
6
IN_HS1
Input High Side 1
Logic input control of high-side 1 gate (i.e., IN_HS1 logic HIGH = GATE_HS1 HIGH).
7
IN_LS1
Input Low Side 1
Logic input control of low-side 1 gate (i.e., IN_LS1 logic HIGH = GATE_LS1 HIGH).
8
GATE_LS1 Gate 1 Output Low Side
Gate of low-side 1 MOSFET.
9
GND1
Ground 1
Device ground 1.
10
LR_OUT
Linear Regulator Output
Output of internal linear regulator.
11
VCC2
Supply Voltage 2
Device power supply 2.
12
GND_A
Analog Ground
Device analog ground.
13
C1
Charge Pump Capacitor
External capacitor for internal charge pump.
14
GND2
Ground 2
Device ground 2.
15
GATE_LS2 Gate 2 Output Low Side
Gate of low-side 2 MOSFET.
16
IN_LS2
Input Low Side 2
Logic input control of low-side 2 gate (i.e., IN_LS2 logic HIGH = GATE_LS2 HIGH).
17
IN_HS2
Input High Side 2
Logic input control of high-side 2 gate (i.e., IN_HS2 logic HIGH = GATE_HS2 HIGH).
18
GATE_HS
2
Gate 2 Output High Side
Gate of high-side 2 MOSFET.
19
SRC_HS2
Source 2 Output High Side
Source of high-side 2 MOSFET.
20
G_EN
Global Enable
Logic input Enable control of device (i.e., G_EN logic HIGH = Full Operation, G_EN
logic LOW = Sleep Mode).
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Supply Voltage 1
VCC
-0.3 to 65
V
Supply Voltage 2 (1)
VCC2
-0.3 to 35
V
Linear Regulator Output Voltage
VLR_OUT
-0.3 to 18
V
High-Side Floating Supply Absolute Voltage
VCP_OUT
-0.3 to 65
V
High-Side Floating Source Voltage
VSRC_HS
-2.0 to 65
V
IS
250
mA
VGATE_HS
-0.3 to 65
V
VGATE_HS VSRC_HS
-0.3 to 20
V
High-Side Floating Supply Gate Voltage
VCP_OUT VGATE_HS
-0.3 to 65
V
Low-Side Gate Voltage
VGATE_LS
-0.3 to 17
V
VG_EN
-0.3 to 35
V
Logic Input Voltage
VIN
-0.3 to 10
V
Charge Pump Capacitor Voltage
VC1
-0.3 to VLR_OUT
V
Charge Pump Capacitor Voltage
VC2
-0.3 to 65
V
ELECTRICAL RATINGS
High-Side Source Current from CP_OUT in Switch ON State
High-Side Gate Voltage
High-Side Gate Source Voltage
(2)
Wake-Up Voltage
ESD Voltage
(3)
V
Human Body Model on All Pins (VCC and VCC2 as Two Power
Supplies)
VESD1
±1500
Machine Model
VESD2
±130
Notes
1. VCC2 can sustain load dump pulse of 40 V, 400 ms, 2.0 .
2.
3.
In case of high current (SRC_HS >100 mA) and high voltage (>20 V) between GATE_HSX and SRC_HS an external zener of 18 V is
needed as shown in Figure 14.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
33883
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
PD
1.25
W
RJA
100
°C / W
TJ
-40 to 150
°C
TSTG
-65 to 150
°C
TPPRT
Note 5
°C
Power Dissipation and Thermal Characteristics
Maximum Power Dissipation @ 25°C
Thermal Resistance (Junction to Ambient)
Operating Junction Temperature
Storage Temperature
Peak Package Reflow Temperature During Reflow (4), (5)
Notes
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions VCC = 12 V, VCC2 = 12 V, CCP = 33 nF, G_EN = 4.5 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
Supply Voltage 1 for Output High-Side Driver and Charge Pump
VCC
5.5
–
55
V
Supply Voltage 2 for Linear Regulation
VCC2
5.5
–
28
V
VCP_OUT
VCC+4
–
VCC + 11
but < 65
V
Logic 1 Input Voltage (IN_LS and IN_HS)
VIH
2.0
–
10
V
Logic 0 Input Voltage (IN_LS and IN_HS)
VIL
–
–
0.8
V
Logic 1 Input Current
IIN+
OPERATING CONDITIONS
High-Side Floating Supply Absolute Voltage
LOGIC
VIN = 5.0 V
Wake-Up Input Voltage (G_EN)
VG_EN
Wake-Up Input Current (G_EN)
IG_EN
VG_EN = 14 V
Wake-Up Input Current (G_EN)
A
200
–
1000
4.5
5.0
VCC2
A
–
200
500
–
–
1.5
mA
IG_EN2
VG_EN = 28 V
V
LINEAR REGULATOR
Linear Regulator
VLR_OUT
VLR_OUT @ VCC2 from 15 V to 28 V, ILOAD from 0 mA to 20 mA
V
12.5
–
16.5
VCC2 - 1.5
–
–
4.0
–
–
VCC = 12 V, ILOAD = 0 mA, CCP_OUT = 1.0 F
7.5
–
–
VCC = 12 V, ILOAD = 7.0 mA, CCP_OUT = 1.0 F
7.0
–
–
VCC2 = VCC = 5.5 V, ILOAD = 0 mA, CCP_OUT = 1.0 F
2.3
–
–
VCC2 = VCC = 5.5 V, ILOAD = 7.0 mA, CCP_OUT = 1.0 F
1.8
–
–
7.5
–
–
7.0
–
–
-2.0
–
2.0
-1.5
–
–
VLR_OUT @ ILOAD = 20 mA
VLR_OUT @ ILOAD = 20 mA, VCC2 =5.5V, VCC 5.5V
CHARGE PUMP
Charge Pump Output Voltage, Reference to VCC
VCP_OUT
VCC = 55 V, ILOAD = 0 mA, CCP_OUT = 1.0 F
VCC = 55 V, ILOAD = 7.0 mA, CCP_OUT = 1.0 F
Peak Current Through Pin C1 Under Rapidly Changing VCC Voltages (see
Figure 13, page 17)
IC1
Minimum Peak Voltage at Pin C1 Under Rapidly Changing VCC Voltages
(see Figure 13, page 17)
VC1MIN
V
A
V
33883
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics (continued)
Characteristics noted under conditions VCC = 12 V, VCC2 = 12 V, CCP = 33 nF, G_EN = 4.5 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SUPPLY VOLTAGE
Quiescent VCC Supply Current
A
IVCCSLEEP
VG_EN = 0 V and VCC = 55 V
–
–
10
VG_EN = 0 V and VCC = 12 V
–
–
10
VCC = 55 V and VCC2 = 28 V
–
2.2
–
VCC = 12 V and VCC2 = 12 V
–
0.7
–
–
–
5.0
Operating VCC Supply Current (6)
Additional Operating VCC Supply Current for Each Logic Input Pin Active
IVCCOP
mA
IVCCLOG
VCC = 55 V and VCC2 = 28 V (7)
Quiescent VCC2 Supply Current
mA
A
IVCC2SLEEP
VG_EN = 0 V and VCC = 12 V
–
–
5.0
VG_EN = 0 V and VCC = 28 V
–
–
5.0
VCC = 55 V and VCC2 = 28 V
–
–
12
VCC = 12 V and VCC2 = 12 V
–
–
9.0
Operating VCC2 Supply Current (6)
Additional Operating VCC2 Supply Current for Each Logic Input Pin Active
IVCC2OP
mA
IVCC2LOG
mA
VCC = 55 V and VCC2 = 28 V (7)
–
–
5.0
UV
4.0
5.0
5.5
V
UV2
4.0
5.0
5.5
V
Overvoltage Shutdown VCC
OV
57
61
65
V
Overvoltage Shutdown VCC2
OV2
29.5
31
35
V
–
–
22
–
–
22
–
100
200
Undervoltage Shutdown VCC
Undervoltage Shutdown VCC2
(8)
OUTPUT
Output Sink Resistance (Turned Off)
Output Source Resistance (Turned On)
Maximum Voltage (VGATE_HS - VSRC_HS)
INH = Logic 1, ISmax = 5.0 mA

RDS
Icharge HSS = 50 mA, VCP_OUT = 20 V (8)
Charge Current of the External High-Side MOSFET Through GATE_HSn
Pin (9)

RDS
Idischarge LSS = 50 mA , VSRC_HS = 0 V (8)
ICHARGE HSS
mA
VMAX
V
–
–
18
Notes
6. Logic input pin inactive (high impedance).
7.
8.
9.
High-frequency PWM-ing (» 20 kHz) of the logic inputs will result in greater power dissipation within the device. Care must be taken to
remain within the package power handling rating.
The device may exhibit predictable behavior between 4.0 V and 5.5 V.
See Figure 5, page 12, for a description of charge current.
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 7.0 V  VSUP  18 V, -40C  TA  125C, GND = 0.0 V unless otherwise noted.
Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
–
200
300
–
80
180
Unit
TIMING CHARACTERISTICS
Propagation Delay High Side and Low Side
CLOAD = 5.0 nF, Between 50% Input to 50% Output
(10) (11)
,
(see Figure 4)
ns
tF
Turn-Off Fall Time
CLOAD = 5.0 nF, 10% to 90%
(see Figure 4)
ns
tR
Turn-On Rise Time
CLOAD = 5.0 nF, 10% to 90%
tPD
(10)
(10) (11)
,
(see Figure 4)
ns
–
80
180
10.
CLOAD corresponds to a capacitor between GATE_HS and SRC_HS for the high side and between GATE_LS and ground for low side.
11.
Rise time is given by time needed to change the gate from 1.0 V to 10 V (vice versa for fall time).
33883
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
TIMING DIAGRAMS
TIMING DIAGRAMS
50%
50%
IN_HS
or IN_LS
GATE_HS
or GATE_LS
t pd
t pd
50%
50%
tf
10% 90%
tr
90% 10%
Figure 4. Timing Characteristics
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33883 is an H-bridge gate driver (or full-bridge predriver) with integrated charge pump and independent highand low-side driver channels. It has the capability to drive
large gate-charge MOSFETs and supports high PWM
frequency. In sleep mode its supply current is very low.
FUNCTIONAL PIN DESCRIPTION
SUPPLY VOLTAGE PINS (VCC AND VCC2)
The VCC and VCC2 pins are the power supply inputs to
the device. VCC is used for the output high-side drivers and
the charge pump. VCC2 is used for the linear regulation. They
can be connected together or independent with different
voltage values. The device can operate with VCC up to 55 V
and VCC2 up to 28 V.
The VCC and VCC2 pins have undervoltage (UV) and
overvoltage (OV) shutdown. If one of the supply voltage
drops below the undervoltage threshold or rises above the
overvoltage threshold, the gate outputs are switched LOW in
order to switch off the external MOSFETs. When the supply
returns to a level that is above the UV threshold or below the
OV threshold, the device resumes normal operation
according to the established condition of the input pins.
INPUT HIGH- AND LOW-SIDE PINS 
(IN_HS1, IN_HS2, AND IN_LS1, IN_LS2)
The IN_HSn and IN_LSn pins are input control pins used
to control the gate outputs. These pins are 5.0 V CMOScompatible inputs with hysteresis. IN_HSn and IN_LSn
independently control GATE_HSn and GATE_LSn,
respectively.
is in sleep mode. The device is enabled and fully operational
when the G_EN pin voltage is logic HIGH, typically 5.0 V.
CHARGE PUMP OUT (CP_OUT)
The CP_OUT pin is used to connect an external reservoir
capacitor for the charge pump.
CHARGE PUMP CAPACITOR PINS 
(C1 AND C2)
The C1 and C2 pins are used to connect an external
capacitor for the charge pump.
LINEAR REGULATOR OUTPUT (LR_OUT)
The LR_OUT pin is the output of the internal regulator. It is
used to connect an external capacitor.
GROUND PINS 
(GND_A, GND1 AND GND2)
These pins are the ground pins of the device. They should
be connected together with a very low impedance
connection.
During wake-up, the logic is supplied from the G_EN pin.
There is no internal circuit to prevent the external high-side
and low-side MOSFETs from conducting at the same time.
SOURCE OUTPUT HIGH-SIDE PINS (SRC_HS1
AND SRC_HS2)
The SRC_HSn pins are the sources of the external highside MOSFETs. The external high-side MOSFETs are
controlled using the IN_HSn inputs.
GATE HIGH- AND LOW-SIDE PINS 
(GATE_HS1, GATE_HS2, AND GATE_LS1,
GATE_LS2)
The GATE_HSn and GATE_LSn pins are the gates of the
external high- and low-side MOSFETs. The external highand low-side MOSFETs are controlled using the IN_HSn and
IN_LSn inputs.
GLOBAL ENABLE (G_EN)
The G_EN pin is used to place the device in a sleep mode.
When the G_EN pin voltage is a logic LOW state, the device
33883
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
Table 5. Functional Truth Table
Conditions
G_EN
IN_HSn
IN_LSn
Gate_HSn
Gate_LSn
Comments
Sleep
0
x
x
0
0
Device is in Sleep mode. The gates are at low state.
Normal
1
1
1
1
1
Normal mode. The gates are controlled independently.
Normal
1
0
0
0
0
Normal mode. The gates are controlled independently.
Undervoltage
1
x
x
0
0
The device is currently in fault mode. The gates are at
low state. Once the fault is removed, the 33883 recovers
its normal mode.
Overvoltage
1
x
x
0
0
The device is currently in fault mode. The gates are at
low state. Once the fault is removed, the 33883 recovers
its normal mode.
Overtemperature
on High-Side Gate Driver
1
1
x
0
x
The device is currently in fault mode. The high-side gate
is at low state. Once the fault is removed, the 33883
recovers its normal mode.
Overtemperature
on Low-Side Gate Driver
1
x
1
x
0
The device is currently in fault mode. The low-side gate
is at low state. Once the fault is removed, the 33883
recovers its normal mode.
x = Don’t care.
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL DEVICE OPERATION
DRIVER CHARACTERISTICS
Figure 5 represents the external circuit of the high-side
gate driver. In the schematic, HSS represents the switch that
is used to charge the external high-side MOSFET through the
GATE_HS pin. LSS represents the switch that is used to
discharge the external high-side MOSFET through the
GATE_HS pin. A 180K internal typical passive discharge
resistance and a 18 V typical protection zener are in parallel
with LSS. The same schematic can be applied to the external
low-side MOSFET driver simply by replacing pin CP_OUT
with pin LR_OUT, pin GATE_HS with pin GATE_LS, and pin
SRC_HS with GND.
The different voltages and current of the high-side gate
driver are illustrated in Figure 6. The output driver sources a
peak current of up to 1.0 A for 200 ns to turn on the gate. After
200 ns, 100 mA is continuously provided to maintain the gate
charged. The output driver sinks a high current to turn off the
gate. This current can be up to 1.0 A peak for a 100 nF load.
IN_HS1
0
HSSpulse_IN
0
CP_OUT
HSS DC_IN
HSS
0
IGATE_HS
HSSDC_IN
Icharge HSS
GATE_HS1
LSS_IN
Idischarge LSS
IN_HS1
HSSpulse_IN
LSS
Icharge HSS
180
k
100 mA Typical
0
18V
LSS_IN
1.0 A Peak
SRC_HS1
Idischarge LSS
1.0 A Peak
0
Figure 5. High-Side Gate Driver Functional Schematic
IGATE_HS
1.0 A Peak
100 mA Typical
0
-1.0 A Peak
Note GATE_HS is loaded with a 100 nF capacitor in the
chronograms. A smaller load will give lower peak and DC charge or
discharge currents.
Figure 6. High-Side Gate Driver Chronograms
33883
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
OPERATIONAL MODES
TURN-ON
TURN-OFF
For turn-on, the current required to charge the gate source
capacitor Ciss in the specified time can be calculated as
follows:
The peak current for turn-off can be obtained in the same
way as for turn-on, with the exception that peak current for fall
time, tf, is substituted for tr:
I P = Qg / t r = 80 nC / 80 ns 1.0 A
I P = Qg /t f = 80 nC / 80 ns 1.0 A
Where Q g is power MOSFET gate charge and t r is peak
current for rise time.
Flyback spike charges lowside gate via Crss charge
current Irss up to 2.0 A.
Causes increased uncontrolled turn-on of low-side
MOSFET.
Crss
In addition to the dynamic current required to turn off or on
the MOSFET, various application-related switching scenarios
must be considered. These scenarios are presented in
Figure 7. In order to withstand high dV/dt spikes, a low
resistive path between gate and source is implemented
during the OFF-state.
Flyback spike pulls down
high-side source VGS.
Delays turn-off of highside MOSFET.
VBAT
Crss
VBAT
Flyback spike charges lowside gate via Crss charge
current Irss up to 2.0 A.
Delays turn-off of low-side
MOSFET.
Crss
VBAT
OFF
OFF
Ciss
GATE_HS
ILOAD
L1
Ciss
GATE_HS
ILOAD
L1
Ciss
Crss
Crss
Crss
GATE_HS
Irss
Flyback spike pulls down
high-side source VGS.
Causes increased uncontrolled turn-on of high-side
Crss
VBAT
VGATE
-VDRN
GATE_HS
ILOAD
L1
Ciss
L1
ILOAD
Crss
VGATE
GATE_LS
OFF
Ciss
GATE_LS
Driver Requirement:
Low Resistive GateSource Path During
OFF-State
OFF
Ciss
Driver Requirement:
Low Resistive GateSource Path During
OFF-State. High Peak
Sink Current Capability
GATE_LS
Ciss
Driver Requirement:
High Peak Sink Current
Capability
GATE_LS
Ciss
Driver Requirement:
Low Resistive GateSource Path During
OFF-State
Figure 7. OFF-State Driver Requirement
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
LOW-DROP LINEAR REGULATOR
The low-drop linear regulator is supplied by VCC2. If VCC2
exceeds 15.0 V, the output is limited to 14.5 V (typical).
capacitor CCP_OUT provides peak current to the high-side
MOSFET through HSS during turn-on (3).
VLR_OUT
VLR-OUT
The low-drop linear regulator provides the 5.0 V for the
logic section of the driver, the Vgs_ls buffered at LR_OUT, and
the +14.5 V for the charge pump, which generates the
CP_OUT The low-drop linear regulator provides 4.0 mA
average current per driver stage.
CP_out
CP_OUT
Tosc2
Tosc2
Ccp
CCP
C1
C1
In case of the full bridge, that means approximately
16 mA — 8.0 mA for the high side and 8.0 mA for the low
side.
D1
D1
C2
C2
D2
D2
Tosc1
Tosc1
VVcc
CC
Note: The average current required to switch a gate with
a frequency of 100 kHz is:
ICP = Qg * f PWM = 80 nC * 100 kHz = 8.0 mA
GATE_HS
GATE_HS
LSS
CHARGE PUMP
T2
The charge pump generates the high-side driver supply
voltage (CP_OUT), buffered at CCP_OUT. Figure 8 shows the
charge pump basic circuit without load.
V
LR_OUT
VLR_OUT
Osc.
OSC.
D1
D1
(3)
T1
HSS
In a full-bridge application only one high side and one low
side switches on or off at the same time.
(2)
C
Ccp_out
CP_OUT
Rg
Rg
HS
MOSFET
High-Side
MOSFET
SRC_HS
SRC_HS
LS
VCP_OUT
CP_OUT
Low-Side
MOSFET
MOSFET
Ccp
CCP
A
C2
C1
CCcp_out
CP_OUT
Pins
pins
Figure 9. High-Side Gate Driver
D2
D2
(1)
VVbat
CC
Figure 8. Charge Pump Basic Circuit
When the oscillator is in low state [(1) in Figure 8], CCP is
charged through D2 until its voltage reaches VCC - VD2. When
the oscillator is in high state (2), CCP is discharged though D1
in CCP_OUT, and final voltage of the charge pump, VCP_OUT,
is Vcc + VLR_OUT - 2VD. The frequency of the 33883 oscillator
is about 330 kHz.
EXTERNAL CAPACITORS CHOICE
External capacitors on the charge pump and on the linear
regulator are necessary to supply high peak current
absorbed during switching.
Figure 9 represents a simplified circuitry of the high-side
gate driver. Transistors Tosc1 and Tosc2 are the oscillatorswitching MOSFETs. When Tosc1 is on, the oscillator is at
low level. When Tosc2 is on, the oscillator is at high level. The
33883
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
CCP
CCP_OUT
CCP choice depends on power MOSFET characteristics
and the working switching frequency. Figure 10 contains two
diagrams that depict the influence of CCP value on VCP_OUT
average voltage level. The diagrams represent two different
frequencies for two power MOSFETs, MTP60N06HD and
MPT36N06V.
Figure 11 depicts the simplified CCP_OUT current and
voltage waveforms. fPWM is the working switching frequency.
VCP_OUT
V Cp_out
rage
V Cp_out
Average
VCP_OUT
21
in low
Low
in
State
state
High Side
High
Side Turn On
turn on
V

VCcp
CP_OUT
_ out
20
kHz
20KhZ
100
100 kHz
KhZ
20.5
VVcp_out
(V)
CP_OUT (v)
Oscillator
Oscillator
in high
High
in
Oscillator
State Oscillator
state
ICP_OUT
I
Cp_out
20
ffPWM
PWM
f=330kHz
f = 330 kHz
19.5
19
18.5
18
5
25
45
65
Peak
Peak Current
Current
85
Figure 11. Simplified CCP_OUT Current and Voltage
Waveforms
C
(nF)
Ccp
CP(nF)
MTP60N06HD (Qg=50nC)
MTP60N06HD (Qg = 50 nC)
MTP60N06HD (Qg = 50 nC)
21.5
20 kHz
100 kHz
21
Vcp_out
(V)(V)
VCP_OUT
As shown above, at high-side MOSFET turn-on VCP_OUT
voltage decreases. This decrease can be calculated
according to the CCP_OUT value as follows:
VCP_OUT =
20.5
CCP_OUT
Where Qg is power MOSFET gate charge.
20
19.5
CLR_OUT
CLR_OUT provides peak current needed by the low-side
MOSFET turn-on. VLR_OUT decrease is as follows:
19
18.5
5
Qg
25
45
65
85
CCcp
(nF)
CP (nF)
VLR_OUT =
Qg
CLR_OUT
MTP36N06V (Qg = 40 nC)
Figure 10. VCP_OUT Versus CCP
The smaller the CCP value is, the smaller the VCP_OUT
value is. Moreover, for the same CCP value, when the
switching frequency increases, the average VCP_OUT level
decreases. For most of the applications, a typical value of
33 nF is recommended.
TYPICAL VALUES OF CAPACITORS
In most working cases the following typical values are
recommended for a well-performing charge pump:
CCP = 33 nF, CCP_OUT = 470 nF, and CLR_OUT = 470 nF
These values give a typical 100 mV voltage ripple on
VCP_OUT and VLR_OUT with Qg = 50 nC.
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
PROTECTION AND DIAGNOSTIC FEATURES
GATE PROTECTION
LOAD DUMP AND REVERSE BATTERY
The low-side driver is supplied from the built-in low-drop
regulator. The high-side driver is supplied from the internal
charge pump buffered at CP_OUT.
VCC and VCC2 can sustain load a dump pulse of 40 V and
double battery of 24 V. Protection against reverse polarity is
ensured by the external power MOSFET with the freewheeling diodes forming a conducting pass from ground to
VCC. Additional protection is not provided within the circuit.
To protect the circuit an external diode can be put on the
battery line. It is not recommended putting the diode on the
ground line.
The low-side gate is protected by the internal linear
regulator, which ensures that VGATE_LS does not exceed the
maximum VGS. Especially when working with the charge
pump, the voltage at CP_OUT can be up to 65 V. The highside gate is clamped internally in order to avoid a VGS
exceeding 18 V.
Gate protection does not include a fly-back voltage clamp
that protects the driver and the external MOSFET from a flyback voltage that can occur when driving inductive load. This
fly-back voltage can reach high negative voltage values and
needs to be clamped externally, as shown in Figure 12.
LR_OUT
IN
OUT
M1
VCC
GATE_HS
VGS < 14 V
Under All
Conditions
SRC_HS
L1
Dc l
M2
IN
Output
Driver
OUT
There is temperature shutdown protection per each halfbridge. Temperature shutdown protects the circuitry against
temperature damage by switching off the output drivers. Its
typical value is 175°C with an hysteresis of 15°C.
DV/DT AT VCC
CP_OUT
Output
Driver
TEMPERATURE PROTECTION
Inductive
Flyback Voltage
Clamp
GATE_LS
Figure 12. Gate Protection and Flyback Voltage Clamp
VCC voltage must be higher than (SRC_HS voltage minus
a diode drop voltage) to avoid perturbation of the high-side
driver.
In some applications a large dV / dt at pin C2 owing to
sudden changes at VCC can cause large peak currents
flowing through pin C1, as shown in Figure 13.
For positive transitions at pin C2, the absolute value of the
minimum peak current, I C1min, is specified at 2.0 A for a
t C1min duration of 600 ns.
For negative transitions at pin C2, the maximum peak
current, IC1max, is specified at 2.0 A for a t C1max duration of
600 ns. Current sourced by pin C1 during a large dV / dt will
result in a negative voltage at pin C1 (Figure 13). The
minimum peak voltage VC1min is specified at -1.5 V for a
duration of t C1max = 600 ns. A series resistor with the charge
pump capacitor (Ccp) capacitor can be added in order to limit
the surge current.
33883
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
VCC
IC1max
t C1min
I (C1+C2)
0A
t C1max
I C1min
V(LR_OUT)
V(C1)
0V
VC1min
Figure 13. Limits of C1 Current and Voltage with Large Values of dV/dt
In the case of rapidly changing VCC voltages, the large dV/
dt may result in perturbations of the high-side driver, thereby
forcing the driver into an OFF state. The addition of
capacitors C3 and C4, as shown in Figure 14, reduces the
dV/dt of the source line, consequently reducing driver
perturbation. Typical values for R3 / R4 and C3 / C4 are 10 
and 10 nF, respectively.
DV/DT AT VCC2
When the external high-side MOSFET is on, in case of
rapid negative change of VCC2 the voltage (VGATE_HS VSRC_HS) can be higher than the specified 18 V. In this case
a resistance in the SRC line is necessary to limit the current
to 5.0 mA max. It will protect the internal zener placed
between GATE_HS and SRC pins.
In case of high current (SRC_HS >100 mA) and high
voltage (>20 V) between GATE_HSX and SRC_HS an
external zener of 18 V is needed as shown in Figure 14.
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
VBAT VBOOST
33883
VCC
VCC2
G_EN
CCP
33 nF
C1
C2
MCU
IN_HS1
IN_LS1
IN_HS2
IN_LS2
VCC
VCC2
G_EN
C1
C2
IN_HS1
CCP_OUT
470 nF
CP_OUT
LR_OUT
GATE_HS1
SRC_HS1
CLR_OUT
470 nF
18 V
GATE_HS2
IN_LS1 SRC_HS2
50 
M3
R2
50 
R4
10 
C3
10 nF
C4
10 nF
DC
Motor
18 V
IN_HS2 GATE_LS2
IN_LS2
M1
R3
10 
GATE_LS1
R1
M2
50 
M4
GND
50 
Figure 14. Application Schematic with External Protection Circuit
33883
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGING DIMENSIONS
PACKAGING
PACKAGING DIMENSIONS
Important For the most current revision of the package, visit www.freescale.com and do a keyword search on the
98ASB42343B drawing number below. Dimensions shown are provided for reference ONLY.
DW SUFFIX
EG SUFFIX (PB-FREE)
20-PIN SOICW
PLASTIC PACKAGE
98ASB42343B
ISSUE J
33883
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
REVISION HISTORY
PACKAGING DIMENSIONS
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
9.0
1/2007
•
•
•
•
•
Implemented Revision History page
Updated to the current Freescale format and style
Added MCZ33883EG/R2 to the Ordering Information
Updated the package drawing to Rev. J
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
MAXIMUM RATINGS on page 4. Added note with instructions from www.freescale.com.
10.0
10/2012
•
•
•
•
Updated orderable part number from MCZ33883EG to MC33883HEG.
Updated Freescale form and style
Removed MC33883DW from the ordering information
Changed from Advance Information to Technical Data
33883
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
How to Reach Us:
Information in this document is provided solely to enable system and software implementers to use Freescale products.
Home Page:
freescale.com
There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based
Web Support:
freescale.com/support
Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no
on the information in this document.
warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance
may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by
customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others.
Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address:
freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm.
Off.SMARTMOS is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of
their respective owners.
© 2013 Freescale Semiconductor, Inc.
Document Number: MC33883
Rev 10.0
10/2012
Similar pages