485BE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN52 6x6, 0.4P
CASE 485BE−01
ISSUE B
DATE 23 JUN 2010
1 52
SCALE 2:1
D
PIN ONE
LOCATION
L
A B
ÉÉÉ
ÉÉÉ
ÉÉÉ
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
EXPOSED Cu
TOP VIEW
0.10 C
A
(A3)
DETAIL B
0.10 C
L
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
0.08 C
A1
NOTE 4
SIDE VIEW
C
D2
DETAIL C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
L2
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.15
0.25
6.00 BSC
4.60
4.80
6.00 BSC
4.60
4.80
0.40 BSC
0.30 REF
0.25
0.45
0.00
0.15
0.15 REF
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
K
14
DETAIL A
L2
27
L2
DETAIL C
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
8 PLACES
E2
52X
XXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
L
1
52
40
52X
e
BOTTOM VIEW
b
0.07 C A B
0.05 C
NOTE 3
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
6.40
4.80
52X
0.63
4.80
6.40
0.11
PKG
OUTLINE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL TIP
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
0.49
DETAIL D
0.40
PITCH
52X
DETAIL D
8 PLACES
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON47515E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN52, 6x6, 0.4MM PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON47515E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. FEELEY.
30 DEC 2009
A
CORRECTED GENERIC MARKING INFORMATION. REQ. BY J. LIU.
19 FEB 2010
B
CORRECTED SOLDER FOOTPRINT TO ADD BEVELED LEAD INFO. REQ. BY J.
LIU.
23 JUN 2010
ON Semiconductor and
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
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© Semiconductor Components Industries, LLC, 2010
June, 2010 − Rev. 01B
Case Outline Number:
485BE
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