Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L68.8x8B
68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 05/13
8.00
A
B
52
6
6
PIN 1
INDEX AREA
68
1
51
PIN 1
INDEX AREA
8.00
EXP. DAP
6.20±0.10
68x 0.40
(4X)
17
35
0.10
18
4
68x 0.20
0.10 M C A B
34
68x 0.40
TOP VIEW
BOTTOM VIEW
SEE DETAIL “X”
0.85±0.05
C
0.10 C
0.08 C
SEATING PLANE
SIDE VIEW
(64x 0.40)
C
0.2 REF
5
(7.80 TYP)6.20
0.00 MIN
0.5 MAX
DETAIL "X"
(68x 0.20)
(68x 0.60)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1