567GF

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP16, 1.56x1.56
CASE 567GF
ISSUE D
DATE 24 APR 2014
SCALE 4:1
ÈÈ
ÈÈ
PIN A1
REFERENCE
D
A
B
A3
A2
E
0.10 C
2X
DETAIL A
0.10 C
2X
TOP VIEW
A2
DETAIL A
0.10 C
0.05 C
A1
DIM
A
A1
A2
A3
b
D
E
e
MILLIMETERS
MIN
MAX
−−−
0.60
0.17
0.23
0.33
0.39
0.04 BSC
0.24
0.29
1.56 BSC
1.56 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
A
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
SEATING
PLANE
C
SIDE VIEW
XXXXX
ALYWW
G
e/2
16X
b
e
0.05 C A B
0.03 C
e
D
e/2
C
B
A
1
2
3
4
BOTTOM VIEW
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.40
PITCH
16X
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON85355E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP16, 1.56X1.56
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON85355E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. HILTON.
15 NOV 2012
A
MOVED PIN ONE INDICATOR OF MARKING DIAGRAM FROM LOWER LEFT
CORNER TO UPPER LEFT CORNER. REQ. BY M. HILTON.
11 DEC 2012
B
CORRECTED GENERIC MARKING DIAGRAM INFORMATION AND CHANGED
DIMENSION A3 TO MIN AND MAX. REQ. BY M. HILTON.
07 JAN 2013
C
CORRECTED GENERIC MARKING DIAGRAM. REQ. BY M. HILTON.
10 APR 2014
D
CHANGED A3 DIMENSION FROM 0.02 MIN & 0.04 MAX TO 0.04 BSC. REQ. BY M.
HILTON.
24 APR 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. C
Case Outline Number:
567GF
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