Plastic Packages for Integrated Circuits Small Outline Exposed Pad Plastic Packages (EPSOIC) M28.3B N INDEX AREA H 0.25(0.010) M 28 LEAD WIDE BODY SMALL OUTLINE EXPOSED PAD PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 TOP VIEW L SEATING PLANE -A- h x 45o A D -C- A1 B 0.25(0.010) M C 0.10(0.004) C A M SIDE VIEW MAX NOTES A 0.091 - 0.099 - 0.001 - 0.005 - B 0.014 - 0.019 9 C 0.0091 - 0.0125 - D 0.701 - 0.711 3 E 0.292 - 0.299 4 0.050 BSC - H 0.400 - 0.410 - h 0.010 - 0.016 5 L 0.024 - 0.040 6 N α B S NOMINAL A1 e α e MIN 28 0° 5° 7 8° - P 0.180 0.214 0.218 11 P1 0.156 0.190 0.194 11 Rev. 0 5/02 1 2 3 NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. P1 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. N P BOTTOM VIEW 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: INCH. 11. Dimensions “P” and “P1” are thermal and/or electrical enhanced variations. Values shown are maximum size of exposed pad within lead count body size. 1